CN101890596A - Low-carbon environmentally-friendly water-based soldering flux - Google Patents
Low-carbon environmentally-friendly water-based soldering flux Download PDFInfo
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- CN101890596A CN101890596A CN 201010234682 CN201010234682A CN101890596A CN 101890596 A CN101890596 A CN 101890596A CN 201010234682 CN201010234682 CN 201010234682 CN 201010234682 A CN201010234682 A CN 201010234682A CN 101890596 A CN101890596 A CN 101890596A
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Abstract
The invention relates to a low-carbon environmentally-friendly water-based soldering flux which has the soldering aid effect in a wave soldering process of circuit board assembly. The soldering flux consists of a solvent and an active additive, wherein the weight of the solvent is 80-97 percent of the total weight of the soldering flux, and the solvent comprises deionized water as a main component and one of polyethylene glycol 800, polyethylene glycol 1000, polyethylene glycol 1200 and polyethylene glycol 1400 and can also comprises an ether compound of which the carbon atom number is 10-14; and the active additive comprises one or more water-soluble organic weak acids and a water-soluble surfactant. In the soldering flux, water is used as the main solvent, and the soldering flux has higher boiling point and nonflammability compared with the traditional alcohol-based soldering flux so that fire disasters cannot be caused in the stages of preheating and soldering, and the soldering flux is safer than the traditional alcohol-based soldering flux. The soldering flux does not contain any halogen chemical substance and meets the requirements on halogen free and environmentally friendly laws and regulations in the electronics industry. The soldering flux uses water as the main solvent, contains lower carbon compared with the traditional alcohol-based soldering flux, reduces the emission of carbon dioxide and is more environmentally friendly.
Description
Technical field
The present invention relates to a kind of scaling powder, refer in particular to the scaling powder of using in the circuit board assembling industry wave soldering technology.
Background technology
Develop along with electronic product turns to miniaturization, integrated and multifunction direction gradually, circuit board assembling industry is also at high speed development, and is therefore also increasing to the demand of scaling powder.
Scaling powder plays the effect of following several respects in welding process:
1. drive away pad and the metal oxide of component pin and the oxide on fusion welding surface.Reaction principle is suc as formula 1:MOx+2xRCOOH=M (RC00) x+xH2O
Annotate: RCOOH represents the organic acid composition in the scaling powder in the formula 1.
2. reduce surface of molten solder tension force, promote wetting.
3. in the welding process, secluding air.Prevent that fusion welding and solder joint from reoxidizing in welding process.
4. in welding process, play the effect of aid in heat transfer.
Scaling powder is mainly used in the wave soldering technology of circuit board assembling.Wave soldering apparatus mainly by scaling powder applying device, preheating zone, weld zone, cooling zone totally four parts form.
The wave soldering technological process is generally as follows:
The good circuit board by the weldering element of plug-in mounting need weld pin face (being the welding initial surface again) and put into the Wave soldering apparatus track down stably earlier; by automatic coating equipment scaling powder is coated on the one side (welding initial surface) that need be welded with pin from bottom to top automatically equably; transmission along with chain; the circuit board that is coated with scaling powder enters the preheating zone; in the preheating zone; when the scaling powder temperature is increased to its activation temperature; scaling powder begins to react with the metal oxide on pad and the component pin; and drive away, and scaling powder can be protected pad to avoid oxidation again and generates new metal oxide.Circuit board begins to enter the wave soldering district through after the preheating zone, and the weld zone is made up of the solder of tin stove and fusion.During circuit board process dual waves, solder takes place wetting on pad and component pin and forms solder joint.When circuit board leaves the weld zone, promptly begin to enter the cooling zone.In this zone, at first scolder begins to solidify the firm solder joint of formation, and the temperature of entire circuit plate is cooled to room temperature subsequently.Final product enters next procedure and carries out visual and ICT (In Circuit Tester) on-line testing instrument test-based examination.
