CN101569536A - Manufacturing method of ultrasonic transducer - Google Patents
Manufacturing method of ultrasonic transducer Download PDFInfo
- Publication number
- CN101569536A CN101569536A CNA2008100367782A CN200810036778A CN101569536A CN 101569536 A CN101569536 A CN 101569536A CN A2008100367782 A CNA2008100367782 A CN A2008100367782A CN 200810036778 A CN200810036778 A CN 200810036778A CN 101569536 A CN101569536 A CN 101569536A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- piezoelectric ceramics
- ultrasonic transducer
- electrode wires
- manufacture method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Transducers For Ultrasonic Waves (AREA)
Abstract
The invention provides a manufacturing method of an ultrasonic transducer so as to achieve the purpose, which is characterized by comprising the following steps: (1) cutting piezoelectric ceramics into array elements, and bending the piezoelectric ceramics into a concave shape; (2)respectively bonding two circuit boards on the right side and the reverse side of an aluminium block, and aligning one end of a circuit board circular arc to a central circular arc line of the concave of the piezoelectric ceramics, with both centers of circles superposed and both curvature radii differing by about 5 mm; (3) welding one end of an electrode wire on a welding pad at one end of the circuit board circular arc, and welding the other end of the electrode wire on a welding spot of an array element signal electrode surface of the piezoelectric ceramics; and (4) filling the concave space of the piezoelectric ceramics and the welded part of the electrode wire with an elastic polymer material mixture by a casting method, namely carrying out backing casting. The manufacturing method can greatly improve the fastness and the reliability of the welding spot and the shock resistance of the transducer, and has a very obvious effect on resisting expansion caused by heat and contraction caused by cold.
Description
Technical field
The present invention relates to a kind of manufacture method of ultrasonic transducer.
Background technology
Ultrasonic transducer is a kind ofly can become ultrasound wave to electrical signal conversion, and can become the ultrasonic reflections conversion of signals that receives from human body or other detected object the device of the signal of telecommunication again, it is widely used in medical supersonic diagnostic field and Ultrasonic NDT field.Usually the structure of ultrasonic transducer as shown in Figure 1, comprise piezoelectric ceramics 1 ', acoustic matching layer 2 ', backing 6 ', acoustic lens 11 ' and the circuit board 15 of band connector '.
Wired configuration of arrayed ultrasonic transducer and convex arc configuration commonly used, how the electrode of tens of piezoelectric ceramics and even a hundreds of array element being connected with wiring board in the arrayed ultrasonic transducer manufacture process is one of critical process, at present drawing of electrode all is based on the piezoelectric ceramic piece that is cut into array and is bonded in above the ready-formed backing, mainly contains three kinds of modes:
First kind of mode as shown in Figure 2, have 2 layers of acoustic matching layer 2 ' piezoelectric ceramics 1 ' be bonded in backing 6 ' on, utilize the protrusion part of piezoelectric ceramics, with scolding tin the signal electrode 5 of each array element ' respectively and flexible PCB or PCB (Printed Circuit Board printed circuit board (PCB)) circuit board 7 ' go up respective pad 10 ' welding mutually, 9 ' be solder joint, long silver-coated copper wire of reuse the ground wire 3 of the ground electrode 4 of all array elements of piezoelectric ceramics ' be welded into connection '.The influence that the lead-out mode of kind electrode line is subject to expand with heat and contract with cold, solder joint is thrown off easily, poor reliability, because pad is all at a lateral edges, transducer is also thrown off by external force easily, causes impact resistance relatively poor, has influenced the service life of ultrasonic transducer.
The second way as shown in Figure 3, have 2 layers of acoustic matching layer 2 ' the ready-formed backing 6 of piezoelectric ceramic piece 1 ' be bonded in ' on, utilize Copper Foil or flexible PCB 8 ' as transition, one end of Copper Foil or the flexible PCB 8 ' polar curve that powers on be welded on piezoelectric ceramic piece 1 ' array element signals electrode 5 ' on, and the other end be welded on the flexible PCB that has connector or PCB circuit board 7 ' pad 10 ' on, 9 ' be solder joint.This method has overcome the deficiency of first method to a certain extent, but this method is not suitable for the manufacturing of the dimpling array transducer of small curvature radius.
The third mode as shown in Figure 4, piezoelectric ceramic piece 1 ' electrode coat two thickness end face 2 ' (as shown in Fig. 5 A and Fig. 5 B), lead or flexible PCB 7 ' electrode wires directly be welded in this two end faces 2 ' array element on, 9 ' be solder joint.This method can be used for the manufacturing of convex arc battle array and dimpling array transducer, but the fastness of solder joint and poor reliability, solder joint is positioned at the edge and causes impact resistance bad, sustains damage easily.
