CN101430067A - Liquid crystal display device - Google Patents
Liquid crystal display device Download PDFInfo
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- CN101430067A CN101430067A CNA2008101746019A CN200810174601A CN101430067A CN 101430067 A CN101430067 A CN 101430067A CN A2008101746019 A CNA2008101746019 A CN A2008101746019A CN 200810174601 A CN200810174601 A CN 200810174601A CN 101430067 A CN101430067 A CN 101430067A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
The present invention provides a liquid crystal display device and a light source device, wherein the light source device is provided with a backlight source and a heat dissipation substrate for transferring the heat from the backlight source. The backlight source comprises the following components: a light conducting plate, an LED light source configured on the end plane of light conducting plate; and an installation substrate which is installed with the LED light source and has insulation property. The heat-conducting adhesive is provided between the installation substrate and the heat dissipation substrate.
Description
The application is that application number is " 200510081483.3 ", and the applying date is on June 29th, 2005, and denomination of invention is divided an application for the application of " liquid crystal indicator ".
Technical field
The present invention relates to a kind of liquid crystal indicator, relate in particular to and utilize the liquid crystal indicator of light emitting diode (hereinafter to be referred as LED) as light source with LCDs and backlight.
Background technology
In the past, in the display mode of liquid crystal indicator, the liquid crystal indicator of transmission-type or Semitransmissive, its structure is for the configuration LCDs and the backlight of transmitted light is provided to LCDs.
Usually, backlight is made up of light source and LGP, can use the small fluorescent pipe that is known as CCFL (cold-cathode tube) as light source.And, allow side's interarea of LGP according to facing mutually with the corresponding mode in the viewing area of LCDs, the interarea (being called the outside) at this side interarea and opposition side forms and makes the scattering part of light in face side scattering and reflection.
The CCFL light source is configured in the end face of LGP, and the CCFL light from the surface feeding sputtering of LGP arrives in the LGP, in the outer sidescattering and the reflection of LGP, launches to LCDs from the surface of LGP.Like this, be transformed into uniform flat light source, with regard to the light source that can be used as liquid crystal indicator and be utilized from linear light sorurce.
But this CCFL light source is enclosed Hg (mercury) advance in the discharge tube, and the fluorophor up conversion that will shine the CCFL tube wall from the ultraviolet ray that mercury discharged because of discharge excitation becomes visible light.
For this reason, if consider environmental problem, then, use alternative source of light and pursue for suppressing the use of harmful mercury.
And, for lighting CCFL, need the high voltagehigh frequency lighting circuit, owing to produce high frequency noise, not only need to tackle in addition noise problem, also exist and be difficult to the problem lighted under the low temperature.
On the other hand, as new light source, researched and developed light-emitting diode (LED) module (led light source) that a kind of utilization holds the light-emitting diode chip for backlight unit with spot light feature backlight as light source.
Along with reduction and the raising of luminous efficiency and the restriction on the environment of price, utilize the backlight of this led light source, also obtain gradually having popularized as the backlight of LCDs.
Simultaneously, along with the high brightnessization of liquid crystal indicator, the maximization of viewing area, the demand that as seen possesses a plurality of led light sources is also more and more higher.
Therefore, become the LED-backlit source of adopting in high brightness, the large-scale LCDs, need and to be transformed into the area source (converting the light source of uniform light at the emitting surface of LGP to) of uniformly light-emitting as the led light source of spot light.Therefore, need control material, the structure of the scattering part outside the LGP, the directionality of cooperated with LED light source disposes led light source in the optimum position simultaneously.
As one of problem, the problem of existence be the heating because of led light source make led light source with and environment temperature rise, cause the luminous efficiency of led light source and life-span low.
By nearest improvement, the luminous efficiency of led light source is improved, and under the As-Is, luminous efficiency is greatly about 10% degree, and remaining 90% be used as heat and discharge.
In with the backlight of LED as light source, the heat that is sent is accumulated in LED and installs on the substrate of LED, along with the rising of LED and its peripheral temperature, can cause the luminous efficiency of LED self to reduce.
And, infer lifetime data (brightness half-life) as shown in figure 25 during the forward current IF=20mA of top view pattern LED about the life-span.As can be seen from Figure 25, environment temperature is in the time of 25 ℃, and the life-span is about 12000 hours, relatively, only has an appointment 5500 hours in the time of 50 ℃, and along with the rising of the peripheral temperature of LED, the life-span can shorten.
Also have the heat that produces among the LED, the reason of wiring equivalent damage that also can become LED or the installation base plate of this LED is installed.
And for realizing the high brightnessization of backlight, if increase the installation quantity of LED, then its caloric value increases, so further can not ignore more.
Patent documentation 1: the spy opens communique 2002-No. 75038;
Patent documentation 2: the spy opens communique 2003-No. 281924.
