CN101648622A - Method for dissipating charges on end face of cover tape - Google Patents
Method for dissipating charges on end face of cover tape Download PDFInfo
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- CN101648622A CN101648622A CN200910034694A CN200910034694A CN101648622A CN 101648622 A CN101648622 A CN 101648622A CN 200910034694 A CN200910034694 A CN 200910034694A CN 200910034694 A CN200910034694 A CN 200910034694A CN 101648622 A CN101648622 A CN 101648622A
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- cover tape
- sealing layer
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Abstract
The invention discloses a method for dissipating charges on the end face of a cover tape, which is used in the process of producing the electronic parts for the electronic carrier tapes and the covertapes. The cover tape comprises an upper surface layer, an intermediate layer and a heat sealing layer from top to bottom in sequence. The heat sealing layer can be bonded with a carrier tape. When bonding is carried out, first antistatic agents are coated on the upper surface of the upper surface layer, the end faces at both sides of the cover tape and the lower surface of the heat sealing layer,so that the end faces of the cover tape, the upper surface of the upper surface layer and the lower surface of the heat sealing layer are connected to form a whole antistatic layer. In the previous method, when static electricity appears, the static electricity generated above can only be dissipated by the upper surface layer and the static electricity generated below can only be dissipated by the lower surface layer. The method of the invention is characterized by dissipating the static electricity as a whole due to upper and lower connection, doubling the dissipation speed and further ensuring the uniformity of the bonding strength of the cover tape and the carrier tape, and effectively improves the adhesiveness and antistatic property, which can not be reached by the previous method.
Description
Technical field
The present invention is applied to the method for cover tape elimination static on the electronic building brick.This method is applied to packing, and transportation and robotic arm take out the electronic original part on the carrier band automatically, are assembled on the circuit card.More particularly, the present invention is directed to the apparatus and method that are used for sealing uniformly and peelling off cover tape elimination static and the more effective protection electronic building brick of saving electrostatic agent.
Background technology
Existing method adopts the mode of the envelope tape spool of electronic building brick moving belt (electronic building brick transports body).The mode of this envelope tape spool, by automatic component feed machine etc., in the groove on the carrier band that electronic building brick is inserted with original paper cooperates, covering one deck plastic cement thickness cover tape on the 50-60 micron on carrier band, allow cover tape and the carrier band tool leak tightness that is bonded together by the heating power rod, be rolled into the rolling strip and transported.This technology generally adopts envelope band machine to carry out.The electronic building brick that needs to be rolled into rolling strip the inside in using the process of electronic building brick will be gone up the electronic building brick that the cover tape strip off takes out the groove the inside that places on the carrier band with robotic arm by moving belt and take out, and install on circuit card.This automated installation of system has become the main trend of this industry.
The desired function of last cover tape for being used in this electronic building brick particularly, has: (1) for the bond strength of last cover tape and carrier band will be in certain scope (20g-80g, and the difference of peak and minimum needs in 20g); (2) under the environment of hot pressing, can obtain the stability of strip off loam cake band strength, no matter and temperature or bonding object how all can obtain suitable binding power; (3) want to avoid robotic arm with adhesive tape in 0.015 second/pc (the fastest at present) strip off, take out the static that electronic building brick produced of groove the inside, so want static discharge will allow cover tape in the strip off speed 0.015 second/below the pc, fault just can not occur, or to cause mechanical arm can't correctly catch the installation of part improper etc. because of cover tape on the generation of static electricity is clung part because of the generation of static electricity electronic building brick.
Because the more and more littler requirement to static of electronic building brick now is than higher, so original product is to the strategy of electrostatic prevention is also many but effect is bad.As, original product, they are the antistatic additive of the top layer of last cover tape and bottom adding GENERAL TYPE, conduction natural gum, molecule metal etc.; The well still anlistatig effect of adhesive bonding property that the antistatic additive of adding GENERAL TYPE is gone up later between cover tape and the carrier band is bad.Add and to go up antistatic good between cover tape and the carrier band after the conduction natural gum but the adhesive bonding property effect is bad, and the price height.Adding the molecule metal goes up later antistatic good between cover tape and the carrier band still the adhesive bonding property intensity effect is bad.So can't satisfy fitness for purpose intensity difference of height below 20g, and the price height.
