CN101854027A - Liquid refrigerator for semiconductor laser - Google Patents
Liquid refrigerator for semiconductor laser Download PDFInfo
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- CN101854027A CN101854027A CN 201010161021 CN201010161021A CN101854027A CN 101854027 A CN101854027 A CN 101854027A CN 201010161021 CN201010161021 CN 201010161021 CN 201010161021 A CN201010161021 A CN 201010161021A CN 101854027 A CN101854027 A CN 101854027A
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Abstract
The invention discloses a liquid refrigerator for a semiconductor laser. The liquid refrigerator for the semiconductor laser comprises a main body of the refrigerator, wherein the upper end of the main body of the refrigerator is a mounting plane; the mounting plane is provided with one or more reserved channels in parallel; one end of each reserved channel is provided with a water inlet, while the other is provided with a water outlet; a clamping seat is arranged at the bottom of each reserved channel; a radiating fin assembly is inserted into the clamping seat; the radiating fin assembly consists of a connecting cover board and a fin array fixedly arranged on the lower side of the connecting cover board; the fin array is extended into the reserved channel and the lower end of the fin array is inserted into the clamping seat; and the connecting cover board and the reserved channel form a sealed radiating channel. The liquid refrigerator has the advantages that: the heat-dissipating capacity is improved and the service life is prolonged, because the liquid refrigerator enlarges the radiating area and increases the turbulent flow during liquid flow by adopting a radiating mode of combining liquid with the fins and changing the forms of the liquid channels; and the use cost is reduced, because in the liquid refrigerator, deionized water does not need to be used as a cooling medium.
Description
Technical field
The invention belongs to semiconductor laser and make the field, relate to a kind of liquid chiller, especially a kind of liquid chiller that is applicable to high power semiconductor lasers.
Background technology
Along with power output, electro-optical efficiency, reliability and the stability of semiconductor laser improves constantly, high power semiconductor lasers is in industry, and the application in medical treatment and the military affairs is more extensive, and the market demand is huge, and development prospect is wide.The performance of laser is except outside the Pass having with chip, also with the heat radiation of laser with encapsulate relevant.In order to improve the reliability and stability of laser, reduce production costs, designing efficiently, radiator structure is necessary.In addition, also require encapsulating structure design and make that simple cost is low, radiating efficiency is high.
At present, high power semiconductor lasers has had commercially produced product to occur, the heat radiation of this class laser mainly contains micro channels liquid refrigeration mode, liquid refrigerating type and conducts three kinds of cooling types, all there is deficiency in these three kinds of types of cooling, are listed below: 1). micro channels liquid refrigerator operation and maintenance cost height.Generally the microchannel is by the high-termal conductivity metal, and commonly used doing as copper forms, and the cooling fluid of refrigerator directly contacts with the laser both positive and negative polarity, therefore must use high-quality deionized water as coolant when work, prevents the both positive and negative polarity conducting.Deionized water is as coolant cost height, and the necessary deionized water that adopts low conductivity, so the operation and maintenance cost is very high.
2). micro channels liquid refrigerator difficulty of processing is big, manufacturing cost is high, useful life is short.The micro channels liquid refrigerator is by the stacked machine-shaping of which floor very thin copper sheet, and inner microchannel is approximately 300 microns.In manufacture process, need process accurately each layer copper sheet, so that the microchannel after stacked is in the strong turbulent flow of the out-of-date formation heat-sinking capability of flow of liquid.Therefore, the accurate processing of microchannel refrigerator is a difficult point, because the Precision Machining difficulty of microchannel refrigerator is quite big, causes its manufacturing cost very high.And the flowing space of coolant is very narrow and small in the refrigerator of microchannel, is easy to generate unnecessary pressure and falls, and air-proof condition is abominable, causes the shortening in useful life of microchannel refrigerator.In addition, in the process of laser works, if when having impurity in the coolant (being generally deionized water), these impurity are easy to attached on the inwall of microchannel, thereby cause the electrochemical corrosion of microchannel tube wall, may be when serious with the tube wall eating thrown of microchannel refrigerator, both the fail safe to laser caused great influence, thereby influenced the useful life of laser.
3). common liq refrigerator poor refrigerating efficiency.This refrigerator mainly relies on the through channel of middle or near-thermal source one side to dispel the heat, area of dissipation is limited, and its inner coolant can not effectively form turbulent flow, and convection transfer rate is low, therefore the heat that can not efficiently chip of laser be produced is taken away poor refrigerating efficiency.