The temperature of wave-soldering preheating zone is provided with the difference difference because of the activation temperature of scaling powder.If temperature was provided with low, scaling powder effect performance is not obvious, causes solder insufficient, and most of solvent of scaling powder can not then can form more residue at postwelding in the preheating zone volatilization fully.If temperature is provided with too high, thereby scaling powder activates prematurely and reacts completely and loses activity, and the too early volatilization of scaling powder is complete, causes pad and component pin generation secondary oxidation, and then influences the wetting effect of scolder.Therefore the temperature setting of wave-soldering preheating zone need be provided with according to the temperature curve that scaling powder manufacturer is recommended.
The solvent of tradition scaling powder is many based on alcohols material, mainly contains three kinds of methyl alcohol, ethanol and isopropyl alcohols.Because the toxic of methyl alcohol and the relative instability in scaling powder thereof seldom have producer to use in formulations of solder flux, it is more therefore to use ethanol or isopropyl alcohol or both to mix the producer of use.Alcohols material itself has inflammable and explosive characteristic, and the flash-point of three kinds of alcohol all is more or less the same, and all at 11-1 ℃, and its vapour pressure is respectively: methyl alcohol is 1 ℃, and ethanol is 5 ℃, and isopropyl alcohol is 4 ℃.This shows that under the identical operations environment, the flammable performance of methyl alcohol is the strongest, secondly is ethanol, is isopropyl alcohol then.By adding fire retardant, general scaling powder flash-point can rise to about 2 ℃ in the prescription of scaling powder, but scaling powder so low flash-point cause and in the wave soldering process, still have very large hidden danger of catching fire.The phenomenon that scaling powder catches fire also happens occasionally in circuit board assembling industry.Scaling powder catches fire and not only brings the certain economic loss to the enterprises and individuals, and might cause fire that the operating personnel is caused personal injury.Therefore, exploitation is that the scaling powder of primary solvent solves the new direction that ignition issues that scaling powder may cause just becomes the research and development of scaling powder with water.
Low-carbon environmentally-friendly water-based soldering flux just had report abroad before more than 10 years.Canadian Hughes Aircraft company in 1992 is in U.S. Pat 5,145, just used deionized water collocation surfactant to use in 531 and replaced common pure based scaling powder, and to recommend preheat temperature is the 150-160 degree.U.S. Ford Motor company successfully applied for U.S. Pat 5,443,660 in 1994.The solvent of the scaling powder at least 90% that this patent is related is made up of deionized water.The Delco electronics corporation of India in 1996 is at patent US5, in 507,882 with deionized water and water-soluble organic acid collocation, the gained scaling powder can be under 1 ℃ of temperature preheating and postwelding residual less, anhydrous residual.
Summary of the invention
The technical problem to be solved in the present invention is to solve the problem of the inflammable and environmental protection of scaling powder in the prior art.The scaling powder safety of aqua type of the present invention is nonflammable, and halogen-free environmental protection also reduces CO2 emission and reaches low-carbon environment-friendly.
Low-carbon environmentally-friendly water-based soldering flux involved in the present invention is made up of solvent and active additive.The main effect of solvent is as carrier lytic activity material, and promptly volatilizees fully at the wave-soldering warm.Solvent also comprises polyethylene glycol 800 simultaneously based on deionized water, cetomacrogol 1000, and polyethylene glycol 1200, one or more among the polyethylene glycol 1400, solvent also can comprise the ether compound of carbon number between 10-14.The percentage by weight that solvent accounts for scaling powder is 80-97wt%, and more suitably ratio is 85-95wt%.The main effect of active additive is the surface tension that reduces scolder and scaling powder, promotes wetting.Active additive comprises one or more water-soluble organic monoacid and surfactants.Water-soluble organic monoacid is by malonic acid, succinic acid, glutaric acid, adipic acid two or more composition wherein.Surfactant also includes methylol BTA, 2-ethyl imidazol(e), N, N-dimethyl lauryl amine, wherein one or more simultaneously.The percentage by weight that active additive accounts for the low-carbon environmentally-friendly water-based soldering flux gross weight be 3-20% more suitably ratio be 5-15wt%.