Summary of the invention
The invention provides a kind of manufacture method of ultrasonic transducer, it is applicable to makes linear array, convex arc battle array and dimpling battle array ultrasonic transducer, solve the deficiency in the background technology, guaranteed the fastness and the reliability with solder joint of drawing of electrode wires, and improved the shock resistance of transducer greatly.
For achieving the above object, the manufacture method of a kind of ultrasonic transducer provided by the invention is characterized in, comprises following steps:
Circuit board in the above-mentioned step 2 is provided with connector.
Above-mentioned step 2 circuit board is flexible PCB or printed circuit board (PCB).
The circuit board circular arc in the above-mentioned step 2 and the center circle camber line of piezoelectric ceramics concave surface, the center of circle of the two coincides, and the radius of curvature of the two differs about 5mm.
Electrode wires in the above-mentioned step 3 adopts silver-plated or tinned wird is made.
The part of the electrode wires welding in the above-mentioned step 4 comprises the pad on electrode wires, part circuit board and the circuit board.
The present invention has following advantage:
The mode that the present invention adopts the casting backing is electrode wires and have the aluminum radiating block and the relevant part of the circuit board of connector is cast into an integral body, whole backing is similar to the reinforced concrete structure in the building, not only can play absorb and decay support or oppose surface radiation ultrasonic energy but also can strengthen entire electrode line deriving structure, guarantee that electrode wires draws fastness and the reliability with solder joint, and can improve the shock resistance of transducer greatly, add that backing is a kind of resilient macromolecular material mixture, the effect of shrinkage is also fairly obvious so heat resistanceheat resistant is expanded.This structure can be used to make linear array, convex arc battle array and dimpling battle array ultrasonic transducer.
Description of drawings:
Fig. 1 is the ultrasonic transducer structural representation in the background technology;
Fig. 2, Fig. 3, Fig. 4 are the structural representation of three kinds of lead-out modes of present arrayed ultrasonic transducer electrode in the background technology;
Fig. 5 A, Fig. 5 B are the sketch maps that the electrode of piezoelectric ceramic piece in the method shown in Figure 4 coats two thickness end faces of its width;
Fig. 6 is a kind of ultrasonic transducer structural representation provided by the present invention.
The specific embodiment:
Followingly a kind of preferred implementation of the present invention is described according to Fig. 6;
As shown in Figure 6, be the specific embodiment of the manufacture method of a kind of ultrasonic transducer provided by the invention,
Present embodiment is that a radius of curvature is the protruding battle array of R40mm, and this ultrasonic transducer comprises aluminium block 14, sticks on two flexible PCBs 7 or PCB circuit board 7, backing 6, electrode wires 16 of aluminium block 14, connects the piezoelectric ceramic piece 1 of backing 6 and acoustic matching layer 2 and the acoustic lens 11 that connects piezoelectric ceramic piece 1;
For achieving the above object, the manufacture method of a kind of ultrasonic transducer provided by the invention is characterized in, comprises following steps:
Described step 2 circuit board 7 is flexible PCB or printed circuit board (PCB).
The part of electrode wires 16 welding in the described step 4 comprises the pad 10 on electrode wires 16, part circuit board 7 and the circuit board.
The manufacture method of a kind of ultrasonic transducer provided by the present invention can improve the fastness and the reliability of solder joint greatly, and can improve the shock resistance of transducer greatly, and the effect of the bloated shrinkage of heat resistanceheat resistant simultaneously is also fairly obvious.
Claims (6)
1. the manufacture method of a ultrasonic transducer is characterised in that, it comprises following steps:
Step 1, piezoelectric ceramics is cut into array element, piezoceramic bending becomes concave shape;
Step 2, two circuit boards are bonded in the tow sides of aluminium block respectively, circuit board circular arc one end is aimed at the center circle camber line of piezoelectric ceramics concave surface;
Step 3, an end of electrode wires is welded on the pad of circuit board circular arc one end, the other end of electrode wires is welded on the solder joint of array element signals electrode surface of piezoelectric ceramics;
Step 4, a kind of resilient macromolecular material mixture is filled up piezoelectric ceramics concave surface space and comprise the part of electrode wires welding with the method for casting, promptly backing is cast.
2. the manufacture method of ultrasonic transducer as claimed in claim 1 is characterized in that, the circuit board in the described step 2 is provided with connector.
3. the manufacture method of ultrasonic transducer as claimed in claim 3 is characterized in that, described step 2 circuit board is flexible PCB or printed circuit board (PCB).
