CN101866917B - Active element array substrate and repair method thereof - Google Patents
Active element array substrate and repair method thereof Download PDFInfo
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- CN101866917B CN101866917B CN2010101889575A CN201010188957A CN101866917B CN 101866917 B CN101866917 B CN 101866917B CN 2010101889575 A CN2010101889575 A CN 2010101889575A CN 201010188957 A CN201010188957 A CN 201010188957A CN 101866917 B CN101866917 B CN 101866917B
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Abstract
The invention discloses an active element array substrate, which comprises a substrate, a plurality of pixels, a plurality of signal wires and a repair structure. The substrate is provided with a display area and a peripheral area. Pixel arrays are arranged on the display area of the substrate. The signal wires are electrically connected with the pixels, and the signal wires extend to the peripheral area from the display area respectively. The repair structure is collocated in the peripheral area, and the repair structure comprises a first repair wire, a second repair wire, an electrostatic release lead and an electrostatic protection element. The first repair wire is staggered with one end of the signal wire, and the first repair wire is electrically floated. The electrostatic protection element is connected between the second repair wire and the electrostatic release lead, and the electrostatic protection element is superposed and electrically insulated with the first repair wire.
Description
Technical field
The invention relates to a kind of array base palte and method for repairing and mending thereof, and particularly relevant for a kind of active component array base board and method for repairing and mending thereof.
Background technology
The function mode of flat-panel screens is to control each pixel (pixel) that is arranged in array with two groups of orthogonal holding wires, and reaches the purpose of video picture.In various video picture control models, what the most often use is the design of scan line (scan line) and data wire (data line), and these scan lines are perpendicular to one another with data wire, and define a plurality of pixels.Each scan line is switched on opening or to close the corresponding switch element in order, so that the signal that each data wire transmitted can write in the pixel, thereby changes the state of corresponding pixel, and reaches the purpose of control display frame.
Though it is ripe that the flat-panel screens technology has become, the element of display floater like active component array base board, can produce some flaws (defect) unavoidably in manufacture process.For instance, scan line on the active component array base board and data wire are very long because of its length, so the situation of broken string takes place easily.When scan line and data wire generation broken string, can cause the pixel of a part can't move (line defect), so must manage repair break lines.In addition, improve technology and realize that zero defect rate is unusual difficulty if only rely on, therefore, the preparing structure of active component array base board and flaw repairing technique just become quite important.In the prior art, the flaw of active component array base board is repaired and is adopted laser welding (laser welding) and/or laser cutting modes such as (laser cutting) to carry out usually.
In general, for repair break lines promptly, can be reserved with the patch cord more than on the active component array base board, under normal circumstances, patch cord is can be with holding wire staggered and have pad, and patch cord and holding wire are electrically insulated.When open circuit flaw (open defect) takes place and during broken string in holding wire, the two ends of holding wire that can this is impaired respectively via pad with the patch cord welding, make impaired holding wire keep the state that conducts, so that the pixel normal operation via patch cord.
In other words; Under normal circumstances, patch cord for electrically float and and holding wire between keep being electrically insulated, and only have when broken string takes place holding wire; Patch cord just can electrically connect through pad and holding wire by modes such as laser weldings, to keep conducting of holding wire.Yet, it should be noted that holding wire and patch cord are as easy as rolling off a log to receive the static discharge effect (electro static discharge, influence ESD) cause holding wire and patch cord to have the phenomenon of short circuit to take place.Thus, can influence the display quality of active component array base board, even cause active component array base board to scrap.
Summary of the invention
The present invention provides a kind of active component array base board, makes holding wire and patch cord not be vulnerable to the static discharge effects and has good element characteristic.
The present invention provides a kind of method for repairing and mending that is applicable to aforesaid active component array base board in addition, so that impaired holding wire is repaired, makes the pixel energy normal operation.
The present invention proposes a kind of active component array base board, and it comprises a substrate, a plurality of pixel, many signal line and a preparing structure.Substrate has a viewing area and an external zones.Pel array is arranged on the viewing area of substrate.Holding wire and pixel electrically connect, and each holding wire extends to external zones from the viewing area respectively.Preparing structure is disposed at external zones, and preparing structure comprises that one first patch cord, one second patch cord, a static discharge a lead and an electrostatic protection element.A wherein end of first patch cord and holding wire is staggered, and first patch cord is for electrically floating.Electrostatic protection element is connected in second patch cord and static and discharges between the lead, and the electrostatic protection element and first patch cord are overlapping and be electrically insulated each other.
The present invention proposes a kind of method for repairing and mending in addition, is suitable for repairing said active element array substrate, and when wherein the open circuit flaw took place a signal line, method for repairing and mending may further comprise the steps.With of the wherein end welding of first patch cord with holding wire with open circuit flaw.In the electrostatic protection element and the first patch cord overlapping, with electrostatic protection element and the welding of first patch cord, wherein second patch cord electrically connects with the holding wire with open circuit flaw through the electrostatic protection element and first patch cord.