The performance parameter of scaling powder detects according to IPC J-STD-004B standard, and the weldering effect that helps of scaling powder is mainly assessed by the solderability test.
Scaling powder of the present invention is primary solvent with water, and is higher, nonflammable than the pure based scaling powder boiling point of tradition, can breaking out of fire in preheating and welding stage, and more safer than the pure based scaling powder of tradition.This scaling powder does not contain the chemical substance of any halogen, the requirement of Halogen and environmental regulation in the adaptation electron trade.This scaling powder is primary solvent with water than traditional pure based scaling powder low-carbon (LC) more, reduces CO2 emission, more environmental protection.
Description of drawings
Fig. 1 is the comparison diagram of embodiment and Comparative Examples scaling powder wetting time (T0).
Fig. 2 is the comparison diagram of embodiment and the maximum wetting power of Comparative Examples scaling powder (Fmax).。
The specific embodiment
Below be further elaboration of the present invention, but the scope of the invention is not the embodiment that is limited to here to be proposed.In the following description, the percentage all about the low-carbon environmentally-friendly water-based soldering flux component all is percetage by weight.
Specific embodiment 1
The composition of low-carbon environmentally-friendly water-based soldering flux:
94% deionized water
1.8% C12 ethers
3% succinic acid
0.1% methylol BTA
0.1% N, N-dimethyl lauryl amine
1% surfactant YK-302
Specific embodiment 2
The composition of low-carbon environmentally-friendly water-based soldering flux:
85% deionized water
5％ PEG800
4.2% C12 ethers
4% malonic acid
0.4% methylol BTA
0.4% N, N-dimethyl lauryl amine
1% surfactant YK-302
Specific embodiment 3
95% deionized water
1.1% C12 ethers
3% succinic acid
0.2% 2-ethyl imidazol(e)
0.2% N, N-dimethyl lauryl amine
0.5% surfactant YK-302
Comparative Examples 1
The composition of the pure fundamental mode scaling powder of tradition:
85% isopropyl alcohol
3.5% newtrex
3% malonic acid
2% glutaric acid
2% N, N-dimethyl lauryl amine
1% surfactant YK-302
The solderability test, the wettability equilibrium method:
Assessment to solderability, each big normal structure IEC in the world, IPC, DIN, JIS etc. have recommended various appraisal procedures, but no matter the repeatability from test still is result's legibility, and wettability equilibrium method (Wetting Balance) all is the solderability method of testing of carrying out qualitative and quantitative analysis of generally acknowledging at present.
The wettability equilibrium ratio juris is to utilize the small-sized solder bath of set point of temperature control, test portion is impregnated into certain degree of depth with fixing speed in scolder, by the variation of the power that takes place on the sample copper sheet in the highly sensitive electronic balance continuity ground recording process, analyze the wettability of solder alloy in view of the above.
This experiment adopts the wettability equilibrium instrument to carry out the wetability test according to the 4th part among the JIS Z3198 of Japanese Industrial Standards " lead-free solder test method " " based on the wettability test method of wettability equilibrium method and contact horn cupping " to the low-carbon environmentally-friendly water-based soldering flux of all embodiment and Comparative Examples.Testing substrates is the anaerobic copper sheet, and scolder uses lead-free solder Sn3.0Ag0.5Cu, test condition and parameter such as table 1, and test result is seen Fig. 1, is reached Fig. 2.