4. the manufacture method of ultrasonic transducer as claimed in claim 3 is characterized in that, the circuit board circular arc in the described step 2 and the center circle camber line of piezoelectric ceramics concave surface, and the center of circle of the two coincides, and the radius of curvature of the two differs about 5mm.
5. the manufacture method of ultrasonic transducer as claimed in claim 1 is characterized in that, the electrode wires in the described step 3 adopts silver-plated or tinned wird is made.
6. the manufacture method of ultrasonic transducer as claimed in claim 1 is characterized in that, the part of the electrode wires welding in the described step 4 comprises the pad on electrode wires, part circuit board and the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100367782A CN101569536A (en) | 2008-04-29 | 2008-04-29 | Manufacturing method of ultrasonic transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100367782A CN101569536A (en) | 2008-04-29 | 2008-04-29 | Manufacturing method of ultrasonic transducer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101569536A true CN101569536A (en) | 2009-11-04 |
Family
ID=41229120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100367782A Pending CN101569536A (en) | 2008-04-29 | 2008-04-29 | Manufacturing method of ultrasonic transducer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101569536A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102151150A (en) * | 2011-01-25 | 2011-08-17 | 古伦勇 | Two-dimensional array and three-dimensional imaging transducer and manufacturing method thereof |
| CN102715918A (en) * | 2012-07-13 | 2012-10-10 | 无锡祥生医学影像有限责任公司 | Multi-frequency ultrasonic probe and scanning method thereof |
| CN103157594A (en) * | 2013-03-25 | 2013-06-19 | 广州多浦乐电子科技有限公司 | Flexible ultrasonic phased array transducer and manufacturing method |
| CN104907240A (en) * | 2015-04-13 | 2015-09-16 | 苏州声之源电子科技有限公司 | Arc array of transducer and preparing method |
| CN105232090A (en) * | 2015-10-28 | 2016-01-13 | 上海爱声生物医疗科技有限公司 | High frequency ultrasonic energy transducer with optimized performance and manufacturing method thereof |
| CN106975590A (en) * | 2017-03-09 | 2017-07-25 | 中国科学院深圳先进技术研究院 | A kind of empty backing two-dimensional array ultrasonic transducer |
| CN107543864A (en) * | 2016-09-14 | 2018-01-05 | 北京卫星环境工程研究所 | Spacecraft leaks positioning acoustic matrix sensor |
| CN109643378A (en) * | 2018-11-20 | 2019-04-16 | 深圳市汇顶科技股份有限公司 | Supersonic changer element and electronic device |
| CN109719279A (en) * | 2018-12-28 | 2019-05-07 | 广州瑞派医疗器械有限责任公司 | Convex configuration ultrasonic transducer manufacturing method and equipment |
| CN110721891A (en) * | 2019-10-29 | 2020-01-24 | 深圳市索诺瑞科技有限公司 | Ultrasonic transducer processing method |
| CN110729398A (en) * | 2019-10-14 | 2020-01-24 | 无锡海鹰电子医疗系统有限公司 | Arc array ultrasonic transducer electrode wire leading-out method |
| CN111375147A (en) * | 2018-12-29 | 2020-07-07 | 深圳先进技术研究院 | Focused ultrasonic transducer and manufacturing method thereof |
| WO2022104684A1 (en) * | 2020-11-20 | 2022-05-27 | 深圳先进技术研究院 | Multi-modal imaging apparatus and method, and multi-modal imaging system |
-
2008
- 2008-04-29 CN CNA2008100367782A patent/CN101569536A/en active Pending
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102151150A (en) * | 2011-01-25 | 2011-08-17 | 古伦勇 | Two-dimensional array and three-dimensional imaging transducer and manufacturing method thereof |
| CN102151150B (en) * | 2011-01-25 | 2012-11-28 | 古伦勇 | Two-dimensional array and three-dimensional imaging transducer and manufacturing method thereof |
| CN102715918A (en) * | 2012-07-13 | 2012-10-10 | 无锡祥生医学影像有限责任公司 | Multi-frequency ultrasonic probe and scanning method thereof |
| CN103157594B (en) * | 2013-03-25 | 2016-01-13 | 广州多浦乐电子科技有限公司 | A kind of flexible ultrasonic phased array array energy transducer and preparation method |
| CN103157594A (en) * | 2013-03-25 | 2013-06-19 | 广州多浦乐电子科技有限公司 | Flexible ultrasonic phased array transducer and manufacturing method |
