CN101875221A - Manufacturing method of schlieren microstructure as well as machine shell - Google Patents
Manufacturing method of schlieren microstructure as well as machine shell Download PDFInfo
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- CN101875221A CN101875221A CN2009101388386A CN200910138838A CN101875221A CN 101875221 A CN101875221 A CN 101875221A CN 2009101388386 A CN2009101388386 A CN 2009101388386A CN 200910138838 A CN200910138838 A CN 200910138838A CN 101875221 A CN101875221 A CN 101875221A
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Abstract
The invention relates to a manufacturing method of a schlieren microstructure as well as a machine shell. The manufacturing method of the schlieren microstructure comprises the following steps of: coating a releasing layer on a film carrier with a schlieren pattern layer; coating an ultraviolet photosensitive resin layer on the releasing layer; hardening the ultraviolet photosensitive resin layer to form the schlieren microstructure; and removing the schlieren pattern layer and the film carrier by utilizing the releasing layer.
Description
Technical field
The invention relates to a kind of preparation method and casing of micro-structural, particularly about a kind of preparation method and casing of smooth line micro-structural.
Background technology
Science and technology is showing improvement or progress day by day, and various electronic installations are constantly weeded out the old and bring forth the new, and the consumer focused on the function face, for example mostly to the requirement of electronic installation in the past: require fast operation, have multiple different function etc. concurrently.Yet, heal to become after the maturation when the development of electronic installation, make the electronic installation of each tame manufacturer on function difference, become similar.So, on the function face, can't highlight the characteristic of the electronic installation that each tame manufacturer releases, so the design of the casing of electronic installation is subjected to consumer's attention day by day, also becomes one of each tame manufacturer Consideration when releasing electronic installation.
Traditionally, the sheathing material of electronic installation mostly is plastic material or metal material greatly.With the made casing of metal material is example, one highest wisdom will be made decorative pattern and change on metal shell, must pass through procedure, for example: grinding, etching, computer Numerical Control (computer number control, CNC) after the processing of multiple apparatus such as processing machine, milling machine, could on the metal shell of electronic installation, produce the variation of decorative pattern.So, not only procedure is too numerous and diverse, and the required Production Time of expending is more, the expenditure that also raises the cost simultaneously, and produced decorative pattern changes and matt the generation.Therefore, on the aesthetic appearance that promotes whole electronic installation, can't reach preferable effect.
Therefore, change in order on the casing of electronic installation, to produce decorative pattern with gloss, light line product thereby generation, yet most smooth line product is with in-molded (in mold forming, IMF) fabrication techniques because the in-molded technology of this kind is not attained as yet in maturation, therefore has the problem of embrittlement to produce easily, particularly in the turning point of decorative pattern, easier failure.
Summary of the invention
In view of this, purpose of the present invention proposes a kind of preparation method and casing of smooth line micro-structural.Utilize method proposed by the invention, need not pass through numerous and diverse procedure, only need on the casing of electronic installation, to produce light line micro-structural, and then beautify the casing of whole electronic installation with gloss by several steps.
The present invention proposes a kind of preparation method of smooth line micro-structural, is applied to crust of the device, comprises the following step: the coating release layer is in the thin-film carrier with light line patterned layer; Coating ultraviolet light photosensitive resin layer is in release layer; Sclerosis ultraviolet light photosensitive resin layer is to form light line micro-structural; Utilize release layer to remove light line patterned layer and thin-film carrier.
The present invention also proposes a kind of casing and comprises outside: Installed puts
, adhesion layer and light line micro-structural.Adhesion layer is attached at crust of the device.Light line micro-structural is arranged at the adhesion layer top, and the step of wherein making light line micro-structural comprises: the coating release layer is in the thin-film carrier with light line patterned layer; Coating ultraviolet light photosensitive resin layer is in release layer; Sclerosis ultraviolet light photosensitive resin layer is to form light line micro-structural; Utilize release layer separated light line patterned layer and ultraviolet light photosensitive resin layer.
Description of drawings
Relevant preferred embodiment of the present invention and effect thereof, with conjunction with figs. explanation as after, wherein:
Figure 1A is the schematic diagram () of light line micro-structural first embodiment.
Figure 1B is the schematic diagram (two) of light line micro-structural first embodiment.
Fig. 1 C is the schematic diagram (three) of light line micro-structural first embodiment.
Fig. 1 D is the schematic diagram (four) of light line micro-structural first embodiment.
Fig. 1 E is the schematic diagram (five) of light line micro-structural first embodiment.
Fig. 2 A is the schematic diagram () of light line micro-structural second embodiment.
Fig. 2 B is the schematic diagram (two) of light line micro-structural second embodiment.
