CN101823716A - Method for separating silica powder and impurities in mixture - Google Patents
Method for separating silica powder and impurities in mixture Download PDFInfo
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- CN101823716A CN101823716A CN 201010120542 CN201010120542A CN101823716A CN 101823716 A CN101823716 A CN 101823716A CN 201010120542 CN201010120542 CN 201010120542 CN 201010120542 A CN201010120542 A CN 201010120542A CN 101823716 A CN101823716 A CN 101823716A
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Abstract
The invention relates to a method for separating silica powder and impurities in mixture, belonging to the photovoltaic and semiconductor field. The method comprises that the mixture is put in liquid formed by organic solvent and water, the used amount of the organic solvent is proportioned to be 0.1-5 times of the weight of the silica powder contained in the mixture, the adopted organic solvent is organic solvent with a polarity parameter less than or equal to 6, the silica powder in the mixture enters an organic solvent phase to obtain a system formed by organic solvent phase globules enclosing the silica powder, impurities, water and the like, a filter is used to filter the organic solvent phase globules enclosing the silica powder and the impurities in the system, the aperture of the filter is larger than the grain size of the impurities and is smaller than the grain size of the organic solvent phase globules enclosing the silica powder, and thereby the separation of the silica powder and the impurities are realized. The method has the advantages that the separation time is greatly reduced, the used amount of the organic solvent is reduced, the cost in separating the silica powder and the impurities in the mixture is decreased and the adverse impact on the environment caused by the great amount of used organic solvent is reduced.
Description
Technical field
The present invention relates to a kind of of photovoltaic and semiconductor applications silica flour in the mixture and impurity are carried out isolating method.
Background technology
The available technology adopting organic solvent is handled silica flour in the mixture and impurity, separates to obtain silica flour and impurity, though can realize silica flour and separate impurities, but the organic solvent amount that is consumed is big, the time that organic solvent is handled is longer, cause cost higher, and the processing cycle is also longer.
Summary of the invention
The technical problem to be solved in the present invention provides a kind ofly carries out isolating method with silica flour in the mixture and impurity, can obviously reduce the separating treatment time, has improved processing efficiency, the usage quantity of also having saved organic solvent simultaneously.
Technical scheme of the present invention is:
A kind of silica flour in the mixture and impurity are carried out isolating method, comprise: mixture is placed the liquid of forming by organic solvent and water, the consumption of organic solvent doubly disposes by the 0.1-5 of contained silica flour weight in the mixture, the organic solvent that is adopted is that the polarity parameter is less than or equal to 6 organic solvent, silica flour in the mixture enter organic solvent mutually in, thereby the relative silicon powder particle of organic solvent coats the organic solvent phase bead that forms the parcel silica flour fully, obtain organic solvent phase bead by the parcel silica flour, the system that impurity and water etc. are formed, wherein: adopt strainer that the organic solvent phase bead and the impurity of the parcel silica flour in the system are filtered, the aperture of this strainer is greater than the impurity particle diameter, less than the organic solvent phase bead particle diameter of parcel silica flour, realize separating of silica flour and impurity.
A kind of silica flour in the mixture and impurity are carried out isolating method, comprise: described impurity is hydrophilic, mixture is placed the liquid of forming by organic solvent and water, the consumption of organic solvent doubly disposes by the 0.1-5 of contained silica flour weight in the mixture, the organic solvent that is adopted is that the polarity parameter is less than or equal to 6 organic solvent, silica flour in the mixture enter organic solvent mutually in, thereby the relative silicon powder particle of organic solvent coats the organic solvent phase bead that forms the parcel silica flour fully, obtain organic solvent phase bead by the parcel silica flour, the system that impurity and water etc. are formed, wherein: adopt strainer that the organic solvent phase bead and the impurity of the parcel silica flour in the system are filtered, the aperture of this strainer is greater than the impurity particle diameter, less than the organic solvent phase bead particle diameter of parcel silica flour, realize separating of silica flour and impurity.
A kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described impurity particle size range is at 0.1～100 μ m.
A kind of silica flour in the mixture and impurity are carried out isolating method, wherein: the organic solvent phase bead particle size range of described parcel silica flour is at 0.1～10mm.
A kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described impurity be in silicon carbide, diamond, aluminum oxide, the ferric oxide any one or several.
A kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described strainer can be a filter cloth, also can other any one structures.
Organic solvent described in the present invention can be any one or a few mixing of normal hexane, octane, kerosene, oleic acid, normal heptane, nonane, benzene, toluene, octane-iso, undecane, pine tar, Oleum Cocois, chloroform.
The implementation result of table 1 the present invention and prior art relatively
| The present invention | Prior art | |
| Treatment time | Treatment time is short | Treatment time is long |
| The organic solvent usage quantity | Little | Greatly |
| Processing cost | Low | High |
| Negative impact to environment | Little | Greatly |
The table 2 required treatment time of different technologies scheme of the present invention
| The organic solvent kind that adopts | The required treatment time (minute) |
| Oleic acid | ??8 |
| Normal hexane | ??6 |
| Octane | ??9 |
| Kerosene | ??10 |
| Normal heptane | ??8 |
| Nonane | ??5 |
| Benzene | ??7 |
| Toluene | ??9 |
| Octane-iso | ??9 |
| Undecane | ??6 |
Principle of work of the present invention: when adopting organic solvent that the silica flour in the mixture and impurity are handled, because the lipophilicity of silica flour, silica flour will enter into organic solvent mutually, can realize the coating fully of the relative silicon powder particle of organic solvent, and because organic solvent and water is insoluble, and silica flour has stopped organic solvent and organic solvent converging mutually mutually, thereby realize silica flour be distributed in organic solvent mutually in and the organic solvent phase bead that forms the parcel silica flour float on or be scattered in aqueous phase, obtain wrapping up the organic solvent phase bead of silica flour, the system that impurity and water etc. are formed, utilize the particle diameter of the organic solvent phase bead particle diameter of parcel silica flour much larger than impurity particle, use the particle diameter of aperture greater than impurity particle, strainer less than the organic solvent phase bead particle diameter of parcel silica flour filters the organic solvent phase bead and the impurity of the parcel silica flour in the system, can realize that silica flour separates with impurity, so can reduce greatly the separating treatment time, also reduce the usage quantity of organic solvent.
Because prior art adopts organic solvent that silica flour and impurity are carried out separating treatment, is the hydrophilic different differences that depend on silica flour lipophilicity, impurity, realize separating fully of silica flour and impurity.Usually, need to add relatively large organic solvent in treating processes, silica flour enters in the organic solvent, and impurity is scattered in the aqueous solution, and because the not mutual solubility of organic solvent and water, and density is lower than water, silica flour be scattered in organic solvent mutually in and float on aqueous solution upper epidermis, by collection to organic solvent layer, realization is to the recovery of silica flour, such method need expend the long treatment time, also need expend relatively large organic solvent simultaneously, is unfavorable for applying aborning.
Advantage of the present invention: after obtaining wrapping up the organic solvent phase bead of silica flour after adopting organic solvent that silica flour is handled, filter by the organic solvent phase bead and the impurity of strainer this parcel silica flour, realize that silica flour separates with impurity, can reduce greatly the separating treatment time, improve processing efficiency, saved the usage quantity of organic solvent simultaneously, the silica flour in the minimizing separating mixture and the cost of impurity, and reduced and used the negative impact of a large amount of organic solvents to environment.
Embodiment
Embodiment 1, a kind of silica flour in the mixture and impurity are carried out isolating method, comprise: mixture is placed the liquid of forming by organic solvent and water, silica flour in the mixture enter organic solvent mutually in, thereby the relative silicon powder particle of organic solvent coats the organic solvent phase bead that forms the parcel silica flour fully, obtain organic solvent phase bead by the parcel silica flour, the system that impurity and water etc. are formed, wherein: adopt strainer that the organic solvent phase bead and the impurity of the parcel silica flour in the system are filtered, the aperture of this strainer is greater than the impurity particle diameter, less than the organic solvent phase bead particle diameter of parcel silica flour, realize separating of silica flour and impurity.