Table 1 embodiment and Comparative Examples solderability conditional parameter
| Project | Temperature | Immersion depth | Immersion speed | Testing time |
| Parameter | 2℃ | 2mm | 5mm/s | 10s |
The time that intersects of curve and abscissa is represented the wetting time (T0) of solder alloy in the wettability equilibrium curve, the maximum wetting power (Fmax) of it and curve characterizes out the wettability of scaling powder jointly, wetting time is short more, wetting power is big more, shows that the wetability of scaling powder is good more.The wetting time and the wetting power of embodiment 1 described low-carbon environmentally-friendly water-based soldering flux are respectively 0.91s and 3.15mN, the wetting time and the wetting power of embodiment 2 described low-carbon environmentally-friendly water-based soldering fluxes are respectively 0.87s and 3.17mN, and the wetting time and the wetting power of embodiment 3 described low-carbon environmentally-friendly water-based soldering fluxes are respectively 0.93s and 3.14mN.The wetting time and the wetting power of Comparative Examples 1 described low-carbon environmentally-friendly water-based soldering flux are respectively 1.05s and 2.95mN.Aspect wetting power, the wetting time of all embodiment all will be lacked than the wetting time of Comparative Examples 1; Aspect the wetting time value, the maximum wetting power of all embodiment all maximum wetting power than Comparative Examples is big, and the wetting effect of this explanation low-carbon environmentally-friendly water-based soldering flux involved in the present invention reaches even is better than common pure fundamental mode scaling powder.Can satisfy the demand of circuit board assembling medium wave peak welder skill to scaling powder.This low-carbon environmentally-friendly water-based soldering flux does not contain the chemical substance of any halogen, the requirement of environmental protection and Halogen rules in the adaptation electron trade.This low-carbon environmentally-friendly water-based soldering flux is primary solvent with water, than the pure based scaling powder of tradition low-carbon (LC) more, and still less CO2 emission, therefore more environmental protection.The activation temperature of this low-carbon environmentally-friendly water-based soldering flux is between 90 ℃, and the preheat temperature of recommendation is 1 ℃.
The comparison of table 2 embodiment and Comparative Examples wettability
Though disclosed the specific embodiment of the present invention above, they are not the limitations of the scope of the invention, know those skilled in the art person the above concrete modifications and variations of implementing is also contained within the scope of the present invention.
Claims (10)
1. a low-carbon environmentally-friendly water-based soldering flux is used for circuit board assembling industry wave-soldering technology, is made up of solvent and active additive, it is characterized in that the solvent main component is a deionized water.
2. low-carbon environmentally-friendly water-based soldering flux as claimed in claim 1 is characterized in that described solvent also comprises polyethylene glycol 800, cetomacrogol 1000, polyethylene glycol 1200, one or more among the polyethylene glycol 1400.
3. low-carbon environmentally-friendly water-based soldering flux as claimed in claim 1 is characterized in that, described solvent also can comprise the ether compound of carbon number between 10～14.
4. low-carbon environmentally-friendly water-based soldering flux as claimed in claim 1 is characterized in that, described active additive comprises one or more water-soluble organic monoacid and surfactants.
5. low-carbon environmentally-friendly water-based soldering flux as claimed in claim 4 is characterized in that, water-soluble organic monoacid is a malonic acid, wherein two or more of succinic acid, glutaric acid, adipic acid.
6. low-carbon environmentally-friendly water-based soldering flux as claimed in claim 4 is characterized in that, surfactant is methylol BTA, 2-ethyl imidazol(e), N, wherein one or more of N-dimethyl lauryl amine.
7. as each described low-carbon environmentally-friendly water-based soldering flux in the claim 1 to 6, it is characterized in that the percentage by weight that described deionized water accounts for scaling powder is 80-97wt%.
8. low-carbon environmentally-friendly water-based soldering flux as claimed in claim 7 is characterized in that, the percentage by weight that deionized water accounts for scaling powder is 85-95wt%.
9. as each described low-carbon environmentally-friendly water-based soldering flux in the claim 1 to 6, it is characterized in that the percentage by weight that active additive accounts for the low-carbon environmentally-friendly water-based soldering flux gross weight is 3-20%.
