CN101714608B - Method for encapsulating piezoelectric polymer thin-film sensor - Google Patents
Method for encapsulating piezoelectric polymer thin-film sensor Download PDFInfo
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- CN101714608B CN101714608B CN2009101997897A CN200910199789A CN101714608B CN 101714608 B CN101714608 B CN 101714608B CN 2009101997897 A CN2009101997897 A CN 2009101997897A CN 200910199789 A CN200910199789 A CN 200910199789A CN 101714608 B CN101714608 B CN 101714608B
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- film
- piezoelectric polymer
- polymer thin
- film sensor
- encapsulating
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- 239000010409 thin film Substances 0.000 title claims abstract description 37
- 229920000642 polymer Polymers 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 12
- 239000004743 Polypropylene Substances 0.000 claims abstract description 7
- -1 polypropylene Polymers 0.000 claims abstract description 7
- 229920001155 polypropylene Polymers 0.000 claims abstract description 7
- 239000010408 film Substances 0.000 claims description 20
- 229920006280 packaging film Polymers 0.000 claims description 14
- 239000012785 packaging film Substances 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 8
- 238000012856 packing Methods 0.000 claims description 5
- 230000008020 evaporation Effects 0.000 claims description 4
- 238000001704 evaporation Methods 0.000 claims description 4
- 230000002441 reversible effect Effects 0.000 claims description 3
- 238000005086 pumping Methods 0.000 claims 1
- 239000012528 membrane Substances 0.000 abstract description 8
- 238000002844 melting Methods 0.000 abstract 2
- 230000008018 melting Effects 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 4
- 229920001169 thermoplastic Polymers 0.000 description 4
- 239000004416 thermosoftening plastic Substances 0.000 description 4
- 230000006870 function Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000006378 damage Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005269 aluminizing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
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- 238000003466 welding Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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Abstract
The invention relates to a method for encapsulating a piezoelectric polymer thin-film sensor, which comprises the following steps of: cutting micropore structure crosslinked polypropylene (XPP) membrane into the membrane with a size of 1cm*5cm; depositing metal electrodes on the two surfaces of the XPP membrane through vapor after a charging process; adhering metal wires (1) on the upper and lower surfaces of the XPP membrane through conductive adhesive to form the piezoelectric polymer thin-film sensor (3); placing the piezoelectric polymer thin-film sensor (3) into an encapsulating thin film (2) of which the melting point is less than that of the XPP membrane to vacuumize; adjusting the temperature of a thermocompressor to the melting point of the encapsulating thin film (2); and adhering the vacuumized piezoelectric polymer thin-film sensor (3) with the encapsulating thin film (2) into a whole. The method for encapsulating the piezoelectric polymer thin-film sensor is simple in process and low in cost and is quick to perform; and the piezoelectric polymer thin-film sensor encapsulated by the method can be bent freely, is ultrathin, water-proof, dust-proof, anti-static, high temperature resistant, strong in insulating ability, good in sealability and pressure resistance and long in service life, and can be widely applied in the fields of communication, sensors, memory cards, severe military environment and the like.
Description
Technical field
The present invention relates to a kind of method for packing of piezoelectric polymer thin-film sensor, specifically is the method that realizes the piezoelectric polymer thin-film sensor encapsulation by the thermoplastic method.Belong to transducer and technical field of function materials.
Technical background
After some nonpolar microcellular structure thin polymer film is handled through suitable electric polarization, the characteristics that piezoelectric and electret are arranged simultaneously, being named as piezo-electric electret (piezoelectret) or ferroelectric electret (ferroelectret), is a member new in the polymeric piezoelectric material family.The appearance of piezo-electric electret apart from the present only less than the time in 20 years, but but be subjected to the extensive concern of material science and sensor field, this is not only because they present the high-tension electricity activity that is similar to piezoelectric ceramic, and has a flexibility, but large tracts of land film forming, cheap environmental protection, therefore the advantages such as low acoustic impedance with water and human body are complementary will have wide practical use aspect transducer (comprising audio frequency and ultrasonic frequency scope) and the actuator.
Piezo-electric electret is different from the conventional piezoelectric body and ferroelectric is that the self character of material is a non-polar material, the generation of its piezoelectric effect comes from two solid dielectric wall surfaces of hole in the electric polarization course and captures the opposite polarity electric charge that the air gap ionic discharge produces respectively, forms " dipole " of macroscopic view (micron dimension) orientation.Hole in the piezo-electric electret material should be the semi-closed structure or the full-closed structure of thickness direction closure at least.This is because the hole wall of piezo-electric electret thin film thickness direction is the medium of memory space electric charge, and hole can be designed to conducting or half conducting structure according to concrete application requirements at horizontal direction.In actual applications, piezo-electric electret thin film must the two sides be coated with electrode just can be with signal of telecommunication output or input.One of fundamental physical quantity that characterizes the piezo-electric electret piezoelectric activity is a piezoelectric coefficient d
33, and piezoelectric coefficient d
33Value and the charge density σ of hole inside
iDirectly related.