In addition, it is best that the bonding effect of last cover tape and carrier band adopts a kind of plastic cement adhesive bonding property.Electrostatic prevention is good, strip off loam cake band strength is even but the adding antistatic additive is wanted later on to reach, and prior art is to be difficult to accomplish.Way originally is the last cover tape film that about 700mm full width is wide, be cut into the loam cake carries product of slices such as 5.3mm and 9.3mm after the antistatic coating of enforcement upper and lower faces again, wherein the end face because of itemize does not have antistatic additive, form the insulation phenomenon of upper and lower layer, have only upper and lower surface that the effect of leading static is arranged respectively.Do like this can as lower floor's coating quality preferably antistatic additive can directly influence the stable effect of heat-sealing of hot sealing layer and carrier band in the hope of conductive effect preferably.
Can sneak into because of electrostatic agent after sealing in the glue of hot sealing layer, this is the reason that produces static when causing tearing cover tape, and static can only lean on the lower surface of hot sealing layer to get rid of.It is inhomogeneous and cause carrier band vibrations back electronic building brick to drop or can run away in the position that the heat-sealing line on both sides is torn power when robotic arm is opened cover tape automatically, thereby cause leaking engineering and bad.
Summary of the invention
At above-mentioned the deficiencies in the prior art, the technical problem to be solved in the present invention provides a kind of electronic building brick loam cake belt surface and goes up the method for the whole dissipation static of cover tape inner face, can better realize the bonding of cover tape and carrier band by this method, and generation that can effectively preventing static is the effect that always can't reach.
For solving the problems of the technologies described above, the present invention adopts following technical scheme.
A kind of method for dissipating charges on end face of cover tape, the seal process that is used for cover tape and carrier band, the wherein said cover tape that goes up comprises upper epidermis, interlayer and hot sealing layer from top to bottom successively, described hot sealing layer can be bonding with carrier band, carry out bonding, at first should be at the upper surface of described upper epidermis, the both sides end face of last cover tape and the lower surface of hot sealing layer are coated antistatic additive, the lower surface of the upper surface of end face, upper epidermis of cover tape and hot sealing layer is connected has formed a whole antistatic backing, when static takes place, can static be got rid of by last adhesive tape top and bottom single-piece.
Preferably, described hot sealing layer lower surface is coated with comprehensively is second-rate but adhesive bonding property antistatic additive preferably, and what the described upper surface of going up cover tape both sides end face and upper epidermis was coated with is quality antistatic additive preferably.
Preferably, the centre of described hot sealing layer scribbles antistatic additive, and the little part in the both sides of the edge of described hot sealing layer is not coated with the good heat-sealing line of antistatic formation.
Adopt technique scheme to have following beneficial effect: the upper surface of upper epidermis is connected via end face with the lower surface of hot sealing layer and has formed a whole antistatic backing, when static takes place, can static be doubled fast speed and get rid of by last adhesive tape upper and lower surface single-piece, prevent static to carrier band in the influence of electronic building brick.There have the lower surface of hot sealing layer and carrier band to realize again to be more bonding, and therefore the bind strength of going up between cover tape and the carrier band is even, can not appear at stressed shakiness when peeling off and phenomenon that electronic building brick is dropped.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification sheets, below with preferred embodiment of the present invention and conjunction with figs. describe in detail as after.The specific embodiment of the present invention is provided in detail by following examples and accompanying drawing thereof.
Description of drawings
Fig. 1 is the front view of one embodiment of the invention.
Fig. 2 is a left view of going up cover tape among Fig. 1, wherein is depicted as hot sealing layer and is coated with antistatic additive comprehensively.
Fig. 3 is the perspective view of second embodiment of the invention.
Fig. 4 is the front view of second embodiment of the invention, wherein is depicted as the local coating of hot sealing layer antistatic additive.
The specific embodiment
Below in conjunction with accompanying drawing, the preferred embodiments of the present invention are described in detail.
As shown in Figure 1, 2, this method for dissipating charges on end face of cover tape is used for the seal process of cover tape 1 and carrier band 2, wherein goes up cover tape 1 and comprises upper epidermis 11, interlayer 12 and hot sealing layer 13 from top to bottom successively, and hot sealing layer 13 can be bonding with carrier band 2.Carry out bonding, at first should be at the upper surface of upper epidermis 11, the both sides end face of last cover tape 1 and the lower surface of hot sealing layer 13 are coated antistatic additive, form antistatic layer 21,14,22 respectively, as shown in Figure 2, antistatic layer 21,14,22 has formed a whole antistatic backing, and the antistatic backing of the upper surface of the upper epidermis 11 that can link via end face when drawing back the loam cake static electrification and take place and the lower surface of hot sealing layer 13 is got rid of static simultaneously.Wherein antistatic layer 21,14 can adopt quality antistatic additive preferably, antistatic layer 22 adopts second-rate but adhesive bonding property antistatic additive preferably, can also guarantee the bonding homogeneity between hot sealing layer 13 and the carrier band 2 like this, avoid appearing at the phenomenon that owing to stressed shakiness electronic building brick is dropped when cover tape 1 is peeled off with carrier band 2 and occur.The antistatic additive of the lower surface of hot sealing layer 13 can directly be added in this hot sealing layer 13, perhaps at the lower surface of hot blast layer by doing comprehensive coating.
