CN101556899A - Marking method and system of wafer manufacturing process - Google Patents
Marking method and system of wafer manufacturing process Download PDFInfo
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- CN101556899A CN101556899A CNA2008100359057A CN200810035905A CN101556899A CN 101556899 A CN101556899 A CN 101556899A CN A2008100359057 A CNA2008100359057 A CN A2008100359057A CN 200810035905 A CN200810035905 A CN 200810035905A CN 101556899 A CN101556899 A CN 101556899A
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Abstract
The invention provides a marking method and system of a wafer manufacturing process. The method comprises the steps of obtaining wafer testing data; converting the wafer testing data into marking data; marking the wafer according to the marking data; and carrying out format check to the wafer testing data and the marking data. The converting steps are as follows; reading a product marking template file and converting the wafer testing data into marking data according to a product marking template. In the invention, the wafer testing data obtained from a probe testing platform can be automatically converted into marking data identified by an ordinary marking device without expensive automatic marking devices, thereby the production cost is reduced and the prior device is sufficiently used.
Description
Technical field
The present invention relates to a kind of labeling method and system of wafer manufacturing process, and be particularly related to mark method and system in a kind of wafer pin survey processing procedure.
Background technology
The manufacture process of chip can generally be divided into the wafer-process processing procedure, the wafer pin is surveyed several steps such as processing procedure, structure process, test processing procedure.
Through behind the processing procedure of wafer-process, promptly form sound of laughing little lattice on the wafer, we are referred to as crystal grain, under general situation, all make identical crystal grain on the same wafer, but also might make the product of different size on same wafer; These wafers must be by the fair Acceptance Tests of wafer, and crystal grain will be one by one surveyed instrument (multiprobe testboard) testing its electrical characteristic through pin, and underproof crystal grain will be put signs on, and this program promptly is referred to as the wafer pin and surveys processing procedure.Wafer will be that unit is divided into independently crystal grain of a grain according to crystal grain then.
The main purpose that the wafer pin is surveyed is the electrical characteristic of each crystal grain in the test wafer, and the connection of circuit checks whether it is defective products, if defective products is then gone up the tassel flower ink, as the usefulness of identification.In addition, another purpose is the yield of test products, judges according to the height of yield whether the process of wafer manufacturing is wrong.All are normal to represent the wafer manufacture process when yields is high, if yields is low excessively, are illustrated in the process of wafer manufacturing, have some step to go wrong, and must notify the engineer inspection as early as possible.
After electrical characteristic through probe test platform test wafer, the wafer sort data that obtain can not directly be discerned by the general labeling device, prior art is to use a kind of full-automatic labelling apparatus to realize automatic mark, but this full-automatic labelling apparatus costs an arm and a leg, therefore on usage quantity, be restricted, when carrying out the mark operation, must wait for by needs that above-mentioned full-automatic labelling apparatus puts in place, so waste the time of a large amount of waiting facilitieses, how to have made the existing general labeling device wafer sort data that can discern the probe test platform automatically that can only the identification mark data become one and be badly in need of the technical problem that solves.
Summary of the invention
The object of the present invention is to provide a kind of labeling method and system of wafer manufacturing process, be used for automatically test data conversion being become flag data.
To achieve these goals, the present invention proposes a kind of labeling method that is used for wafer manufacturing process, it comprises: obtain the wafer sort data; Above-mentioned wafer sort data transaction is become flag data; According to above-mentioned flag data above-mentioned wafer is carried out mark.
Further, wherein above-mentioned wafer sort data are surveyed the test data that obtains behind the processing procedure for above-mentioned wafer being carried out pin.
Further, this method more comprises above-mentioned wafer sort data is carried out format checking.
Further, wherein above-mentioned switch process becomes flag data according to the said goods marker template with above-mentioned wafer sort data transaction for reading a product labelling template file.
Further, this method more comprises above-mentioned flag data is carried out format checking.