The specific embodiment
Please refer to schematic diagram ()～(five) that Figure 1A～Fig. 1 E is respectively light line micro-structural first embodiment.Light line micro-structural proposed by the invention can be applicable to the casing of electronic installation, and in order to decoration device shell 1, makes crust of the device 1 have diversity and changes and have a light line micro-structural of reflecting feel.
At first, shown in Figure 1A, provide thin-film carrier 10 with light line patterned layer 20.In this, thin-film carrier 10 can be made by materials such as PET, PVC or PP, and thickness about slightly 23～125 microns (μ m).Light line patterned layer 20 is arranged at thin-film carrier 10 surfaces.Wherein, approximately slightly 5～20 microns of the thickness of light line patterned layer 20 can be made by UV-radiation-sensitive resin (UV resin), can be adjusted to harder material in order to cooperate processing procedure, and are slightly different with the composition of the ultraviolet light photosensitive resin layer 40 that will introduce in the back.
Please refer to Figure 1B, according to the shape of light line patterned layer 20, in the surface of light line patterned layer 20 coating release layer 30.So, can in subsequent step, conveniently remove above-mentioned thin-film carrier 10 and light line patterned layer 20, this in after more detailed explanation will be arranged.Wherein, the thickness of release layer 30 is approximately slightly 3 microns.
Please refer to Fig. 1 C, coating ultraviolet light photosensitive resin layer 40 is in release layer 30, and the ultraviolet light photosensitive resin layer 40 that be coated with this moment is still uncured, is flexible material, therefore can mould shape according to light line patterned layer 20.That is to say, previous set light line patterned layer 20 is similar to be the mould of ultraviolet light photosensitive resin layer 40 moulding usefulness, can change light line patterned layer 20 according to the demand of different shapes or pattern, so can produce the ultraviolet light photosensitive resin layer 40 of difformity or pattern.After the coated ultraviolet light photosensitive resin layer 40, and will originally be hardened, and be formed light line micro-structural for soft ultraviolet light photosensitive resin layer 40 irradiating ultraviolet light.
Please refer to Fig. 1 D, adhesion layer 50 is set in ultraviolet light photosensitive resin layer 40 formed smooth line micro-structurals, with usefulness as follow-up attaching.Refer again to Fig. 1 E, attach adhesion layer 50 in crust of the device 1.Wherein, adhesion layer 50 can be similar to PUR, therefore when attaching, can utilize heating adhesion layer 50, makes adhesion layer 50 hot melts, so can smoothly adhesion layer 50 be attached on the crust of the device 1.Then utilize the previous release layer that is coated with 30, make light line patterned layer 20 and thin-film carrier 10 be located away from ultraviolet light photosensitive resin layer 40, that is remove light line patterned layer 20 and thin-film carrier 10.
So, can make ultraviolet light photosensitive resin layer 40 after adhesion layer 50 attaches, become the outermost layer that crust of the device 1 has grain pattern.Moreover, because ultraviolet light photosensitive resin layer 40 has multifrequency nature, for example: good hardness, wear-resisting, anti-solvent etc., can satisfy as crust of the device 1 outermost layer and have various variational smooth line micro-structural.In addition, above-mentioned crust of the device 1 can be metal or plastic material, but not as limit.
Please refer to schematic diagram () and (two) that Fig. 2 A and Fig. 2 B are respectively light line micro-structural second embodiment.The difference of second embodiment and first embodiment is, one deck decorative layers 60 that increase among second embodiment more.
When coated ultraviolet light photosensitive resin layer 40 in release layer 30, and sclerosis ultraviolet light photosensitive resin layer 40 can be provided with decorative layer 60 earlier in ultraviolet light photosensitive resin layer 40 formed smooth line micro-structurals with after forming light line micro-structural.Because ultraviolet light photosensitive resin layer 40 formed smooth line micro-structurals can be transparent,, can one deck decorative layer 60 be set again on the surface of ultraviolet light photosensitive resin layer 40 therefore in order to increase variability.Wherein, decorative layer 60 can be color printing layer or evaporation aluminium lamination, forms in the mode of printing with evaporation respectively.When decorative layer 60 is the color printing layer, can comply with different demand or hobbies, utilize the color printing layer to change the color that light line micro-structural is presented.On the other hand, when decorative layer 60 is the evaporation aluminium lamination, can allow light line micro-structural present the appearance tactile impression of metal sense.
In second embodiment, adhesion layer 50 is arranged at decorative layer 60, that is decorative layer 60 is arranged between adhesion layer 50 and the ultraviolet light photosensitive resin layer 40 formed smooth line micro-structurals, shown in Fig. 2 A.In this embodiment, decorative layer 60 and ultraviolet light photosensitive resin layer 40 formed smooth line micro-structurals are attached at crust of the device 1 simultaneously by adhesion layer 50, and utilize release layer 30 and remove light line patterned layer 20 and thin-film carrier 10, shown in Fig. 2 B.
