CN101754590B - Circuit board manufacturing method with built-in passive components - Google Patents

Abstract

The invention relates to a method for manufacturing a circuit board with a built-in passive element, which mainly prints conductive adhesive or solder paste on a first substrate which completes via hole and circuit manufacturing so as to install the passive element on the first substrate, and forms electric connection with the circuit on the first substrate after baking; forming an opening corresponding to the passive element on a dielectric material, sequentially laminating the dielectric material and a second substrate for completing the fabrication of the via hole and the circuit on the first substrate, and performing the steps of drilling, fabricating the via hole, fabricating the outer layer circuit and the like after laminating to complete a circuit board with the passive element inside; the passive element is arranged in the circuit board by utilizing the technology, and the circuit board has the advantages of stable raw material supply, low manufacturing cost and the like.

Description

Circuit board manufacturing method with built-in passive components

technical field

The invention relates to a manufacturing method of a circuit board, in particular to a manufacturing method of a built-in passive element in the circuit board. the

Background technique

As the circuit structure of electronic products is becoming more and more sophisticated and has more and more functions, but the requirement for reducing the volume has not changed. In order to meet this requirement, in addition to the circuit board must be changed to a multi-layer board, many Electronic components are required to be integrated in the multi-layer structure of the circuit board in the circuit board process to further increase the density of the circuit. the

If the applicant previously applied for and was granted a patent, China Taiwan Announcement No. 395145 "Plate Type Resistor Capacitor and Its Manufacturing Method (2)" Invention Patent Case and China Taiwan Announcement No. 421979 "Built-in Fingered Plate Capacitor Resistance and Its "Manufacturing method (1)" invention patent cases, etc., all use the technology of printing high-resistance conductive layers in the circuit board process to build resistance in the circuit board. Although the technique of printing special materials is simple, the supply of special materials is limited to specific manufacturers, so the supply of raw materials is not stable, and the cost of materials is expensive. the

At present, there is also a process technology that directly adopts the finished product of passive components with abundant sources and builds them into the circuit board, such as the "conductive paste puncture method". The process steps are as follows:

First, as shown in FIG. 6A , a tapered conductive column 702 is mainly printed on a copper skin 701 with a special conductive paste, and then pressed together with a dielectric layer 703 and another copper skin 704 (As shown in FIG. 6B ), then use the upper and lower layers of copper skin 701, 704 to make lines 705, 706 respectively, and form conduction through the conduction column 702 piercing the dielectric layer 703 (as shown in FIG. 6C ), thus A first substrate 71 is formed. the

Then use a special conductive paste to print a tapered conductive column 707 on the first substrate 71, and place a capacitor 73 on the first substrate 71 (as shown in Figure 6D), and further connect with a second substrate The material 72 is pressed together (as shown in FIG. 6E ). During the pressing process, in addition to the conduction column 707 on the first base material 71 forming electrical contact with the capacitor 73, part of the conduction column 707 will also be in contact with the first base material 71. The wires on the two substrates 72 form an electrical connection (as shown in FIG. 6F ). the

The above-mentioned process technology is to use the conductive paste printing technology to build the finished passive component (capacitor) into the circuit board. Since the supply of the finished capacitor is safe, it has the advantage of stable raw material supply. However, the conductive paste that is printed to form the via column is a special material and is only supplied by a specific manufacturer, so problems such as unstable material supply and high cost of raw materials cannot be avoided, and the process technology is relatively complicated. the

Contents of the invention

It can be seen from the above that in order to build part of the passive components into the multilayer structure of the circuit board to increase the density of the circuit, as far as the prior art is concerned, printing methods, conductive paste puncturing methods, etc. can be used, but at the same time there are high material costs, Problems such as unstable supply or complicated process technology need to be further reviewed and feasible solutions must be sought. the

Therefore, the main purpose of the present invention is to provide a circuit board manufacturing method with built-in passive components, which has the advantages of low raw material cost and stable supply, thereby effectively solving the problems of existing built-in passive component technology. the

The main technical means adopted for achieving the aforementioned purpose is to make the aforementioned method include the following steps:

A first base material and a second base material are provided, the first base material and the second base material are mainly provided with a copper skin on one side of a dielectric layer respectively, and a circuit is formed on the other side, and the circuit is passed through the dielectric layer. The interlayer conduction on the electrical layer forms conduction with the copper skin;

Placing passive components on the aforementioned first substrate, and making the passive components electrically connected to the circuit on the first substrate;

providing a plate-shaped dielectric material, the dielectric material is formed with more than one opening, and the opening corresponds to the passive element on the first substrate;

Laminating the aforementioned dielectric material and the second base material on the first base material in sequence, and performing pressing, wherein the passive element on the first base material is located between the openings of the dielectric material;

Utilizing the copper skin on the outer side of the first and second base materials to make the outer layer circuit;