Embodiment 2, a kind of silica flour in the mixture and impurity are carried out isolating method, comprise: described impurity is hydrophilic, mixture is placed the liquid of forming by organic solvent and water, the consumption of organic solvent doubly disposes by the 0.1-5 of contained silica flour weight in the mixture, the organic solvent that is adopted is that the polarity parameter is less than or equal to 6 organic solvent, silica flour in the mixture enter organic solvent mutually in, thereby the relative silicon powder particle of organic solvent coats the organic solvent phase bead that forms the parcel silica flour fully, obtain organic solvent phase bead by the parcel silica flour, the system that impurity and water etc. are formed, wherein: adopt strainer that the organic solvent phase bead and the impurity of the parcel silica flour in the system are filtered, the aperture of this strainer is greater than the impurity particle diameter, less than the organic solvent phase bead particle diameter of parcel silica flour, realize separating of silica flour and impurity.
Embodiment 3, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described impurity particle diameter is 0.1 μ m.All the other are with embodiment 1 or embodiment 2.
Embodiment 4, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described impurity particle diameter is 0.2 μ m.All the other are with embodiment 1 or embodiment 2.
Embodiment 5, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described impurity particle diameter is 0.5 μ m.All the other are with embodiment 1 or embodiment 2.
Embodiment 6, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described impurity particle diameter is 0.8 μ m.All the other are with embodiment 1 or embodiment 2.
Embodiment 7, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described impurity particle diameter is 1 μ m.All the other are with embodiment 1 or embodiment 2.
Embodiment 8, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described impurity particle diameter is 3 μ m.All the other are with embodiment 1 or embodiment 2.
Embodiment 9, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described impurity particle diameter is 5 μ m.All the other are with embodiment 1 or embodiment 2.
Embodiment 10, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described impurity particle diameter is 8 μ m.All the other are with embodiment 1 or embodiment 2.
Embodiment 11, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described impurity particle diameter is 10 μ m.All the other are with embodiment 1 or embodiment 2.
Embodiment 12, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described impurity particle diameter is 20 μ m.All the other are with embodiment 1 or embodiment 2.
Embodiment 13, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described impurity particle diameter is 30 μ m.All the other are with embodiment 1 or embodiment 2.
Embodiment 14, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described impurity particle diameter is 40 μ m.All the other are with embodiment 1 or embodiment 2.
Embodiment 15, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described impurity particle diameter is 50 μ m.All the other are with embodiment 1 or embodiment 2.
Embodiment 16, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described impurity particle diameter is 60 μ m.All the other are with embodiment 1 or embodiment 2.
Embodiment 17, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described impurity particle diameter is 70 μ m.All the other are with embodiment 1 or embodiment 2.
Embodiment 18, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described impurity particle diameter is 80 μ m.All the other are with embodiment 1 or embodiment 2.
Embodiment 19, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described impurity particle diameter is 90 μ m.All the other are with embodiment 1 or embodiment 2.
Embodiment 20, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described impurity particle diameter is 100 μ m.All the other are with embodiment 1 or embodiment 2.
Embodiment 21, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: the organic solvent phase bead particle diameter of described parcel silica flour is 0.1mm.All the other are with embodiment 1 or embodiment 2.
Embodiment 22, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: the organic solvent phase bead particle diameter of described parcel silica flour is 0.3mm.All the other are with embodiment 1 or embodiment 2.
Embodiment 23, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: the organic solvent phase bead particle diameter of described parcel silica flour is 0.5mm.All the other are with embodiment 1 or embodiment 2.
Embodiment 24, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: the organic solvent phase bead particle diameter of described parcel silica flour is 0.8mm.All the other are with embodiment 1 or embodiment 2.
