CN101750027A - Three-dimensional appearance detection device - Google Patents
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Abstract
Description
技术领域technical field
本发明涉及一种光学检测装置,特别是涉及一种三维形貌检测装置。The invention relates to an optical detection device, in particular to a three-dimensional shape detection device.
背景技术Background technique
精密的形貌检测是现代科技中非常重要的一环,当许多元组件渐渐微小化,就更需要精确可靠的检测技术来验证其微结构尺寸或形貌的精度,以控制品质及制造工艺。其中利用光学非接触检测方式的测量技术,可以非破坏方式取得待测物表面精确的形貌数据,已广泛应用于各种产业中。Precise shape detection is a very important part of modern technology. When many components are gradually miniaturized, accurate and reliable detection technology is needed to verify the accuracy of their microstructure size or shape, so as to control the quality and manufacturing process. Among them, the measurement technology using optical non-contact detection method can obtain accurate shape data of the surface of the object to be measured in a non-destructive manner, and has been widely used in various industries.
参照图1,当待测物12形貌表面斜率较大时,因光学显微镜11常使用的物镜倍率为20倍以下,此区间的数值孔径过小,会造成待测物12表面反射光13无法进入光学显微镜11,而无法取得待测物表面形貌数据。因此,往往只能采用数值内插法,补足所缺的形貌数据,但无法量得实际形貌尺寸及其粗糙度数据。Referring to Fig. 1, when the slope of the topographical surface of the object to be measured 12 is relatively large, the magnification of the objective lens commonly used in the
中国台湾专利TW1229186利用双视角的线性扫描装置搭配一斜向光源,可用以检测缺陷的大致形状及尺寸,主要优点为可较快速检测大面积的缺陷,并判断缺陷为凸起或凹陷。但是无法精确量取微结构三维形貌尺寸,也没有解决待测物形貌表面斜率较大时,表面信号无法被撷取到的问题。Taiwan Patent TW1229186 uses a dual-view linear scanning device with an oblique light source to detect the approximate shape and size of defects. The main advantage is that it can detect large-area defects faster and determine whether the defects are protrusions or depressions. However, it is impossible to accurately measure the three-dimensional shape size of the microstructure, and it does not solve the problem that the surface signal cannot be captured when the surface slope of the shape of the object to be measured is large.
美国专利6,449,048利用将干涉仪倾斜一角度,与待测物横移方向不成垂直,可直接使用传统的垂直扫描干涉仪(VSI)及相移干涉仪(PSI)硬件,连续扫描待测物表面,不需用影像缝补技术,取得待测物表面形貌。但仍未能解决待测物形貌表面斜率较大时的全方位角形貌取得的问题。U.S. Patent No. 6,449,048 utilizes the interferometer to be tilted at an angle, which is not perpendicular to the traverse direction of the object to be measured, and can directly use the traditional vertical scanning interferometer (VSI) and phase shift interferometer (PSI) hardware to continuously scan the surface of the object to be measured. Obtain the surface topography of the object under test without using image stitching technology. However, it still fails to solve the problem of obtaining the omni-directional angular topography when the surface slope of the topography of the object to be tested is large.
QED Technology公司则发展出以倾斜待测物并旋转的方式,取得较大表面待测物斜率较大的表面形貌数据。但此种方式受限于较小的待测样品,若待测样品较大,无法配合倾斜时,则无法使用。QED Technology has developed a method of tilting and rotating the object to be measured to obtain surface topography data with a larger slope of the object to be measured on a larger surface. However, this method is limited to smaller samples to be tested. If the sample to be tested is too large to match the tilt, it cannot be used.
发明内容Contents of the invention
本发明针对先进制造工艺的切削、压印、研磨、纳米加工产业,开发精密机械所需微结构表面形貌尺寸、大行程纳米解析、以及高速测量的共通先进检测和验证核心技术。本发明提出一种三维形貌检测装置,可以有效克服待测物形貌表面斜率较大时,造成待测物表面反射光信号无法进入显微镜,而无法取得待测物表面形貌数据的问题。不论是规则性简单微结构或复杂的微结构,均得以利用本发明进行微结构的检测,可达纳米级的应用。The invention aims at the cutting, embossing, grinding, and nano-processing industries of advanced manufacturing technology, and develops the common advanced detection and verification core technology of microstructure surface topography size, large-stroke nano-analysis, and high-speed measurement required by precision machinery. The invention proposes a three-dimensional shape detection device, which can effectively overcome the problem that when the surface slope of the shape of the object to be measured is relatively large, the reflected light signal on the surface of the object to be measured cannot enter the microscope, and the surface shape data of the object to be measured cannot be obtained. Whether it is a regular simple microstructure or a complex microstructure, the invention can be used to detect the microstructure, which can reach nanoscale applications.
