CN101502822B - Nozzle calibration device and nozzle calibration method - Google Patents
Nozzle calibration device and nozzle calibration method Download PDFInfo
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- CN101502822B CN101502822B CN2008100054557A CN200810005455A CN101502822B CN 101502822 B CN101502822 B CN 101502822B CN 2008100054557 A CN2008100054557 A CN 2008100054557A CN 200810005455 A CN200810005455 A CN 200810005455A CN 101502822 B CN101502822 B CN 101502822B
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- 238000000034 method Methods 0.000 title abstract description 6
- 239000004065 semiconductor Substances 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims description 58
- 238000009434 installation Methods 0.000 claims description 54
- 239000011148 porous material Substances 0.000 claims description 27
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 23
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 230000001681 protective effect Effects 0.000 abstract 2
- 239000011540 sensing material Substances 0.000 description 16
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000000696 magnetic material Substances 0.000 description 2
- 241001247287 Pentalinon luteum Species 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
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Abstract
The invention provides a nozzle calibration device and a nozzle calibration method. The calibration device is suitable for calibrating the nozzle of a semiconductor machine table, the base of the semiconductor machine table is provided with a central hole, the radius of the central hole is R1, the outer side of the nozzle is provided with a protective cover, the outer diameter of the nozzle is R2, and the outer diameter of the protective cover is R3. The calibration device comprises a jig which comprises an upper part and a lower part. The fixture comprises a recess on the front surface of the upper part, and the recess comprises an outer part and an inner part. The depth of the outer portion is D1, and the radius of the outer portion is R4, R4 being greater than R3. The depth of the interior is D2, and the radius of the interior is R5, D2 is greater than D1, and R5 is greater than R2. The lower part is connected to the back of the upper part and used for fixing the jig in the central hole of the base, the radius of the lower part is R6, and R6 is smaller than R1. Wherein the values of (R4-R3), (R5-R2), and (R1-R6) are within an allowable calibration error range. The calibration device of the nozzle provided by the invention can accurately position the coordinate position of the nozzle.
Description
Technical field
The present invention relates to a kind of calibrating installation of semiconductor board and the calibration steps of semiconductor board, and be particularly related to a kind of calibrating installation of nozzle and the calibration steps of nozzle.
Background technology
Present having need utilize nozzle to carry out the operation of technology in many semiconductor boards.For instance, in semiconductor boards such as photoresistance coating machine platform and cleaning machine, all has nozzle.
Using this semiconductor board with nozzle after a period of time, the track that nozzle moves can produce deviation, and can't on the coordinate position that sets (comprising X orientation, Y orientation and Z orientation), carry out operation exactly.
Yet; When coordinate position that position deviation that moving nozzle arrived sets; Up to the present do not have any calibrating installation and can be used for nozzle is calibrated, remain the judgement of being dependent on operating personnel and come the mobile setting of nozzle is finely tuned, this is quite coarse method.
Summary of the invention
In view of this, the object of the invention is exactly that a kind of calibrating installation of nozzle is being provided, and can calibrate the position of nozzle effectively.
Another object of the present invention provides a kind of calibration steps of nozzle, can accurately calibrate the mobile setting of nozzle.
Another purpose of the present invention provides a kind of calibration steps of nozzle, can make nozzle on correct coordinate position, carry out operation.
The present invention proposes a kind of calibrating installation of nozzle, is applicable to the nozzle of semiconductor board is calibrated, and semiconductor board has pedestal; Pedestal has medium pore; The radius of medium pore is R1, and the nozzle arranged outside has protecting cover, and wherein the external diameter of nozzle is that the external diameter of R2 and protecting cover is R3.Calibrating installation comprises tool, and tool comprises top and bottom.Front on top comprises depression, and depression comprises outside and inside.The outside degree of depth is D1, and outside radius is R4, and wherein R4 is greater than R3, and value (R4-R3) is in permissible calibration error scope.The inner degree of depth is D2, and inner radius is R5, and wherein D2 is greater than D1, and R5 is greater than R2, and value (R5-R2) is in permissible calibration error scope.The bottom is connected in the back side on top, and in order to tool is fixed in the medium pore of pedestal, the radius of bottom is R6, and R6 is less than R1, and value (R1-R6) is in permissible calibration error scope.