Embodiment 25, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: the organic solvent phase bead particle diameter of described parcel silica flour is 1mm.All the other are with embodiment 1 or embodiment 2.
Embodiment 26, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: the organic solvent phase bead particle diameter of described parcel silica flour is 2mm.All the other are with embodiment 1 or embodiment 2.
Embodiment 27, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: the organic solvent phase bead particle diameter of described parcel silica flour is 3mm.All the other are with embodiment 1 or embodiment 2.
Embodiment 28, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: the organic solvent phase bead particle diameter of described parcel silica flour is 5mm.All the other are with embodiment 1 or embodiment 2.
Embodiment 29, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: the organic solvent phase bead particle diameter of described parcel silica flour is 8mm.All the other are with embodiment 1 or embodiment 2.
Embodiment 30, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: the organic solvent phase bead particle diameter of described parcel silica flour is 10mm.All the other are with embodiment 1 or embodiment 2.
Embodiment 31, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described strainer is a filter cloth.All the other are with embodiment 1 or embodiment 2.
Embodiment 32, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described impurity is silicon carbide.All the other are with embodiment 1 or embodiment 2.
Embodiment 33, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described impurity is diamond.All the other are with embodiment 1 or embodiment 2.
Embodiment 34, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described impurity is aluminum oxide.All the other are with embodiment 1 or embodiment 2.
Embodiment 35, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described impurity is ferric oxide.All the other are with embodiment 1 or embodiment 2.
Embodiment 36, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described impurity is silicon carbide, adamantine mixing.All the other are with embodiment 1 or embodiment 2.
Embodiment 37, a kind of silica flour in the mixture and impurity are carried out isolating method, wherein: described impurity is the mixing of aluminum oxide, ferric oxide.All the other are with embodiment 1 or embodiment 2.
Embodiment 38, a kind of silica flour in the mixture and impurity are carried out isolating method, comprise: mixture is placed the liquid of forming by organic solvent and water, the consumption of organic solvent is pressed 0.1 times of configuration of contained silica flour weight in the mixture, the organic solvent that is adopted is a normal hexane, silica flour in the mixture enter normal hexane mutually in, thereby the relative silicon powder particle of normal hexane coats the normal hexane phase bead that forms the parcel silica flour fully, obtain normal hexane phase bead by the parcel silica flour, the system that silicon carbide impurity and water etc. are formed, wherein: adopt strainer that the normal hexane phase bead and the silicon carbide impurity of the parcel silica flour in the system are filtered, silicon carbide impurity particle diameter is 0.1～20 μ m, the organic solvent phase bead particle diameter of described parcel silica flour is 0.1mm, the aperture of this strainer is 50 μ m, the separating treatment time of being spent is 6 minutes altogether, realizes separating of silica flour and silicon carbide impurity.All the other are with embodiment 1 or embodiment 2.
Embodiment 39, a kind of silica flour in the mixture and impurity are carried out isolating method, comprise: mixture is placed the liquid of forming by organic solvent and water, the consumption of organic solvent is pressed 0.5 times of configuration of contained silica flour weight in the mixture, the organic solvent that is adopted is a normal heptane, silica flour in the mixture enter normal heptane mutually in, thereby the relative silicon powder particle of normal heptane coats the normal heptane phase bead that forms the parcel silica flour fully, obtain normal heptane phase bead by the parcel silica flour, the system that silicon carbide impurity and water etc. are formed, wherein: adopt strainer that the normal heptane phase bead and the silicon carbide impurity of the parcel silica flour in the system are filtered, silicon carbide impurity particle diameter is 0.5 μ m, the normal heptane phase bead particle diameter of described parcel silica flour is 0.5mm, the aperture of this strainer is 100 μ m, the separating treatment time of being spent is 8 minutes altogether, realizes separating of silica flour and silicon carbide impurity.All the other are with embodiment 1 or embodiment 2.
