CN101629971B - Probe station, probe socket, probe card and combination thereof - Google Patents
Probe station, probe socket, probe card and combination thereof Download PDFInfo
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- CN101629971B CN101629971B CN 200810133585 CN200810133585A CN101629971B CN 101629971 B CN101629971 B CN 101629971B CN 200810133585 CN200810133585 CN 200810133585 CN 200810133585 A CN200810133585 A CN 200810133585A CN 101629971 B CN101629971 B CN 101629971B
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- probe
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- subassembly
- louvre
- station
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Abstract
The invention relates to a probe system, a probe socket, a probe card and a combination thereof. The probe card of the invention comprises a circuit board. The circuit board is provided with a supporting component and radiating holes. The supporting component is used for supporting a plurality of probes to form a needle. The radiating holes are used for cooling the probe card.
Description
Technical field
The present invention relates to a kind of probe station, probe socket receptacle, probe and combination thereof, particularly a kind of probe station, probe socket receptacle, probe and combination thereof with unique heat sinking function.
Background technology
In the manufacture process of integrated circuit component, all can test its electrical specification, so as to filtering out the integrated circuit component that does not meet product specification with probe.
Fig. 1 discloses a kind of probe station 11, and it comprises two and is set in parallel in the slide rail 16 of rectangular aperture platform both sides, a plurality of non-circular overarm 12 and at least one and is set up in fine setting platform 14 in the described non-circular overarm.Two ends of described non-circular overarm 12 are set up on the described slide rail 16 by a slide 18 respectively.Described fine setting platform 14 is used to carry a probe, and can adjust the relative angle of described probe and element under test.Described probe station 11 can be fixedly arranged on the tester table by a plurality of screws 13.
Yet semiconductor wafer is to be placed on the wafer base with heating arrangement when test.When testing, described heating arrangement can heat semiconductor wafer, for example carry out the reliability testing (reliabilitytest) of described integrated circuit component, and the heat of its generation can the heat radiation mode be sent to the residing test environment of described probe, or be sent to the residing test environment of described test board with heat exchange pattern via the probe tip of described probe, cause the temperature of described test environment to rise.And, physical property or the chemical property that the temperature that rises may cause described probe and be in the object of described test environment change (for example the characteristic of expanding with heat and contract with cold of material causes object to produce deformation), cause measuring process to carry out smoothly, perhaps influence the accuracy of measurement result.
Summary of the invention
Fundamental purpose of the present invention provides a kind of probe station, probe socket receptacle, probe and combination thereof, and it can reduce the environment temperature of probe described in the test process effectively, produces the variation of physics or chemical property to avoid described probe.
Probe station of the present invention comprises two slide rails, at least one non-circular overarm, a plurality of probe socket receptacle and at least one transmission axle.Two ends of described at least one non-circular overarm are arranged on described two slide rails.Described a plurality of probe socket receptacle is arranged in the described non-circular overarm.Described at least one transmission axle comprises at least one airduct, and wherein said at least one airduct is communicated to the bottom of described probe socket receptacle.
Probe socket receptacle of the present invention comprises a plurality of splicing ears and at least one wind-tunnel.Described a plurality of splicing ear is arranged at the bottom of described probe socket receptacle, is used to transmit and receive the electric signal between described transmission axle and the probe.Described at least one wind-tunnel is used to transmit nitrogen or the cold air that described transmission axle is sent.
Probe of the present invention comprises a circuit board.Described circuit board has support member and louvre.Described support member is used to support a plurality of probes and forms needle point.Described louvre is used to cool off described probe.
Combination of the present invention has depressed part, opening and sidewall, and wherein said opening is used to hold described support member.
Description of drawings
Fig. 1 shows a probe station;
Fig. 2 shows the relation between a probe station and element under test;
Fig. 3 shows the substructure of a probe socket receptacle;
Fig. 4 and Fig. 5 show the stereographic map of the subassembly of probe and collocation thereof;
Fig. 6 shows the combination figure of the subassembly of probe and collocation thereof;
Fig. 7 shows the stereographic map of another angle of the subassembly of probe and collocation thereof;
Fig. 8 shows the combination figure of the subassembly of probe and collocation thereof; And
The sectional view of Fig. 9 displayed map 8.