4). the conduction refrigerator mainly by high thermal conductivity metal or other thermal conductivity preferably material carry out heat loss through conduction, heat-sinking capability is limited, has restricted the power expansion of laser.
Summary of the invention
The objective of the invention is to overcome the shortcoming of above-mentioned prior art, a kind of liquid chiller that is used for semiconductor laser is provided, this liquid chiller adopts the radiating mode of liquid in conjunction with fin, by changing the fluid passage form, increase area of dissipation, increase the turbulent flow in the liquid flow, reach the purpose that improves heat-sinking capability and increase the service life.And this liquid chiller does not need to use deionized water as coolant, has therefore reduced use cost.
The objective of the invention is to be achieved through the following technical solutions: this liquid chiller that is used for semiconductor laser, comprise the refrigerator main body, the upper end of described refrigerator main body is a mounting plane, parallel one or more reserved passageway that offers on the described mounting plane, end in the reserved passageway is provided with water inlet, the other end is provided with delivery port, the bottom of reserved passageway is provided with deck, be inserted with the radiating fin assembly on the deck, described radiating fin assembly is formed in the array of fins that is connected the cover plate downside with stationary arrangement by connecting cover plate, array of fins puts in the reserved passageway and the lower end is inserted on the deck, connects the heat dissipation channel that cover plate and reserved passageway are formed sealing.
Above-mentioned refrigerator main body is a rectangular block shape, and the water inlet of described reserved passageway and delivery port are communicated on the sidewall at refrigerator main body two ends by the cooling passage of being located in the refrigerator main body respectively.
The array of fins of above-mentioned radiating fin assembly is to be become by a plurality of bar shaped sheet fins set that are parallel to each other, and described bar shaped sheet fin vertical fixing is in connecting on the cover plate; Described deck is provided with many bar shaped sheet fin lower ends corresponding groove with array of fins, and the lower end of described a plurality of bar shaped sheet fins inserts in respectively in each groove of deck.
The array of fins of above-mentioned radiating fin assembly is made up of in the column that connects on the cover plate a plurality of orthogonal array, described deck is provided with a plurality of fixing holes corresponding with the column lower end of array of fins, and the lower end of described a plurality of columns inserts in respectively in each fixing hole of deck.
A preferred embodiment of the present invention is: the above cross section of forming a plurality of columns of array of fins is circle, and the fixing hole on the described deck is a circular hole, and the internal diameter of circular hole is identical with the external diameter of column.
Another preferred embodiment of the present invention is: the above cross section of forming a plurality of columns of array of fins is a polygon, and the hole cross sectional shape of fixing hole adapts with corresponding column shape of cross section on the described deck.
The above connects cover plate and array of fins is an integral structure.
The lateral surface of above-mentioned connection cover plate is concordant with mounting plane, vertically offers many groups on the described mounting plane and is used for fixing the screw hole that clings to bar.
In the preferred version of the present invention, the material that the refrigerator main body is selected for use is high metal of thermal conductivity or pottery.
The present invention has following beneficial effect: 1) cost is low.The present invention includes refrigerator main body, radiating fin assembly and deck, the structure of these parts is easy to machining, and cost of manufacture is low.For example the refrigerator main body can be directly with the preparation of standard machinery processing method, and can be on the refrigerator main body auxiliary process such as thread mill drilling; Radiating fin assembly and deck can be used the type of squeezing or die casting or one-shot forming technique production according to its shape, and be lower than the refrigerator cost of general use wire cutting technology, is suitable for mass production.
2) heat-sinking capability is strong.The present invention adopts liquid refrigerating, and it uses heat radiating fin structure in fluid path, in inside with water route demultiplexing current, constituted complicated micro-channel units, increase the area of dissipation of liquid chiller greatly, and strengthened the turbulivity of coolant, thus the refrigeration of reinforcement refrigerator.
3) reliability height.Therefore compare with general microchannel, the water route size of this refrigerator is big, and can add anticorrosion coating, has greatly reduced the risk of the blocked or heavy corrosion in water route, and reliability improves greatly.
4) have adjustable, each parts of the present invention can be according to different heat radiation requirements, the profile of draw-in groove in change fin profile and the corresponding deck, and agent structure does not need to change.Can select to have only the structure of a slice fin when for example, requiring to hang down as heat radiation; Heat radiation can select to have the structure of multi-disc fin when having relatively high expectations, convenient to structure reasonable utilization and to the management and control of cost.