Embodiment 40, a kind of silica flour in the mixture and impurity are carried out isolating method, comprise: mixture is placed the liquid of forming by organic solvent and water, the consumption of organic solvent is pressed 0.8 times of configuration of contained silica flour weight in the mixture, the organic solvent that is adopted is a kerosene, silica flour in the mixture enter kerosene mutually in, thereby the relative silicon powder particle of kerosene coats the kerosene phase bead that forms the parcel silica flour fully, obtain kerosene phase bead by the parcel silica flour, the system that silicon carbide impurity and water etc. are formed, wherein: adopt strainer that the kerosene phase bead and the silicon carbide impurity of the parcel silica flour in the system are filtered, silicon carbide impurity particle diameter is 1 μ m, the kerosene phase bead particle diameter of described parcel silica flour is 0.8mm, the aperture of this strainer is 300 μ m, the separating treatment time of being spent is 10 minutes altogether, realizes separating of silica flour and silicon carbide impurity.All the other are with any one embodiment among the embodiment 3-37.All the other are with embodiment 1 or embodiment 2.
Embodiment 41, a kind of silica flour in the mixture and impurity are carried out isolating method, comprise: mixture is placed the liquid of forming by organic solvent and water, the consumption of organic solvent is pressed 1 times of configuration of contained silica flour weight in the mixture, the organic solvent that is adopted is an oleic acid, silica flour in the mixture enter oleic acid mutually in, thereby the relative silicon powder particle of oleic acid coats the oleic acid phase bead that forms the parcel silica flour fully, obtain oleic acid phase bead by the parcel silica flour, the system that diamond impurity and water etc. are formed, wherein: adopt strainer that the oleic acid phase bead and the diamond impurity of the parcel silica flour in the system are filtered, diamond impurity particle diameter is 10 μ m, the oleic acid phase bead particle diameter of described parcel silica flour is 1mm, the aperture of this strainer is 500 μ m, the separating treatment time of being spent is 8 minutes altogether, realizes separating of silica flour and diamond impurity.All the other are with embodiment 1 or embodiment 2.
Embodiment 42, a kind of silica flour in the mixture and impurity are carried out isolating method, comprise: mixture is placed the liquid of forming by organic solvent and water, the consumption of organic solvent is pressed 2 times of configurations of contained silica flour weight in the mixture, the organic solvent that is adopted is an octane-iso, silica flour in the mixture enter octane-iso mutually in, thereby the relative silicon powder particle of octane-iso coats the octane-iso phase bead that forms the parcel silica flour fully, obtain octane-iso phase bead by the parcel silica flour, the system that diamond impurity and water etc. are formed, wherein: adopt strainer that the octane-iso phase bead and the diamond impurity of the parcel silica flour in the system are filtered, diamond impurity particle diameter is 30 μ m, the octane-iso phase bead particle diameter of described parcel silica flour is 3mm, the aperture of this strainer is 600 μ m, the separating treatment time of being spent is 9 minutes altogether, realizes separating of silica flour and diamond impurity.All the other are with embodiment 1 or embodiment 2.
Embodiment 43, a kind of silica flour in the mixture and impurity are carried out isolating method, comprise: mixture is placed the liquid of forming by organic solvent and water, the consumption of organic solvent is pressed 2.5 times of configurations of contained silica flour weight in the mixture, the organic solvent that is adopted is a nonane, silica flour in the mixture enter nonane mutually in, thereby the relative silicon powder particle of nonane coats the nonane phase bead that forms the parcel silica flour fully, obtain nonane phase bead by the parcel silica flour, the system that silicon carbide impurity and water etc. are formed, wherein: adopt strainer that the nonane phase bead and the silicon carbide impurity of the parcel silica flour in the system are filtered, silicon carbide impurity particle diameter is 40 μ m, the nonane phase bead particle diameter of described parcel silica flour is 2mm, the aperture of this strainer is 300 μ m, the separating treatment time of being spent is 5 minutes altogether, realizes separating of silica flour and silicon carbide impurity.All the other are with embodiment 1 or embodiment 2.