Embodiment
Fig. 2 shows the relation between probe station of the present invention and element under test.Similar with routine techniques, probe station 20 of the present invention also has two slide rail 16 and a plurality of non-circular overarms 12 that are set in parallel in described rectangular aperture platform both sides.A plurality of probe socket receptacles 24 are set up in the described non-circular overarm 12, the relative position of its fine-tuning probe and described element under test 21 (for example wafer).By moving horizontally and the vertical moving of described non-circular overarm 12 on described slide rail 16 in described non-circular overarm 12, described probe socket receptacle 24 can be by the optional position of coarse adjustment to described element under test 21.Different with routine techniques is, described probe socket receptacle 24 is by a transmission axle and outside tester table (scheme not shown) connection, and described transmission axle not only comprises signal wire, also comprises at least one airduct.Described airduct transmits nitrogen or cold air, and it can pass through described probe socket receptacle 24, and is penetrated by the wind hole 32 of its bottom.
Fig. 3 shows the substructure of described probe socket receptacle 24.Described base 31 comprises wind hole 32, its negotiable nitrogen or cold air, and be accompanied by electric signal and be sent to described probe 42.
Fig. 4 shows the stereographic map of the subassembly 41 of probe 42 of the present invention and collocation thereof.Described probe 42 has at least one louvre 427, it can be by nitrogen that described probe socket receptacle 24 transmitted or cold air and effectively realizes the samming of described probe 42, and effectively reduces the temperature that described probe 42 increases because of the heating of described element under test 21.Even if therefore described element under test 21 is heated to 300 ℃, described probe 42 still can be kept for example about 100 ℃ samming by described louvre 427.Not because of the increase of service time produces the biased situation of moving of pin, described a plurality of probes are fixed on the support member 424 with epoxy resin in order to ensure the horizontal level of probe.The end of described a plurality of probes forms needle point 423, and described needle point 423 and described probe 425 form an angle, in order to reduce the STRESS VARIATION that is produced when described probe 425 contacts with element under test 21.Described probe 42 can be provided with a plurality of registration holes 428, and its registration holes 33 with described probe socket receptacle 24 is relative, and can be locked in described probe socket receptacle 24 by screw in case of necessity.Described subassembly 41 is used to cover described probe 42, and it can prevent also that except being used to protect the described probe 42 nitrogen or cold air that described louvre 427 transmits from directly blowing to described element under test 21.Described subassembly 41 comprises opening 412 and a plurality of registration holes 411, and described opening 412 is used to hold the support member 424 of described probe 42.
Fig. 5 shows the stereographic map of another angle of the subassembly 41 of probe 42 of the present invention and collocation thereof.The subassembly 41 that Fig. 6 shows probe 42 of the present invention and collocation thereof according to the direction of Fig. 5 in conjunction with after stereographic map.Fig. 7 shows the reverse side stereographic map of the subassembly 41 of probe 42 of the present invention and collocation thereof.The subassembly 41 that Fig. 8 shows probe 42 of the present invention and collocation thereof according to the direction of Fig. 7 in conjunction with after stereographic map.The sectional view of Fig. 9 displayed map 8.
With respect to routine techniques, the subassembly 41 of probe station 20 of the present invention, probe socket receptacle 24, probe 42 and collocation thereof has following advantage at least:
1. described probe socket receptacle 24 also has wind-tunnel except that having signal wire.When the transmission measurement signal, can send nitrogen or cold air in the lump.
2. described probe 42 can utilize screw to lock described a plurality of registration holes 428 in described probe socket receptacle 24, and makes described probe 42 be parallel to described element under test 21.
3. described probe 42 is provided with louvre 427, can utilize nitrogen that described probe socket receptacle 24 transmits or cold air and keeps samming, and reduce the temperature of described probe 42.
4. by subassembly 41, described probe 42 can avoid nitrogen or cold air directly to blow to element under test 21.And described subassembly 41 still leaves a room in combination after the described probe 42, but nitrogen or cold air enter PARALLEL FLOW behind the described room via described louvre 427, and contacts arbitrary position of described probe 42 equably, and realizes the samming cooling purpose.
Technology contents of the present invention and technical characterstic disclose as above, yet the those skilled in the art still may be based on teaching of the present invention and announcement and done all replacement and modifications that does not break away from spirit of the present invention.Therefore, protection scope of the present invention should be not limited to those disclosed embodiments, and should comprise various do not break away from replacement of the present invention and modifications, and is contained by the claims of enclosing.