Drill holes in the above-mentioned laminated structure composed of the first substrate, the dielectric material and the second substrate, and make via holes to electrically connect the circuits on the first and second substrates; A circuit board with built-in passive components. the

In addition to making circuit boards with built-in passive components using the above-mentioned process technology, because of the use of off-the-shelf passive component products, combined with pressing operations, thin plate etching, thin plate electroplating and other technologies, the production of circuit boards with built-in passive components can be completed. It has the advantages of stable supply source, low cost and high process efficiency. the

Description of drawings

Relevant features and implementation of the present invention, below in conjunction with accompanying drawing and preferred embodiment describe in detail as follows, wherein:

FIG. 1A and FIG. 1B are schematic diagrams of a process for fabricating a substrate in a preferred embodiment of the present invention. the

2A-C are schematic diagrams of the process of forming an electrical connection between a passive device and a substrate in a preferred embodiment of the present invention. the

3A-C are schematic diagrams of the process of forming an electrical connection between a passive device and a substrate in a preferred embodiment of the present invention. the

4A-E are schematic diagrams of a process for fabricating a substrate and electrically connecting the substrate and passive components according to another preferred embodiment of the present invention. the

5A-C are schematic diagrams of the process of forming an electrical connection between the passive device and the substrate in a preferred embodiment of the present invention. the

6A-F are schematic diagrams of conventional process steps for embedding passive components in a circuit board by using the conductive paste piercing method. the

Detailed ways

About the processing step of a preferred embodiment of the present invention, detail is as follows (please cooperate and refer to shown in Fig. 1):

A first base material 10 is provided. The first base material 10 is mainly laminated with a copper skin 11 and 12 on the upper and lower sides of a dielectric layer 13 (as shown in FIG. 1A ), wherein a copper skin 11 is used for A circuit 110 is made, and a via hole 130 is formed on the dielectric layer 13, so that the circuit 110 is electrically connected to the copper skin 12 through the via hole 130 (as shown in FIG. 1B ), and the circuit 110 includes components Contact 111. the

Place the passive element on the aforementioned first substrate 10, and make the passive element electrically connected with the circuit on the first substrate 10; in this embodiment, the passive element is a ceramic capacitor, which is connected to the first substrate 10 The way that the circuit 110 provided above constitutes the electrical connection can be as shown in Figure 2:

Print a conductive adhesive 112 (as shown in FIG. 2A ) on the element contact 111 of the aforementioned first substrate 10, the conductive adhesive 112 can be conductive adhesive or solder paste;

A ceramic capacitor 30 (as shown in FIG. 2B ) is placed on the element contact 111 on which the conductive adhesive 112 has been printed on the aforementioned first substrate 10 . The two ends of the ceramic capacitor 30 have an electrode 31 respectively, and are placed on the first substrate correspondingly. Component contacts 111 on the material 10;

Bake the aforementioned first substrate 10 on which the ceramic capacitor 30 has been placed, to melt the conductive adhesive 112 (as shown in FIG. 2C ), and then make the ceramic capacitor 30 and the circuit 110 on the first substrate 10 form an electrical connection;

Then provide a second substrate 20 and a dielectric material 40 with a thickness (as shown in FIG. A copper skin 22 is pressed together, and a circuit 210 is formed on the other side; the size of the dielectric material 40 is matched with the first substrate 10, and more than one opening 41 is formed on it, and the opening 41 corresponds to the first Ceramic capacitor 30 on the substrate 10;

Next, the dielectric material 40 and the second substrate 20 are sequentially stacked on the first substrate 10, and the ceramic capacitor 30 on the first substrate 10 is properly positioned in the opening 41 of the dielectric material 40, and then the The aforementioned three are pressed together, and the structure after the pressing is as shown in Figure 3B; then, the outer layer circuits 120, 220 are made by using the copper skins 12, 22 on the opposite outer sides of the aforementioned first and second base materials 10, 20 , and drill holes;

After the drilling is completed, electroplating drilling is performed to form a via hole 42 (as shown in FIG. 3C ), and the via hole 42 is used to make the inner layer lines 110 , 210 and the outer layer lines 120 , 220 conductive. the

After the foregoing process steps, a multilayer circuit board with built-in passive components can be completed. If it is necessary to increase the number of layers of the circuit board or to further increase the built-in passive components in the laminated structure, it is only necessary to repeat the above steps. the

Please also refer to FIG. 4, which is another preferred embodiment of the present invention, and its process steps are roughly the same as those of the previous embodiment. FIG. 4A-FIG. A base material 10, after printing conductive glue 112 on the component contacts 111 of the first base material 10, and placing the ceramic capacitor 30, it is then baked, so that the ceramic capacitor 30 is electrically connected to the circuit 110 on the first base material 10 . the