The present invention more proposes a kind of Mk system that is used for wafer manufacturing process, and it comprises: at least one testboard, in order to test above-mentioned wafer; Processing unit becomes flag data in order to the wafer sort data transaction with above-mentioned at least one testboard; Labelling apparatus is in order to carry out mark according to above-mentioned flag data to above-mentioned wafer.
Further, wherein above-mentioned at least one testboard is that the probe test platform is surveyed processing procedure in order to above-mentioned wafer is carried out pin.
Further, wherein above-mentioned processing unit comprises: procedure control unit, carry out program control in order to the execution flow process to above-mentioned processing unit; Date Conversion Unit is in order to become flag data with the above-mentioned wafer sort data transaction that reads.
Further, wherein the said procedure control unit more comprises a test data inspection unit, in order to above-mentioned wafer sort data are carried out format checking.
Further, wherein above-mentioned Date Conversion Unit more comprises a flag data inspection unit, in order to above-mentioned flag data is carried out format checking.
Further, wherein above-mentioned Date Conversion Unit reads a product labelling template file, according to the said goods marker template above-mentioned wafer sort data transaction is become flag data.
Further, wherein this system more comprises the mark server, and above-mentioned processing unit is transferred to above-mentioned mark server with above-mentioned flag data, and above-mentioned mark server is transferred to above-mentioned labelling apparatus with above-mentioned flag data again.
The labeling method of wafer manufacturing process of the present invention and system, to change into the discernible flag data of general labeling device automatically from the wafer sort data that the probe test platform obtains, do not need to use expensive automatic labelling apparatus, reduced production cost, and made full use of existing equipment.
Description of drawings
Figure 1 shows that the flow chart of a preferred embodiment of the present invention;
Figure 2 shows that the functional block diagram of a preferred embodiment of the present invention;
Figure 3 shows that the functional block diagram of processing unit among Fig. 2;
Figure 4 shows that the flowchart of processing unit among Fig. 2.
Embodiment
In order more to understand technology contents of the present invention, especially exemplified by preferred embodiment and cooperate appended graphic being described as follows.
Please refer to Fig. 1, Figure 1 shows that the flow chart of a preferred embodiment of the present invention.A kind of labeling method that is used for wafer manufacturing process that the present invention proposes, it comprises: step 10: obtain the wafer sort data, according to a preferred embodiment of the present invention, wherein above-mentioned wafer sort data are surveyed the test data that obtains behind the processing procedure for above-mentioned wafer being carried out pin; Then carry out step 20: above-mentioned wafer sort data are carried out format checking; Carry out step 30 again: above-mentioned wafer sort data transaction is become flag data, according to a preferred embodiment of the present invention, this step comprises step 31: read a product labelling template file, and step 32: according to the said goods marker template above-mentioned wafer sort data transaction is become flag data; Then carry out step 40: above-mentioned flag data is carried out format checking; Carry out step 50 at last: above-mentioned wafer is carried out mark according to above-mentioned flag data.
Then please refer to Fig. 2 and Fig. 3, Figure 2 shows that the functional block diagram of a preferred embodiment of the present invention, Figure 3 shows that the functional block diagram of processing unit among Fig. 2.The Mk system that is used for wafer manufacturing process that a preferred embodiment of the present invention proposes, it comprises a plurality of testboards 110,120,130,140, processing unit 200, mark server 300 and labelling apparatus 400.
