CN101542724A - Pulsating cooling system - Google Patents
Pulsating cooling system Download PDFInfo
- Publication number
- CN101542724A CN101542724A CNA2007800438438A CN200780043843A CN101542724A CN 101542724 A CN101542724 A CN 101542724A CN A2007800438438 A CNA2007800438438 A CN A2007800438438A CN 200780043843 A CN200780043843 A CN 200780043843A CN 101542724 A CN101542724 A CN 101542724A
- Authority
- CN
- China
- Prior art keywords
- cavity
- opening
- transducer
- aforementioned
- harmonic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A cooling device comprising at least one transducer (1) having a membrane adapted to generate pressure waves at a working frequency, characterized by a first and a second cavity (3, 4), said transducer being arranged between said first and second cavities, such that said membrane forms an fluid tight seal between said cavities, each cavity having at least one opening (7, 8) adapted to emit a pulsating net output fluid flow, wherein said cavities and openings are formed such that, at said working frequency, a first harmonic fluid flow emitted by said opening(s) (7) of a first one of said cavities is in anti-phase with a second harmonic fluid flow emitted by said opening(s) (8) of a second one of said cavities, so that a sum of harmonic fluid flow from said openings is essentially zero. With this design, sound reproduction at the working frequency is largely cancelled due to the counter phase of the outlets resulting in a close to zero far-field volume velocity.
Description
Technical field
The present invention relates to a kind of pulsating cooling system, promptly a kind of like this cooling system, wherein transducer causes the vibration that forms pulsating fluid stream, this pulsating fluid stream can be towards object guiding to be cooled.Can be advantageously at its resonance frequency, or come drive system to obtain high fluid velocity near its resonance frequency at least.
Background technology
Because the higher heat flux density that electronic installation caused of new development, for example compacter and/or higher than conventional apparatus power has increased the needs for cooling in various application.The example of this improved device comprises (for example) more high power semiconductor light source, such as laser or light-emitting diode, RF power device and more high performance microprocessor, hard disk drive is as the CD-ROM drive of CDR, DVD and blu-ray drive and such as the large-area devices of panel TV and light fixture.
Alternative as what utilize blower fan to cool off, document 2005/008348 discloses a kind of synthetic jet actuator and pipe that is used to cool off purpose.This pipe is connected to resonant cavity and forms pulse jet at the far-end of pipe, and this pulse jet can be used for cooling object.Cavity and pipe form Helmholtz resonator, i.e. second-order system (second order system), and wherein the air in cavity serves as spring, and the air in the pipe is as quality.
Another example is provided by people such as N.Beratlis, is used for the optimization (Optimization of synthetic jet cooling for microelectronicsapplications) of the synthesizing jet-flow cooling of microelectronic applications, 19
ThSEMITHERM San Jose, 2003.A kind of synthesizing jet-flow machine disclosed herein, it has two barrier films, and each barrier film and identical aperture are communicated with.
With as the typical case uses in the conventional cooling system (for example, cooling blower) laminar flow compare, find that such pulsating fluid stream (typically being air stream) more effectively cools off.The resonance cooling system also needs littler space and generation noise still less.
But formerly in the system of Ti Chuing, for example, in disclosed system in WO 2005/008348, still there is the audio reproduction to a certain degree of the frequency dependence that flows with the vibration air.
Summary of the invention
Therefore the objective of the invention is to further to reduce the noise level in the pulsating cooling system.
According to the present invention, this purpose and other purpose are realized by the cooling device that comprises two cavitys, transducer arrangement makes film form fluid-tight sealing between two cavitys between cavity, each cavity has at least one opening, this opening is suitable for sending pulsation clean output fluid stream (pulsating net output fluid flow), wherein this cavity and this opening are formed and make with operating frequency anti-phasely with the second harmonic fluid that opening the was sent stream of second cavity of these cavitys by the first harmonic fluid that opening the was sent stream of first cavity in these cavitys, and the harmonic wave fluid stream sum from these openings is substantially zero like this.
Be arranged in two transducers between the cavity and will serve as dipole, that is, and two anti-phase sound sources.The present invention is based on such design: promptly will offset from the harmonic wave part of the sound in these two sources.Represent the anharmonic wave part of the major part of cooling effect can coherently not add and therefore will can not offset.
