CN101735895A - Pickling solution composition for polished computer hard disk substrate - Google Patents
Pickling solution composition for polished computer hard disk substrate Download PDFInfo
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- CN101735895A CN101735895A CN201010023075A CN201010023075A CN101735895A CN 101735895 A CN101735895 A CN 101735895A CN 201010023075 A CN201010023075 A CN 201010023075A CN 201010023075 A CN201010023075 A CN 201010023075A CN 101735895 A CN101735895 A CN 101735895A
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Abstract
The invention relates to a pickling solution composition for a polished computer hard disk substrate, in particular to an acid cleaning solution composition capable of being used for the surface of a polished computer hard disk substrate plated with Ni-P. The pickling solution composition of the invention comprises the following components in percentage by weight: 1-8% of acid, 0.1-2.0% of corrosion inhibitor, 0.05-1.0% of surfactant and the balance deionized water. By using the pickling solution composition provided by the invention to clean the polished computer hard disk substrate, the number of nano-scale micro rough peaks on the surface can be effectively reduced, polishing micro defects on the surface can be reduced, and residual particles on the surface can be reduced, thereby improving the smoothness and the cleanness of the surface.
Description
Technical field
The present invention relates to a kind of pickling solution composition that is used for polished computer hard disk substrate, particularly a kind of acidic cleaning solution that is used for the surface of polished computer hard disk substrate of Ni-P plating.Belong to hard disc of computer surface cleaning processing technical field.
Background technology
In recent years, along with the appearance of the fast rise and the vertical storage technology of memory, hard disk capacity, storage density, the flying height of computer magnetic head has been reduced to about 8nm, estimates that the next generation will be reduced to about 2nm.Along with operation between magnetic head and disk is so approaching, more and more higher to the requirement of the planarization of magnetic disk surface and cleanliness factor.If hard disc surface roughness, percent ripple are excessive, in the process of high speed rotating, magnetic head will bump with magnetic disk surface, damages magnetic head or the lip-deep magneticmedium of memory, hard disk, thereby causes disk unit to break down or the mistake of reading writing information.Particularly, because the reduction of flying height, the microdefects such as number of the little rough peak of surface of polished nano level have also been proposed harsh requirement, the little rough peak of surface of polished nano level is too much, can influence the flight stability of magnetic head.
Simultaneously, residual microparticle also can cause head crash on the memory, hard disk surface.At present, generally adopt chemically machinery polished (CMP) technology that the hand disk wafer surface is polished, because polishing back unsalted surface is active high, and factors such as a large amount of nanometer abrasive particles (as nano silicon, nano alumina particles) that use high densitys, number of chemical product in the CMP polishing fluid, workpiece surface very easily adsorbs pollutents such as nano particle, causes cleaning behind the CMP extremely difficult.
In a word, the surface microscopic planarization of hand disk wafer, little rough peak situation, surface clearness etc. have badly influenced the use properties of computer hard disc substrate.
Summary of the invention
The purpose of this invention is to provide the deficiency that overcomes cleaning technique after the existing hand disk wafer chemically machinery polished, the acidic cleaning solution composition of a kind of suitable computer hard disc substrate chemically machinery polished rear surface is provided.
A kind of pickling solution composition that is used for polished computer hard disk substrate of the present invention is characterized in that this pickling solution composition has following moiety and weight percentage thereof:
Acid 1～8%,
Inhibiter 0.1～2.0%,
Tensio-active agent 0.05～1.0%,
The deionized water surplus;
Described acid is water-soluble inorganic acid or organic acid, and mineral acid is any one or two kinds of mixing acid in phosphoric acid, sulfuric acid, the nitric acid; Organic acid is any in formic acid, amino acid, acetate, the thionamic acid; Perhaps the mixing acid that cooperates with organic acid for mineral acid is that phosphoric acid adds amino sulfonic acid;
Described inhibiter is water-soluble organic or inorganic inhibiter, and they are: urotropine, benzotriazole, thiocarbamide, phosphoric acid salt, borate; Select wherein any;
Described tensio-active agent is the water soluble surfactant active, includes: dodecyl Soxylat A 25-7, dodecyl polyoxyethylene ether sulfate, tween, dodecyl polyethenoxy ether carboxylate; Select wherein any.