10. low-carbon environmentally-friendly water-based soldering flux as claimed in claim 9 is characterized in that, the percentage by weight that active additive accounts for the low-carbon environmentally-friendly water-based soldering flux gross weight more suitably ratio is 5-15wt%.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105171272A (en) * | 2015-09-06 | 2015-12-23 | 湖北长海新能源科技有限公司 | Lead-acid storage battery polar plate scaling powder and preparation method thereof |
| CN107584233A (en) * | 2017-09-29 | 2018-01-16 | 苏州宙璎电子有限公司 | A kind of environmentally friendly cleaning-free water base scaling powder |
| CN108247239A (en) * | 2018-01-12 | 2018-07-06 | 吉安谊盛电子材料有限公司 | Lead acid accumulator pole group cast welding oiliness scaling powder |
| CN113798732A (en) * | 2021-09-26 | 2021-12-17 | 上海用森电子科技有限公司 | Water-based cleaning-free soldering flux and preparation method thereof |
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| CN1131076A (en) * | 1995-03-16 | 1996-09-18 | 雒社教 | Cleaning-free scaling powder |
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| CN1565791A (en) * | 2003-07-03 | 2005-01-19 | 梁树华 | Wash-free film forming water-based type welding flux |
| CN1836825A (en) * | 2006-04-21 | 2006-09-27 | 北京工业大学 | Water-soluble soldering flux dedicated for lead-free solder |
| CN101049661A (en) * | 2007-05-11 | 2007-10-10 | 北京工业大学 | Free from cleaning soldering flux without halogen and rosin in use for solder without lead |
| CN101596656A (en) * | 2009-07-02 | 2009-12-09 | 东莞市中实焊锡有限公司 | A kind of aqueous cleaning soldering flux for lead-free soldering and preparation method thereof |
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2010
- 2010-07-23 CN CN 201010234682 patent/CN101890596A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1131076A (en) * | 1995-03-16 | 1996-09-18 | 雒社教 | Cleaning-free scaling powder |
| CN1404959A (en) * | 2002-10-18 | 2003-03-26 | 深圳市唯特偶化工开发实业有限公司 | Halogen-free low-solid-contained water-base washing-free scaling powder |
| CN1565791A (en) * | 2003-07-03 | 2005-01-19 | 梁树华 | Wash-free film forming water-based type welding flux |
| CN1836825A (en) * | 2006-04-21 | 2006-09-27 | 北京工业大学 | Water-soluble soldering flux dedicated for lead-free solder |
| CN101049661A (en) * | 2007-05-11 | 2007-10-10 | 北京工业大学 | Free from cleaning soldering flux without halogen and rosin in use for solder without lead |
| CN101596656A (en) * | 2009-07-02 | 2009-12-09 | 东莞市中实焊锡有限公司 | A kind of aqueous cleaning soldering flux for lead-free soldering and preparation method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105171272A (en) * | 2015-09-06 | 2015-12-23 | 湖北长海新能源科技有限公司 | Lead-acid storage battery polar plate scaling powder and preparation method thereof |
| CN107584233A (en) * | 2017-09-29 | 2018-01-16 | 苏州宙璎电子有限公司 | A kind of environmentally friendly cleaning-free water base scaling powder |
| CN108247239A (en) * | 2018-01-12 | 2018-07-06 | 吉安谊盛电子材料有限公司 | Lead acid accumulator pole group cast welding oiliness scaling powder |
| CN108247239B (en) * | 2018-01-12 | 2021-01-22 | 吉安谊盛电子材料有限公司 | Oily scaling powder for cast welding of lead-acid storage battery plate group |
| CN113798732A (en) * | 2021-09-26 | 2021-12-17 | 上海用森电子科技有限公司 | Water-based cleaning-free soldering flux and preparation method thereof |
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Application publication date: 20101124 |