Utilize this design, realize improved cooling effect, simultaneously because the anti-phase far field volume velocity that is close to zero that causes of outlet has been cancelled the audio reproduction that carries out with operating frequency to a great extent by vibration air stream.Therefore, cooling system according to the present invention has than the significantly lower audio reproduction of prior art " synthesizing jet-flow " cooling device.
Can be used to cool off a variety of objects by the outflow through guiding of various liquid or gaseous fluid (being not only air) according to cooling device of the present invention.But it is specially adapted to the air cooling of these objects (such as circuit).
Each cavity can only have an opening, or has more than an opening.But importantly harmonic wave effect (harmonic contribution) sum from all openings is substantially zero.
Can be arranged between the cavity more than a transducer, for example, the transducer of two relative positionings and operated in anti-phase will obtain bigger air stream.By " relative positioning " meaning is such a case, promptly wherein is directed in the cavity from each pressure wave of a transducer, and is directed in another cavity from each pressure wave of another transducer.
" transducer " is the device that input signal can be converted to corresponding pressure wave output in this article.Input signal can be the signal of telecommunication, magnetic signal or mechanical signal.The example of suitable transducer comprises various types of films, piston, piezoelectric structure etc.Especially, can use the electrodynamic loudspeaker of suitable dimension as transducer.
Compare with the wavelength that is in operating frequency, the distance between the opening should be shorter.For mutual distance is d, and intensity is two sources (for example, two openings) of A, is that the pressure p at r place should be apart from the distance in these sources
Wherein k is that (ω/c) and θ are viewing angle to wave number.For keeping this pressure less, according to preferred embodiment, should be apart from d less than 0.2 λ, and even more preferably less than 0.1 λ.
Do not have absolute requirement for operating frequency.But, operating frequency preferably is selected to the air velocity and the air displacement that make by opening and has local maximum, and this betides near the resonance frequency of device usually, that is, and and corresponding to the frequency of local maximum of the electric input impedance of device (transducer that combines with cavity and opening).Usually, select minimum this frequency.
Perhaps, can select operating frequency to make the cone of described transducer drift in this operating frequency like this and have local minimum.Usually, this betides the antiresonant frequency place of device, that is, and and corresponding to the frequency of local minimum of the electric input impedance of device.
Guarantee that air velocity has the size and the anti-phase a kind of method that equate basically and is, for all air streams provide identical situation.For example, cavity can be formed has identical volume, and opening can be formed and has identical sectional area.But this is not requirement, and can utilize the cavity of different sizes and/or opening to realize that the air of offsetting flows.
According to an embodiment, opening is connected to respective cavities via passage (or pipeline).This allows bigger design freedom, because passage can be formed some air streams is directed to same position and has desirable direction.Because mentioned above, passage can be formed has equal lengths and sectional area.
According to an embodiment, but this passage long enough is more can serve as pipe resonator.According to alternate embodiment, the length of passage is alternatively enough short in to allow cavity to serve as conventional Helmholtz resonator.
Connect extensible second cavity that passes of passage of at least one opening of first cavity, make this opening be positioned on the sidepiece identical on the described device with the opening of second cavity.Have the extension on plane basically and be arranged to one at cavity (that is, be similar to two dish on another top) under the situation at another top, this design will allow all openings of location on the top side of device or bottom side.
Two or more devices according to the present invention capable of being combined have the cooling of a multiple opening of two and arrange with formation.To the distance between two openings of the requirement of the average distance between the opening of first device and the opening that second installs and each device require identical, and should be, and even more preferably less than 0.1 λ preferably less than 0.2 λ.
According to this design, for the wavelength in operating frequency, the outlet of four (or more) is arranged close to each otherly.This causes the further reduction of noise during the cooling placement operations.This part ground is because better how much symmetries, because there are two (mirror image and be equal to) transducers, and partly is because the better compensation of two identical nonlinear distortions that loud speaker produced.
Description of drawings
Referring to accompanying drawing, now this aspect of the present invention and others will be described in more detail, accompanying drawing shows currently preferred embodiments of the present invention.
Fig. 1 illustrates the cooling system according to the first embodiment of the present invention.
Fig. 2 illustrates the frequency response of electric input impedance, air velocity, air displacement and cone displacement (conedisplacement) respectively.
Fig. 3 illustrates cooling system according to a second embodiment of the present invention.
Fig. 4 illustrates the cooling system of a third embodiment in accordance with the invention.
Fig. 5 illustrates the cooling system of the modification of a third embodiment in accordance with the invention.
