CN101559946B - 利用等离子体制备硅纳米颗粒的方法及装置 - Google Patents
利用等离子体制备硅纳米颗粒的方法及装置 Download PDFInfo
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- CN101559946B CN101559946B CN2009100980511A CN200910098051A CN101559946B CN 101559946 B CN101559946 B CN 101559946B CN 2009100980511 A CN2009100980511 A CN 2009100980511A CN 200910098051 A CN200910098051 A CN 200910098051A CN 101559946 B CN101559946 B CN 101559946B
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- 239000005543 nano-size silicon particle Substances 0.000 title claims abstract description 87
- 238000000034 method Methods 0.000 title claims abstract description 30
- 239000007789 gas Substances 0.000 claims abstract description 54
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 14
- 239000010703 silicon Substances 0.000 claims abstract description 14
- 239000011261 inert gas Substances 0.000 claims abstract description 11
- 239000005046 Chlorosilane Substances 0.000 claims description 15
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical group Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 14
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 12
- 230000005284 excitation Effects 0.000 claims description 10
- 239000001257 hydrogen Substances 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- 229910052786 argon Inorganic materials 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000001307 helium Substances 0.000 claims description 2
- 229910052734 helium Inorganic materials 0.000 claims description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052754 neon Inorganic materials 0.000 claims description 2
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 claims description 2
- 239000011241 protective layer Substances 0.000 claims description 2
- 239000002019 doping agent Substances 0.000 claims 1
- 238000002360 preparation method Methods 0.000 abstract description 8
- 238000000151 deposition Methods 0.000 abstract description 4
- 238000011031 large-scale manufacturing process Methods 0.000 abstract 1
- 229910001220 stainless steel Inorganic materials 0.000 description 7
- 239000010935 stainless steel Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000000460 chlorine Substances 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000002441 X-ray diffraction Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000005049 silicon tetrachloride Substances 0.000 description 3
- 239000012808 vapor phase Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229910000085 borane Inorganic materials 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 238000009776 industrial production Methods 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000010532 solid phase synthesis reaction Methods 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- UORVGPXVDQYIDP-UHFFFAOYSA-N trihydridoboron Substances B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 2
- 238000001429 visible spectrum Methods 0.000 description 2
- 241001416181 Axis axis Species 0.000 description 1
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical class [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 1
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 229940069428 antacid Drugs 0.000 description 1
- 239000003159 antacid agent Substances 0.000 description 1
- 230000001458 anti-acid effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- SLLGVCUQYRMELA-UHFFFAOYSA-N chlorosilicon Chemical compound Cl[Si] SLLGVCUQYRMELA-UHFFFAOYSA-N 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000002159 nanocrystal Substances 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000004098 selected area electron diffraction Methods 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 1
- 239000005052 trichlorosilane Substances 0.000 description 1
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CN2009100980511A CN101559946B (zh) | 2009-04-27 | 2009-04-27 | 利用等离子体制备硅纳米颗粒的方法及装置 |
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CN2009100980511A CN101559946B (zh) | 2009-04-27 | 2009-04-27 | 利用等离子体制备硅纳米颗粒的方法及装置 |
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CN101559946A CN101559946A (zh) | 2009-10-21 |
CN101559946B true CN101559946B (zh) | 2011-01-05 |
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Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102335580A (zh) * | 2011-06-21 | 2012-02-01 | 浙江大学 | 电容耦合等离子体制备四族纳米颗粒的装置及方法 |
CN102260908B (zh) * | 2011-07-20 | 2013-04-10 | 河北大学 | 一种生长纳米晶硅粉体的装置 |
CN102320606B (zh) * | 2011-07-20 | 2012-10-31 | 河北大学 | 一种生长纳米晶硅粉体的方法 |
CN102745848B (zh) * | 2012-06-25 | 2014-06-04 | 宁波大学 | 一种微波光催化降解反应装置 |
CN102849752A (zh) * | 2012-08-28 | 2013-01-02 | 浙江大学 | 一种硼纳米颗粒的制备方法 |
CN102951643B (zh) * | 2012-10-15 | 2014-08-13 | 宁波广博纳米新材料股份有限公司 | 纳米级球形硅粉的生产方法 |
CN102910630B (zh) * | 2012-10-15 | 2014-07-02 | 江苏博迁新材料有限公司 | 纳米硅粉的生产方法 |
CN103224238B (zh) * | 2013-05-23 | 2014-12-17 | 刘国钧 | 一种纳米硅复合材料的制备方法 |
CN104211066B (zh) * | 2013-06-05 | 2018-02-02 | 福建省辉锐材料科技有限公司 | 一种硅粉的制备设备 |
CN103523785A (zh) * | 2013-10-17 | 2014-01-22 | 大连理工大学 | 一种硅及其掺杂纳米片的制备方法 |
CN104555909B (zh) * | 2014-12-22 | 2016-01-27 | 郑灵浪 | 一种实验室生产硅锗核壳结构纳米颗粒的方法和设备 |
CN105025649B (zh) * | 2015-07-06 | 2018-05-25 | 山西大学 | 一种低气压下产生感应耦合热等离子体的装置与方法 |
US11975301B2 (en) | 2019-03-30 | 2024-05-07 | Dow Silicones Corporation | Method of producing nanoparticles |
KR20210144832A (ko) * | 2019-03-31 | 2021-11-30 | 다우 실리콘즈 코포레이션 | 나노입자의 제조 방법 |
CN110156022A (zh) * | 2019-07-06 | 2019-08-23 | 金雪莉 | 一种宏量制备硅纳米材料的方法及装置 |
CN110255532A (zh) * | 2019-07-06 | 2019-09-20 | 金雪莉 | 一种宏量制备碳硅纳米材料的方法及装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060051505A1 (en) * | 2004-06-18 | 2006-03-09 | Uwe Kortshagen | Process and apparatus for forming nanoparticles using radiofrequency plasmas |
US20070172406A1 (en) * | 2003-11-19 | 2007-07-26 | Degussa Ag | Nanoscale, crystalline silicon powder |
CN101379214A (zh) * | 2006-02-03 | 2009-03-04 | 应用材料股份有限公司 | 干式蚀刻以及外延沉积工艺及装置 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070172406A1 (en) * | 2003-11-19 | 2007-07-26 | Degussa Ag | Nanoscale, crystalline silicon powder |
US20060051505A1 (en) * | 2004-06-18 | 2006-03-09 | Uwe Kortshagen | Process and apparatus for forming nanoparticles using radiofrequency plasmas |
CN101379214A (zh) * | 2006-02-03 | 2009-03-04 | 应用材料股份有限公司 | 干式蚀刻以及外延沉积工艺及装置 |
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Application publication date: 20091021 Assignee: Suzhou Huizhi Vacuum Science and Technology Co., Ltd. Assignor: Zhejiang University|Han Qingrong Contract record no.: 2012320010169 Denomination of invention: Method and device for preparing silicon nanoparticles by utilizing plasma body Granted publication date: 20110105 License type: Exclusive License Record date: 20120905 |
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Granted publication date: 20110105 Termination date: 20180427 |