Embodiment 44, a kind of silica flour in the mixture and impurity are carried out isolating method, comprise: mixture is placed the liquid of forming by organic solvent and water, the consumption of organic solvent is pressed 3 times of configurations of contained silica flour weight in the mixture, the organic solvent that is adopted is an octane, silica flour in the mixture enter octane mutually in, thereby the relative silicon powder particle of octane coats the octane phase bead that forms the parcel silica flour fully, obtain octane phase bead by the parcel silica flour, the system that aluminum oxide impurity and water etc. are formed, wherein: adopt strainer that the octane phase bead and the aluminum oxide impurity of the parcel silica flour in the system are filtered, aluminum oxide impurity particle diameter is 50 μ m, the octane phase bead particle diameter of described parcel silica flour is 5mm, the aperture of this strainer is 700 μ m, the separating treatment time of being spent is 9 minutes altogether, realizes separating of silica flour and aluminum oxide impurity.All the other are with embodiment 1 or embodiment 2.
Embodiment 45, a kind of silica flour in the mixture and impurity are carried out isolating method, comprise: mixture is placed the liquid of forming by organic solvent and water, the consumption of organic solvent is pressed 4 times of configurations of contained silica flour weight in the mixture, the organic solvent that is adopted is a pine tar, silica flour in the mixture enter pine tar mutually in, thereby the relative silicon powder particle of pine tar coats the pine tar phase bead that forms the parcel silica flour fully, obtain pine tar phase bead by the parcel silica flour, the system that ferric oxide impurity and water etc. are formed, wherein: adopt strainer that the pine tar phase bead and the ferric oxide impurity of the parcel silica flour in the system are filtered, ferric oxide impurity particle diameter is 80 μ m, the pine tar phase bead particle diameter of described parcel silica flour is 8mm, the aperture of this strainer is 800 μ m, the separating treatment time of being spent is 7 minutes altogether, realizes separating of silica flour and ferric oxide impurity.All the other are with embodiment 1 or embodiment 2.
Embodiment 46, a kind of silica flour in the mixture and impurity are carried out isolating method, comprise: mixture is placed the liquid of forming by organic solvent and water, the consumption of organic solvent is pressed 5 times of configurations of contained silica flour weight in the mixture, the organic solvent that is adopted is an Oleum Cocois, silica flour in the mixture enters in the coconut oil phase, thereby the relative silicon powder particle of Oleum Cocois coats the coconut oil phase bead that forms the parcel silica flour fully, obtain coconut oil phase bead by the parcel silica flour, the system that silicon carbide impurity and water etc. are formed, wherein: adopt strainer that the coconut oil phase bead and the silicon carbide impurity of the parcel silica flour in the system are filtered, silicon carbide impurity particle diameter is 100 μ m, the coconut oil phase pellet of described parcel silica flour directly is 10mm, the aperture of this strainer is 900 μ m, the separating treatment time of being spent is 6 minutes altogether, realizes separating of silica flour and silicon carbide impurity.All the other are with embodiment 1 or embodiment 2.
Claims (6)
1. one kind is carried out isolating method with silica flour in the mixture and impurity, comprise: mixture is placed the liquid of forming by organic solvent and water, the consumption of organic solvent doubly disposes by the 0.1-5 of contained silica flour weight in the mixture, the organic solvent that is adopted is that the polarity parameter is less than or equal to 6 organic solvent, silica flour in the mixture enter organic solvent mutually in, thereby the relative silicon powder particle of organic solvent coats the organic solvent phase bead that forms the parcel silica flour fully, obtain organic solvent phase bead by the parcel silica flour, the system that impurity and water etc. are formed, it is characterized in that: adopt strainer that the organic solvent phase bead and the impurity of the parcel silica flour in the system are filtered, the aperture of this strainer is greater than the impurity particle diameter, less than the organic solvent phase bead particle diameter of parcel silica flour, realize separating of silica flour and impurity.