Description of drawings
Fig. 1 is overall structure figure of the present invention; Fig. 2 disassembles schematic diagram for each parts of the present invention; Fig. 3 is refrigerator main body 1 structural representation of the present invention; Fig. 4-1,4-2,4-3 is the structural representation of three kinds of different embodiment of deck 3 of the present invention; Fig. 5-1,5-2,5-3 is the structural representation of three kinds of different embodiment of heat sink assembly 2 of the present invention; Fig. 6-1,6-2,6-3 are the embodiment internal structure and the operation principle schematic diagram of three kinds of different structures of the present invention.
Wherein: 1 is the refrigerator main body; 2 is fin; 3 is deck; 4 is the limbers; 5 is mounting plane; 6 is reserved passageway; 7 for connecting cover plate; 8 is array of fins; 9 is cooling passage; 10 is main current; 11 for dividing current.
Embodiment
Below in conjunction with accompanying drawing the present invention is done and to describe in further detail: the present invention is based on refrigerator main body 1, the structure of refrigerator main body 1 as shown in Figure 3, on installation and processing plane, the upper end of refrigerator main body 15, parallel one or more reserved passageway 6 (Figure 3 shows that) of offering on the mounting plane 5, end in the reserved passageway 6 is provided with water inlet, the other end is provided with delivery port, and the water inlet of reserved passageway 6 and delivery port are communicated on the sidewall at refrigerator main body 1 two ends by the cooling passage of being located in the refrigerator main body 19 respectively.The position that is communicated with the intake-outlet of cooling passage 9 on refrigerator main body 1 sidewall can be set according to technological requirement, the two ends that Fig. 3 or refrigerator main body 1 sidewall water inlet shown in Figure 1 and delivery port all are opened in the refrigerator main body 1 of rectangular block shape.The material of refrigerator main body 1 can be selected the heat conduction good metal for use, as copper billet, also can be made by the good pottery of heat conduction, and in the optimal case of the present invention, refrigerator main body 1 is selected thermal conductive ceramic for use.
The bottom of reserved passageway 6 is provided with deck 3, and the width of deck 3 equates with the width of reserved passageway, so that deck 3 can be fixedly installed in the reserved passageway.Be inserted with radiating fin assembly 2 on the deck 3, radiating fin assembly 2 is formed in the array of fins 8 that is connected cover plate 7 downsides with stationary arrangement by connecting cover plate 7, deck 3 is provided with the fixed structure that adapts with array of fins 8 lower ends, array of fins 8 puts in the reserved passageway 6 and the lower end is inserted on the deck 3, connect cover plate 7 and form the heat dissipation channel that seals with reserved passageway 6, and the lateral surface that connects cover plate 7 is concordant with mounting plane 5, also vertically offer many groups on the mounting plane 5 and be used for fixing the screw hole that clings to bar, during use, the crust bar of laser fixedly is close to by screw hole and connects on the cover plate 7.
Radiating fin assembly 2 of the present invention and be mated installation deck 3 can according to the heat radiation needs be designed to multiple version, below list the embodiment of several different structures of optimum of the present invention: referring to Fig. 5-1: the array of fins 8 of radiating fin assembly 2 is to be become by a plurality of bar shaped sheet fins set that are parallel to each other, and bar shaped sheet fin vertical fixing is in connecting on the cover plate 7.Deck 3 is provided with many bar shaped sheet fin lower ends corresponding groove (as Fig. 4-1) with array of fins 8, and the lower end of a plurality of bar shaped sheet fins inserts in respectively in the groove of deck 3.
Referring to Fig. 5-2 and Fig. 5-3: the array of fins 8 of radiating fin assembly 2 is made up of in the column that is connected on the cover plate 7 a plurality of orthogonal array, deck 3 is provided with a plurality of fixing holes corresponding with the column lower end of array of fins 8, and the lower end of a plurality of columns inserts in respectively in the fixing hole of deck 3.Wherein, the cross section of forming a plurality of columns of array of fins 8 among Fig. 5-2 is circular, fixing hole on the deck 3 that matches with it is circular hole (as Fig. 4-2) too, and the internal diameter of circular hole is identical with the top external diameter of column, and its top can just be inserted in the circular hole.The cross section of forming a plurality of columns of array of fins 8 among Fig. 5-3 is a polygon, wherein the outside can be designed to triangle section with the column in the outside according to the structure needs, the column of inside is designed to the square-section, also can be designed to the cross-sectional form of other shapes as required, the hole cross sectional shape of the fixing hole on the deck 3 that meanwhile, is mated also adapts with corresponding column shape of cross section.When the cross section of column is polygon, also fixing hole can be set on the deck 3, but be polygonal projection equally by cross section is set, shown in Fig. 4-3, this projection just in time extend into.Between a plurality of columns of array of fins 8, whole array of fins 8 is fixed up.In the optimal case of the present invention,, will connect cover plate 7 and array of fins 8 is designed to integral structure in order to realize good thermal conductivity.