| CN104907240A (en) * | 2015-04-13 | 2015-09-16 | 苏州声之源电子科技有限公司 | Arc array of transducer and preparing method |
| CN105232090A (en) * | 2015-10-28 | 2016-01-13 | 上海爱声生物医疗科技有限公司 | High frequency ultrasonic energy transducer with optimized performance and manufacturing method thereof |
| CN107543864A (en) * | 2016-09-14 | 2018-01-05 | 北京卫星环境工程研究所 | Spacecraft leaks positioning acoustic matrix sensor |
| CN107543864B (en) * | 2016-09-14 | 2020-01-03 | 北京卫星环境工程研究所 | Acoustic array sensor for spacecraft leakage positioning |
| CN106975590A (en) * | 2017-03-09 | 2017-07-25 | 中国科学院深圳先进技术研究院 | A kind of empty backing two-dimensional array ultrasonic transducer |
| CN106975590B (en) * | 2017-03-09 | 2019-06-04 | 中国科学院深圳先进技术研究院 | A kind of sky backing two-dimensional array ultrasonic transducer |
| CN109643378B (en) * | 2018-11-20 | 2024-01-26 | 深圳市汇顶科技股份有限公司 | Ultrasonic transducer and electronic device |
| CN109643378A (en) * | 2018-11-20 | 2019-04-16 | 深圳市汇顶科技股份有限公司 | Supersonic changer element and electronic device |
| CN109719279A (en) * | 2018-12-28 | 2019-05-07 | 广州瑞派医疗器械有限责任公司 | Convex configuration ultrasonic transducer manufacturing method and equipment |
| CN109719279B (en) * | 2018-12-28 | 2021-04-27 | 广州瑞派医疗器械有限责任公司 | Convex array type ultrasonic transducer manufacturing method and equipment |
| CN111375147A (en) * | 2018-12-29 | 2020-07-07 | 深圳先进技术研究院 | Focused ultrasonic transducer and manufacturing method thereof |
| CN110729398A (en) * | 2019-10-14 | 2020-01-24 | 无锡海鹰电子医疗系统有限公司 | Arc array ultrasonic transducer electrode wire leading-out method |
| CN110729398B (en) * | 2019-10-14 | 2023-04-25 | 无锡海鹰电子医疗系统有限公司 | Electrode wire leading-out method of arc array ultrasonic transducer |
| CN110721891B (en) * | 2019-10-29 | 2021-11-05 | 深圳市索诺瑞科技有限公司 | Ultrasonic transducer processing method |
| CN110721891A (en) * | 2019-10-29 | 2020-01-24 | 深圳市索诺瑞科技有限公司 | Ultrasonic transducer processing method |
| WO2022104684A1 (en) * | 2020-11-20 | 2022-05-27 | 深圳先进技术研究院 | Multi-modal imaging apparatus and method, and multi-modal imaging system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101569536A (en) | Manufacturing method of ultrasonic transducer | |
| CN2865867Y (en) | Ultrasonic transducer | |
| JP4801989B2 (en) | Ultrasonic probe | |
| EP2176027B1 (en) | Ultrasonic joining method using a flat end face of chip provided with straight grooves | |
| CN105127082A (en) | Ultrasonic transducer and manufacturing method thereof | |
| JP2008022077A (en) | Ultrasonic probe | |
| US11335960B2 (en) | Circuit board and battery module | |
| CN103594076B (en) | Piezoelectric plate structure | |
| KR101538186B1 (en) | Circuit board, process for manufacturing circuit board and coverlay film | |
| WO2021093559A1 (en) | Ultrasonic probe, piezoelectric composite wafer and preparation method therefor | |
| CN108668435B (en) | Circuit board connecting structure | |
| CN113571844A (en) | Preparation method of current collector assembly, battery monomer and battery pack | |
| US11881333B1 (en) | Ground terminal and electronic device | |
| CN105704907A (en) | Flexible circuit board for reducing impedance of piezoresonator | |
| US9805867B2 (en) | Acoustically quiet capacitors | |
| CN105763168B (en) | It is a kind of containing whether there is or not the piezo-electric resonators of gum base materials flexible circuit board | |
| CN211534504U (en) | Area array transducer arrangement | |
| US20030011277A1 (en) | Unidirectional acoustic probe and method for making same | |
| CN109952768A (en) | Flexible Circuit with Redundant Connection Points for Ultrasound Arrays | |
| JP3929722B2 (en) | Array-type ultrasonic probe | |
| CN205491433U (en) | Reduce flexible printed circuit, FPC of piezoelectric resonator impedance | |
| CN113422165A (en) | Current collector assembly, battery monomer and battery pack | |
| CN218975803U (en) | Grounding terminal and electronic equipment | |
| US8387230B2 (en) | Method of making an ultrasonic transducer system | |
| CN221979196U (en) | Soft and hard combined board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Open date: 20091104 |