Fig. 6 illustrates the cooling system of another modification of a third embodiment in accordance with the invention.
Fig. 7 illustrates the cooling system of a fourth embodiment in accordance with the invention.
Fig. 8 illustrates cooling system according to a fifth embodiment of the invention.
Embodiment
Cooling system among Fig. 1 comprises the transducer 1 that is arranged in the shell 2.Transducer 1 is arranged to shell is divided into and has volume V respectively
1And V
2Two cavitys 3,4.Each cavity is connected to surrounding atmosphere via two paths respectively, and herein, these two paths are that length is L
P1With L
P2And sectional area is S
P1With S
P2Pipeline 5,6. Pipeline 5,6 has outlet 7 and 8, and outlet 7 and 8 is oriented to d at a distance from each other.Opening is illustrated as to have round-shapedly, but the present invention is not limited to this shape.On the contrary, opening can have Any shape, thereby and also can be taper and influence air stream in desirable mode.
Select volume V
1And V
2And the form of pipeline 5,6, making that in use transducer will serve as the pressure wave dipole, cause the fluid that is present in the cavity to pass the pulsating flow of outlet, this pulsating flow equates basically and is anti-phase.When driving transducer with operating frequency, two fluid streams thereby will cancel each other out, thus suppress any pressure wave from dipole overflow (that is interference sound).
Should be pointed out that this principle is not subjected to the restriction of any particular fluid, but this description will promptly, produce the device of vibration air stream based on the device of operating in air.
According to illustrated example, make V respectively
1And V
2, L
P1With L
P2, and S
P1With S
P2Have identical value and guarantee this aspect.
By the d that the keeps at a distance weak point of comparing with wavelength, that is, less than 0.1 λ, wherein λ be in air corresponding to the wavelength of operating frequency, keep very little from the air pressure of dipole radiation.
Volume V
1And V
2And the form (Fig. 1) of pipeline 5,6 may be selected to and exists characteristic frequency to make by each outlet air velocity v of 7,8
1And v
2Has identical local maximum and anti-phase.So the selectively operating frequency identical with this frequency with guarantee maximum air velocity and in response to cooling effect.Usually, these local maximums go up identical with the electric input impedance peak value of left part in frequency scale (frequency scale).
According to exemplary embodiments, device can have following character:
Moving mass=0.57g
Resonance frequency=370Hz
B1-factor=2.57N/A
Effective diameter=24mm
DC resistance=6.63 Ω
Volume: V
1=3.77cm
3
V
2＝3.65cm
3
Port size: L
P1=L
P2=8cm
S
p1＝S
p2＝π·(0.0025)
2m2
Electricity input: 2.83V (1 watt, nominal value)
For this device, Fig. 2 is a) to Fig. 2 d) electric input impedance, air velocity v be shown respectively
1And v
2, air particles outlet 7 and outlet in 8 displacement and the frequency response characteristic of transducer cone displacement.Under this illustrated case, be well understood to v
1And v
2The maximum of curve overlaps with first resonance frequency (first local maximum of input impedance) of system.Should be pointed out that for the sake of clarity volume V
1And V
2Be selected to difference slightly, so the curve among Fig. 2 overlaps fully.
Figure 3 illustrates another embodiment, it is crooked minimizing footprint area wherein managing 5 and 6, and minimized distance d.This unit comprises two helical elements 11, plate 12 between these two helical elements 11, accompanying, and sealed by end plate 13 at the upside and the downside of these two helical elements 11.The center of plate 12 during the film 14 of transducer 1 is arranged in.The inner most space 15 of each spiral is corresponding to the volume V among Fig. 1
1And V
2
Described another embodiment in Fig. 4, wherein two cavitys 21,22 are arranged to a top at another, are separated by the middle plate that has film 23.In illustrated example, there is not the pipeline that connects cavity and surrounding air, only there be two holes or the very little pipe 24,25 that is arranged in end plate 26,27.In use, sound wave will come out by 24,25 anti-phase eradiations from the hole, cause very moderate sound levels with compound mode.
On hole 24,25 and the nonessential opposite side that is arranged in cavity.As shown in Figure 5, they also can be positioned on the sidepiece of each cavity.In illustrated example, hole 24a-d and 25a-d are positioned on the respective cavities in couples.The desired orientation that causes cooling blast is depended in the distribution in hole, illustrates with arrow A in Fig. 5.
