CN101552313B - A magnetic field excitation LED online detection method - Google Patents
A magnetic field excitation LED online detection method Download PDFInfo
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- CN101552313B CN101552313B CN 200910103915 CN200910103915A CN101552313B CN 101552313 B CN101552313 B CN 101552313B CN 200910103915 CN200910103915 CN 200910103915 CN 200910103915 A CN200910103915 A CN 200910103915A CN 101552313 B CN101552313 B CN 101552313B
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- 238000001514 detection method Methods 0.000 title claims abstract description 17
- 230000005284 excitation Effects 0.000 title claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 29
- 238000003466 welding Methods 0.000 claims abstract description 8
- 238000005538 encapsulation Methods 0.000 claims description 11
- 238000004020 luminiscence type Methods 0.000 claims description 11
- 238000010998 test method Methods 0.000 claims description 8
- 238000004026 adhesive bonding Methods 0.000 claims description 6
- 238000004804 winding Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 238000012858 packaging process Methods 0.000 abstract 3
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
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Abstract
The invention discloses a magnetic field excitation LED open-line detection method, which uses the alternating magnetic field to pass through a closed circuit composed of the LED chip, a stand and bonding wires to produce alternating current, realizes the diction of function status and performance parameter of the LED chip, and quality problem of adhering and welding and the like procedures extracted from the electrode in the packaging process, by detecting the irradiance characteristic produced by the alternating current exciting the LED chip. The invention has beneficial technical effect of overcoming the technical drawbacks existing in the prior detecting technique that it is needed to directly contact the LED chip or it can only detect completed products. The inventive method can rapidly detect the function status and performance parameter of the LED chip, and quality problem of adhering and welding and the like procedures extracted from the electrode in the packaging process without touching the LED chip itself in the entire packaging process of the LED chip.
Description
Technical field
The present invention relates to a kind of LED online measuring technique, more particularly relate to a kind of LED online test method of magnetic field excitation.
Technical background
LED (Light Emitting Diode) is with its intrinsic characteristics, and such as power saving, life-span length, vibration resistance, the characteristics such as fast response time, cold light source are widely used in the fields such as indicator light, signal lamp, display screen, Landscape Lighting; But because the each side of technology and process conditions, cause the encapsulation rate of finished products of led chip in the process that LED produces to be subjected to a certain extent impact.Therefore, the detection for chip before led chip encapsulation and encapsulation just seems particularly important.
Present existing led chip detection method and equipment are mainly used in the led chip epitaxial wafer and detect, and chip-scale detects and finished product detection.Detection for chip-scale mainly contains at chip surface and applies laser, makes the chip active area produce recombination luminescence, thereby analyzes the electroluminescent properties that obtains led chip.But the method needs the direct contact chip of detector probe, easily causes pollution even the damage of chip, and in addition, test probe also has larger loss in the process that detects, cause above-mentioned technology to be difficult to promote the use in suitability for industrialized production.
Detection for the LED epitaxial wafer, Chinese invention patent (the patent No.: 02123646.1) disclose a kind of two electrodes of settling on epitaxial wafer surface, high-voltage constant-current power supply is added between two electrodes, by detect the quality of light tiles at the mobile positive pole in epitaxial wafer surface.In addition, Chinese invention patent (the patent No.: 01112096.7) also propose a kind of luminescence generated by light by laser induced semiconductor chip, luminous intensity is converted to the signal of telecommunication, and estimates semi-conductive impurity and defective by the damping time constant of luminescence generated by light.But above-mentioned two detection methods all are to detect for the LED epitaxial wafer.
02265834.3), the Chinese invention patent (patent No.: 02265834.3) and the Chinese invention patent (patent No.: 02136269.6) disclose respectively several detection methods for the LED finished product in addition, the Chinese invention patent (patent No.:.Owing to being very crucial step in the production process that is encapsulated in whole led chip of led chip, therefore the detection of led chip in the process that reaches encapsulation before encapsulating is just seemed is necessary very much.But, also do not have desirable detection method at this technique direction at present.