Summary of the invention
The object of the present invention is to provide a kind of liquid crystal indicator with LED-backlit source, by reducing the heat of accumulating in the installation base plate that led light source is installed, the temperature rising of led light source is diminished, the luminous efficiency that can suppress led light source reduces, prevent the damage of light-emitting diode chip for backlight unit simultaneously, can the long-life and carry out liquid crystal display brightly.
Light supply apparatus of the present invention has backlight and transmits heat-radiating substrate from the heat of this backlight, and described backlight comprises: LGP, at the led light source of the end face configuration of this LGP and the installation base plate of this led light source being installed and being had insulating properties; Between described installation base plate and described heat-radiating substrate, get involved the adhesive of conduction heat.
Another kind of light supply apparatus of the present invention, have backlight and transmit heat-radiating substrate from the heat of this backlight, described backlight comprises: LGP, at the led light source of the end face configuration of this LGP and the installation base plate of this led light source being installed and being had insulating properties; Between described installation base plate and described heat-radiating substrate, get involved the splicing tape of conduction heat.
Liquid crystal indicator of the present invention comprises: LCDs, and it gets involved liquid crystal having between a pair of substrate of show electrode and oriented film, constitutes the viewing area of being made up of a plurality of pixel regions; Backlight, it contains and is configured in described LCDs one side's substrate outside and the LGP corresponding with described viewing area and at the led light source array of the end face configuration of this LGP; And heat-radiating substrate.Described led light source array contains installation base plate and installs a plurality of and hold the LED container of light-emitting diode chip for backlight unit in the LED of this installation base plate installed surface configuration, and gets involved the heat conductivity parts between described installation base plate and described heat-radiating substrate.
In this liquid crystal indicator, between installation base plate and heat-radiating substrate that the led light source that constitutes the led light source array is installed, by getting involved the heat conductivity parts, just can conduct heat, and spread heat radiation expeditiously to the outside from installation base plate high efficiency between heat-radiating substrate.
Therefore, the installation base plate by led light source reduce to be installed accumulate heat, the temperature that reduces led light source rises, and just can suppress the luminous efficiency reduction of led light source.Its result can provide a kind of led light source damage of preventing, and bright and liquid crystal indicator that long-life ground carries out liquid crystal display.
Preferred described heat conductivity parts are made up of the high heat conductivity thin slice of elasticity.
When crimping heat conductivity parts, elasticity according to the heat conductivity thin slice, make it trickle concavo-convex corresponding with the contact-making surface of installation base plate and heat-radiating substrate, the heat conductivity thin slice is coincide with it, get rid of the air layer of contact-making surface, and can conduct heat from led light source to heat-radiating substrate expeditiously.
Preferred described heat conductivity thin slice, bonding by adhesive and heat-radiating substrate that flowability is high.
By between installation base plate and heat-radiating substrate, getting involved mobile high adhesive, just can between installation base plate and heat-radiating substrate, carry out the heat conduction expeditiously.Like this, just can in resin, there be bubble, thereby hinders the heat conduction as electroconductive resin in the past.And, in the supply operation of adhesive, also can utilize capillarity that adhesive simply and reliably is provided, the LED container can be securely fixed on the installation base plate.
Described heat conductivity parts also can be close to by flowability low fluid and heat-radiating substrate.
By adopting mobile low fluid, trickle concavo-convex place in the contact-making surface existence of the contact-making surface of the back side of installation base plate (face that the LED installed surface is opposite) and heat conductivity parts and heat conductivity parts and heat-radiating substrate, there is mobile low fluid to flow into, improves between installation base plate and the heat conductivity parts, the goodness of fit between heat conductivity parts and the heat-radiating substrate.Therefore, can the deaeration layer, improve the radiating efficiency from the installation base plate to the heat-radiating substrate.
Can adopt following formation: the installation base plate of described led light source array, the interarea that is configured in described relatively LGP is vertical in fact direction, described LED container, by having light-emitting area that light that described light-emitting diode chip for backlight unit is emitted sends and constitute, the back side of described LED container is installed on the described installation base plate as the LED installed surface with the back side of this light-emitting area subtend and the basket shape LED container of 4 sides.
This installation base plate is configured to the vertical in fact structure of described relatively LGP, concrete as Fig. 1, Figure 11, Figure 12, Figure 15, shown in Figure 180.
In this structure, described LED container, because the back side of described LED container is installed on the described installation base plate as the LED installed surface, so described installation base plate, its light incident direction that is configured to described relatively LGP is vertical substantially direction.
Described heat-radiating substrate also can have at least 2 faces that bend to L word shape, and each face is configured to face mutually with the back side of described installation base plate and the outside of described LGP.
According to such configuration, in the cross section corresponding with the outside of described LGP is on the heat-radiating substrate that disposed of L word shape, by the heat conductivity parts, just can the heat that be accumulated on the installation base plate be conducted to heat-radiating substrate effectively from the back side one side of installation base plate.