The present invention proposes another kind of active component array base board, and it comprises a substrate, a plurality of pixel, many signal line and a preparing structure.Substrate has a viewing area and an external zones.Pel array is arranged on the viewing area of substrate.Holding wire and pixel electrically connect, and each holding wire extends to external zones from the viewing area respectively, and wherein a signal line has the open circuit flaw.Preparing structure is disposed at external zones, and preparing structure comprises that one first patch cord, one second patch cord, a static discharge a lead and an electrostatic protection element.A wherein end of first patch cord and holding wire is staggered, and first patch cord is for electrically floating.Electrostatic protection element is electrically connected at second patch cord and static discharges between the lead; And the electrostatic protection element and first patch cord are overlapping and be electrically insulated each other; Wherein first patch cord has at least one pad with a wherein end of the holding wire with open circuit flaw; The overlapping of the electrostatic protection element and first patch cord has at least one pad, so that second patch cord electrically connects with the holding wire with open circuit flaw through the electrostatic protection element and first patch cord.
The present invention proposes another active component array base board, and it comprises a substrate, a plurality of pixel, many signal line and a preparing structure.Substrate has a viewing area and an external zones.Pel array is arranged on the viewing area of substrate.Holding wire and pixel electrically connect, and each holding wire extends to external zones from the viewing area respectively, and wherein a signal line has the open circuit flaw.Preparing structure is disposed at external zones, and preparing structure comprises that one first patch cord, one second patch cord, a static discharge a lead and an electrostatic protection element.A wherein end of first patch cord and holding wire is staggered, and first patch cord is for electrically floating.Electrostatic protection element is electrically connected at second patch cord and static discharges between the lead; Wherein electrostatic protection element comprises a plurality of diodes of serial connection each other; Each diode comprises control electrode and the semi-conductor layer that one first electrode, one second electrode, one and second electrode electrically connect; Semiconductor layer is positioned at the control electrode top, and is connected between first electrode and second electrode, and one of them first electrode and the static with the electric connection of second electrode does not discharge the lead electric connection; And one of them second electrode and the electric connection of second patch cord of not electrically connecting with first electrode, and first patch cord and one of them second electrode are overlapping.Wherein first patch cord and holding wire with open circuit flaw wherein an end staggered place, second electrode and the first patch cord overlapping and part control electrode all have at least one pad with the part second electrode overlapping so that second patch cord is through part control electrode, part second electrode and first patch cord and the holding wire electric connection with the flaw of opening a way.
Based on above-mentioned, active component array base board of the present invention has preparing structure, and preparing structure ability guard signal line and patch cord are not vulnerable to the influence of static discharge effect, are short-circuited to avoid holding wire and patch cord.Thus, active component array base board can have preferable qualification rate and display quality.
For letting the above-mentioned feature and advantage of the present invention can be more obviously understandable, hereinafter is special lifts embodiment, and cooperates appended graphic elaborating as follows.
Description of drawings
Figure 1A is for looking sketch map on a kind of active component array base board of one embodiment of the invention;
Figure 1B is the enlarged diagram of the preparing structure of Figure 1A;
Fig. 2 A be one embodiment of the invention a kind of active component array base board on look sketch map;
Fig. 2 B is the enlarged diagram of the preparing structure of Fig. 2 A;
Fig. 3 is a kind of method for repairing and mending of one embodiment of the invention, is suitable for repairing the active component array base board of Figure 1A;
Fig. 4 is the enlarged diagram of another kind of preparing structure of the active component array base board of Figure 1A;
Fig. 5 is the enlarged diagram of another kind of preparing structure of the active component array base board of Fig. 2 A;
Fig. 6 is a kind of method for repairing and mending of one embodiment of the invention, is suitable for repairing the active component array base board of the preparing structure with Fig. 5.