Above-mentioned a plurality of testboard 110,120,130,140 in order to test above-mentioned wafer, according to a preferred embodiment of the present invention, and wherein above-mentioned a plurality of testboards 110,120,130,140 is that the probe test platform is surveyed processing procedure so that check out underproof crystal grain in order to above-mentioned wafer is carried out pin;
Above-mentioned processing unit 200 is in order to above-mentioned probe test platform 110,120,130,140 wafer sort data transaction becomes flag data, surveying the wafer sort data of processing procedure acquisition can not directly be discerned by common labelling apparatus by pin, therefore need carry out this Data Format Transform program, according to a preferred embodiment of the present invention, wherein above-mentioned processing unit 200 comprises: procedure control unit 210 and Date Conversion Unit 220, said procedure control unit 210 carries out program control in order to the execution flow process to above-mentioned processing unit, above-mentioned Date Conversion Unit 220 is in order to become flag data with the above-mentioned wafer sort data transaction that reads, wherein said procedure control unit 210 more comprises a test data inspection unit 211, in order to above-mentioned wafer sort data are carried out format checking, above-mentioned Date Conversion Unit 220 more comprises a flag data inspection unit 221, in order to above-mentioned flag data is carried out format checking, according to a preferred embodiment of the present invention, wherein above-mentioned Date Conversion Unit 220 reads a product labelling template file, according to the said goods marker template above-mentioned wafer sort data transaction is become flag data, on wafer, can make different products, therefore and these different products have different marker template, need to become corresponding product labelling data according to the corresponding product labelling template wafer sort data transaction of will being correlated with.
Above-mentioned labelling apparatus 400 is in order to carry out mark according to above-mentioned flag data to above-mentioned wafer, and above-mentioned labelling apparatus 400 is common labelling apparatus, and it can discern the flag data after the conversion.According to a preferred embodiment of the present invention, wherein this system more comprises mark server 300, above-mentioned processing unit 200 is transferred to above-mentioned mark server 300 with above-mentioned flag data, above-mentioned mark server 300 is transferred to above-mentioned flag data above-mentioned labelling apparatus 400 again, in integrated networked operating system, above-mentioned mark server 300 receives above-mentioned flag data, is transferred to corresponding labelling apparatus 400 then as requested to carry out the mark operation.
Please refer to Fig. 4 again, Figure 4 shows that the flowchart of processing unit among Fig. 2.The execution flow process of processing unit 200 comprises: step S100: the executive program control unit; Step S110: judge whether to read the wafer sort data, if the result whether, then jumps to step S120: standby, on the contrary jump to step S130: above-mentioned wafer sort data are carried out format checking; Step S140: whether the form of judging above-mentioned wafer sort data is correct, if the result whether, then jumps to step S150: error reporting, then carry out step S120: standby, on the contrary jump to step S160: download above-mentioned wafer sort data; Then carry out step S200: carry out Date Conversion Unit; Step S210: read the product labelling template file; Step S220: above-mentioned wafer sort data transaction is become flag data according to the said goods marker template; Step S230: above-mentioned flag data is carried out format checking; Carry out determining step S240: judge whether above-mentioned flag data form is correct, if the result whether, then jumps to step S150: error reporting, then carry out step S120: standby, on the contrary jump to step S250: above-mentioned flag data is transferred to labelling apparatus.So, just above-mentioned wafer sort data transaction can be become corresponding labelling apparatus 400 discernible flag datas, utilize above-mentioned labelling apparatus 400 to carry out the mark operation again, thereby underproof crystal grain mark is come out by the execution flow process of above-mentioned processing unit 200.
In sum, the labeling method of wafer manufacturing process of the present invention and system, to change into the discernible flag data of general labeling device automatically from the wafer sort data that the probe test platform obtains, do not need to use the automatic labelling apparatus of high duty, reduce production cost, and made full use of existing equipment.
Though the present invention discloses as above with preferred embodiment, so it is not in order to limit the present invention.The persond having ordinary knowledge in the technical field of the present invention, without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations.Therefore, protection scope of the present invention is as the criterion when looking claims person of defining.
Claims (12)
1. labeling method that is used for wafer manufacturing process is characterized in that comprising:
Obtain the wafer sort data;
Above-mentioned wafer sort data transaction is become flag data;
According to above-mentioned flag data above-mentioned wafer is carried out mark.
2. labeling method according to claim 1 is characterized in that the test data of wherein above-mentioned wafer sort data for above-mentioned wafer being carried out obtain behind the pin survey processing procedure.
3. labeling method according to claim 1, it is characterized in that this method more comprises carries out format checking to above-mentioned wafer sort data.
4. labeling method according to claim 1 is characterized in that wherein above-mentioned switch process for reading a product labelling template file, becomes flag data according to the said goods marker template with above-mentioned wafer sort data transaction.