Though technology contents of the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; anyly have the knack of this skill person; do not breaking away from spirit of the present invention a little change and the retouching done; all should be covered by in the category of the present invention, so protection scope of the present invention is as the criterion when looking claims person of defining.
Claims (17)
1. the preparation method of a light line micro-structural is applied to crust of the device, it is characterized in that, described preparation method comprises the following step:
The coating release layer is in the thin-film carrier with light line patterned layer;
Coating ultraviolet light photosensitive resin layer is in described release layer;
Harden described ultraviolet light photosensitive resin layer to form light line micro-structural; And
Utilize described release layer to remove described smooth line patterned layer and described thin-film carrier.
2. the preparation method of smooth line micro-structural according to claim 1 is characterized in that, described thin-film carrier is selected from PET, PVC, PP and group that combination constituted thereof.
3. the preparation method of smooth line micro-structural according to claim 1 is characterized in that, the thickness of described thin-film carrier is 23～125 microns.
4. the preparation method of smooth line micro-structural according to claim 1 is characterized in that, the thickness of described smooth line patterned layer is 5～20 microns.
5. according to the preparation method of the light line micro-structural of claim 1, it is characterized in that the thickness of described release layer is 3 microns.
6. the preparation method of smooth line micro-structural according to claim 1 is characterized in that, described smooth line micro-structural is transparent.
7. the preparation method of smooth line micro-structural according to claim 1 is characterized in that, described preparation method also comprises the following step:
Adhesion layer is set in described smooth line micro-structural; And
Attach described adhesion layer in described crust of the device.
8. the preparation method of smooth line micro-structural according to claim 7 is characterized in that, attaches the step of described adhesion layer in described crust of the device, comprises:
Heat described adhesion layer, make described adhesion layer hot melt.
9. the preparation method of smooth line micro-structural according to claim 1 is characterized in that, described preparation method also comprises the following step:
Decorative layer is set in described smooth line micro-structural;
Adhesion layer is set in described decorative layer; And
Attach described adhesion layer in described crust of the device.
10. the preparation method of smooth line micro-structural according to claim 9 is characterized in that, attaches the step of described adhesion layer in described crust of the device, comprises:
Heat described adhesion layer, make described adhesion layer hot melt.
11. the preparation method of smooth line micro-structural according to claim 9 is characterized in that, the described step that described decorative layer is set in described smooth line micro-structural comprises:
The print color printed layers is to form described decorative layer.
12. the preparation method of smooth line micro-structural according to claim 9 is characterized in that, the described step that described decorative layer is set in described smooth line micro-structural comprises:
Evaporation evaporation aluminium lamination is to form described decorative layer.
13. a casing is characterized in that, comprises:
Adhesion layer is attached at described crust of the device; And
Light line micro-structural is arranged at described adhesion layer top, and the step of making described smooth line micro-structural comprises:
The coating release layer is in light line patterned layer;
Coating ultraviolet light photosensitive resin layer is in described release layer;
Harden described ultraviolet light photosensitive resin layer to form described smooth line micro-structural; And
Utilize described release layer to separate described smooth line patterned layer and described ultraviolet light photosensitive resin layer.
14. casing according to claim 13 is characterized in that, described smooth line micro-structural is transparent.
15. casing according to claim 13 is characterized in that, described crust of the device also comprises decorative layer, is arranged between described adhesion layer and the described smooth line micro-structural.
16. casing according to claim 15 is characterized in that, described decorative layer is color printing layer or evaporation aluminium lamination.
17. casing according to claim 13 is characterized in that, described crust of the device comprises metal or plastic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101388386A CN101875221A (en) | 2009-04-29 | 2009-04-29 | Manufacturing method of schlieren microstructure as well as machine shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101388386A CN101875221A (en) | 2009-04-29 | 2009-04-29 | Manufacturing method of schlieren microstructure as well as machine shell |
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| Publication Number | Publication Date |
|---|---|
| CN101875221A true CN101875221A (en) | 2010-11-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2009101388386A Pending CN101875221A (en) | 2009-04-29 | 2009-04-29 | Manufacturing method of schlieren microstructure as well as machine shell |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110328979A (en) * | 2019-08-07 | 2019-10-15 | 武汉华工图像技术开发有限公司 | A kind of blocking film with deep texture structure, thermoprint structure and preparation method |
-
2009
- 2009-04-29 CN CN2009101388386A patent/CN101875221A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110328979A (en) * | 2019-08-07 | 2019-10-15 | 武汉华工图像技术开发有限公司 | A kind of blocking film with deep texture structure, thermoprint structure and preparation method |
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Application publication date: 20101103 |