[main element symbol description]
100,100a: active component array base board
102: substrate
104: the viewing area
106: external zones
110: pixel
112: active member
114: pixel electrode
116: gate driver circuit
118: source electrode drive circuit
120: scan line
130,130a: data wire
131a, 131b: end
134: flexible circuit board
136: control element
138: electrostatic protection element
140: preparing structure
142: the first patch cords
144: the second patch cords
146: static discharges lead
150: electrostatic protection element
152,152a, 152b: diode
154: the first electrodes
156: the second electrodes
158: control electrode
160: semiconductor layer
162: conductive layer
180: pad
D: open circuit flaw
Embodiment
Figure 1A is for looking sketch map on a kind of active component array base board of one embodiment of the invention, and Figure 1B is the enlarged diagram of the preparing structure of Figure 1A.Please with reference to Figure 1A, active component array base board 100 comprises a substrate 102, a plurality of pixel 110, multi-strip scanning line 120, many data wires 130 and a preparing structure 140.Substrate 102 has a viewing area 104 and an external zones 106.In the present embodiment, viewing area 104 is that the zone that dotted line among Figure 1A crosses interior zone dotted line to substrate 102 edges that come then is an external zones 106.Pixel 110 arrayed are on the viewing area 104 of substrate 102.Dispose gate driver circuit 116 and source electrode drive circuit 118 in the external zones 106.Pixel 110 comprises such as transistorized active member 112 and the pixel electrode 114 that electrically connects with active member 112.Scan line 120 and data wire 130 are interconnected on substrate 102, and 104 extend to external zones 106 from the viewing area respectively.Gate driver circuit 116 is connected to the active member 112 in the pairing pixel 110 via scan line 120 and data wire 130 respectively with source electrode drive circuit 118, with driving pixels 110.
Please be simultaneously with reference to Figure 1A and Figure 1B, preparing structure 140 is disposed at external zones 106, and preparing structure 140 comprises that one first patch cord 142, one second patch cord 144, a static discharge a lead 146 and an electrostatic protection element 150.First patch cord 142 is staggered and overlapping with a wherein end 131a of data wire 130.First patch cord 142 is for electrically floating, and first patch cord 142 is electrically insulated with data wire 130 each other.Electrostatic protection element 150 is connected in second patch cord 144 and static and discharges between the lead 146 (please check Figure 1B), and electrostatic protection element 150 and first patch cord 142 are overlapping and be electrically insulated each other.In the present embodiment, electrostatic protection element 150 for example is to comprise at least one diode 152, and diode 152 comprises one first electrode 154, one second electrode 156, a control electrode 158 and semi-conductor layer 160.Wherein, the control electrode 158 and second electrode 156 for example are to electrically connect by conductive layer 162.Wherein the conductive material layer 162 may be a transparent material (for example: indium tin oxide, aluminum tin oxide, indium zinc oxide, aluminum zinc oxide, Han, or other suitable material, or a combination of the above), the reflection Material (for example: gold, silver, copper, tin, aluminum, molybdenum, titanium, tantalum, or other suitable materials, or alloys of these materials, or said material is a nitride or oxide of these materials, or such materials nitrogen oxides, or a combination of the above), or a combination of the above.Conductive layer 162 materials of the embodiment of the invention are example with the transparent material, therefore, can be described as transparency conducting layer 162 again, but are not limited thereto.Semiconductor layer 160 is positioned at part control electrode 158 tops, and is connected between first electrode 154 and second electrode 156.First electrode 154 for example is to discharge lead 146 by transparency conducting layer 162 and static to electrically connect, and static release lead 146 for example is to be electrically connected at a common voltage end or a ground connection.Second electrode 156 for example is to electrically connect with second patch cord 144.Second patch cord 144 for example is to be connected to a control element 136 via source electrode drive circuit 118 and flexible circuit board 134, and control element 136 for example is a circuit control panel; Or second patch cord 144 for example be to be connected with flexible circuit board 134 via source electrode drive circuit 118.
In the present embodiment, active component array base board 100 for example is more to comprise an electrostatic protection element 138, connects each data wire 130, and is adjacent to first patch cord 142 and each data wire 130 staggered place.Electrostatic protection element 138 for example is a diode.Moreover; What deserves to be mentioned is; First patch cord 142 is staggered and overlapping with a wherein end 131a of data wire 130; Second patch cord 144 is staggered and overlapping with the other end 131b of data wire 130, and second electrode 156 of electrostatic protection element 150 and first patch cord 142 are overlapping and be electrically insulated each other.
In general, in making the technology of active component array base board or when using active component array base board, all probably cause the static discharge effect, and influence the element characteristic or the display quality of active component array base board.Particularly, the static discharge effect may cause holding wire and patch cord to be short-circuited.Therefore, in the present embodiment, active component array base board 100 is provided with electrostatic protection element 150, is not subject to the influence of static discharge effect with guard signal line (such as data wire 130) and patch cord 142.In detail; When taking place electrostatic charges accumulated improperly in the external zones 106 of active component array base board 100 or the situation of static discharge take place; Dispose electrostatic protection element 150 because second patch cord 144 and static discharge between the lead 146, so electrostatic energy is along the path of second electrode 156, first electrode 154 and the static release lead 146 of second patch cord 144, electrostatic protection element 150 and derive.Thus, can avoid holding wire (such as data wire 130) and patch cord 142 to receive electrostatic influence and be short-circuited, make active component array base board 100 can have preferable qualification rate and display quality.