Said according to one embodiment of the invention, in the calibrating installation of above-mentioned nozzle, tool comprises at least one opening, and opening runs through top and bottom.
Said according to one embodiment of the invention, in the calibrating installation of above-mentioned nozzle, the surface of nozzle and/or protecting cover comprises the light reflecting material layer.
Said according to one embodiment of the invention, in the calibrating installation of above-mentioned nozzle, also comprise light emission/sensor, be disposed at medium pore below, in order to launching light, and the light that reflected by the light reflecting material layer of sensing.
Said according to one embodiment of the invention, in the calibrating installation of above-mentioned nozzle, the material of tool comprises light transmissive material.
Said according to one embodiment of the invention, in the calibrating installation of above-mentioned nozzle, the surface of nozzle and/or protecting cover comprises the light reflecting material layer.
Said according to one embodiment of the invention, in the calibrating installation of above-mentioned nozzle, also comprise light emission/sensor, be disposed at medium pore below, light emission/sensor is in order to launching light, and the light that reflected by the light reflecting material layer of sensing.
Said according to one embodiment of the invention, in the calibrating installation of above-mentioned nozzle, tool comprises a magnetisable material.
Said according to one embodiment of the invention, in the calibrating installation of above-mentioned nozzle, nozzle and/or protecting cover comprise magnetisable material, make nozzle and/or protecting cover and tool attract each other through magnetic force.
The present invention proposes a kind of calibration steps of nozzle, uses aforesaid calibrating installation that nozzle is calibrated, and this calibration steps comprises the following steps.At first, the bottom of tool is inserted in the medium pore of pedestal, so that tool is fixed on the pedestal.Then, moving nozzle inserts in the depression on top of tool and with tool nozzle and protecting cover and engages, and calibrates with X orientation and Y orientation to nozzle.Then, the rising nozzle makes protecting cover leave depression.Next, measure the upper surface of tool and the distance between the protecting cover, calibrate with Z orientation to nozzle.
Said according to one embodiment of the invention, in the calibration steps of above-mentioned nozzle, also comprise the following steps.At first, continue the rising nozzle.Then, measure the upper surface of tool and the distance between the protecting cover, calibrate with Z orientation to nozzle.
Said according to one embodiment of the invention; In the calibration steps of above-mentioned nozzle; When tool comprised that the surface of at least one opening, nozzle and/or the protecting cover that run through top and bottom comprises that light reflecting material layer and calibrating installation also comprise the light emission/sensor that is disposed at the medium pore below, calibration steps also comprised the following steps.At first, utilize light emission/sensor emission light to the light reflecting material layer.Then, the light that utilizes light emission/sensor sensing to be reflected by the light reflecting material layer is with X orientation, Y orientation and the Z orientation of calibration nozzle.
Said according to one embodiment of the invention; In the calibration steps of above-mentioned nozzle; When the material of tool comprised that the surface of light transmissive material, nozzle and/or protecting cover comprises that light reflecting material layer and calibrating installation also comprise the light emission/sensor that is disposed at the medium pore below, calibration steps also comprised the following steps.At first, utilize light emission/sensor emission light to the light reflecting material layer.Then, the light that utilizes light emission/sensor sensing to be reflected by the light reflecting material layer is with X orientation, Y orientation and the Z orientation of calibration nozzle.
Said according to one embodiment of the invention; In the calibration steps of above-mentioned nozzle; When tool comprises that magnetisable material and nozzle and/or protecting cover comprise magnetisable material; Calibration steps also comprises through magnetic force attracts each other nozzle and/or protecting cover and tool, with X orientation, Y orientation and the Z orientation of calibration nozzle.