The difference from the previous embodiment is that a core 50 is used to replace the dielectric material 40 between the first substrate 10 and the second substrate 20, and the core 50 is still placed on the core before lamination. Form an opening 51 (as shown in FIG. 5A ), and the opening 51 corresponds to the ceramic capacitor 30 on the first base material 10; base material 10, and make the ceramic capacitor 30 on the first base material 10 fit in the opening 51 of the core board 50, and then still press the above three, the structure after pressing is shown in Figure 5B ; Then utilize the copper skin 12,22 on the relative outer side of the aforementioned first and second substrates 10,20 to make the outer layer circuit 120,220, and drill holes;

After the drilling is completed, electroplating drilling is performed to form a via hole 52 (as shown in FIG. 5C ), and the via hole 52 is used to make the inner layer lines 110 , 210 and the outer layer lines 120 , 220 conductive. the

As can be seen from the above, the detailed content of the process of each embodiment of the present invention, using these technologies, the finished products of passive components such as resistors or capacitors can be built into the multi-layer structure of the circuit board. Since the finished products of passive components are used, the acquisition of passive components As far as there is no supply problem, and in terms of process technology, the threshold involved is low, and mass production can be easily carried out, so manufacturing costs can be reduced and production efficiency can be improved. the

Claims (12)

1. the method for manufacturing circuit board of a built-in passive components comprises the following steps:

One first base material and one second base material are provided, and this first, second base material mainly is provided with a copper sheet respectively at the one side of a dielectric layer, and its another side then is formed with circuit, and interlayer conduction and copper sheet that this link tester is crossed on the dielectric layer constitute conducting;

Be provided with at aforementioned first base material on the one side of circuit and place passive device, and passive device and circuit on first base material are constituted be electrically connected;

One tabular dielectric material is provided, is formed with more than one perforate on this dielectric material, this perforate is corresponding to the passive device on first base material;

Make the aforementioned dielectric material and second base material superimposed in regular turn on first base material, and carry out pressing, wherein the passive device on first base material is positioned between the perforate of dielectric material;

Utilize the copper sheet on first, second base material outside to make outer-layer circuit;

The aforementioned superimposed structure that is made up of first base material, dielectric material and second base material is holed, and make via, to be electrically connected the circuit on first, second base material.

2. the method for manufacturing circuit board of built-in passive components as claimed in claim 1; Circuit on this first base material comprises component contacts; Be printed with the conduction jelly on this component contacts; This passive device is positioned on the component contacts of first base material, makes the melting of conduction jelly through baking, passive device is constituted with component contacts be electrically connected.

3. the method for manufacturing circuit board of built-in passive components as claimed in claim 2, this conduction jelly is conducting resinl or tin cream.

4. the method for manufacturing circuit board of built-in passive components as claimed in claim 3, this passive device is electric capacity or resistance.

5. the method for manufacturing circuit board of built-in passive components as claimed in claim 4, this electric capacity further is a ceramic condenser, its two ends have electrode, correspond respectively to the component contacts on first base material.

6. the method for manufacturing circuit board of built-in passive components as claimed in claim 5, the via on this first, second base material is a laser via.

7. the method for manufacturing circuit board of a built-in passive components comprises the following steps:

One first base material and one second base material are provided, and this first, second base material mainly is provided with a copper sheet respectively at the one side of a dielectric layer, and its another side then is formed with circuit, and interlayer conduction and copper sheet that this link tester is crossed on the dielectric layer constitute conducting;

Be provided with at aforementioned first base material on the one side of circuit and place passive device, and passive device and circuit on first base material are constituted be electrically connected;

One central layer is provided, is formed with more than one perforate on this central layer, this perforate is corresponding to the passive device on first base material;

Make the aforementioned central layer and second base material superimposed in regular turn on first base material, and carry out pressing, wherein the passive device on first base material is positioned between the perforate of central layer;

Utilize the copper sheet on first, second base material outside to make outer-layer circuit;

The aforementioned superimposed structure that is made up of first base material, central layer and second base material is holed, and make via, to be electrically connected the circuit on first, second base material.

8. the method for manufacturing circuit board of built-in passive components as claimed in claim 7; Circuit on this first base material comprises component contacts; Be printed with the conduction jelly on this component contacts; This passive device is positioned on the component contacts of first base material, makes the melting of conduction jelly through baking, passive device is constituted with component contacts be electrically connected.

9. the method for manufacturing circuit board of built-in passive components as claimed in claim 8, this conduction jelly is conducting resinl or tin cream.

10. the method for manufacturing circuit board of built-in passive components as claimed in claim 9, this passive device is electric capacity or resistance.

11. the method for manufacturing circuit board of built-in passive components as claimed in claim 10, this electric capacity further are a ceramic condenser, its two ends have electrode, correspond respectively to the component contacts on first base material.

12. the method for manufacturing circuit board of built-in passive components as claimed in claim 11, the via on this first, second base material are laser vias.

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