Summary of the invention
The present invention proposes a kind of LED online test method of magnetic field excitation, the method is passed the closed-loop path that is made of led chip and support, bonding wire with alternating magnetic field and is produced alternating current, realizes the detection of the quality problems of the processes such as gluing and welding that the electrode in functional status, performance parameter and the encapsulation process to led chip is drawn by detecting the characteristics of luminescence that this alternating current excites led chip to produce.
Described alternating magnetic field vertically passes the closed-loop path that is made of led chip and support, bonding wire.
Produce alternating magnetic field by the alternating magnetic field generation device, to place alternating magnetic field by the closed-loop path that led chip and support, bonding wire consist of, the light emission scioptics group that led chip produces is assembled, the signal processing system analyzing and processing is sent in the LED light emission that characteristics of luminescence checkout gear gathers after set of lenses is assembled, thereby realizes the detection of the quality problems of processes such as gluing and welding that the electrode in functional status, performance parameter and the encapsulation process of led chip is drawn.
Described alternating magnetic field generation device is that the magnetic core winding around consists of, and magnetic core passes the closed-loop path that is made of led chip and support, bonding wire and produces alternating magnetic field.
Useful technique effect of the present invention is: the technology drawback that the inventive method has overcome the direct contact chip of the existing needs of prior art or only can detect for LED epitaxial wafer, chip or finished product.Can finish in the whole encapsulation process at led chip, not contact led chip itself and detect rapidly the functional status of led chip and the quality problems of the processes such as gluing and welding that the electrode in performance parameter and the encapsulation process is drawn.
Description of drawings
Fig. 1 is the schematic diagram of the LED online test method of magnetic field excitation;
Fig. 2 is a kind of implementation of alternating magnetic field generation unit;
Among the figure, detect control and signal acquisition process unit 1, alternating magnetic field generation device 2, alternating magnetic field 3, bonding wire 4, led chip 5, support 6, light emission 7, set of lenses 8, characteristics of luminescence checkout gear 9, magnetic core 10, coil 11.
Embodiment
The structure of conventional led chip 5 when encapsulation is as follows: the negative electrode of the PN junction of led chip 5 and anode, by gluing, welding is connected with support and bonding wire 4 connects conductings, PN junction, support 6 and bonding wire 4 form led chip 5 closed-loop paths.
The online equipment that detects mainly comprises: several unit such as alternating magnetic field generation device 2, set of lenses 8, spectrum detection device 9, detection control and signal acquisition process unit 1.
Its operation principle is: in detecting operation, detect control and signal acquisition process unit 1 control alternating magnetic field generation device, 2 generation alternating magnetic fields 3, for example, we can consist of alternating magnetic field generation device 2 with magnetic core 10 winding arounds 11, magnetic core 10 is placed led chip 5 closed-loop paths, after magnetic core 10 inserts the closed-loop path, because the variation of alternating magnetic field 3 then can produce alternating current in led chip 5 closed-loop paths; Led chip 5 is current mode devices, and according to the luminescence mechanism of led chip 5, when electric current flow through PN junction, PN junction will be luminous; And contained the various information of led chip 5 materials and structure in the characteristics of luminescence of led chip 5, can find by detecting this light emission characteristics whether the quality of led chip 5 has problems.
Its testing process is: characteristics of luminescence checkout gear 9 scioptics groups 8 gather the light emission 7 of led chip 5, be input to detect in control and the signal acquisition process unit 1 and process in real time, (comprise luminous intensity by the parameter to the light of led chip 5 emission 7, peak wavelength, halfwidth) with the analysis of the correlation of the material of led chip 5 devices own and structural parameters, obtains functional status and the performance parameter of led chip 5.
The present invention can also detect led chip 5 and the quality of connection of drawing pin except the functional status and performance parameter that can detect online led chip 5; Because the closed-loop path produces alternating current, if electric current is enough large, the function of PN junction is normal, and electrode is connected normally with the pin support, and then led chip 5 can produce light and launches 7, launches 7 otherwise can't obtain light.