Fig. 2 A be one embodiment of the invention a kind of active component array base board on look sketch map, and Fig. 2 B is the enlarged diagram of the preparing structure of Fig. 2 A.Fig. 3 is a kind of method for repairing and mending of one embodiment of the invention, is suitable for repairing the active component array base board of Figure 1A.What pay special attention to is; The member of active component array base board 100a shown in Fig. 2 A is identical in fact with the member of the active component array base board 100 shown in Figure 1A; But in the active component array base board 100a shown in Fig. 2 A; Wherein a signal line (such as data wire 130a) has open circuit flaw D, therefore needs to repair by preparing structure 140 and method for repairing and mending shown in Figure 3.
Please at first, carry out step S310 simultaneously with reference to Fig. 2 A, Fig. 2 B and Fig. 3, with of the wherein end 131a welding of first patch cord 142 with holding wire (such as data wire 130a) with open circuit flaw D.In the present embodiment; Wherein data wire 130a of active component array base board 100a has open circuit flaw D; First patch cord 142 is overlapping with the end 131a of the data wire 130a with open circuit flaw D, and second patch cord 144 is overlapping with the other end 131b of the data wire 130a with open circuit flaw D.Therefore, in the present embodiment, for example be an end 131a overlapping that welds first patch cord 142 and data wire 130a with the mode of laser welding, to form a pad 180.Thus, the data wire 130a that has open circuit flaw D is by pad 180 and 142 electric connections of first patch cord.Moreover in the present embodiment, method for repairing and mending more comprises the other end 131b overlapping of welding second patch cord 144 and data wire 130a, to form a pad 180.
Then; Carry out step S320; In electrostatic protection element 150 and first patch cord, 142 overlappings; With electrostatic protection element 150 and 142 welding of first patch cord, wherein second patch cord 144 electrically connects with the holding wire (such as data wire 130a) with open circuit flaw D through the electrostatic protection element 150 and first patch cord 142.In detail; In the present embodiment; Electrostatic protection element 150 for example is to comprise at least one diode 152; Diode 152 comprises one first electrode 154, one second electrode 156, a control electrode 158 and semi-conductor layer 160, semiconductor layer 160 be arranged at control electrode 158 tops and be connected in first electrode 154 and second electrode 156 between.Electrostatic protection element 150 and first patch cord, 142 overlappings for example are second electrode 156 and first patch cord, 142 overlappings; Therefore; Welding electrostatic protection element 150 and first patch cord, 142 overlappings for example are welding second electrode 156 and first patch cord, 142 overlappings, to form a pad 180 in second electrode 156 and first patch cord, 142 overlappings.
Please with reference to Fig. 2 A and Fig. 2 B, in the present embodiment, second electrode 156 for example is to electrically connect with second patch cord 144.Therefore; After welding first patch cord 142 and data wire 130a overlapping, second patch cord 144 and data wire 130a overlapping and second electrode 156 and first patch cord, 142 overlappings; Signal can be via second electrode 156 of second patch cord 144, electrostatic protection element 150, pad 180 (being positioned at first patch cord 142 and second electrode, 156 overlappings), first patch cord 142, pad 180 (being positioned at data wire 130a and first patch cord, 142 overlappings) and is sent to the end 131a of data wire 130a; And the other end 131b with data wire 130a welds by pad 180 owing to second patch cord 144, so signal can be sent to other end 131b by the end 131a of the data wire 130a with open circuit flaw D via above-mentioned path.Thus, the data wire 130a with open circuit flaw D can keep the state that conducts by preparing structure 140, makes pixel 110 ability normal operations.
In addition, in other embodiment, second electrode 156 also can be connected to like the described static of Fig. 4 of following embodiment and discharge lead 146.Embodiments of the invention are that being not attached to like the described static release of Fig. 4 of following embodiment lead 146 with second electrode 156 is example, but are not limited thereto.
Can know that by the above embodiments the preparing structure 140 of active component array base board 100,100a can not be vulnerable to the static discharge effects with patch cord 142 by protected data line 130, and can repair the data wire 130a with open circuit flaw D.In other words; Shown in Figure 1A and Figure 1B; At holding wire (such as data wire 130) is under the normal situation, because preparing structure 140 can be derived static effectively, therefore can avoid holding wire (such as data wire 130) and patch cord 142 to have the situation of short circuit to take place because of receiving the static discharge effect.Thus, can promote the qualification rate of active component array base board 100, and then make display floater have superior display quality.In addition; Shown in Fig. 2 A and Fig. 2 B, when holding wire (such as data wire 130a) had open circuit flaw D, preparing structure 140 can be in order to repair signal line (such as data wire 130a); Make holding wire keep the state that conducts, so that pixel 110 normal operations with open circuit flaw.In other words, the design of preparing structure 140 makes active component array base board 100,100a have good element characteristic and good display quality.