Said according to one embodiment of the invention, in the calibration steps of above-mentioned nozzle, measure the upper surface of tool and the instrument of the distance between the protecting cover and comprise thickness gage (feeder gauge) or laser range finder.
The present invention proposes the calibration steps of another kind of nozzle, is applicable to the nozzle of semiconductor board is calibrated, and calibration steps comprises the following steps.At first, semiconductor board is provided, semiconductor board has pedestal, and pedestal has medium pore, and the nozzle arranged outside has protecting cover, and comprises in nozzle and/or the protecting cover and treat the sensing material.Then, calibrating installation is provided, calibrating installation comprises the sensing body, and the sensing body is positioned at the medium pore below of pedestal.Then, moving nozzle and utilize sensing body sensing nozzle and/or protecting cover treat the sensing material, with X orientation, Y orientation and the Z orientation of calibration nozzle.
Said according to another embodiment of the present invention, in the calibration steps of above-mentioned nozzle, treat that the sensing material comprises layer of reflective material, the portion that is coated with is in nozzle and/or protecting cover surface.
Said according to another embodiment of the present invention, in the calibration steps of above-mentioned nozzle, the sensing body comprises light emission/sensor.
Said according to another embodiment of the present invention, in the calibration steps of above-mentioned nozzle, treat that sensing material and sensing body comprise magnetisable material.
Said according to another embodiment of the present invention, in the calibration steps of above-mentioned nozzle, the sensing body also comprises Magnetic Sensor.
Based on above-mentioned, through the calibration steps of nozzle proposed by the invention, can be accurately the coordinate position of nozzle be positioned, therefore can calibrate the mobile setting of nozzle effectively, and then make nozzle can on correct coordinate position, carry out operation.
For let above-mentioned and other purposes of the present invention, feature and advantage can be more obviously understandable, hereinafter is special lifts preferred embodiment, and cooperates appended diagram, elaborates as follows.
Description of drawings
Fig. 1 illustrate is the profile of the calibrating installation of the first embodiment of the present invention.
Fig. 2 A to Fig. 2 C illustrate is the flow process profile of the calibration steps of the nozzle that calibrating installation carried out of the use first embodiment of the present invention.
Fig. 3 illustrate is the flow chart of the calibration steps of the nozzle that calibrating installation carried out of the use first embodiment of the present invention.
Fig. 4 illustrate is the profile of the calibrating installation of the second embodiment of the present invention.
Fig. 5 illustrate is the profile of the calibrating installation of the third embodiment of the present invention.
Fig. 6 illustrate is the profile of the calibrating installation of the fourth embodiment of the present invention.
Fig. 7 illustrate is the flow chart of the calibration steps of the nozzle that calibrating installation carried out of the use fourth embodiment of the present invention.
Description of reference numerals
100: tool
102: top
104: the bottom
106: depression
108: the outside
110: inside
112: light emission/sensor
114: opening
116: light
200,300: semiconductor board
202,302: nozzle
204,304: pedestal
206,306: medium pore
208,308: protecting cover
210: the light reflecting material layer
310: treat the sensing material
312: the sensing body
D1, D2: the degree of depth
D1, d2: distance
R1, R4, R5, R6: radius
R2, R3: external diameter
S100、S102、S104、S106、S1008、S110、S200、S202、
S204: step numbers
The specific embodiment
Fig. 1 illustrate is the profile of the calibrating installation of the first embodiment of the present invention.
Please with reference to Fig. 1; Calibrating installation is applicable to be calibrated the nozzle 202 of semiconductor board 200; Semiconductor board 200 has pedestal 204, and pedestal 204 has medium pore 206, and the radius of medium pore 206 is R1; And nozzle 202 arranged outside have protecting cover 208, and wherein the external diameter of nozzle 202 is that the external diameter of R2 and protecting cover 208 is R3.Semiconductor board 200 for example is boards such as photoresistance coating machine platform and cleaning machine.In this first embodiment, protecting cover 208 for example is to protrude from nozzle 202 (about 1mm).