5. labeling method according to claim 1, it is characterized in that this method more comprises carries out format checking to above-mentioned flag data.
6. Mk system that is used for wafer manufacturing process is characterized in that comprising:
At least one testboard is in order to test above-mentioned wafer;
Processing unit becomes flag data in order to the wafer sort data transaction with above-mentioned at least one testboard;
Labelling apparatus is in order to carry out mark according to above-mentioned flag data to above-mentioned wafer.
7. Mk system according to claim 6 is characterized in that wherein above-mentioned at least one testboard is that the probe test platform is surveyed processing procedure in order to above-mentioned wafer is carried out pin.
8. Mk system according to claim 6 is characterized in that wherein above-mentioned processing unit comprises:
Procedure control unit carries out program control in order to the execution flow process to above-mentioned processing unit;
Date Conversion Unit is in order to become flag data with the above-mentioned wafer sort data transaction that reads.
9. Mk system according to claim 8 is characterized in that wherein the said procedure control unit more comprises a test data inspection unit, in order to above-mentioned wafer sort data are carried out format checking.
10. Mk system according to claim 8 is characterized in that wherein above-mentioned Date Conversion Unit more comprises a flag data inspection unit, in order to above-mentioned flag data is carried out format checking.
11. Mk system according to claim 8 is characterized in that wherein above-mentioned Date Conversion Unit reads a product labelling template file, becomes flag data according to the said goods marker template with above-mentioned wafer sort data transaction.
12. Mk system according to claim 6, it is characterized in that wherein this system more comprises the mark server, above-mentioned processing unit is transferred to above-mentioned mark server with above-mentioned flag data, and above-mentioned mark server is transferred to above-mentioned labelling apparatus with above-mentioned flag data again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100359057A CN101556899A (en) | 2008-04-10 | 2008-04-10 | Marking method and system of wafer manufacturing process |
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| Application Number | Priority Date | Filing Date | Title |
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| CNA2008100359057A CN101556899A (en) | 2008-04-10 | 2008-04-10 | Marking method and system of wafer manufacturing process |
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| CNA2008100359057A Pending CN101556899A (en) | 2008-04-10 | 2008-04-10 | Marking method and system of wafer manufacturing process |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103809099A (en) * | 2014-03-05 | 2014-05-21 | 上海华虹宏力半导体制造有限公司 | Method for detecting test times of wafer probe |
| CN103970938A (en) * | 2014-04-22 | 2014-08-06 | 上海华力微电子有限公司 | Wafer test result map mark modification method |
| WO2015039339A1 (en) * | 2013-09-23 | 2015-03-26 | Spreadtrum Communications (Shanghai) Co., Ltd. | Apparatus and method for fanout of flip chip |
-
2008
- 2008-04-10 CN CNA2008100359057A patent/CN101556899A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015039339A1 (en) * | 2013-09-23 | 2015-03-26 | Spreadtrum Communications (Shanghai) Co., Ltd. | Apparatus and method for fanout of flip chip |
| CN105593981A (en) * | 2013-09-23 | 2016-05-18 | 展讯通信（上海）有限公司 | Apparatus and method for fanout of flip chip |
| CN105593981B (en) * | 2013-09-23 | 2018-06-05 | 展讯通信（上海）有限公司 | The fanout apparatus and method of a kind of flip-chip |
| CN103809099A (en) * | 2014-03-05 | 2014-05-21 | 上海华虹宏力半导体制造有限公司 | Method for detecting test times of wafer probe |
| CN103809099B (en) * | 2014-03-05 | 2016-09-28 | 上海华虹宏力半导体制造有限公司 | The detection method of wafer probe testing time |
| CN103970938A (en) * | 2014-04-22 | 2014-08-06 | 上海华力微电子有限公司 | Wafer test result map mark modification method |
| CN103970938B (en) * | 2014-04-22 | 2017-07-28 | 上海华力微电子有限公司 | Wafer sort result figure marks amending method |
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Open date: 20091014 |