Claims (5)
1. the combination of a probe is characterized in that it comprises:
Probe, it comprises support member and louvre, and described louvre is located at the other end of described support member; And
Subassembly, it has depressed part, opening and sidewall, wherein said opening is used to hold described support member, and described sidewall is set up along the edge of described depressed part, and described subassembly is used to cover described probe, described subassembly still leaves a room after the described probe of combination, so that gas enters via louvre.
2. the combination of probe according to claim 1 it is characterized in that wherein said depressed part comprises described room, and described room can be communicated with the zone more than 3/4ths of described probe.
3. the combination of probe according to claim 1 is characterized in that wherein said depressed part is along growing limit direction of principal axis extension and having broad respectively to narrower width.
4. the combination of probe according to claim 1 is characterized in that wherein said sidewall has a plurality of registration holes.
5. the combination of probe according to claim 1 is characterized in that wherein said subassembly has the pincer attack portion that is positioned at described opening both sides, and described pincer attack portion presents the shape of taper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810133585 CN101629971B (en) | 2008-07-17 | 2008-07-17 | Probe station, probe socket, probe card and combination thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810133585 CN101629971B (en) | 2008-07-17 | 2008-07-17 | Probe station, probe socket, probe card and combination thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101629971A CN101629971A (en) | 2010-01-20 |
| CN101629971B true CN101629971B (en) | 2013-07-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810133585 Active CN101629971B (en) | 2008-07-17 | 2008-07-17 | Probe station, probe socket, probe card and combination thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101629971B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6092509B2 (en) * | 2011-10-17 | 2017-03-08 | 東京エレクトロン株式会社 | Contact terminal support and probe card |
| JP5827554B2 (en) * | 2011-12-05 | 2015-12-02 | 株式会社日本マイクロニクス | Probe assembly for power semiconductor device inspection and inspection apparatus using the same |
| JP5928203B2 (en) * | 2012-07-10 | 2016-06-01 | 三菱電機株式会社 | Inspection device |
| CN113625016B (en) * | 2021-07-27 | 2022-06-10 | 深圳市欧米加智能科技有限公司 | Miniature blade needle module with heat dissipation function |
| CN116909590B (en) * | 2023-09-07 | 2023-12-01 | 宜宾本信电子科技有限公司 | OTP (one time programmable) burning jig for liquid crystal display |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000241454A (en) * | 1999-02-23 | 2000-09-08 | Mitsubishi Electric Corp | Probe card for high temperature test and test equipment |
| US6342788B1 (en) * | 1999-06-02 | 2002-01-29 | International Business Machines Corporation | Probing systems for chilled environment |
| CN1536635A (en) * | 2003-04-03 | 2004-10-13 | 思达科技股份有限公司 | Detection card for testing semiconductor |
-
2008
- 2008-07-17 CN CN 200810133585 patent/CN101629971B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000241454A (en) * | 1999-02-23 | 2000-09-08 | Mitsubishi Electric Corp | Probe card for high temperature test and test equipment |
| US6342788B1 (en) * | 1999-06-02 | 2002-01-29 | International Business Machines Corporation | Probing systems for chilled environment |
| CN1536635A (en) * | 2003-04-03 | 2004-10-13 | 思达科技股份有限公司 | Detection card for testing semiconductor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101629971A (en) | 2010-01-20 |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20181211 Address after: Room 1106, 11F Comet Valley Space-time Building, No. 4 Luyu East Road, Donghu New Technology Development Zone, Wuhan City, Hubei Province Patentee after: Starr Technology (Wuhan) Co., Ltd. Address before: Taiwan, China Patentee before: Sida Science and Technology Co., Ltd. |
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| TR01 | Transfer of patent right | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20100120 Assignee: Decott Testing Technology (Suzhou) Co., Ltd Assignor: Starr Technology (Wuhan) Co.,Ltd. Contract record no.: X2020980003101 Denomination of invention: Probe station, probe socket, probe card and combination thereof Granted publication date: 20130724 License type: Exclusive License Record date: 20200616 |
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| EE01 | Entry into force of recordation of patent licensing contract |