Shown in Fig. 3,4, as an alternative embodiment of the invention, the difference of itself and the foregoing description is, is that centre portion scribbles antistatic agent at the lower surface of hot sealing layer 13, form antistatic backing 22, and the edge of the lower surface of hot sealing layer 13 forms good heat-sealing line.Adopt said structure, when two heat-sealing lines produce static, can reach the effect that obtains whole electrostatic dissipation via 14 bonded assemblys 21 by 22.Adopt two heat-sealing lines and carrier band to carry out bonding, can make that the power of tearing when cover tape and carrier band are peeled off is more steady, article two, line can both be torn the highest minimum difference in the every limit of power and accomplishes below the 10g, peeling off of convenient upward cover tape and carrier band, and the use amount of antistatic additive reduces, thereby reduced the cost of last cover tape, improved productivity effect.
In the such scheme, the upper epidermis material comprises
■ paper
The poly diaxon stretched PTFE film of ■
The polyacrylic diaxon stretched PTFE film of ■
The diaxon stretched PTFE film of ■ polyester
The diaxon stretched PTFE film of ■ nylon.
Intermediate layer material ■ polyethylene kind
■ α-polyalkenes
The ethylene acrylic of ■ ethylene copolymer, ethylene methyl acrylate, ethylene methacrylic acid, ethylene ethyl acrylic acid, ethylene ethyl acrylate, ethylene ethyl alcohol
The ■ ion exchange resin
■ elastic body class such as styrene-isoprene-phenylethene
S-B-S
Styrene-ethylene-butadiene-styrene
Styrene-ethylene-propylene-styrene
And above-mentioned hydride
Poly-mephenesin Carbamate, ternary ethylene propylene rubber, hydrogenation polyisobutylene
The ■ tackifier
■ oxidizer, UV resistant agent, antisticking agent, lubrication prescription.
The hot sealing layer material of internal layer is the ■ polyethylene kind
■ α-polyalkenes
The ethylene acrylic of ■ ethylene copolymer, ethylene methyl acrylate, ethylene methacrylic acid, ethylene ethyl acrylic acid, ethylene ethyl acrylate, ethylene ethyl alcohol
The ■ ion exchange resin
■ elastic body class such as styrene-isoprene-phenylethene
S-B-S
Styrene-ethylene-butadiene-styrene
Styrene-ethylene-propylene-styrene
And above-mentioned hydride
Poly-mephenesin Carbamate, ternary ethylene propylene rubber, hydrogenation polyisobutylene
The ■ tackifier
■ oxidizer, UV resistant agent, antisticking agent, lubrication prescription.
In such scheme, the antistatic additive of every layer upper surface and inside face coating is:
1) interface activating agent: for example-ionic (anion, cation), the nonionic organic compound.
2) various slaines, penus slaine, amido salt.
3) conductive agent: for example-particle metal, metallic oxide, carbon black and conducting polymer cmpd.Interlayer can add organic electrostatic agent that prevented: for example-and the compound of Choline Chloride, methyl methacrylate and glyoxal ethyline.
Skin, interlayer, hot sealing layer all can be by the structures of the structure to three of one deck layer.
More than the method for dissipating charges on end face of cover tape that the embodiment of the invention provided is described in detail; for persons skilled in the art; thought according to the embodiment of the invention; part in specific embodiments and applications all can change; in sum; this description should not be construed as limitation of the present invention, and all any changes of making according to design philosophy of the present invention are all within protection scope of the present invention.