If hole is semi-closed structure, when piezo-electric electret is applied in humidity or liquid environment, for example the higher environment of relative humidity be soaked in water or oil in, then Chao Shi steam or liquid will cause space charge σ from the open hole inside of laterally entering of film
iDecay, the reduction of transducer sensitivity and the shortening in life-span.On the other hand, when piezo-electric electret is applied to transducer, if directly be exposed to the adverse circumstances environment of corrosive gas (as have) or long-term work atmospheric environment in humidity, the electrode of film surface will be damaged, influence the input and output of the signal of telecommunication, even cause the forfeiture of senser element function.
Summary of the invention
The objective of the invention is to propose a kind of method of simple and easy to do realization piezopolymer sensor package.The method that realizes the encapsulation of piezopolymer transducer among the present invention is the thermoplastic method.
For reaching above-mentioned purpose, the present invention makes piezopolymer transducer (work package) secure package in thin polymer film inside, work package can not be subjected to the erosion of external dust foreign material, also can not be subjected to the influence (function of use encapsulating material) of daylight, reduce the piezopolymer depletion sensor, improved the useful life of piezopolymer transducer.Simultaneously, this method has simple to operate, cheap, can finish rapidly, easily extensive film forming, and can cross the characteristics of moulding by secondary, encapsulation technology adopts unique material, make piezoelectricity force cell after completing not only have ultra-thin, can free bend, waterproof, heatproof, withstand voltage, insulating properties strong, film and the tight characteristics of lead fixed, and really realized the work package feature of long life.The step of the encapsulation of usefulness thermoplastic method realization piezopolymer transducer is as follows among the present invention:
First preparation piezoelectric polymer thin-film sensor: commercially available microcellular structure crosslinked polypropylene (XPP) film is cut into the rectangle that is of a size of 1cm * 5cm size, be placed on the plate electrode, 1min charges under the direct voltage of-20KV.The charging back is to the two-sided evaporation metal electrode of XPP film, again at two-sided evaporation the upper and lower surface of XPP film of metal electrode by conducting resinl respectively with plain conductor and XPP bonding, become when mechanical force is on the XPP film and have the signal of telecommunication, it is characterized in that from the piezoelectric polymer thin-film sensor that plain conductor spreads out of:
At first, with packaging film piezoelectric polymer thin-film sensor is packed into wherein, packaging film is the fusing point that fusing point is lower than the XPP film of forming the piezopolymer transducer; Take out air between packaging film and the piezoelectric polymer thin-film sensor with commercially available vacuum equipment again;
Then, with the fusing point of commercially available hot press adjustment, piezopolymer transducer and packaging film after vacuumizing are bonded into one at packaging film.
Advantage of the present invention and effect are as follows:
1, manufacture craft of the present invention is very simple, cost of manufacture is also very low, but through the good piezoelectric polymer thin-film sensor good airproof performance of packaging by hot pressing of the present invention, prevent that piezoelectric polymer thin-film sensor from directly contacting with liquid such as dust impurity and water, make the out of use defective of transducer thereby eliminated decline owing to the piezoelectric polymer thin-film piezoelectric property.
2, the packaged transducer of the inventive method still can use under rugged environment, has prolonged the service life of piezopolymer transducer, has increased the useful life and the use field of piezopolymer transducer.
3, the present invention can make the outward appearance of piezopolymer transducer any pattern of wanting, the demand of having catered to market by the outward appearance and the pattern that change encapsulating film.
Description of drawings
Fig. 1 is the plane graph through encapsulation back piezoelectric polymer thin-film sensor.
Fig. 2 is the end view through encapsulation back piezoelectric polymer thin-film sensor.
Wherein, 1-front metal lead, 2-packaging film, 3-piezoelectric polymer thin-film sensor, 4-conducting resinl, 5-reverse side plain conductor.
Embodiment
The invention is further illustrated by the following examples.
Referring to Fig. 1, Fig. 2, the XPP film is cut into be of a size of 1cm * 5cm earlier, be placed on the plate electrode, 1min charges under the direct voltage of-20KV; The electrode of aluminizing respectively on its two sides then, with conducting resinl 4 front metal lead 1 and reverse side plain conductor 5 are sticked on respectively on the XPP film again, on the aluminium electrode of lower surface, made the piezoelectric polymer thin-film sensor 3 of XPP film at this point, ready-made piezoelectric polymer thin-film sensor 3 is clipped between two packaging films 2, take out air between packaging film 2 and the piezoelectric polymer thin-film sensor 3 with vacuumfilter, being warmed up to 85 ℃ with hot press from room temperature then is bonded together two packaging films 2, realize the encapsulation of piezoelectric polymer thin-film sensor 3, the sensor thickness after the encapsulation is 2mm.
When masterpiece was used on the packaged piezoelectric polymer thin-film sensor 3, the signal of telecommunication that piezoelectric polymer thin-film sensor 3 produces was derived by plain conductor after conducting resinl 4.
Above-mentioned front metal lead 1 and reverse side plain conductor 5 are general leads of selling on the market, through being commonly used to the components and parts of connecting circuit, as the connecting line of welding resistance and electric capacity.
Above-mentioned metal electrode can be conduction good metal materials such as zinc metal sheet, copper sheet or tin sheet.