What specify is; Though be being example at the wherein end 131a of data wire 130a configuration preparing structure 140 in the above embodiments, preparing structure 140 also can be configured in the other end 131b of data wire 130a or be disposed at two ends 131a, the 131b of data wire 130a simultaneously.In addition; Though be to be example in the above embodiments preparing structure 140 is used for repairing data wire 130; Also can be configured to scan line staggeredly and have the scan line of open circuit flaw but have preparing structure that common knowledge the knowledgeable should understand active component array base board of the present invention in the affiliated field, not give unnecessary details in this in order to repairing.Moreover, in the above embodiments, be to comprise that with electrostatic protection element 150 diode 152 is an example, but electrostatic protection element 150 also can comprise a plurality of diodes or comprise the diode with other configuration.
Fig. 4 is the enlarged diagram of another kind of preparing structure 140 of the active component array base board of Figure 1A.Please with reference to Fig. 4, in the present embodiment, preparing structure 140 comprises that one first patch cord 142, one second patch cord 144, a static discharge a lead 146 and an electrostatic protection element 150.A wherein end 131a of first patch cord 142 and data wire 130 interlocks and has an overlapping.First patch cord 142 is for electrically floating, and first patch cord 142 is electrically insulated with data wire 130 each other.Electrostatic protection element 150 is connected in second patch cord 144 and static and discharges between the lead 146, and electrostatic protection element 150 and first patch cord 142 are overlapping and be electrically insulated each other.
Please with reference to Fig. 4; In the present embodiment; Electrostatic protection element 150 for example is to comprise a plurality of diode 152a, the 152b of serial connection each other, and each diode 152a, 152b comprise one first electrode 154, one second electrode 156, a control electrode 158 and semi-conductor layer 160.Wherein, control electrode 158 for example is to electrically connect by the conductive layer 162 and second electrode 156.Wherein the conductive material layer 162 may be a transparent material (for example: indium tin oxide, aluminum tin oxide, indium zinc oxide, aluminum zinc oxide, Han, or other suitable material, or a combination of the above), the reflection Material (for example: gold, silver, copper, tin, aluminum, molybdenum, titanium, tantalum, or other suitable materials, or alloys of these materials, or said material is a nitride or oxide of these materials, or such materials nitrogen oxides, or a combination of the above), or a combination of the above.Conductive layer 162 materials of the embodiment of the invention are example with the transparent material, therefore, can be described as transparency conducting layer 162 again, but are not limited thereto.Semiconductor layer 160 is positioned at part control electrode 158 tops, and is connected between first electrode 154 and second electrode 156.First electrode 154 of diode 152a is connected with second electrode 156 of diode 152b, with serial connection diode 152a and diode 152b.Moreover; One of them first electrode 154 (being first electrode 154 of diode 152b) with 156 electric connections of second electrode for example is not to discharge lead 146 by transparency conducting layer 162 and static to electrically connect, and it for example is to be electrically connected at a common voltage end or a ground connection that static discharges lead 146.One of them second electrode 156 (being second electrode 156 of diode 152a) with 154 electric connections of first electrode for example is not and 144 electric connections of second patch cord; Second patch cord 144 for example is to be connected to a control element 136, and control element 136 for example is a circuit control panel or flexible circuit board.
In the present embodiment; Wherein an end 131a is staggered and overlapping with data wire 130 for first patch cord 142; Second patch cord 144 is staggered and overlapping with the other end 131b of data wire 130; Second electrode 156 (being second electrode 156 of diode 152b) is overlapping with first patch cord 142, and control electrode 158 (being the control electrode 158 of diode 152a) is overlapping with second electrode 156 (being second electrode 156 of diode 152b).
Please be simultaneously with reference to Figure 1A and Fig. 4; When taking place electrostatic charges accumulated improperly in the external zones 106 of active component array base board 100 or the situation of static discharge take place; Dispose electrostatic protection element 150 because second patch cord 144 and static discharge between the lead 146, so electrostatic energy is along the path of first electrode 154 of second electrode 156 of first electrode 154 of second electrode 156 of the diode 152a of second patch cord 144, electrostatic protection element 150, diode 152a, diode 152b, diode 152b and static release lead 146 and derive.Thus, can avoid holding wire (such as data wire 130) and patch cord 142 to receive electrostatic influence and be short-circuited, make active component array base board 100 can have preferable qualification rate and display quality.
Fig. 5 is the enlarged diagram of another kind of preparing structure 140 of the active component array base board of Fig. 2 A.Fig. 6 is a kind of method for repairing and mending of one embodiment of the invention, is suitable for repairing the active component array base board 100a of the preparing structure 140 with Fig. 5.Please be simultaneously with reference to Fig. 2 A and Fig. 5, in the present embodiment, the wherein signal line (such as data wire 130a) of active component array base board 100a has open circuit flaw D, therefore needs to repair by the preparing structure 140 of Fig. 5 and method for repairing and mending shown in Figure 6.