Calibrating installation comprises tool 100, and tool 100 comprises top 102 and bottom 104.Comprise depression 106 in the front on the top 102 of tool 100, depression 106 comprises outside 108 and inner 110.Outside 108 the degree of depth is D1, and outside 108 radius is R4, and wherein R4 is greater than R3, and value (R4-R3) is in permissible calibration error scope.Inner 110 the degree of depth is D2, and inner 110 radius is R5, and wherein D2 is greater than D1, and R5 is greater than R2, and value (R5-R2) is in permissible calibration error scope.Following at the restrictive condition of above-mentioned radius can make depression 106 can hold nozzle 202 and protecting cover 208, and can not cause the calibration error value to surpass permissible error range.
Fig. 2 A to Fig. 2 C illustrate is the flow process profile of the calibration steps of the nozzle that calibrating installation carried out of the use first embodiment of the present invention.Fig. 3 illustrate is the flow chart of the calibration steps of the nozzle that calibrating installation carried out of the use first embodiment of the present invention.
Please at first, carry out step S100 simultaneously with reference to Fig. 2 A and Fig. 3, the bottom 104 of tool 100 is inserted in the medium pore 206 of pedestal 204, so that tool 100 is fixed on the pedestal 204.Thus, the center of pedestal 204 capable of using is as the benchmark of calibration.
Then, carry out step S102, moving nozzle 202 inserts in the depression 106 on top 102 of tools 100 and with tool 100 nozzle 202 and protecting cover 208 and engages, and calibrates with X orientation and Y orientation to nozzle 202.
Please then, carry out step S104 simultaneously with reference to Fig. 2 B and Fig. 3, rising nozzle 202 makes protecting cover 208 leave depression 106.
Next, carry out step S106, measure between upper surface and the protecting cover 208 of tool 100 apart from d1, calibrate with Z orientation nozzle 202.Measuring the upper surface of tool 100 and the instrument apart from d1 between the protecting cover 208 for example is thickness gage or laser range finder.
Please afterwards, optionally carry out step S108 simultaneously with reference to Fig. 2 C and Fig. 3, continue rising nozzle 202.
Moreover, after carrying out step S108, can carry out step S110, measure between upper surface and the protecting cover 208 of tool 100 apart from d2, calibrate with Z orientation nozzle 202.Measuring the upper surface of tool 100 and the instrument apart from d2 between the protecting cover 208 for example is thickness gage or laser range finder.
In addition; In other embodiments; Tool 100, nozzle 202 and/or protecting cover 208 can comprise magnetisable material, that is have magnetisable material on tool 100, nozzle 202 and/or the protecting cover 208, or the own material of tool 100, nozzle 202 and/or protecting cover 208 is magnetic material.Thus, can be so that nozzle 202 and/or protecting cover 208 be attracted each other to a location and X orientation, Y orientation and Z orientation that can assisted calibration nozzle 202 through magnetic force with tool 100.
Can know by above-mentioned first embodiment, can be accurately the coordinate position of nozzle 202 be positioned, therefore can calibrate the mobile setting of nozzle 202 effectively, and then make nozzle 202 can on correct coordinate position, carry out operation through tool 100.
In addition, when in the tool 100, when comprising magnetisable material in nozzle 202 and/or the protecting cover 208, the carrying out of the calibrating operation of pilot jet 202 effectively.
Fig. 4 illustrate is the profile of the calibrating installation of the second embodiment of the present invention.Fig. 5 illustrate is the profile of the calibrating installation of the third embodiment of the present invention.Member identical with Fig. 2 among Fig. 4 and Fig. 5 uses identical label, and repeats no more.
Please be simultaneously with reference to Fig. 2, Fig. 4 and Fig. 5; The maximum difference of first embodiment that is introduced among second embodiment that is introduced among Fig. 4 and Fig. 2 is: the nozzle 202 among second embodiment and/or the surface of protecting cover 208 comprise light reflecting material layer 210; And calibrating installation also comprises light emission/sensor 112; And also comprise at least one opening 114 in the tool, opening 114 runs through top 102 and bottom 104.