Above-mentioned hot press is to be used for the machine of thermoplastic photo in the general photo studio.
With the method for present piezopolymer encapsulation be that piezoelectric membrane with plated electrode is bonded in signal processing device with conducting resinl and is set up, again device is placed to toast in the baking oven and compare, method for packing raw material of the present invention are easily buied, be not easy the performance injury to piezoelectric membrane, weak point consuming time, expense is low, does not require meticulous operation, and just can change after the piezoelectric membrane permanent damage.
Method for packing of the present invention is simple to operate, and cheapness can be finished rapidly, and the piezoelectric force cell after completing have ultra-thin, can free bend, strong, the film of waterproof, insulating properties fixes tight characteristics with lead.
Claims (1)
1. the method for packing of a piezoelectric polymer thin-film sensor, earlier prepare piezoelectric polymer thin-film sensor (3) as follows: microcellular structure crosslinked polypropylene film is cut into the rectangle that is of a size of 1cm * 5cm size, be placed on the plate electrode, charging is 1 minute under the direct voltage of-20KV; The charging back is to the two-sided evaporation metal electrode of microcellular structure crosslinked polypropylene film, again at two-sided evaporation the upper and lower surface of microcellular structure crosslinked polypropylene film of metal electrode by conducting resinl (4) respectively with front metal lead (1) and reverse side plain conductor (5) and its bonding, become and when mechanical force is on microcellular structure crosslinked polypropylene film, have the piezoelectric polymer thin-film sensor (3) of the signal of telecommunication, it is characterized in that from plain conductor output:
At first, with packaging film (2) piezoelectric polymer thin-film sensor (3) is packed into wherein, the fusing point of packaging film (2) is lower than the fusing point of the microcellular structure crosslinked polypropylene film of forming piezopolymer transducer (3); Take out air between packaging film (2) and the piezoelectric polymer thin-film sensor (3) with vaccum-pumping equipment again;
Then, the hot press adjustment to packaging film (2) fusing point, is bonded into one piezoelectric polymer thin-film sensor after vacuumizing (3) and packaging film (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101997897A CN101714608B (en) | 2009-12-01 | 2009-12-01 | Method for encapsulating piezoelectric polymer thin-film sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101997897A CN101714608B (en) | 2009-12-01 | 2009-12-01 | Method for encapsulating piezoelectric polymer thin-film sensor |
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| Publication Number | Publication Date |
|---|---|
| CN101714608A CN101714608A (en) | 2010-05-26 |
| CN101714608B true CN101714608B (en) | 2011-05-25 |
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|---|---|---|---|
| CN2009101997897A Expired - Fee Related CN101714608B (en) | 2009-12-01 | 2009-12-01 | Method for encapsulating piezoelectric polymer thin-film sensor |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102522495B (en) * | 2011-12-21 | 2014-02-19 | 贝辛电子科技（上海）有限公司 | Method for raising signal to noise ratio of piezoelectric electret film sensor |
| CN102723752B (en) * | 2012-05-24 | 2015-09-09 | 深圳市豪恩声学股份有限公司 | Piezoelectric charging formula mobile terminal |
| CN105588585A (en) * | 2015-12-15 | 2016-05-18 | 感至源电子科技（上海）有限公司 | Composite shielding type piezoelectric film sensor |
| CN106025060A (en) * | 2016-07-15 | 2016-10-12 | 北京大学 | Wavy piezoelectric composite device and preparation method and application thereof |
| GB201617171D0 (en) * | 2016-10-10 | 2016-11-23 | Universitetet I Troms� - Norges Arktiske Universitet | Piezoelectric films |
| CN106805954B (en) * | 2017-02-28 | 2020-02-14 | 华中科技大学 | Wearable flexible pressure sensor and preparation method thereof |
| CN111377081A (en) * | 2018-12-27 | 2020-07-07 | 云南全控机电有限公司 | Vacuumizing packaging equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6570300B1 (en) * | 1996-05-23 | 2003-05-27 | Siemens Aktiengesellschaft | Piezoelectric bending transducer and method for producing the transducer |
| CN1739011A (en) * | 2003-01-24 | 2006-02-22 | 松下电器产业株式会社 | Pressure sensor, object detection device, opening/closing device, and method for producing the pressure sensor |
| EP1724849A2 (en) * | 2005-05-03 | 2006-11-22 | Argillon GmbH | Piezoelectric element |
-
2009
- 2009-12-01 CN CN2009101997897A patent/CN101714608B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6570300B1 (en) * | 1996-05-23 | 2003-05-27 | Siemens Aktiengesellschaft | Piezoelectric bending transducer and method for producing the transducer |
| CN1739011A (en) * | 2003-01-24 | 2006-02-22 | 松下电器产业株式会社 | Pressure sensor, object detection device, opening/closing device, and method for producing the pressure sensor |
| EP1724849A2 (en) * | 2005-05-03 | 2006-11-22 | Argillon GmbH | Piezoelectric element |
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|---|---|
| CN101714608A (en) | 2010-05-26 |
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Granted publication date: 20110525 Termination date: 20131201 |