Please at first, carry out step S610 simultaneously with reference to Fig. 2 A, Fig. 5 and Fig. 6, with of the wherein end 131a welding of first patch cord 142 with holding wire (such as data wire 130a) with open circuit flaw D.In the present embodiment; Wherein data wire 130a of active component array base board 100a has open circuit flaw D; First patch cord 142 is overlapping with the end 131a of the data wire 130a with open circuit flaw D, and second patch cord 144 is overlapping with the other end 131b of the data wire 130a with open circuit flaw D.Therefore, in the present embodiment, for example be an end 131a overlapping that welds first patch cord 142 and data wire 130a with the mode of laser welding, to form a pad 180.Thus, the data wire 130a that has open circuit flaw D is by pad 180 and 142 electric connections of first patch cord.Moreover in the present embodiment, method for repairing and mending more comprises the other end 131b overlapping of welding second patch cord 144 and data wire 130a, to form a pad 180.
Then, carry out step S620, in second electrode 156 and first patch cord, 142 overlappings, with second electrode 156 and 142 welding of first patch cord.In the present embodiment, second electrode 156 of diode 152b for example is overlapping with first patch cord 142.Therefore, this step for example is to weld second electrode 156 and first patch cord 142 of diode 152b with the mode of laser welding, to form a pad 180.
Then; Carry out step S630; With part control electrode 158 and 156 welding of part second electrode, so that second patch cord 144 electrically connects through part control electrode 158, part second electrode 156 and first patch cord 142 and the holding wire (such as data wire 130a) with open circuit flaw D.In the present embodiment, electrostatic protection element 150 for example is to comprise a plurality of diode 152a, the 152b of serial connection each other, and each diode 152a, 152b comprise one first electrode 154, one second electrode 156, a control electrode 158 and semi-conductor layer 160.Wherein, the control electrode 158 of diode 152a is overlapping with second electrode 156 of diode 152a.Therefore, in this step, welding portion control electrode 158 for example is the control electrode 158 of welding diode 152a and second electrode 156 of diode 152a with part second electrode 156, to form a pad 180.Wherein, Because for example being second electrode 156 with diode 152b, the control electrode 158 of diode 152a electrically connects; Therefore second electrode 156 of diode 152a can electrically connect through the control electrode 158 of pad 180 with diode 152a, and then electrically connects with second electrode 156 of diode 152b.
Please with reference to Fig. 2 A and Fig. 5, in the present embodiment, second electrode 156 of diode 152a for example is to electrically connect with second patch cord 144.Therefore; After second electrode 156 of the control electrode 158 of second electrode 156 of welding first patch cord 142 and data wire 130a overlapping, diode 152b and first patch cord, 142 overlappings and diode 152a and diode 152a; Signal can be through second patch cord 144, electrostatic protection element 150 second electrode 156, pad 180 (being positioned at second electrode, 156 overlappings of first patch cord 142 and diode 152b), first patch cord 142, the signal pad 180 (being positioned at data wire 130a and first patch cord, 142 overlappings) of diode 152b of control electrode 158, electrostatic protection element 150 of diode 152a of second electrode 156, pad 180 (being positioned at the control electrode 158 of diode 152a and second electrode, 156 overlappings of diode 152a), electrostatic protection element 150 of diode 152a be sent to the end 131a of data wire 130a; And the other end 131b with data wire 130a welds by pad 180 owing to second patch cord 144, so signal can be sent to other end 131b by the end 131a of the data wire 130a with open circuit flaw D via above-mentioned path.Thus, the data wire 130a with open circuit flaw D can keep the state that conducts by preparing structure 140, makes pixel 110 ability normal operations.
In addition, in other embodiment, second electrode 156 of diode 152b also can be not attached to static like the said design of Fig. 2 of above-mentioned embodiment and discharge lead 146.Embodiments of the invention are that second electrode 156 with diode 152b is connected to static to discharge lead 146 be example, but are not limited thereto.
Can know that by the above embodiments the preparing structure 140 of active component array base board 100,100a can not be vulnerable to the static discharge effects with patch cord 142 by protected data line 130, and can repair the data wire 130a with open circuit flaw.In other words; Like Figure 1A and shown in Figure 4; At holding wire (such as data wire 130) is under the normal situation, because preparing structure 140 can be derived static effectively, therefore can avoid holding wire (such as data wire 130) and patch cord 142 to have the situation of short circuit to take place because of receiving the static discharge effect.Thus, can promote the qualification rate of active component array base board 100, and then make display floater have superior display quality.In addition; Like Fig. 2 A and shown in Figure 5, when holding wire (such as data wire 130a) had open circuit flaw D, preparing structure 140 can be in order to repair signal line (such as data wire 130a); Make holding wire keep the state that conducts, so that pixel 110 normal operations with open circuit flaw.In other words, the design of preparing structure 140 makes active component array base board 100,100a have good element characteristic and good display quality.