Described heat conductivity parts also can comprise: the 1st heat conductivity parts, and it covers the back side of the LED installed surface of described installation base plate; With the 2nd heat conductivity parts, it allows the light-emitting area of described at least LED container expose, and covers the LED installed surface and the described LED container of described installation base plate.
Like this, the heat that will produce by led light source, wherein the heat of transmitting to installation base plate from the LED container is transmitted to the 1st, the 2nd heat conductivity parts, can be expeditiously to the heat-radiating substrate release heat.And, owing in the 2nd heat conductivity parts, form and make the peristome that the mounted LEDs container exposes on installation base plate, so the leaded light till can not hindering from the LED container to LGP.Should " the 1st heat conductivity parts " be equivalent to the heat conductivity elastomeric element 31 in the aftermentioned illustration, " the 2nd heat-conduction component " is equivalent to the heat conductivity elastomeric element 20,32,34 in the aftermentioned illustration.
If described the 2nd heat conductivity parts are configured to be close to the end face of described LGP and the LED installed surface of installation base plate, then can make heat, effectively become separated in flight by LGP one side by led light source LED installed surface one side that produce, that be accumulated in installation base plate.Structure that should " the 2nd heat conductivity parts, be close to the LED installed surface of the end face of described LGP and installation base plate and dispose ", Figure 12, Figure 18 explanation are adopted in the back.
Described the 1st heat conductivity parts and described the 2nd heat conductivity parts also can being integral.These incorporate heat conductivity parts, back in Figure 15～Figure 18 as heat conductivity elastomeric element 32 illustrations.
Liquid crystal indicator of the present invention also can be configured in the installation base plate of described led light source array the parallel in fact direction of interarea of described relatively LGP, and described LED container is by having the light-emitting area that light that described light-emitting diode chip for backlight unit is emitted sends; Constitute with basket shape LED container, 1 in 4 sides of described LED container is installed on the described installation base plate as the LED installed surface with the back side of this light-emitting area subtend and 4 sides.
In this liquid crystal indicator, with side type LED container, that is, relatively the LED installed surface of installation base plate is that 1 side of quadrature is installed on the installation base plate as the LED container of light-emitting area, then, makes the inside of installation base plate be close to heat-radiating substrate or basket.
In this liquid crystal indicator, be plane on the described heat-radiating substrate substance, be configured to face mutually with the back side of described installation base plate and the outside of described LGP.This structure, aftermentioned are as shown in figure 19.
Described heat conductivity parts allow the light-emitting area of described LED container expose at least, cover the side of the LED installed surface and the described LED container of described installation base plate.In this case, the heat conductivity parts of getting involved between described installation base plate and described heat-radiating substrate are as heat conductivity elastomeric element 34 illustrations.
Liquid crystal indicator of the present invention comprises: LCDs, and it gets involved liquid crystal having between a pair of substrate of show electrode and oriented film, constitutes the viewing area of being made up of a plurality of pixel regions; Backlight, it contains and is configured in described LCDs one side's substrate outside and the LGP corresponding with described viewing area and at the led light source array of the end face configuration of this LGP; And heat-radiating substrate.Described led light source array contains installation base plate and installs a plurality of and hold the LED container of light-emitting diode chip for backlight unit in the LED of this installation base plate installed surface configuration, described installation base plate, according to allowing the light-emitting area of described LED container expose at least, and cover its LED installed surface and the back side by the heat conductivity parts, and described heat-conduction component contacts with described heat-radiating substrate or bonding.
In this liquid crystal indicator, the LED installed surface of installation base plate and the back side thereof are covered by incorporate heat conductivity parts.Therefore, by the heat that the LED container produces,, dispel the heat by heat-radiating substrate from the two sides of installation base plate again by the heat conductivity parts.
Described heat-conduction component has the shortcoming part, and its cross section is
(U) word shape is used to make the light-emitting area of described LED container to expose.
In this structure, the strip installation base plate of led light source array is installed, is by the cross section that 3 faces in 4 faces (1 pair of interarea, the end face of 1 pair of long axis direction) of the long axis direction of installation base plate are covered
(U) the heat conductivity parts of word shape and covering.With the cross section of this LED installed surface and back side covering thereof be
(U) the heat conductivity parts of word shape are equivalent to Figure 15, heat conductivity elastomeric element 32 shown in Figure 180.Owing to be in the cross section
(U) face of the heat conductivity parts of word shape, therefore the lack part that formation is exposed the light-emitting area of LED container can not hinder and will offer LGP reliably from the light that the LED container sends.
Preferred described heat conductivity parts are made of the rubber-like material.
According to the elasticity of heat conductivity parts, trickle concavo-convex corresponding with the contact-making surface of installation base plate and heat-radiating substrate by crimping heat conductivity parts, can make the heat conductivity thin slice coincide with it, gets rid of the air layer of contact-making surface.And, covering by described 3 faces by making installation base plate, the impact absorption aspect also can be fine.