In addition; The maximum difference of first embodiment that is introduced among the 3rd embodiment that is introduced among Fig. 5 and Fig. 2 is: the nozzle 202 among the 3rd embodiment and/or the surface of protecting cover 208 comprise light reflecting material layer 210; And calibrating installation also comprises light emission/sensor 112, and the material of tool 100 is a light transmissive material.
Calibration steps about nozzle 202; The calibration steps of first embodiment, second embodiment and the 3rd embodiment is roughly the same; Its difference is: second embodiment and the 3rd embodiment have light emission/sensor 112 and light reflecting material layer 210, can be in order to X orientation, Y orientation and the Z orientation of assisted calibration nozzle 202.
The method of the light emission/sensor 112 of second embodiment and the 3rd embodiment and light reflecting material layer 210 assisted calibration nozzle 202 is: utilize light emission/sensor 112 emission light 116 earlier, light 116 passes tool 100 and arrives light reflecting material layer 210; The light 116 that utilizes light emission/sensor 212 sensings to be reflected by light reflecting material layer 210 again is with X orientation, Y orientation and the Z orientation of calibration nozzle 202.
Fig. 6 illustrate is the profile of the calibrating installation of the fourth embodiment of the present invention.Fig. 7 illustrate is the flow chart of the calibration steps of the nozzle that calibrating installation carried out of the use fourth embodiment of the present invention.
Please with reference to Fig. 6, the calibration steps of the 4th embodiment is applicable to be calibrated the nozzle 302 of semiconductor board 300
Please at first, carry out step S200 simultaneously with reference to Fig. 6 and Fig. 7; Semiconductor board 300 is provided, and semiconductor board has pedestal 304, and pedestal 304 has medium pore 306; And nozzle 302 arranged outside have protecting cover 308, and nozzle 302 and/or protecting cover 308 comprise and treat sensing material 310.Semiconductor board 300 for example is boards such as photoresistance coating machine platform and cleaning machine.
In the present embodiment, treat that sensing material 310 is is that example describes with layer of reflective material or the magnetic substance layer of coating nozzle 302 and/or protecting cover 308.In other embodiments, treat that sensing material 310 can be to be scattered in nozzle 302 and/or the protecting cover 308, that is the material of nozzle 302 and/or protecting cover 308 for example is reflecting material or magnetic material for treating sensing material 310.
Then, carry out step S202, calibrating installation is provided, calibrating installation comprises sensing body 312, and sensing body 312 is positioned at medium pore 306 belows of pedestal 304.When treating sensing material 310 for layer of reflective material, sensing body 312 for example is a light emission/sensor.In addition, when treating sensing material 310 for magnetic substance layer, sensing body 312 comprises magnetisable material, and more can comprise Magnetic Sensor in the sensing body 312.
Then, carry out step S204, moving nozzle 302 and utilize sensing body 312 sensing nozzles 302 and/or protecting cover 308 treat sensing material 310, with X orientation, Y orientation and the Z orientation of calibration nozzle 302.
When treating sensing material 310 for layer of reflective material, sensing body 312 is light emission/sensor, and the calibration steps of nozzle 302 is: utilize sensing body 312 emission light earlier, light passes medium pore 306 arrival and treats sensing material 310; Utilize sensing body 312 sensings by the light of treating that sensing material 310 is reflected again, with X orientation, Y orientation and the Z orientation of calibration nozzle 302.
When treating sensing material 310 for magnetic substance layer; Have magnetisable material in the sensing body 312 and more can have Magnetic Sensor; The calibration steps of nozzle 302 is: through magnetic force nozzle 302 and/or protecting cover 308 are attracted each other to a location with sensing body 312, with X orientation, Y orientation and the Z orientation of calibration nozzle 302.In addition, see through the measurement of Magnetic Sensor for magnetic force, but with X orientation, Y orientation and the Z orientation of assisted calibration nozzle 302.