根据本发明一实施范例的三维形貌检测装置,其包含至少二光学检测装置及一倾斜角度调整机构。该倾斜角度调整机构将至少二光学检测装置架设其上,以调整该光学检测装置的倾斜角度。当至少二光学检测装置的倾斜角度改变时,至少二光学检测装置的焦点维持在同一位置(或同一焦平面),并使待测物位于该至少二光学检测装置的视场范围(Field of view)内。将该至少二光学检测装置撷取影像数据进行影像重建后,即可得到待测物的三维形貌。A three-dimensional shape detection device according to an embodiment of the present invention includes at least two optical detection devices and an inclination angle adjustment mechanism. The inclination angle adjustment mechanism erects at least two optical detection devices on it to adjust the inclination angle of the optical detection devices. When the inclination angles of the at least two optical detection devices are changed, the focal points of the at least two optical detection devices are maintained at the same position (or the same focal plane), and the object to be measured is located in the field of view (Field of view) of the at least two optical detection devices )Inside. After the image data captured by the at least two optical detection devices is reconstructed, the three-dimensional shape of the object under test can be obtained.
本发明利用倾斜式光学检测架构,可取得斜率较大的表面形貌数据,且可应用于待测样品不方便倾斜的状况。另外,本发明利用倾斜角度调整架构可调整影像检测装置至任意角度,以取得待测物影像并重建三维形貌;且可检测微结构形貌尺寸及较大表面待测物的形貌尺寸。The present invention utilizes an inclined optical detection framework to obtain surface topography data with a large slope, and can be applied to the situation where the sample to be tested is inconvenient to incline. In addition, the present invention uses the tilt angle adjustment structure to adjust the image detection device to any angle to obtain the image of the object to be tested and reconstruct the three-dimensional shape; and can detect the size of the microstructure and the size of the surface of the object to be measured.
附图说明Description of drawings
图1是显示现有的三维形貌检测装置的示意图;Fig. 1 is a schematic diagram showing an existing three-dimensional shape detection device;
图2至图4是显示本发明一实施范例的三维形貌检测装置的示意图;2 to 4 are schematic diagrams showing a three-dimensional shape detection device according to an embodiment of the present invention;
图5及图6是显示本发明的三维形貌检测装置的概念示意图。5 and 6 are conceptual diagrams showing the three-dimensional shape detection device of the present invention.
主要元件符号说明:Description of main component symbols:
11 光学显微镜 12 待测物11
13 反射光13 reflected light
20 三维形貌检测装置 21 光学检测装置20 Three-dimensional
22 光学检测装置 23 圆弧轨道22
25 枢纽 26 待测物25
27 旋转平台 28 移动平台27
30 马达 31 导螺杆30
43 连接轴 44 连接轴43 connecting
50 三维形貌检测装置 51 光学检测装置50 Three-dimensional
52 光学检测装置 53 倾斜角度调整装置52
55 待测物 60 三维形貌检测装置55 Object to be tested 60 Three-dimensional shape detection device
61 方向角调整机构61 Direction angle adjustment mechanism
具体实施方式Detailed ways
本发明所提供的三维形貌检测系统架构的实现方法将参考附图举例说明如下,但是所述实现方式仅为例示,而并非为其局限。The implementation method of the three-dimensional shape detection system framework provided by the present invention will be illustrated as follows with reference to the accompanying drawings, but the implementation is only for illustration and not for limitation.
如图2所示,三维形貌检测装置20主要包含两光学检测装置21、22,分置于一圆弧轨道23的两侧。光学检测装置21利用枢纽25在圆弧轨道23滑动,光学检测装置22亦利用枢纽(其设置位置类似于枢纽25相对于光学检测装置21的位置,但恰为光学检测系统22所阻挡而未见于图中)在圆弧轨道23滑动。圆弧轨道23为一体成型,具良好的刚性,而可提升光学检测装置21、22移动位置的精密度。As shown in FIG. 2 , the three-dimensional
根据此圆弧轨道23的路径可以调整光学检测装置21和22的倾斜角度,亦即圆弧轨道23为一倾斜角度调整机构。圆弧轨道23的圆弧中心为光学检测装置21和22的对焦成像点,使光学检测装置21和22的倾斜角度改变时,光学检测装置21和22的焦点随时维持在同一位置(同一焦平面)。此外,为了要使待测物26的位置落在光学检测装置21和22的视场范围内,或者要取得待测物26的全方位角影像时,可以通过待测物旋转平台27及移动平台28协助完成取像工作。The inclination angles of the
光学检测装置21和22分别倾斜一个固定角度后各取像一次,此固定角度的大小取决于待测物26的表面斜率,然后分别取得的影像经由软件进行缝合而重建出待测物26的形貌。另外,可视待测物26的形貌结构复杂度决定是否需要增设待测物26的转动平台27及移动平台28,以改变不同视角或检测位置,取得全方位角的三维形貌影像。The
上述三维形貌检测装置20的实际运用可如图3及图4所示的架构,其中图3显示立体架构,图4则为侧视图。经由两组步进马达30转动导螺杆31,移动连接于光学检测装置21和22的连接轴43及44,使得各光学检测装置21和22的枢纽25(另一枢纽未示于图中)可以在圆弧轨道23上滑动。然后光学检测装置21和22分别取得的影像可经由软件进行缝合而重建出待测物形貌。另外,可视待测物的形貌结构复杂度决定是否需要待测物的转动及移动平台,以改变不同视角或检测位置,取得全方位角的三维形貌影像。The actual application of the above-mentioned three-dimensional
实际应用上,并非以上述实施例为限,圆弧轨道也可以其他的倾斜角度调整机构替代,例如:连杆机构、X-Y平面位移平台、旋转平台等可实现的机构。该光学检测装置21、22包含光学显微镜、干涉仪等。In practical applications, the above-mentioned embodiments are not limited, and the arc track can also be replaced by other tilt angle adjustment mechanisms, such as linkage mechanism, X-Y plane displacement platform, rotating platform and other achievable mechanisms. The