In order to prevent the corrosion of water stream channel, be equipped with anticorrosion coating at the inwall of reserved passageway 6, cooling passage 9, this mode at water route plating corrosion-resistant material has improved the resistance to corrosion of cooling system greatly.
Fin in the present invention diagram is sheet, and is cylindric, the rhombus column, and in actual applications, fin of the present invention also can make improvements slightly, as fin being made into the structure that ring-type etc. helps dispelling the heat.
Preparation process of the present invention is as follows: a) the processing rectangular block that has mounting plane 5 as shown in Figure 3 is as refrigerator main body 1 and at middle processing cooling passage, and wherein the entrance and exit of cooling passage is located at the two ends of refrigerator main body 1; B) prepare groove as reserved passageway 6 on refrigerator main body 1, wherein cooling passage 9 runs through reserved passageway 6, is water inlet and delivery port at the two ends of reserved passageway 6; Shown reserved passageway 6 guarantees that bottom portion of groove keeps smooth; C) width of the bottom of deck 3 shown in Figure 5 (base) equals the recess width of reserved passageway 6, and the plane width that connects cover plate 7 in the radiating fin assembly 2 equals the recess width of reserved passageway 6 among Fig. 3; D) be reserved passageway 6 inwalls and cooling passage 9 inwalls plating anticorrosion coating, and the deck 3 of Fig. 4 is placed on the bottom of reserved passageway 6 of Fig. 3 and fixing, fixing hole on the maintenance deck 3 up, the radiating fin assembly of Fig. 5 is inverted the corresponding deck 3 in back places, the lower end of fin display 8 is just snapped in the fixing hole of deck 3.At last the connection cover plate 7 of radiating fin assembly 2 is put in order with the mounting plane 5 of refrigerator main body 1, made the surface keep smooth smooth.Make liquid chiller of the present invention.
Operation principle of the present invention is as follows: as Fig. 6-1, Fig. 6-2 and Fig. 6-3 is respectively the radiating fin assembly 2 of three kinds of different structure forms and the operation principle cutaway view after deck 3 assemblings.Plating rete on the close position of radiating fin assembly 2 on the liquid chiller mounting plane 5 of the present invention, the heat that thermal source produced when encapsulated semiconductor chip of laser (crust bar) semiconductor laser chip was worked on rete again is transmitted on the refrigerator radiating fin assembly 2 vertically downward by heat conducting mode, dispels the heat by radiating fin assembly 2.Concrete working method is: coolant enters cooling passage 9 by the water inlet on refrigerator main body 1 wall, as the main current 10 among the figure, main current 10 pour and form turbulent flow in the reserved passageway 6, and by array of fins 8 shuntings of radiating fin assembly 2, form the interior current of fin of many paths, as the branch current among the figure.The heat that thermal source (chip of laser) produces is transmitted on the fin, and by current in the fin heat is in time taken away, and current flow out through exhalant canal.Like this, semiconductor laser chip is transmitted to heat on the liquid chiller medium that is cooled and takes away.Because the existence of radiating fin, area of dissipation increases greatly, thereby produces good refrigeration.
The present invention can be designed to encapsulate the liquid chiller of a crust bar arbitrarily, when the crust bar number of encapsulation changes, and the corresponding change of the length of liquid chiller, width and thickness.
Liquid flowing channel of the present invention can be designed to one, also can be many.Cooling passage 9 also can be two or more.