In sum, the present invention has advantage at least:
1. utilize the calibrating installation of nozzle proposed by the invention can accurately orient the coordinate position of nozzle;
2. the calibration steps of nozzle proposed by the invention can be calibrated the mobile setting of nozzle effectively; With
3. the calibration steps through nozzle proposed by the invention can make nozzle on correct coordinate position, carry out operation.
Though the present invention discloses as above with preferred embodiment; Right its is not in order to limit the present invention; Any those skilled in the art; Do not breaking away from the spirit and scope of the present invention, when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking appended the claim person of defining.
Claims (15)
1. the calibrating installation of a nozzle is applicable to a nozzle of semiconductor board is calibrated that this semiconductor board has a pedestal; This pedestal has a medium pore; The radius of this medium pore is R1, and this nozzle arranged outside has a protecting cover, and wherein the external diameter of this nozzle is that the external diameter of R2 and this protecting cover is R3; This calibrating installation comprises a tool, and this tool comprises:
One top comprises a depression in the front on this top, and this depression comprises:
One outside, this outside degree of depth is D1, and radius that should the outside is R4, wherein R4 is greater than R3, and value (R4-R3) is in permissible calibration error scope; And
One inside, this inner degree of depth is D2, and radius that should inside is R5, wherein D2 is greater than D1, and R5 is greater than R2, and value (R5-R2) is in permissible calibration error scope; And
One bottom is connected in the back side on this top, and in order to this tool is fixed in the medium pore of this pedestal, the radius of this bottom is R6, and R6 is less than R1, and value (R1-R6) is in permissible calibration error scope.
2. calibrating installation as claimed in claim 1, wherein this tool comprises at least one opening, this at least one opening runs through this top and this bottom.
3. calibrating installation as claimed in claim 2, wherein the surface of this nozzle and/or this protecting cover comprises a light reflecting material layer.
4. calibrating installation as claimed in claim 3 also comprises a light emission/sensor, is disposed at this medium pore below, in order to launching a light, and this light of being reflected by this light reflecting material layer of sensing.
5. calibrating installation as claimed in claim 1, wherein the material of this tool comprises a light transmissive material.
6. calibrating installation as claimed in claim 5, wherein the surface of this nozzle and/or this protecting cover comprises a light reflecting material layer.
7. calibrating installation as claimed in claim 6 also comprises a light emission/sensor, is disposed at this medium pore below, and this light emission/sensor is in order to launching a light, and this light of being reflected by this light reflecting material layer of sensing.
8. calibrating installation as claimed in claim 1, wherein this tool comprises a magnetisable material.
9. calibrating installation as claimed in claim 8, wherein this nozzle and/or this protecting cover comprise this magnetisable material, make this nozzle and/or this protecting cover and this tool attract each other through magnetic force.
10. the calibration steps of a nozzle uses calibrating installation as claimed in claim 1 that this nozzle is calibrated, and this calibration steps comprises:
This bottom of this tool is inserted in this medium pore of this pedestal, so that this tool is fixed on this pedestal;
Move this nozzle, make in this depression on this nozzle and this top of this this tool of protecting cover insertion and to engage, calibrate with X orientation and Y orientation to this nozzle with this tool;
This nozzle that raises makes this protecting cover leave this depression; And
Measure the upper surface of this tool and the distance between this protecting cover, calibrate with Z orientation to this nozzle.
11. the calibration steps of nozzle as claimed in claim 10 also comprises:
Continue this nozzle that raises; And
Measure the upper surface of this tool and the distance between this protecting cover, calibrate with Z orientation to this nozzle.