Preferred described heat conductivity parts, bonding by adhesive and heat-radiating substrate that flowability is high.By between installation base plate and heat-radiating substrate, getting involved mobile high adhesive, just can between installation base plate and heat-radiating substrate, efficiently carry out the heat conduction.
Described heat conductivity parts also can be close to by flowability low fluid and heat-radiating substrate.By adopting mobile low fluid, the trickle concavo-convex place that the contact-making surface of the contact-making surface of the back side of installation base plate and heat conductivity parts and heat conductivity parts and heat-radiating substrate is existed, there is mobile low fluid to enter, improve between installation base plate and the heat conductivity parts goodness of fit between heat conductivity parts and the heat-radiating substrate.Therefore, can the deaeration layer, improve from the radiating efficiency of installation base plate to heat-radiating substrate.
According to the above, the effect of liquid crystal indicator of the present invention is, is maximized in the viewing area of LCDs 1, the shape of LGP 3 maximizes, sufficient light is provided for the LGP 3 that maximizes, carries many more led light sources 2 on installation base plate 21, then effect is good more.
Above-mentioned or other other advantages, feature and effect of the present invention just can be understood by the embodiment of explanation the following stated with reference to accompanying drawing.
Description of drawings
Fig. 1 represents the cutaway view of the liquid crystal indicator of an embodiment of the present invention.
Fig. 2 represents the brief strabismus map of liquid crystal indicator of the present invention.
Fig. 3 represents the structure cutaway view of the LCDs that adopts in the liquid crystal indicator of the present invention.
Fig. 4 represents to see from LED installed surface one side the brief strabismus map of the installation base plate of led light source.
Fig. 5 represents that from the back side one side sees the brief strabismus map of the installation base plate of led light source.
Fig. 6 represents the general profile chart of the installation base plate of led light source of the present invention.
The amplification view of the A part of Fig. 7 presentation graphs 6.
Fig. 8 is illustrated in the brief strabismus map that carries the led light source array of a plurality of led light sources on the installation base plate.
Fig. 9 is expressed as the schematic diagram of the structure of led light source.
Figure 10 is expressed as the oblique view of L font heat conductivity parts.
Figure 11 represents the general profile chart of the liquid crystal indicator of another embodiment of the present invention.
Figure 12 represents the general profile chart of the liquid crystal indicator of the another embodiment of the present invention.
Figure 13 represents the oblique view of the 2nd heat conductivity parts.
Figure 14 represents to adopt the summary exploded perspective view of the led light source array of the 2nd heat conductivity parts.
Figure 15 represents the general profile chart of the liquid crystal indicator of the another embodiment of the present invention.
Figure 16 (a)～(c) represents that respectively the cross section of adopting in the liquid crystal indicator of Figure 15 is
(U) oblique view of the heat conductivity parts of word shape.
Figure 17 (a)～(c) represents that respectively the cross section is
(U) oblique view of the metal shell that adopts in the heat conductivity parts of word shape.
Figure 18 represents the general profile chart of the liquid crystal indicator of the another embodiment of the present invention.
Figure 19 represents the general profile chart of the liquid crystal indicator of the another embodiment of the present invention.
Figure 20 represents the brief strabismus map of the led light source array that adopts in the liquid crystal indicator of Figure 19.
Figure 21 represents the oblique view of the heat conductivity parts that adopt in the liquid crystal indicator of Figure 19.
Figure 22 is the general profile chart of the embodiment of expression installation base plate.
Figure 23 is the general profile chart of another embodiment of expression installation base plate.
Figure 24 is the brief strabismus map of led light source array.
Figure 25 is the environment temperature of expression led chip and the performance plot of life relation.
The specific embodiment
(overall structure)
Fig. 1 is the cutaway view of liquid crystal indicator of the present invention, and Fig. 2 is the stereogram of liquid crystal indicator.
Fig. 3 is the cutaway view of the LCDs that adopts in the liquid crystal indicator of the present invention.
Liquid crystal indicator of the present invention, it is mainly by LCDs 1; The backlight BL that contains LGP 3 and led light source 2; Constitute with the upside basket 4 that holds both, downside basket 5.
(LCDs)
And, at the inner face of downside transparency carrier 11, form show electrode 15, oriented film etc.And,, also form show electrode 16, oriented film etc. at the inner face of upside transparency carrier 12.
By at the show electrode 15 of this downside transparency carrier 11 and the show electrode 16 of upside transparency carrier 12, form the display pixel area of rectangular arrangement.
And, on the transparency carrier 12 of downside transparency carrier 11 and upside,, dispose Polarizer, phase-contrast film, dispose the scattering film as required though omitted among the figure.
In addition, be under the situation of transmissive liquid crystal display device at this liquid crystal indicator, show electrode all is made of transparency electrode, and display pixel area makes the light from backlight BL penetrate from display surface one side.