2. one kind is carried out isolating method with silica flour in the mixture and impurity, comprise: described impurity is hydrophilic, mixture is placed the liquid of forming by organic solvent and water, the consumption of organic solvent doubly disposes by the 0.1-5 of contained silica flour weight in the mixture, the organic solvent that is adopted is that the polarity parameter is less than or equal to 6 organic solvent, silica flour in the mixture enter organic solvent mutually in, thereby the relative silicon powder particle of organic solvent coats the organic solvent phase bead that forms the parcel silica flour fully, obtain organic solvent phase bead by the parcel silica flour, the system that impurity and water etc. are formed, wherein: adopt strainer that the organic solvent phase bead and the impurity of the parcel silica flour in the system are filtered, the aperture of this strainer is greater than the impurity particle diameter, less than the organic solvent phase bead particle diameter of parcel silica flour, realize separating of silica flour and impurity.
3. as claimed in claim 1 or 2ly a kind of silica flour in the mixture and impurity are carried out isolating method, it is characterized in that: described impurity particle size range is at 0.1～100 μ m.
4. as claimed in claim 1 or 2ly a kind of silica flour in the mixture and impurity are carried out isolating method, it is characterized in that: the organic solvent phase bead particle size range of described parcel silica flour is at 0.1～10mm.
5. as claimed in claim 1 or 2ly a kind of silica flour in the mixture and impurity are carried out isolating method, it is characterized in that: described impurity be in silicon carbide, diamond, aluminum oxide, the ferric oxide any one or several.
6. as claimed in claim 1 or 2ly a kind of silica flour in the mixture and impurity are carried out isolating method, it is characterized in that: described strainer can be a filter cloth, also can other any one structures.
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| CN102229113A (en) * | 2011-06-07 | 2011-11-02 | 王楚雯 | Method for recovering sapphire powder |
| CN102275926A (en) * | 2011-05-05 | 2011-12-14 | 王楚雯 | Recovery method of silicon powder |
| CN102275930A (en) * | 2011-05-05 | 2011-12-14 | 王楚雯 | Recycling method for silicon powder |
| CN103342364A (en) * | 2013-07-30 | 2013-10-09 | 江西赛维Ldk太阳能高科技有限公司 | Method for separating silicon powder and impurities from mixture |
| CN103373731A (en) * | 2012-04-12 | 2013-10-30 | 江西赛维Ldk太阳能高科技有限公司 | Method for recycling silicon powder from diamond wire cutting slurry |
| CN104437822A (en) * | 2014-11-27 | 2015-03-25 | 河南新大新材料股份有限公司 | C-SiC micro powder separating method |
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| CN102275930B (en) * | 2011-05-05 | 2013-06-19 | 王楚雯 | Recycling method for silicon powder |
| CN102229113A (en) * | 2011-06-07 | 2011-11-02 | 王楚雯 | Method for recovering sapphire powder |
| CN103373731A (en) * | 2012-04-12 | 2013-10-30 | 江西赛维Ldk太阳能高科技有限公司 | Method for recycling silicon powder from diamond wire cutting slurry |
| CN103373731B (en) * | 2012-04-12 | 2015-07-15 | 江西赛维Ldk太阳能高科技有限公司 | Method for recycling silicon powder from diamond wire cutting slurry |
| CN103342364A (en) * | 2013-07-30 | 2013-10-09 | 江西赛维Ldk太阳能高科技有限公司 | Method for separating silicon powder and impurities from mixture |
| CN103342364B (en) * | 2013-07-30 | 2016-02-03 | 江西赛维Ldk太阳能高科技有限公司 | A kind of method of silica flour in mixture and impurity being carried out be separated |
| CN104437822A (en) * | 2014-11-27 | 2015-03-25 | 河南新大新材料股份有限公司 | C-SiC micro powder separating method |
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Application publication date: 20100908 |