In another modification of in Fig. 4, installing, can be guided through in the end plate 26 hole in the end plate from the air of two cavitys 21,22.As shown in Figure 6, this can guide the passage 27 that passes lower cavity 22 arrival holes 28 to reach by providing in bottom end plate 26 from upper chamber 21.Other hole 29 in base plate 26 is directed to lower cavity 22.For the similar path from each cavity is provided, hole 29 also can be connected to lower cavity 22 via passage 30, and the length of passage 30 and cross section are similar to the length and the cross section of passage 27.
As general comment, should be pointed out that the number of active lanes from each cavity may not equate.For example, in the embodiment of Fig. 5 and Fig. 6, the hole of a cavity in these cavitys can be more than the hole from another cavity.But importantly compare equal and opposite in direction and anti-phase with air stream from another cavity from total air stream of a cavity.
Fig. 7 illustrates an embodiment more of the present invention.In the case, two cavitys 31,32 are separated by wall 33, and these two of wall 33 supportings are relatively placed and the transducer 34,35 of operated in anti-phase.The advantage of this design is to have compensated any disparity (for example referring to Fig. 1, wherein transducer occupies more volume in the cavity 4) that is caused by transducer.Go to Fig. 7, the feature of this embodiment also is to have a pipeline 36, and this pipeline 36 is divided into two passages 37,38 that are directed to respective cavities.
According to another embodiment shown in Figure 8, use two devices in combination according to an embodiment among the previous described embodiment, be device 41,42 according to embodiment among Fig. 3 herein.These two devices form have two transducers 1 and four opening 7a, 7b, the cooling system of 8a, 8b.All four openings should preferably be arranged adjacent to each other, and are most preferably in the space D less than 0.2 λ, as indicated above.In addition, as long as distance is enough little, unimportant from the direction of the air of each opening stream.Therefore, will be appreciated that opening and nonessential example as Fig. 8 are parallel and in same level, but, on the contrary, can be many other configuration arrange.Should be noted also that two the device 41 with 42 and nonessential be identical as this example.On the contrary, can be advantageously in conjunction with any two dipole devices.
Those skilled in the art will recognize that the present invention never is limited to preferred embodiment mentioned above.On the contrary, many modifications in the category of appended claims and modification also are possible.For example, the number of transducer can further increase, and the placement of opening and passage also can be depending on application-specific with form and different.
In addition, this transducer may be implemented in MEMS (micro electro mechanical system) (MEMS) technology, promptly realizes with unusual small size.More specifically, on such small size, whole cooling device comprises transducer, cavity, opening and any passage, can use etching technique to be implemented in the silicon fully.This device can be advantageously integrates with IC (for example microprocessor) to be cooled.By by providing cooling, can make cooling more effective with cooling device that object to be cooled has an identical size.Certainly, the silicon device can combine with the additional channels that is connected to silicon substrate.
Claims (15)
1. cooling device, it comprises at least one transducer (1) with film, described transducer (1) is suitable for producing pressure wave with operating frequency, it is characterized in that:
First cavity and second cavity (3,4), described transducer arrangement make described film form fluid-tight sealing between described first cavity and second cavity between these cavitys,
Each cavity has at least one opening (7,8), and described opening (7,8) is suitable for sending the clean output of pulsation fluid stream,
Wherein, form described cavity and opening so that in described operating frequency, the first harmonic fluid stream that is sent by the described opening (7) of first cavity in the described cavity is anti-phase with the second harmonic fluid stream that the described opening (8) of second cavity of described cavity is sent, and the harmonic wave fluid stream sum from described these openings is substantially zero like this.
2. device according to claim 1 is characterized in that, each cavity has more than an opening.
3. device according to claim 1 and 2 is characterized in that, two transducers (34,35) are arranged in relative position between the described cavity (31,32).
4. according to each described device in the aforementioned claim, it is characterized in that, between any two openings apart from d less than 0.2 λ, and preferably less than 0.1 λ, wherein λ is corresponding to the wavelength of described operating frequency in described fluid.
5. according to each described device in the aforementioned claim, it is characterized in that, described operating frequency is chosen as the speed that described first harmonic stream and second harmonic are flowed has local maximum at this operating frequency place.
6. according to each described device in the aforementioned claim, it is characterized in that described cavity (3,4) has the volume that equates basically.
7. according to each described device in the aforementioned claim, it is characterized in that described opening (7,8) has the sectional area that equates basically.