Under situation,, be arranged side by side: the photo-emission part that a part is made of reflecting metallic film in display pixel area as transflective liquid crystal display device; A part makes the light transmission department of the energy transmissive of backlight BL.
In this transflective liquid crystal display device, make from the exterior light of display surface one side incident, the photo-emission part by pixel region reflects, and returns display surface one side, the light that makes backlight BL simultaneously through light transmission department by transmission.
Like this, under the situation that light is stronger, can show outside, when light is more weak outside, can show by the transmission-type pattern by the reflection-type pattern.
And, for realizing colored the demonstration, can colour filter be set at either party pixel region of downside transparency carrier 11 or upside transparency carrier 12.
Also have, in the liquid crystal indicator of the present invention, can be at downside transparency carrier 11, perhaps any one pixel region of upside transparency carrier 12 forms switch element, and the demonstration in each pixel region is controlled.
In addition, either party substrate in upside transparency carrier 12 or the downside transparency carrier 11, for example in the periphery of the viewing area of upside transparency carrier 12, the wiring pattern that is connected with show electrode 15 or above-mentioned switch element can be set, the drive circuit 19 that given signal, given voltage are provided to this wiring pattern perhaps is set; The input terminal that is connected with outside drive circuit perhaps is set.
In addition, do not form the substrate of wiring pattern one side, for example the show electrode of downside transparency carrier 11 can be connected with above-mentioned wiring pattern by the electroconductive stuffing of the configuration of the periphery between two electrodes 11,12.
The material of downside transparency carrier 11 or upside transparency carrier 12 for example has glass, light transmission plastics etc. Show electrode 15,16 is by forming as the ITO of transparent conductive material or tin oxide etc.And the reflecting metallic film that constitutes photo-emission part is made of aluminium or titanium etc.Also have, the polyimide resin of oriented film after by milled processed constitutes.Be provided with under the situation of colour filter, in resin, adding dyestuff or pigment etc., forming the versicolor filter of red, green, blue at each pixel region.And then, can be between each filter or pixel region around in, because of the shading purpose adopts black resin.
Such downside transparency carrier 11 and upside transparency carrier 12 are pasted and crimping by sealing 14, by the liquid crystal material that a part of opening injection of sealing portion 14 is made up of nematic crystal, then, seal this inlet.
When fitting, show electrode 15,16 both sides of configuration in two transparency carriers 11,12, both are quadrature.The part of reporting to the leadship after accomplishing a task of show electrode is each pixel region, this pixel region set becoming together viewing area.
Like this, just constituted LCDs 1.
(backlight)
In the outside (being downside among the figure) of the downside transparency carrier 1 of this LCDs 1, configuration backlight BL.
Backlight BL as shown in Figure 1, has led light source 2, LGP 3, lens 3a, diffusion sheet 3b, reflector plate 3c, with the installation base plate 21 of the strip of LGP 3 configured in parallel, as the heat conductivity thin slice 31 of heat conductivity parts.
Preferred this heat conductivity thin slice 31 is formed by rubber-like parts such as rubber.Therefore, below be called " heat conductivity flexure strip 31 ".
The structure that replaces reflector plate 3c can be formed for making the ditch of the direct scattering of light and reflection in the outside of LGP 3c, and then, also can be the plated film that formation has scattering and reflection function.
And this reflector plate 3c can also be at 4 end faces of LGP 3, and 3 end faces that remove the end face of configure led light source 2 form.
Led light source 2 as Fig. 4～shown in Figure 8, is installed on the installation base plate 21.
Led light source 2, shown in the cutaway view of Fig. 9, the LED container 23b that its formation comprises led chip 23a and is made up of heat stable resin material or ceramic material etc., this led chip 23a has illuminating part, positive electrode and the negative electrode of being made up of semi-conducting material.
The LED container 23b of this led light source 2 has light-emitting area; With the back side opposite with this light-emitting area; 4 sides, the light-emitting area of LED container 23b as shown in Figure 1, is configured to face with the end face portion of LGP 3.
In the light-emitting area of LED container 23b, form mortar shape cavity 23d, dispose, hold led chip 23a in the bottom of this cavity 23d.
Positive electrode, the negative electrode of this led chip 23a are connected with the portion of terminal 23c that outside beyond the light-emitting area of LED container 23b forms.
In addition, the internal face at mortar shape cavity also can apply reflective coating.And, in cavity, can also fill translucent resin to bury led chip 23a underground.
The led light source 2 of this spline structure as shown in Figure 8, on ruler shape installation base plate 21, is installed a plurality of these led light sources 2 with given interval.A plurality of led light sources 2 of An Zhuaning and installation base plate 21 are called the led light source array like this.
At the LED of this installation base plate 21 installed surface, be formed for installing led light source 2 installation metal film 22, to led chip 23a provide given drive current metal driving wiring 24, make metal driving wiring 24 metal film patterns that separate 25.