Claims (4)
1. the LED online test method of a magnetic field excitation, it is characterized in that: pass the closed-loop path that consisted of by led chip and support, bonding wire with alternating magnetic field and produce alternating current, realize the detection of the quality problems of the gluing and welding schedule that the electrode in functional status, performance parameter and the encapsulation process to led chip is drawn by detecting the characteristics of luminescence that this alternating current excites led chip to produce.
2. the LED online test method of magnetic field excitation according to claim 1, it is characterized in that: described alternating magnetic field vertically passes the closed-loop path that is made of led chip and support, bonding wire.
3. the LED online test method of magnetic field excitation according to claim 1, it is characterized in that: produce alternating magnetic field by the alternating magnetic field generation device, to place alternating magnetic field by the closed-loop path that led chip and support, bonding wire consist of, the luminous scioptics group that led chip produces is assembled, the signal processing system analyzing and processing is also sent in the LED light emission that characteristics of luminescence checkout gear gathers after set of lenses is assembled, thereby realizes the detection of the quality problems of gluing and welding schedule that the electrode in functional status, performance parameter and the encapsulation process of led chip is drawn.
4. the LED online test method of magnetic field excitation according to claim 3 is characterized in that: described alternating magnetic field generation device is that the magnetic core winding around consists of, and magnetic core passes the closed-loop path generation alternating magnetic field that is made of led chip and support, bonding wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910103915 CN101552313B (en) | 2009-05-22 | 2009-05-22 | A magnetic field excitation LED online detection method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910103915 CN101552313B (en) | 2009-05-22 | 2009-05-22 | A magnetic field excitation LED online detection method |
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| Publication Number | Publication Date |
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| CN101552313A CN101552313A (en) | 2009-10-07 |
| CN101552313B true CN101552313B (en) | 2013-02-27 |
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| CN 200910103915 Expired - Fee Related CN101552313B (en) | 2009-05-22 | 2009-05-22 | A magnetic field excitation LED online detection method |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011145278A1 (en) * | 2010-05-19 | 2011-11-24 | パナソニック株式会社 | Method and device for mounting semiconductor light-emitting element |
| KR101856533B1 (en) | 2011-03-28 | 2018-05-14 | 삼성전자주식회사 | Apparatus for inspecting light emitting device and inspecting method using the same |
| CN103579473A (en) * | 2012-08-08 | 2014-02-12 | 苏州世鼎电子有限公司 | Welding and temperature detecting method for LED element |
| CN103954629B (en) * | 2014-05-12 | 2017-01-18 | 重庆大学 | Quality detection device and method of encapsulation LED solder joint |
| CN111856240A (en) * | 2019-04-23 | 2020-10-30 | 苏州雷霆光电科技有限公司 | A kind of LED package quality detection method |
| CN110361644B (en) * | 2019-08-22 | 2021-10-15 | 厦门乾照光电股份有限公司 | Device and method for detecting electrical property of LED chip |
| CN115902596B (en) * | 2023-02-27 | 2023-05-23 | 杭州朗迅科技股份有限公司 | Non-contact chip quality detection device and detection method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000223746A (en) * | 1999-02-03 | 2000-08-11 | Rohm Co Ltd | Method and apparatus for inspecting resin packaged led |
| JP2002005963A (en) * | 2000-06-23 | 2002-01-09 | Nec Fielding Ltd | Clamp type electrical excitation checking device |
| JP2002033516A (en) * | 2000-07-19 | 2002-01-31 | Japan Science & Technology Corp | Method and device for evaluating active layer of light emitting diode |
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2009
- 2009-05-22 CN CN 200910103915 patent/CN101552313B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000223746A (en) * | 1999-02-03 | 2000-08-11 | Rohm Co Ltd | Method and apparatus for inspecting resin packaged led |
| JP2002005963A (en) * | 2000-06-23 | 2002-01-09 | Nec Fielding Ltd | Clamp type electrical excitation checking device |
| JP2002033516A (en) * | 2000-07-19 | 2002-01-31 | Japan Science & Technology Corp | Method and device for evaluating active layer of light emitting diode |
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| CN101552313A (en) | 2009-10-07 |
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