8. according to each described device in the aforementioned claim, it is characterized in that described opening is connected to respective cavities via passage (5,6).
9. device according to claim 8 is characterized in that, described passage (5,6) has equal lengths basically.
10. device according to claim 8 is characterized in that, described passage (5,6) has the cross section that equates basically.
11. each described device in 10 according to Claim 8, it is characterized in that, the passage that connects at least one opening of described first cavity passes described second cavity and extends, and makes described at least one opening be positioned at the identical sidepiece of the opening with described second cavity of described device.
12., it is characterized in that it uses MEMS (micro electro mechanical system) (MEMS) technology to realize according to each described device in the aforementioned claim.
13. device according to claim 12 is characterized in that, described transducer forms by etched silicon substrate.
14. a coolings layout that comprises two according to each described device (41,42) in the aforementioned claim, the opening of wherein said device is arranged to cooperate with each other to realize improved cooling.
15. cooling according to claim 14 is arranged, it is characterized in that, average distance between the described opening of described first device and the described second described opening that installs is less than 0.2 λ, and preferably less than 0.1 λ, wherein λ is corresponding to the wavelength of described operating frequency in described fluid.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP06125061.9 | 2006-11-30 | ||
| EP06125061 | 2006-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101542724A true CN101542724A (en) | 2009-09-23 |
Family
ID=39179713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007800438438A Pending CN101542724A (en) | 2006-11-30 | 2007-11-27 | Pulsating cooling system |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20100018675A1 (en) |
| EP (1) | EP2089902A1 (en) |
| JP (1) | JP2010511142A (en) |
| KR (1) | KR20090085700A (en) |
| CN (1) | CN101542724A (en) |
| TW (1) | TW200839980A (en) |
| WO (1) | WO2008065602A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104501646A (en) * | 2014-12-26 | 2015-04-08 | 李达 | Jet flow heat radiationmechanism and jet flow heat radiator |
| CN114823578A (en) * | 2021-01-19 | 2022-07-29 | 通用汽车环球科技运作有限责任公司 | Power module with pulse tube jet impingement cooling system |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1929836A2 (en) * | 2005-09-20 | 2008-06-11 | Koninklijke Philips Electronics N.V. | Audio transducer system |
| US20090168343A1 (en) * | 2006-03-21 | 2009-07-02 | Koninklijke Philips Electronics N.V. | Cooling device and electronic device comprising such a cooling device |
| JP5320298B2 (en) * | 2006-12-15 | 2013-10-23 | コーニンクレッカ フィリップス エヌ ヴェ | Pulsating fluid cooling with frequency control |
| US7768779B2 (en) * | 2007-06-04 | 2010-08-03 | Nuventix, Inc. | Synthetic jet ejector with viewing window and temporal aliasing |
| WO2008152560A1 (en) * | 2007-06-14 | 2008-12-18 | Koninklijke Philips Electronics N.V. | Lighting device with pulsating fluid cooling |
| US7990705B2 (en) * | 2008-05-09 | 2011-08-02 | General Electric Company | Systems and methods for synthetic jet enhanced natural cooling |
| KR20110073582A (en) * | 2008-10-17 | 2011-06-29 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | Cooling arrangement |
| US10274263B2 (en) | 2009-04-09 | 2019-04-30 | General Electric Company | Method and apparatus for improved cooling of a heat sink using a synthetic jet |
| US9615482B2 (en) | 2009-12-11 | 2017-04-04 | General Electric Company | Shaped heat sinks to optimize flow |
| US8496049B2 (en) * | 2009-04-09 | 2013-07-30 | General Electric Company | Heat sinks with distributed and integrated jet cooling |
| US8776871B2 (en) | 2009-11-19 | 2014-07-15 | General Electric Company | Chassis with distributed jet cooling |
| CH703357A1 (en) * | 2010-06-25 | 2011-12-30 | Alstom Technology Ltd | HEAT-LOADED, COOLED COMPONENT. |
| US8602607B2 (en) | 2010-10-21 | 2013-12-10 | General Electric Company | Lighting system with thermal management system having point contact synthetic jets |