A kind of preparation method who is used for the pickling solution composition of polished computer hard disk substrate of the present invention, it is characterized in that having following process and step: take by weighing each raw material by above-mentioned prescription, under mechanical stirring, successively tensio-active agent, inhibiter are joined in the deionized water, after treating stirring and dissolving, under constantly stirring, add acid again, stir, obtain transparent liquid, be the pickling solution composition of computer hard disc substrate.
Pickling solution composition of the present invention is specially adapted to the cleaning process of the computer hard disc substrate chemically machinery polished rear surface of Ni-P plating.By the effect of each composition in the described pickling solution composition to hand disk wafer surface after polishing, can effectively reduce the little rough peak number of nano surface level, alleviate surface finish microdefect situation, reduce the remained on surface particle, thereby improved surperficial smooth finish and degree of cleaning.
Embodiment
After now specific embodiments of the invention being described in.
Embodiment one: in the present embodiment, the composition and the weight percentage of the pickle solution of surface of polished computer hard disk substrate are as follows:
Tensio-active agent dodecyl Soxylat A 25-7 0.2%
Inhibiter urotropine 1.5%
Phosphoric acid 5.0%
Deionized water 93.3%
The preparation of pickle solution: under mechanical stirring, successively tensio-active agent, inhibiter are joined in the deionized water, after the stirring and dissolving, stir adding acid down, stirring gets final product, and what obtain is transparent liquid.
The computer hard disc substrate that Ni-P after the polishing is applied plating carries out ultrasonic cleaning with above-mentioned pickle solution, ultrasonic frequency 100KHz, 5 minutes time; Normal process is cleaned routinely then; Use atomic force microscope (AFM) that nano surface rough peak number is measured at last, (LPC) measures surperficial residual particles with the liquid-phase particle calculating instrument.Detected result sees Table 1.Embodiment two: in the present embodiment, the composition and the weight percentage of the pickle solution of surface of polished computer hard disk substrate are as follows:
Tensio-active agent dodecyl Soxylat A 25-7 0.2%
Inhibiter thiocarbamide 1.5%
Phosphoric acid+sulfuric acid (by 1: 1 weight ratio) 5.0%
Deionized water 93.3%
Pickle solution preparation in the present embodiment, acid cleaning process and surperficial testing process are identical with the foregoing description 1.Detected result sees Table 1.
Embodiment three: in the present embodiment, the composition and the weight percentage of the pickle solution of surface of polished computer hard disk substrate are as follows:
Tensio-active agent tween 0.2%
Inhibiter benzotriazole 1.5%
Formic acid 5.0%
Deionized water 93.3%
Pickle solution preparation in the present embodiment, acid cleaning process and surperficial testing process are identical with the foregoing description 1.Detected result sees Table 1.Embodiment four: in the present embodiment, the composition and the weight percentage of the pickle solution of surface of polished computer hard disk substrate are as follows:
Tensio-active agent dodecyl polyethenoxy ether sodium sulfate 0.2%
Inhibiter benzotriazole 1.5%
Phosphoric acid+thionamic acid (by 1: 1 weight ratio) 5.0%
Deionized water 93.3%
Pickle solution preparation in the present embodiment, acid cleaning process and surperficial testing process are identical with the foregoing description 1.Detected result sees Table 1.In order to compare the effect of pickle solution, as a comparison case with blank deionized water.
Comparative example 1 (blank assay)
Deionized water 100%
Replace pickle solution to carry out ultrasonic cleaning with deionized water, undertaken by above same cleaning then, detect equally at last, it the results are shown in Table 1.