And, the face of facing mutually with the LED installed surface, be substrate back, as shown in Figure 5, almost whole form heat transmission metal film 26.
And,, form to make a plurality of metallic vias conductors 27 that metal film 22 is connected with heat transmission metal film 26 be installed at the thickness direction of installation base plate 21.
Also have, the portion of terminal 23c of led light source 2 is connected with metal driving wiring 24 by conduction bond materials such as scolding tin.
Each installs metal film 22, metal driving wiring 24, metal film pattern 25, heat transmission metal film 26, metallic vias conductor 27, is that metal material (copper product or copper facing) etc. forms by copper or copper.The part of metal driving wiring 24 or metal film 22, heat transmission metal film 26, metallic vias conductor 27 are installed especially wherein, shown in Figure 7 as after the a-quadrant that circle surrounded among Fig. 6 is amplified covered by soldering-tin layer 28.
And,, covered by resin etchant resist 29 on the surface of metal film pattern 25.If this etchant resist 29 then can effectively offer LGP 3 with the light that leaks from led light source 2 for white.
(heat conductivity parts)
Then, describe about the structure that will discharge by the heat that led light source 2 produces.
When the backlight BL that makes liquid crystal indicator drives (led light source 2 is lighted), when it is luminous, also can produce heat.
The heat that led chip 23a in the led light source 2 is produced needs to conduct to the parts with wideer area by LED container 23b, installation base plate 21, and heat is discharged to the external world from these parts.
As this heat dissipating method, in the present embodiment, have heat-radiating substrate 5 as the metal parts of the tortuous L of one-tenth word shape, the outside of LGP 3 and the face (back side) of the heat transmission metal film 26 that forms installation base plate 21 are faced mutually.
At the flat area of heat-radiating substrate 5, i.e. the zone of facing with the outside of LGP 3 for increasing and the contacting of the external world, can form the heat conductivity hole as required.
And the zone of heat-radiating substrate 5 tortuous one-tenth L word shapes as shown in Figure 1, by heat conductivity flexure strip 31, combines with the heat transmission metal film 26 of installation base plate 21 closely.
Figure 10 represents the oblique view of this L word shape heat conductivity flexure strip 31.
Heat conductivity flexure strip 31, forming the cross section is L word shape, and the back side of installation base plate 21 is contacted with lower surface with the rectangular installation base plate 21 of this face.
This cross section is that outside and the cross section of the heat conductivity flexure strip 31 of L word shape is that the heat dissipation metal substrate 5 of L word shape carries out face and contacts.
Heat conductivity flexure strip 31 is made of materials such as lamellar heat-conductive characteristic better elastic rubber, and it is shaped as writing board shape.
Because this heat conductivity flexure strip 31 has elasticity, the surperficial trickle concaveconvex shape of installation base plate 21 and heat-radiating substrate 5 is absorbed, and installation base plate 21 and heat conductivity flexure strip 31 and heat-radiating substrate 5 are not almost got involved air layer and carried out face reliably and contact.According to such structure, the heat that produces by led light source 2, from LED container 23b conduction to installation base plate 21, and by heat conductivity flexure strip 31 to the stable heat radiation of heat-radiating substrate 5.Like this, the heat that is produced by led chip 23a can arrive heat-radiating substrate 5, and its result just can reduce led light source 2 and peripheral temperature thereof.
Especially, because heat conductivity flexure strip 31 its formation cross sections are L word shape, and because the heat of not only sending from the back side of installation base plate 21, the heat of sending from the lower end of installation base plate 21 also can be scattered by heat conductivity flexure strip 31 in addition, therefore can high efficiency with the heat of accumulating in the installation base plate 21, pass to heat-radiating substrate 5.
Here, as shown in figure 10,, thicker a little than the interval between installation base plate 21 and the heat-radiating substrate 5 about the longitudinal axis thickness w partly of heat conductivity flexure strip 31.Like this, the longitudinal axis part of heat conductivity flexure strip 31 is between installation base plate 21 and heat-radiating substrate 5, by seamless crimping clamping.
On the other hand, about the transverse axis thickness h partly of heat conductivity flexure strip 31, also thick a little than the interval between installation base plate 21 and the heat-radiating substrate 5 transverse axis part.Like this, the transverse axis part of heat conductivity flexure strip 31 is between the lower surface and heat-radiating substrate 5 of installation base plate 21, by seamless crimping clamping.
And, preferably grinding cutting processing is carried out in the lower surface at least of installation base plate 21.
Like this, it is concavo-convex that the lower surface of installation base plate 21 is not almost had, and combines closely with heat conductivity flexure strip 31.
Especially by grinding,, therefore can prevent to produce air layer between installation base plate 21 and the heat conductivity flexure strip 31, dispel the heat expeditiously owing to can get rid of chips of glass, the resin bed that the crest line part of the lower surface of installation base plate 21 is produced.