| US8529097B2 (en) | 2010-10-21 | 2013-09-10 | General Electric Company | Lighting system with heat distribution face plate |
| US9027702B2 (en) * | 2013-10-16 | 2015-05-12 | The Boeing Company | Synthetic jet muffler |
| US11910568B2 (en) * | 2020-04-20 | 2024-02-20 | Cisco Technology, Inc. | Heat dissipation system with microelectromechanical system (MEMS) for cooling electronic or photonic components |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6123145A (en) * | 1995-06-12 | 2000-09-26 | Georgia Tech Research Corporation | Synthetic jet actuators for cooling heated bodies and environments |
| US5758823A (en) * | 1995-06-12 | 1998-06-02 | Georgia Tech Research Corporation | Synthetic jet actuator and applications thereof |
| GB0114222D0 (en) * | 2001-06-12 | 2001-08-01 | Pulsar Light Of Cambridge Ltd | Lighting unit with improved cooling |
| US6848631B2 (en) * | 2002-01-23 | 2005-02-01 | Robert James Monson | Flat fan device |
| JP4677744B2 (en) * | 2003-11-04 | 2011-04-27 | ソニー株式会社 | Jet generating device, electronic device and jet generating method |
| JP4572548B2 (en) * | 2004-03-18 | 2010-11-04 | ソニー株式会社 | Gas ejection device |
| US7140753B2 (en) * | 2004-08-11 | 2006-11-28 | Harvatek Corporation | Water-cooling heat dissipation device adopted for modulized LEDs |
| JP4747657B2 (en) * | 2005-04-21 | 2011-08-17 | ソニー株式会社 | Jet generator and electronic device |
| JP2006310586A (en) * | 2005-04-28 | 2006-11-09 | Sony Corp | Air current generator and electronic apparatus |
| EP1722412B1 (en) * | 2005-05-02 | 2012-08-29 | Sony Corporation | Jet generator and electronic device |
-
2007
- 2007-11-27 CN CNA2007800438438A patent/CN101542724A/en active Pending
- 2007-11-27 KR KR1020097013612A patent/KR20090085700A/en not_active Application Discontinuation
- 2007-11-27 WO PCT/IB2007/054796 patent/WO2008065602A1/en active Application Filing
- 2007-11-27 EP EP07849261A patent/EP2089902A1/en not_active Withdrawn
- 2007-11-27 US US12/515,999 patent/US20100018675A1/en not_active Abandoned
- 2007-11-27 JP JP2009538820A patent/JP2010511142A/en not_active Withdrawn
- 2007-11-28 TW TW096145319A patent/TW200839980A/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104501646A (en) * | 2014-12-26 | 2015-04-08 | 李达 | Jet flow heat radiationmechanism and jet flow heat radiator |
| CN114823578A (en) * | 2021-01-19 | 2022-07-29 | 通用汽车环球科技运作有限责任公司 | Power module with pulse tube jet impingement cooling system |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200839980A (en) | 2008-10-01 |
| EP2089902A1 (en) | 2009-08-19 |
| WO2008065602A1 (en) | 2008-06-05 |
| US20100018675A1 (en) | 2010-01-28 |
| KR20090085700A (en) | 2009-08-07 |
| JP2010511142A (en) | 2010-04-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101542724A (en) | Pulsating cooling system | |
| JP5133970B2 (en) | Cooling device and electronic device having such a cooling device | |
| KR101827669B1 (en) | Speaker module | |
| JP6555845B2 (en) | Multifunctional synthetic jet and method of production | |
| US8588449B2 (en) | Audio driver | |
| CN101889485B (en) | Cooling device utilizing internal synthetic jets | |
| US8069910B2 (en) | Acoustic resonator for synthetic jet generation for thermal management | |
| JP2007218241A (en) | Vibration actuator, jet stream generating apparatus, and electronic apparatus | |
| JP2010141720A (en) | Microphone unit and voice input device equipped with the same | |
| US11381919B2 (en) | Speaker box and speaker | |
| KR20070100665A (en) | Minuature loudspeaker and magnetic circuit having integrated air flow passage | |
| US8218318B2 (en) | Low noise cooling device | |
| US20060039571A1 (en) | Heat dissipating audio systems and methods thereof | |
| JP2008153716A (en) | Television receiver | |
| JP2008014148A (en) | Jet generating apparatus and electronic equipment | |
| JP2005260625A (en) | Speaker instrument | |
| US20160044404A1 (en) | Speaker apparatus | |
| JP2010114612A (en) | Indicator equipped with small speaker, and small speaker structure | |
| KR20050102143A (en) | Generating device for generating a useful stream of a medium, in particular for generating sound | |
| FI20177086A1 (en) | Loud-speaker enclosure particularly in a personal radio transmitter-receiver |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20090923 |