The detected result of each embodiment of table 1
From table 1 as seen, after clean is carried out on the computer hard disc substrate surface of the deposited plating of Ni-P after adopting pickle solution provided by the invention to polishing, carry out normal wash again, significantly reduced nano surface level rough peak number, lowered remained on surface particle number, improved surface clearness.
Claims (2)
1. pickling solution composition that is used for polished computer hard disk substrate is characterized in that this pickling solution composition has following moiety and weight percentage thereof:
Acid 1～8%,
Inhibiter 0.1～2.0%,
Tensio-active agent 0.05～1.0%,
The deionized water surplus;
Described acid is water-soluble inorganic acid or organic acid, and mineral acid is any one or two kinds of mixing acid in phosphoric acid, sulfuric acid, the nitric acid; Organic acid is any in formic acid, amino acid, acetate, the thionamic acid; Perhaps the mixing acid that cooperates with organic acid for mineral acid is that phosphoric acid adds amino sulfonic acid;
Described inhibiter is water-soluble organic or inorganic inhibiter, and they are: urotropine, benzotriazole, thiocarbamide, phosphoric acid salt, borate; Select wherein any;
Described tensio-active agent is the water soluble surfactant active, includes: dodecyl Soxylat A 25-7, dodecyl polyoxyethylene ether sulfate, tween, dodecyl polyethenoxy ether carboxylate; Select wherein any.
2. preparation method who is used for the pickling solution composition of polished computer hard disk substrate, it is characterized in that having following process and step: take by weighing each raw material by above-mentioned prescription, under mechanical stirring, successively tensio-active agent, inhibiter are joined in the deionized water, after treating stirring and dissolving, under constantly stirring, add acid again, stir, obtain transparent liquid, be the pickling solution composition of computer hard disc substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010100230753A CN101735895B (en) | 2010-01-21 | 2010-01-21 | Pickling solution composition for polished computer hard disk substrate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010100230753A CN101735895B (en) | 2010-01-21 | 2010-01-21 | Pickling solution composition for polished computer hard disk substrate |
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| CN101735895A true CN101735895A (en) | 2010-06-16 |
| CN101735895B CN101735895B (en) | 2012-02-22 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102011128A (en) * | 2010-12-30 | 2011-04-13 | 上海大学 | Cleaning agent composite used after computer hard disk substrate polishing |
| CN102477359A (en) * | 2010-11-26 | 2012-05-30 | 安集微电子（上海）有限公司 | Chemical mechanical polishing cleaning solution |
| CN103146246A (en) * | 2013-04-03 | 2013-06-12 | 东莞市剑鑫电子材料有限公司 | Aqueous acid metal printing ink cleaner, and preparation and using methods thereof |
-
2010
- 2010-01-21 CN CN2010100230753A patent/CN101735895B/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102477359A (en) * | 2010-11-26 | 2012-05-30 | 安集微电子（上海）有限公司 | Chemical mechanical polishing cleaning solution |
| CN102477359B (en) * | 2010-11-26 | 2015-12-02 | 安集微电子（上海）有限公司 | A kind of chemically mechanical polishing cleaning liquid |
| CN102011128A (en) * | 2010-12-30 | 2011-04-13 | 上海大学 | Cleaning agent composite used after computer hard disk substrate polishing |
| CN102011128B (en) * | 2010-12-30 | 2012-07-04 | 上海大学 | Cleaning agent composite used after computer hard disk substrate polishing |
| CN103146246A (en) * | 2013-04-03 | 2013-06-12 | 东莞市剑鑫电子材料有限公司 | Aqueous acid metal printing ink cleaner, and preparation and using methods thereof |
| CN103146246B (en) * | 2013-04-03 | 2014-12-24 | 东莞市剑鑫电子材料有限公司 | Aqueous acid metal printing ink cleaner, and preparation and using methods thereof |
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| Publication number | Publication date |
|---|---|
| CN101735895B (en) | 2012-02-22 |
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