And, can prevent from by the shaded effect that the light-emitting area attached to led light source 2 causes, the light of led light source 2 to be utilized to greatest extent by chips of glass, the resin-lint of the section generation of installation base plate 21.
Then, the effectively structure of other heat conductivity parts is described with above-mentioned heat conductivity flexure strip 31 uses.
Figure 11 represents the general profile chart of liquid crystal indicator of the present invention.The parts identical with Fig. 1 adopt same label.Below, just the difference with Fig. 1 describes.
Above-mentioned heat conductivity flexure strip 31, adopt the elastomeric sheeting of rubber-like, even seize on both sides by the arms by installation base plate 21 and heat-radiating substrate 5 and the state of crimping heat conductivity flexure strip 31 under, the contact-making surface of the contact-making surface of installation base plate 21 and heat conductivity flexure strip 31 and heat conductivity flexure strip 31 and heat-radiating substrate 5 probably also can produce air layer.
Like this, the contact-making surface that installation base plate 21 or heat-radiating substrate 5 are contacted with heat conductivity flexure strip 31 is not complete smooth face, unavoidably has small concavo-convexly, and the state of seizing on both sides by the arms of heat conductivity flexure strip 31 also can change because of the impact of outside etc.
For preventing the generation of air layer,, get involved mobile high adhesive 17, perhaps mobile low fluid 17 like this at the contact-making surface of heat conductivity flexure strip 31 and installation base plate 21 and the contact-making surface of heat conductivity flexure strip 31 and heat-radiating substrate 5.
If by mobile high adhesive 17, the contact-making surface of the contact-making surface of stationary heat conductibility flexure strip 31 and installation base plate 21 and heat conductivity flexure strip 31 and heat-radiating substrate 5, then easy heat with led light source 2 passes to heat-radiating substrate 5.
As the high adhesive 17 of flowability, can use adhesive that for example heat conductivity is high (for example Japan's bundle レ ダ ウ heat conductivity adhesive SE4420 that コ-ニ Application グ シ リ コ-Application (limited company) is produced) or splicing tape for example (the heat conduction splicing tape No.8805 that SUMITOMO CHEMICAL ス リ-エ system (limited company) is produced)
And mobile low fluid 17 is formed (be called heat and conduct compound) by the molecule of the high pottery of for example lubricant component and heat conductivity.
Because the existence of fluid 17, small concavo-convex corresponding with installation base plate 21 and heat-radiating substrate 5, infiltration has the lubricant component of fluid 17, and gets rid of small air layer.Like this, the retaining that the retaining of installation base plate 21 and heat conductivity flexure strip 31 connects state and heat conductivity flexure strip 31 and heat-radiating substrate 5 connects state to be improved reliably, and the heat that installation base plate 21 produces is transmitted to heat-radiating substrate 5 effectively by conductibility flexure strip 31.
Therefore, the heat that is produced by led light source 2 can effectively be discharged into the external world, and owing to be difficult to accumulate heat in led light source 2 or the installation base plate 21, therefore can effectively suppress the rising of led light source 2 or its peripheral temperature.
Then, further specify the miscellaneous part that is fit to 31 uses of heat conductivity flexure strip.
Figure 12 represents the general profile chart of liquid crystal indicator of the present invention in other embodiment.The parts identical with Fig. 1 adopt identical label.Below, just the difference with Fig. 1 describes.
In the present embodiment, with the installed surface state of contact of the led light source 2 of installation base plate 21 under, heat conductivity elastomeric element 20 is set.
Figure 13 represents the oblique view of heat conductivity elastomeric element 20.
Heat conductivity elastomeric element 20, for basic corresponding elongated tabular of installation base plate 21.
In heat conductivity elastomeric element 20, be formed for being contained in the opening portion 20a of the window shape of mounted LEDs light source 2 on the installation base plate 21.
The heat conductivity elastomeric element 20 of this shape is configured in the LED installed surface of installation base plate 21.Can make like this, also that mounted LEDs light source 2 is positioned at opening portion 20a and is pressed on installation base plate 21.
Figure 14 represents oblique view applied heat conductibility elastomeric element 20, that carry the installation base plate 21 of led light source array.
Heat conductivity elastomeric element 20 as shown in figure 12, is seized on both sides by the arms between the incident light end face of installation base plate 21 and LGP 3.
Because around led light source 2, there is heat conductivity elastomeric element 20 in substance, therefore from led light source 2 around led light source 2 and all heats of discharging of installed surface one side of installation base plate 21 can both accept by heat conductivity elastomeric element 20, and arrive LGP 3 or installation base plate 21.
Especially, because the heat of led light source 2, begin from the portion of terminal 23c that among LED container 23b, forms, by the metal driving wiring 24 the fastest transmission that on installation base plate 21, form, therefore if make heat conductivity elastomeric element 20, with the metal driving of installation base plate 21 wiring 24, metal pattern, and then portion of terminal 23c directly contacts, and then radiating effect is better.