Claims (4)
1 one kinds of method for dissipating charges on end face of cover tape, the seal process that is used for cover tape (1) and carrier band (2), the wherein said cover tape (1) that goes up comprises upper epidermis (11) from top to bottom successively, interlayer (12) and hot sealing layer (13), described hot sealing layer (13) can be bonding with carrier band (2), it is characterized in that: carry out bonding, at first should be at the upper surface of described upper epidermis (11), the lower surface of the both sides end face of last cover tape (1) and hot sealing layer (13) is coated antistatic additive, make the end face of cover tape (1), the lower surface of the upper surface of upper epidermis (11) and hot sealing layer (13) is connected and has formed a whole antistatic backing, can static be got rid of by upper and lower surface integral body when static takes place.
2 a kind of method for dissipating charges on end face of cover tape according to claim 1, it is characterized in that: described hot sealing layer (13) lower surface is coated with is second-rate but adhesive bonding property antistatic additive preferably, and what the described upper surface of going up cover tape (1) both sides end face and upper epidermis (11) was coated with is electrostatic dissipation quality antistatic additive preferably.
3 a kind of method for dissipating charges on end face of cover tape according to claim 1 and 2 is characterized in that: the centre of described hot sealing layer (13) scribbles antistatic additive, and the both sides of the edge of described hot sealing layer (13) do not have the coating antistatic additive and form good heat-sealing line.
4 a kind of method for dissipating charges on end face of cover tape according to claim 1 and 2 is characterized in that: the comprehensive coating of hot sealing layer does not influence the antistatic additive of heat-sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910034694A CN101648622A (en) | 2009-09-08 | 2009-09-08 | Method for dissipating charges on end face of cover tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910034694A CN101648622A (en) | 2009-09-08 | 2009-09-08 | Method for dissipating charges on end face of cover tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101648622A true CN101648622A (en) | 2010-02-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910034694A Pending CN101648622A (en) | 2009-09-08 | 2009-09-08 | Method for dissipating charges on end face of cover tape |
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| Country | Link |
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| CN (1) | CN101648622A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104590739A (en) * | 2013-10-31 | 2015-05-06 | 株式会社村田制作所 | Electronic component package, electronic component series, and carrier tape |
| CN104648816A (en) * | 2013-11-18 | 2015-05-27 | 罗姆股份有限公司 | Electronic component packaging body |
| CN105209350A (en) * | 2013-05-14 | 2015-12-30 | 住友电木株式会社 | Sheet for producing carrier tape, production method for sheet for producing carrier tape, and package |
| CN110844324A (en) * | 2019-11-15 | 2020-02-28 | 东莞市航达电子有限公司 | FPC carrier band |
| CN115298109A (en) * | 2020-03-17 | 2022-11-04 | 大日本印刷株式会社 | Cover tape for packaging electronic component and package |
| WO2024085137A1 (en) * | 2022-10-21 | 2024-04-25 | 住友ベークライト株式会社 | Cover tape, cover tape manufacturing method, cover tape web roll, and electronic component packaging |
-
2009
- 2009-09-08 CN CN200910034694A patent/CN101648622A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105209350A (en) * | 2013-05-14 | 2015-12-30 | 住友电木株式会社 | Sheet for producing carrier tape, production method for sheet for producing carrier tape, and package |
| CN105209350B (en) * | 2013-05-14 | 2018-05-08 | 信越聚合物株式会社 | Carrier tape production sheet material, the manufacture method of carrier tape production sheet material and package body |
| CN104590739A (en) * | 2013-10-31 | 2015-05-06 | 株式会社村田制作所 | Electronic component package, electronic component series, and carrier tape |
| CN104648816A (en) * | 2013-11-18 | 2015-05-27 | 罗姆股份有限公司 | Electronic component packaging body |
| CN110844324A (en) * | 2019-11-15 | 2020-02-28 | 东莞市航达电子有限公司 | FPC carrier band |
| CN115298109A (en) * | 2020-03-17 | 2022-11-04 | 大日本印刷株式会社 | Cover tape for packaging electronic component and package |
| CN115298109B (en) * | 2020-03-17 | 2024-02-06 | 大日本印刷株式会社 | Cover tape for packaging electronic component and package |
| WO2024085137A1 (en) * | 2022-10-21 | 2024-04-25 | 住友ベークライト株式会社 | Cover tape, cover tape manufacturing method, cover tape web roll, and electronic component packaging |
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| DD01 | Delivery of document by public notice |
Addressee: Chen Qi Document name: Notification of Decision on Request for Restoration of Right |
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| DD01 | Delivery of document by public notice |
Addressee: Alliance Electronic Technology (Kunshan) Co., Ltd. Chen Qi Document name: Decision of Rejection |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20100217 |