What specify is, though be being example at the wherein end 131a of data wire 130a configuration preparing structure 140 in the above embodiments, preparing structure 140 also can be configured in other end 131b or two ends 131a, the 131b of data wire 130a.In addition; Though in the above embodiments, be that to be used for repairing data wire 130 be example only with preparing structure 140, under have preparing structure that common knowledge the knowledgeable should understand active component array base board of the present invention in the field and also can be configured to scan line staggered and have a scan line of open circuit flaw in order to repairing.Moreover, in the above embodiments, be to comprise that with electrostatic protection element 150 two diodes 152 are example, but electrostatic protection element 150 also can comprise the diode of serial connection more than two or comprise the diode with other configuration.
In sum, active component array base board of the present invention has preparing structure, and preparing structure can be derived static effectively.Therefore; When taking place electrostatic charges accumulated improperly in the external zones of active component array base board or the situation of static discharge take place; Preparing structure can the guard signal line and patch cord be not vulnerable to the influence of static discharge effect, and then avoid holding wire and patch cord to be short-circuited.That is active component array base board of the present invention is not vulnerable to the destruction of static discharge and has good quality.Therefore, when display floater has said active element array substrate, display floater also have superior display quality and be difficult for because of the destruction of static discharge impaired.
Though the present invention discloses as above with preferred embodiment; Right its is not in order to limit the present invention; Under the situation that does not deviate from spirit of the present invention and essence thereof; Those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (18)
1. active component array base board comprises:
One substrate has a viewing area and an external zones;
A plurality of pixels, arrayed is on this viewing area of this substrate;
Many signal line electrically connect with those pixels, and respectively this holding wire extend to this external zones from this viewing area respectively; And
One preparing structure is disposed at this external zones, and this preparing structure comprises:
One first patch cord, staggered with a wherein end of those holding wires, and this first patch cord is for electrically floating;
One second patch cord;
One static discharges lead; And
One electrostatic protection element is connected in this second patch cord and this static and discharges between the lead, and this electrostatic protection element and this first patch cord are overlapping and be electrically insulated each other.
2. active component array base board as claimed in claim 1 is characterized in that, those holding wires comprise multi-strip scanning line and many data wires, and those scan lines and those data wires are staggered.
3. active component array base board as claimed in claim 1 is characterized in that, this static discharges lead and is electrically connected at a common voltage end.
4. active component array base board as claimed in claim 1 is characterized in that, this static discharges lead ground connection.
5. active component array base board as claimed in claim 1 is characterized in that this electrostatic protection element comprises at least one diode, and this diode comprises:
One first electrode;
One second electrode;
One control electrode electrically connects with this second electrode; And
Semi-conductor layer is positioned at this control electrode top, and is connected between this first electrode and this second electrode.
6. active component array base board as claimed in claim 5; It is characterized in that; This first electrode and this static discharge lead and electrically connect, this second electrode and the electric connection of this second patch cord, and wherein this second electrode and this first patch cord are overlapping and be electrically insulated each other.
7. active component array base board as claimed in claim 1; It is characterized in that; This electrostatic protection element comprises a plurality of diodes of serial connection each other; Respectively this diode comprises one first electrode, one second electrode, one and this second electrode control electrode and the semi-conductor layer that electrically connect, and this semiconductor layer is positioned at this control electrode top, and is connected between this first electrode and this second electrode.
8. active component array base board as claimed in claim 7; It is characterized in that; One of them first electrode and this static with this second electrode electric connection does not discharge the lead electric connection; And one of them second electrode and the electric connection of this second patch cord of not electrically connecting with this first electrode, and this first patch cord and one of them second electrode are overlapping.
9. active component array base board as claimed in claim 1 is characterized in that, this second patch cord is connected to a control element.
10. active component array base board as claimed in claim 1 is characterized in that, further comprises another electrostatic protection element, connects respectively this holding wire, and is adjacent to this first patch cord and this holding wire staggered place respectively.
11. a method for repairing and mending is suitable for repairing the described active component array base board of claim 1, when wherein open circuit flaw (open defect) took place a signal line, this method for repairing and mending comprised:
With of the wherein end welding of this first patch cord with holding wire with this open circuit flaw; And
At this electrostatic protection element and this first patch cord overlapping, with this electrostatic protection element and the welding of this first patch cord, wherein this second patch cord electrically connects with the holding wire with this open circuit flaw through this electrostatic protection element and this first patch cord.