In sum, structure of the present invention is easy to machining, and cost of manufacture is low. For example the refrigerator main body can be directly with the preparation of standard machinery processing method, and can be on the refrigerator main body auxiliary process such as thread mill drilling; Radiating fin assembly and deck can be used the type of squeezing or die casting or one-shot forming technique production according to its shape, refrigerator cost than normal operation wire cutting technology is lower, be suitable for mass production, certainly, sample can use the wire cutting technology preparation equally, and its first type surface can be machined directly to uses needed flatness and roughness; The assembling of refrigerator main body can be used welding procedure according to concrete applicable cases, and technique for sticking etc. are once finished. If high to the refrigerator surface requirements, also can directly carry out the secondary operations such as grinding to principal plane in the rear secondary of refrigerator main body assembling, also can outside overall architecture, also add anticorrosion coating.
Claims (9)
1. liquid chiller that is used for semiconductor laser, comprise refrigerator main body (1), it is characterized in that: the upper end of described refrigerator main body (1) is a mounting plane (5), mounting plane (5) is gone up parallel one or more reserved passageway (6) that offers, end in the reserved passageway (6) is provided with water inlet, the other end is provided with delivery port, the bottom of reserved passageway (6) is provided with deck (3), be inserted with radiating fin assembly (2) on the deck (3), described radiating fin assembly (2) is formed in the array of fins (8) that is connected cover plate (7) downside with stationary arrangement by connecting cover plate (7), array of fins (8) puts in the reserved passageway (6) and the lower end is inserted on the deck (3), connects cover plate (7) and forms the heat dissipation channel that seals with reserved passageway (6).
2. the liquid chiller that is used for semiconductor laser according to claim 1, it is characterized in that: described refrigerator main body (1) is a rectangular block shape, and the water inlet of described reserved passageway (6) and delivery port are communicated on the sidewall at refrigerator main body (1) two ends by the cooling passage of being located in the refrigerator main body (1) (9) respectively.
3. the liquid chiller that is used for semiconductor laser according to claim 1, it is characterized in that: the array of fins (8) of described radiating fin assembly (2) is to be become by a plurality of bar shaped sheet fins set that are parallel to each other, and described bar shaped sheet fin vertical fixing is in connecting on the cover plate (7); Described deck (3) is provided with many bar shaped sheet fin lower ends corresponding groove with array of fins (8), and the lower end of described a plurality of bar shaped sheet fins inserts in respectively in each groove of deck (3).
4. the liquid chiller that is used for semiconductor laser according to claim 1, it is characterized in that: the array of fins (8) of described radiating fin assembly (2) is made up of in the column that connects on the cover plate (7) a plurality of orthogonal array, described deck (3) is provided with the corresponding fixing hole in column lower end a plurality of and array of fins (8), and the lower end of described a plurality of columns inserts in respectively in each fixing hole of deck (3).
5. the liquid chiller that is used for semiconductor laser according to claim 4, it is characterized in that: the cross section of forming a plurality of columns of array of fins (8) is circle, fixing hole on the described deck (3) is a circular hole, and the internal diameter of circular hole is identical with the external diameter of column.
6. the liquid chiller that is used for semiconductor laser according to claim 4, it is characterized in that: the cross section of forming a plurality of columns of array of fins (8) is a polygon, and the hole cross sectional shape of the last fixing hole of described deck (3) adapts with corresponding column shape of cross section.
7. according to claim 1, the 3 or 4 described liquid chillers that are used for semiconductor laser, it is characterized in that: connect cover plate (7) and array of fins (8) and be integral structure.
8. the liquid chiller that is used for semiconductor laser according to claim 1 is characterized in that: the lateral surface of described connection cover plate (7) is concordant with mounting plane (5), vertically offers many groups on the mounting plane (5) and is used for fixing the screw hole that clings to bar.