12. the calibration steps of nozzle as claimed in claim 10; Wherein when this tool comprised that the surface of at least one opening, this nozzle and/or this protecting cover that run through this top and this bottom comprises that a light reflecting material layer and this calibrating installation also comprise a light emission/sensor that is disposed at this medium pore below, this calibration steps also comprised:
Utilize this light emission/sensor emission one light to this light reflecting material layer; And
This light that utilizes this light emission/sensor sensing to be reflected by this light reflecting material layer is with X orientation, Y orientation and the Z orientation of calibrating this nozzle.
13. the calibration steps of nozzle as claimed in claim 10; Wherein when the material of this tool comprised that the surface of a light transmissive material, this nozzle and/or this protecting cover comprises that a light reflecting material layer and this calibrating installation also comprise a light emission/sensor that is disposed at this medium pore below, this calibration steps also comprised:
Utilize this light emission/sensor emission one light to this light reflecting material layer; And
This light that utilizes this light emission/sensor sensing to be reflected by this light reflecting material layer is with X orientation, Y orientation and the Z orientation of calibrating this nozzle.
14. the calibration steps of nozzle as claimed in claim 10, wherein when this tool comprised that a magnetisable material and this nozzle and/or this protecting cover comprise this magnetisable material, this calibration steps also comprised:
Through magnetic force this nozzle and/or this protecting cover and this tool are attracted each other, with X orientation, Y orientation and the Z orientation of calibrating this nozzle.
15. the calibration steps of nozzle as claimed in claim 10 is wherein measured the upper surface of this tool and the instrument of the distance between this protecting cover and is comprised thickness gage or laser range finder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100054557A CN101502822B (en) | 2008-02-04 | 2008-02-04 | Nozzle calibration device and nozzle calibration method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100054557A CN101502822B (en) | 2008-02-04 | 2008-02-04 | Nozzle calibration device and nozzle calibration method |
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| Publication Number | Publication Date |
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| CN101502822A CN101502822A (en) | 2009-08-12 |
| CN101502822B true CN101502822B (en) | 2012-05-30 |
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| CN2008100054557A Active CN101502822B (en) | 2008-02-04 | 2008-02-04 | Nozzle calibration device and nozzle calibration method |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| FR2959427B1 (en) * | 2010-05-03 | 2012-04-27 | Peugeot Citroen Automobiles Sa | DEVICE AND METHOD FOR CENTERING EXTRUSION NOZZLE |
| CN103849873A (en) * | 2012-11-30 | 2014-06-11 | 深南电路有限公司 | Residual copper removal method and device |
| CN104567665B (en) * | 2013-10-29 | 2017-12-22 | 中芯国际集成电路制造(上海)有限公司 | The detection method of nozzle in control wafer and coating developing machine |
| CN106449467A (en) * | 2015-08-13 | 2017-02-22 | 辛耘企业股份有限公司 | Pipeline outlet indicating device and substrate processing device |
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|---|---|---|---|---|
| US5976256A (en) * | 1996-11-27 | 1999-11-02 | Tokyo Electron Limited | Film coating apparatus |
| CN1610614A (en) * | 2002-09-30 | 2005-04-27 | 索尼株式会社 | Electronic-component alignment method and apparatus therefor |
| CN1651155A (en) * | 2004-02-05 | 2005-08-10 | 东京毅力科创株式会社 | Device and method for forming coating film |
| CN1757439A (en) * | 2004-10-07 | 2006-04-12 | 大日本网目版制造株式会社 | Substrate processing device and method |
-
2008
- 2008-02-04 CN CN2008100054557A patent/CN101502822B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5976256A (en) * | 1996-11-27 | 1999-11-02 | Tokyo Electron Limited | Film coating apparatus |
| CN1610614A (en) * | 2002-09-30 | 2005-04-27 | 索尼株式会社 | Electronic-component alignment method and apparatus therefor |
| CN1651155A (en) * | 2004-02-05 | 2005-08-10 | 东京毅力科创株式会社 | Device and method for forming coating film |
| CN1757439A (en) * | 2004-10-07 | 2006-04-12 | 大日本网目版制造株式会社 | Substrate processing device and method |
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| CN101502822A (en) | 2009-08-12 |
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