12. method for repairing and mending as claimed in claim 11; It is characterized in that; This electrostatic protection element comprises at least one diode; This diode comprises a control electrode, one first electrode, one second electrode and semi-conductor layer, and this semiconductor layer is arranged at this control electrode top and is connected between this first electrode and this second electrode, and wherein this electrostatic protection element and this first patch cord overlapping are this second electrode and this first patch cord overlapping.
13. a method for repairing and mending is suitable for repairing the described active component array base board of claim 8, when wherein open circuit flaw (open defect) took place a signal line, this method for repairing and mending comprised:
With of the wherein end welding of this first patch cord with holding wire with this open circuit flaw;
At this second electrode and this first patch cord overlapping, with this second electrode and the welding of this first patch cord; And
With part control electrode and the welding of part second electrode, so that this second patch cord electrically connects through part control electrode, part second electrode and this first patch cord and the holding wire with this open circuit flaw.
14. an active component array base board is characterized in that, comprising:
One substrate has a viewing area and an external zones;
A plurality of pixels, arrayed is on this viewing area of this substrate;
Many signal line electrically connect with those pixels, and respectively this holding wire extend to this external zones from this viewing area respectively, and wherein a signal line has open circuit flaw (open defect); And
One preparing structure is disposed at this external zones, and this preparing structure comprises:
One first patch cord, staggered with a wherein end of those holding wires, and this first patch cord is for electrically floating;
One second patch cord;
One static discharges lead;
One electrostatic protection element; Being electrically connected at this second patch cord and this static discharges between the lead; This electrostatic protection element and this first patch cord are overlapping and be electrically insulated each other; Wherein this first patch cord has at least one pad with the wherein end with holding wire of this open circuit flaw; The overlapping of this electrostatic protection element and this first patch cord has at least one pad, so that this second patch cord electrically connects with the holding wire with this open circuit flaw through this electrostatic protection element and this first patch cord.
15. active component array base board as claimed in claim 14; It is characterized in that; This electrostatic protection element comprises at least one diode, and this diode comprises a control electrode, one first electrode, one second electrode and semi-conductor layer, and this semiconductor layer is arranged at this control electrode top and is connected between this first electrode and this second electrode; Wherein this electrostatic protection element and this first patch cord overlapping are this second electrode and this first patch cord overlapping, and this overlapping has this pad.
16. active component array base board as claimed in claim 14 is characterized in that, further comprises another electrostatic protection element, connects respectively this holding wire, and is adjacent to this first patch cord and this holding wire staggered place respectively.
17. an active component array base board is characterized in that, comprising:
One substrate has a viewing area and an external zones;
A plurality of pixels, arrayed is on this viewing area of this substrate;
Many signal line electrically connect with those pixels, and respectively this holding wire extend to this external zones from this viewing area respectively, and wherein a signal line has open circuit flaw (open defect); And
One preparing structure is disposed at this external zones, and this preparing structure comprises:
One first patch cord, staggered with a wherein end of those holding wires, and this first patch cord is for electrically floating;
One second patch cord;
One static discharges lead; And
One electrostatic protection element; Being electrically connected at this second patch cord and this static discharges between the lead; Wherein this electrostatic protection element comprises a plurality of diodes of serial connection each other; Respectively this diode comprises one first electrode, one second electrode, one and this second electrode control electrode and the semi-conductor layer that electrically connect; This semiconductor layer is positioned at this control electrode top, and is connected between this first electrode and this second electrode, and one of them first electrode and this static with this second electrode electric connection does not discharge the lead electric connection; And one of them second electrode and the electric connection of this second patch cord of not electrically connecting with this first electrode, and this first patch cord and one of them second electrode are overlapping;
Wherein this first patch cord and the holding wire with this open circuit flaw wherein an end staggered place, this second electrode and this first patch cord overlapping and part control electrode and the part second electrode overlapping all have at least one pad so that this second patch cord is through part control electrode, part second electrode and this first patch cord and have the holding wire electric connection of this open circuit flaw.
18. active component array base board as claimed in claim 17 is characterized in that, further comprises another electrostatic protection element, connects respectively this holding wire, and is adjacent to this first patch cord and this holding wire staggered place respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101889575A CN101866917B (en) | 2010-05-24 | 2010-05-24 | Active element array substrate and repair method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101889575A CN101866917B (en) | 2010-05-24 | 2010-05-24 | Active element array substrate and repair method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN101866917A CN101866917A (en) | 2010-10-20 |
| CN101866917B true CN101866917B (en) | 2012-01-25 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6753885B2 (en) * | 2018-04-16 | 2020-09-09 | シャープ株式会社 | How to fix defects in active matrix boards, display devices, and active matrix boards |
| CN113611689B (en) * | 2021-08-06 | 2024-03-22 | 武汉天马微电子有限公司 | Display panel and display device |
| TW202332072A (en) * | 2022-01-19 | 2023-08-01 | 友達光電股份有限公司 | Sensing device |
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