CN101556379A

CN101556379A - Combination structure

Info

Publication number: CN101556379A
Application number: CNA2008100893260A
Authority: CN
Inventors: 林明德; 陈进勇
Original assignee: Raydium Semiconductor Corp
Current assignee: Raydium Semiconductor Corp
Priority date: 2008-04-10
Filing date: 2008-04-10
Publication date: 2009-10-14

Abstract

The invention provides a combination structure which comprises a first substrate, a second substrate and a medium layer, wherein the medium layer is provided with a side edge between the first substrate and the second substrate, and the second substrate comprises at least one wire. When the second substrate is arranged on the medium layer, the wire of the second substrate correspondingly passes through the side edge of the medium layer in inclination. When the second substrate generates a plurality of bending times corresponding to the medium layer, because the layout mode that the wire of the second substrate correspondingly passes through the side edge of the medium layer in inclination, the bending angle of the wire of the second substrate can be properly reduced, and the strength of the wire can be improved; thus the service life of the wire of the second substrate can be prolonged.

Description

Unitized construction

Technical field

The present invention relates to a kind of unitized construction, particularly relate to the unitized construction that repeatedly bends applicable in the assembling production run.

Background technology

With regard to the general flexible circuit board that liquid crystal panel and its electrically connected, under a side with respect to liquid crystal panel, the lead of flexible circuit board is electrically connected at the lead (or contact) of liquid crystal panel repeatedly to put mode, and the distribution of the lead in the flexible circuit board is relatively perpendicular to the side of liquid crystal panel.Yet because flexible circuit board can carry out bending repeatedly in the assembling production run of liquid crystal panel, and this bending operation is the main cause that causes the wire fracture in the flexible circuit board.

Therefore, how carry out layout and the intensity that can suitably improve lead is considerable problem for the lead in the flexible circuit board.

Summary of the invention

Unitized construction of the present invention comprises first substrate, second substrate and dielectric layer.Dielectric layer has a side, and between first substrate and second substrate, second substrate comprises at least one lead.When second substrate is arranged at dielectric layer, the relatively oblique side of the lead of second substrate by dielectric layer.

First substrate can be panel, and second substrate can be flexible circuit board, and dielectric layer can be anisotropic conductive film.

When second substrate produces repeatedly bending with respect to dielectric layer, since the layout type of the relatively oblique side by dielectric layer of the lead of second substrate can suitably reduce by second substrate lead bending angle and improve its intensity, so can increase the serviceable life of the lead of second substrate.

For above and other objects of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below:

Description of drawings

Fig. 1 represents the synoptic diagram with unitized construction of the present invention;

Fig. 2 A represents that the line segment (N-N) along Fig. 1 carries out sectional view under the partial cut for electronic installation; And

Fig. 2 B represents the vertical view according to the structure of Fig. 2 A.

The primary clustering symbol description

10～the first substrates, 100～side

101～lead 10u～upper surface

20～the second substrates, 201～lead

201p～projected segment 21～circuit board

K～dielectric layer k100～side

N-N～line segment W～unitized construction

Embodiment

Fig. 1 represents that the present invention has the synoptic diagram of unitized construction W, and Fig. 2 A represents to carry out sectional view under the partial cut along the line segment N-N of Fig. 1 for electronic installation, and Fig. 2 B represents the structure vertical view according to Fig. 2 A.

Shown in Fig. 1,2A, unitized construction W comprises first substrate 10, second substrate 20, dielectric layer K and circuit board 21.Dielectric layer K is between first substrate 10 and second substrate 20.

Shown in Fig. 2 A, 2B, first substrate 10 is for having upper surface 10u, a side 100 and a plurality of leads 101 square shape member of (as than shown in the long dotted line), and wherein, a plurality of leads 101 are distributed in upper surface 10u and extend toward side 100.In the present embodiment, first substrate 10 is a liquid crystal panel, and a plurality of leads 101 are plain conductor.

Second substrate 20 is for having the member of a plurality of leads 201.A plurality of leads 201 of second substrate 20 (shown in short dotted line) are to be arranged at respect to a plurality of leads 101 of first substrate 10 above the dielectric layer K.In the present embodiment, (for example: cover brilliant film (chip on film, COF)), dielectric layer K is an anisotropic conductive film for flexible circuit board in second substrate 20.

When utilizing dielectric layer K when combining between second substrate 20 and first substrate 10, second substrate 20 is in the mode of the side k100 by dielectric layer K and repeatedly place dielectric layer K, the purpose that electrically connects with a plurality of leads 101 of a plurality of leads 201 that reach second substrate 20 and first substrate 10, and a plurality of leads 201 of second substrate 20 are projected to the side k100 that projected segment 201p on first substrate 10 is diagonal to dielectric layer K, that is the relatively oblique side k100 of a plurality of leads 201 of second substrate 20, by dielectric layer K.

When second substrate 20 produces repeatedly bending with respect to dielectric layer K, since the layout type of the relatively oblique side k100 by dielectric layer K of a plurality of leads 201 of second substrate 20 can suitably reduce by second substrate 20 a plurality of leads 201 bending angle and improve its intensity, so can increase the serviceable life of a plurality of leads 201 of second substrate 20.

Repeatedly place on the dielectric layer K though it should be noted that second substrate 20 in the foregoing description, and see through the electric connection that dielectric layer K provides a plurality of leads 101 with a plurality of leads 201 of second substrate 20 of first substrate 10, non-in order to limit the present invention.In other embodiments, second substrate can be adopted the mode of insertion or clamping and be connected with first substrate, or a plurality of leads of first substrate can be replaced by electrical contact.

Though the present invention discloses as above with preferred embodiment; right its is not in order to restriction the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; can do and change and retouching, so protection scope of the present invention is worked as with being as the criterion that accompanying Claim was defined.

Claims

1. unitized construction comprises:

First substrate;

Dielectric layer comprises a side; And

Second substrate is arranged at described first substrate, and wherein, described second substrate comprises at least one lead, and described at least one lead obliquely passes through the described side of described dielectric layer relatively.

2. unitized construction according to claim 1, wherein, described first substrate is a panel.

3. unitized construction according to claim 1, wherein, described second substrate is a flexible circuit board.

4. unitized construction according to claim 1, wherein, described dielectric layer is arranged between described first substrate and described second substrate.

5. unitized construction according to claim 1, wherein, described dielectric layer is an anisotropic conductive film.

6. unitized construction comprises:

First substrate;

Dielectric layer comprises a side, repeatedly places described first substrate; And

Second substrate, mode with the described side by described dielectric layer repeatedly places described dielectric layer, wherein, described second substrate comprises a plurality of leads, described lead sees through dielectric layer and is electrically connected at described first substrate, and described lead is projected to the described side that projected segment on described first substrate is diagonal to described dielectric layer.

7. unitized construction according to claim 6, wherein, described first substrate is a panel.

8. unitized construction according to claim 6, wherein, described second substrate is a flexible circuit board.

9. unitized construction according to claim 6, wherein, described dielectric layer is arranged between described first substrate and described second substrate.

10. unitized construction according to claim 6, wherein, described dielectric layer is an anisotropic conductive film.