综合上述,本发明的概念如图5所示,一个三维形貌检测装置50包含两个光学检测装置51、52及一个倾斜角度调整机构53。光学检测装置51、52利用倾斜角度调整机构53进行倾斜角度位置调整,使光学检测装置51和52的倾斜角度改变时,其焦点仍随时维持在同一位置(同一焦平面),以针对待测物55进行形貌检测。三维形貌检测装置50可应用于检测规则性简单微结构,如背光模块中的增亮膜(BEF)等。In summary, the concept of the present invention is shown in FIG. 5 , a three-dimensional
若需检测如复杂的曲面或锥状等结构时,复杂微结构是单靠两组光学检测装置及倾斜角度调整机构仍无法完成检测,而需要搭配上可调整待测物方向角机构才能够完成检测工作。参照图6,一个三维形貌检测装置60除包含两个光学检测装置51、52及一个倾斜角度调整机构53外,另包含一待测物方向角调整机构61,其可包含例如图2所示的旋转平台27及移动平台28。If it is necessary to detect complex structures such as curved surfaces or cones, the detection of complex microstructures cannot be completed by relying on two sets of optical detection devices and tilt angle adjustment mechanisms alone, but it needs to be equipped with a mechanism that can adjust the direction angle of the object detection work. Referring to FIG. 6, a three-dimensional
总而言之,本发明利用倾斜式光学检测架构,可取得斜率较大的表面形貌数据,且可应用于待测样品不方便倾斜的状况。另外,本发明利用倾斜角度调整架构可调整影像检测装置至任意角度,以取得待测物影像并重建三维形貌;且可检测微结构形貌尺寸及较大表面待测物的形貌尺寸。In a word, the present invention utilizes a tilting optical detection framework to obtain surface topography data with a large slope, and can be applied to situations where the sample to be tested is inconvenient to tilt. In addition, the present invention uses the tilt angle adjustment structure to adjust the image detection device to any angle to obtain the image of the object to be tested and reconstruct the three-dimensional shape; and can detect the size of the microstructure and the size of the surface of the object to be measured.
以应用方面而言,例如应用于平面显示器产业背光模块的滚筒模仁加工机,可在加工完成后直接在加工机上检测加工精度,不需将工件卸下检测,若检测出加工精度不足,又需再重新上机定位加工的麻烦,可节省时间,提高效率。又如可应用于半导体产业、平面显示器产业、光学元件产业的微结构检测及光学元件形貌检测。本发明可用于显微镜支架架构,用以检测待测样品的微结构三微形貌,特别是可以克服斜率较大的表面检测问题;或用于检测较大表面的待测物(如非球面镜)的形貌尺寸,可确实掌握产品品质,提高工艺效率。In terms of application, for example, the roller core processing machine used in the backlight module of the flat panel display industry can directly detect the processing accuracy on the processing machine after the processing is completed, without unloading the workpiece for inspection. If the processing accuracy is detected to be insufficient, then It can save time and improve efficiency by avoiding the trouble of positioning and processing on the machine again. Another example is that it can be applied to microstructure detection and optical component morphology detection in the semiconductor industry, flat panel display industry, and optical component industry. The present invention can be used in the framework of the microscope bracket to detect the three micro-topography of the microstructure of the sample to be tested, especially to overcome the problem of surface detection with a large slope; or to detect the object to be measured with a larger surface (such as an aspheric mirror) The shape and size of the machine can accurately grasp the product quality and improve the process efficiency.
本发明的技术内容及技术特点已揭示如上,然而本领域技术人员仍可能基于本发明的教示而做种种不背离本发明精神的替换及修饰。因此,本发明的保护范围应不限于实施范例所公开的,而应包括各种不背离本发明的替换及修饰,并为权利要求书的范围所涵盖。The technical content and technical features of the present invention have been disclosed above, but those skilled in the art may still make various replacements and modifications based on the teachings of the present invention without departing from the spirit of the present invention. Therefore, the protection scope of the present invention should not be limited to the disclosure of the implementation examples, but should include various replacements and modifications that do not depart from the present invention, and are covered by the scope of the claims.
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CN110687018A (en) * | 2019-09-24 | 2020-01-14 | 武汉大学 | 3D contact angle measuring device and measuring method |
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CN112611337B (en) * | 2020-11-23 | 2022-07-08 | 江苏科技大学 | Three-dimensional measurement device and method based on binocular stereo vision |
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