9. the liquid chiller that is used for semiconductor laser according to claim 1 is characterized in that: the selected material of described refrigerator main body (1) is high metal of thermal conductivity or pottery.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010161021 CN101854027A (en) | 2010-04-30 | 2010-04-30 | Liquid refrigerator for semiconductor laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010161021 CN101854027A (en) | 2010-04-30 | 2010-04-30 | Liquid refrigerator for semiconductor laser |
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| Publication Number | Publication Date |
|---|---|
| CN101854027A true CN101854027A (en) | 2010-10-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010161021 Pending CN101854027A (en) | 2010-04-30 | 2010-04-30 | Liquid refrigerator for semiconductor laser |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102623889A (en) * | 2012-04-11 | 2012-08-01 | 西安炬光科技有限公司 | Method for preparing liquid refrigerator applied to semiconductor laser and refrigerating device thereof |
| CN102620592A (en) * | 2012-04-11 | 2012-08-01 | 西安炬光科技有限公司 | Preparation method for liquid refrigerator applied to semiconductor laser and refrigerating device for semiconductor laser |
| CN105742955A (en) * | 2016-05-12 | 2016-07-06 | 核工业理化工程研究院 | Semiconductor laser diode fin-type heat dissipation device |
| CN107210582A (en) * | 2015-02-16 | 2017-09-26 | 三菱电机株式会社 | Semiconductor laser light resource device, semiconductor laser light resource system and image display |
| CN107800028A (en) * | 2017-11-28 | 2018-03-13 | 武汉锐科光纤激光技术股份有限公司 | A kind of cooling structure for high power pump source |
| CN109471228A (en) * | 2018-11-27 | 2019-03-15 | 武汉光迅科技股份有限公司 | A kind of radiator structure of coaxial packaging optical device |
| CN109565148A (en) * | 2016-08-30 | 2019-04-02 | Nec显示器解决方案株式会社 | Light supply apparatus, projection display device and the method for cooling down semiconductor light-emitting elements |
| CN112366512A (en) * | 2020-09-28 | 2021-02-12 | 北京凯普林光电科技股份有限公司 | Semiconductor laser heat radiation structure |
| CN112563224A (en) * | 2020-12-04 | 2021-03-26 | 合肥圣达电子科技实业有限公司 | Micro-channel device for heat dissipation of high-power semiconductor chip |
| CN113808628A (en) * | 2021-08-27 | 2021-12-17 | 西安理工大学 | RRAM array water-cooling heat dissipation device based on packaging part deionized water |
| CN114300931A (en) * | 2021-12-06 | 2022-04-08 | 武汉锐科光纤激光技术股份有限公司 | Heat radiator for laser chip |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102620592A (en) * | 2012-04-11 | 2012-08-01 | 西安炬光科技有限公司 | Preparation method for liquid refrigerator applied to semiconductor laser and refrigerating device for semiconductor laser |
| CN102620592B (en) * | 2012-04-11 | 2014-06-04 | 西安炬光科技有限公司 | Preparation method for liquid refrigerator applied to semiconductor laser and refrigerating device for semiconductor laser |
| CN102623889B (en) * | 2012-04-11 | 2014-12-24 | 西安炬光科技有限公司 | Method for preparing liquid refrigerator applied to semiconductor laser and refrigerating device thereof |
| CN102623889A (en) * | 2012-04-11 | 2012-08-01 | 西安炬光科技有限公司 | Method for preparing liquid refrigerator applied to semiconductor laser and refrigerating device thereof |
| CN107210582A (en) * | 2015-02-16 | 2017-09-26 | 三菱电机株式会社 | Semiconductor laser light resource device, semiconductor laser light resource system and image display |
| CN105742955B (en) * | 2016-05-12 | 2019-03-29 | 核工业理化工程研究院 | Semiconductor laser diode rib-type radiator |
| CN105742955A (en) * | 2016-05-12 | 2016-07-06 | 核工业理化工程研究院 | Semiconductor laser diode fin-type heat dissipation device |
| CN109565148A (en) * | 2016-08-30 | 2019-04-02 | Nec显示器解决方案株式会社 | Light supply apparatus, projection display device and the method for cooling down semiconductor light-emitting elements |
| CN109565148B (en) * | 2016-08-30 | 2021-09-10 | Nec显示器解决方案株式会社 | Light source device, projection type display device, and method for cooling semiconductor light emitting element |
| CN107800028A (en) * | 2017-11-28 | 2018-03-13 | 武汉锐科光纤激光技术股份有限公司 | A kind of cooling structure for high power pump source |
| CN109471228A (en) * | 2018-11-27 | 2019-03-15 | 武汉光迅科技股份有限公司 | A kind of radiator structure of coaxial packaging optical device |
| CN112366512A (en) * | 2020-09-28 | 2021-02-12 | 北京凯普林光电科技股份有限公司 | Semiconductor laser heat radiation structure |
| CN112563224A (en) * | 2020-12-04 | 2021-03-26 | 合肥圣达电子科技实业有限公司 | Micro-channel device for heat dissipation of high-power semiconductor chip |
| CN113808628A (en) * | 2021-08-27 | 2021-12-17 | 西安理工大学 | RRAM array water-cooling heat dissipation device based on packaging part deionized water |
| CN114300931A (en) * | 2021-12-06 | 2022-04-08 | 武汉锐科光纤激光技术股份有限公司 | Heat radiator for laser chip |
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