And, as shown in figure 12,,, can directly release heat dissipation capacity, so radiating effect is better to heat-radiating substrate 5 by the end face of heat conductivity elastomeric element 20 downsides.
Therefore, the heat that is produced by led light source 2 can effectively be discharged into the external world, and owing to be difficult to accumulate heat in led light source 2 or the installation base plate 21, therefore can effectively suppress the rising of led light source 2 and peripheral temperature thereof.
Here, the thickness to heat conductivity elastomeric element 20, heat conductivity flexure strip 31 describes.
Importantly the Thickness Design with heat conductivity elastomeric element 20 becomes than the design between the end face of installation base plate 21 and LGP 3 at interval, and promptly the setting height(from bottom) than led light source 2 is thick a little.
And then, the thickness of heat conductivity flexure strip 31 is also thick a little at interval than the design of installation base plate 21 and heat-radiating substrate 5.
By setting such thickness, because two heat conductivity elastomeric elements 20 and 31 have elasticity, the installation base plate 21 of led light source 2 is installed, be crimped and be clamped between LGP 3 or the heat-radiating substrate 5, therefore can stably keep installation base plate 21.
And, even, exist under the state of trickle concaveconvex shape in the end face of LGP 3, the table back side of installation base plate 21, the outside of heat-radiating substrate 5, trickle concavo-convexly also can be absorbed.
Like this, the contact portion of LGP 3, heat conductivity elastomeric element 20, installation base plate 21, heat conductivity flexure strip 31, heat-radiating substrate 5 does not almost get involved air layer, can carry out the face contact reliably.
Simultaneously, like this, by allowing heat conductivity elastomeric element 20,31 have elasticity, even apply impact by the external world to liquid crystal indicator, this impacts also and can be absorbed by heat conductivity elastomeric element 20,31.Therefore, impact not to be directly passed to installation base plate 21, installation base plate 21 can not take place produce dislocation, perhaps installation base plate 21 itself produce damaged, perhaps situation such as led light source 2 disengagings:.
Figure 15 represents the general profile chart of liquid crystal indicator of the present invention in other embodiments.The parts identical with Fig. 1 adopt identical label.Below, the difference with Fig. 1 is described.
In the present embodiment, be that the heat conductivity elastomeric element 32 of コ (U) word shape is arranged to the installed surface installed with the led light source 2 of installation base plate 21 and the back side of this face opposition side with the cross section, and contact with the lower surface of the rectangular installation base plate 21 of this face.
Figure 16 represents the oblique view of heat conductivity elastomeric element 32 1 examples.
Heat conductivity elastomeric element 32 shown in Figure 16 (a), comprises: seize on both sides by the arms at the back side of installation base plate 21 and the 1st position 32a between the heat-radiating substrate 5; Seize the 2nd position 32b between the LED of installation base plate 21 installed surface and LGP 3 on both sides by the arms; Be configured in the lower surface of installation base plate 21 and the 3rd position 32c between the heat-radiating substrate 5.
Heat conductivity elastomeric element 32 is by the 1st position 32a, the 2nd position 32b and the 3rd position 32c, from the left and right sides of accompanying drawing, for the cross section of upper opening is
(U) word shape.
Then, corresponding at the 2nd position 32b with the position of mounted LEDs light source 2 on installation base plate 21, form a plurality of opening portion 32d.
At this moment, preferably at the contact-making surface of contact-making surface, heat conductivity elastomeric element 32 and the heat-radiating substrate 5 of heat conductivity elastomeric element 32 and installation base plate 21 and the contact-making surface of heat-radiating substrate 5 and LGP 3, get involved high adhesive of above-mentioned flowability 17 or mobile low fluid 17, be used to improve heat conductivity.
Other example of Figure 16 (b), (c) expression heat conductivity elastomeric element 32.
Figure 16 (b) is and the led light source 2 corresponding opening portion 32d that form at the 2nd position 32b, is an example of window shape.
In this case, because 4 sides around led light source 2, there is heat conductivity elastomeric element 32 in substance, is therefore all accepted by heat conductivity elastomeric element 32 from the heat that discharges on every side of led light source 2, can arrive heat-radiating substrate 5 or LGP 3.
In addition, when disposing installation base plate 21 on this heat conductivity elastomeric element 32, the gap between the 1st position 32a and the 2nd position 21b is extended from upside, and this state down can as long as insert 21 of installation base plates from top.
And heat conductivity elastomeric element 32 shown in Figure 16 (c), also can be with LED installed surface, its back side of installation base plate 21 and contacts such cross section with the rectangular upper and lower end face of these faces and be
(U) word shape.
The heat conductivity elastomeric element 32 of this Figure 16 (c), and then also the 4th position 32e is set at upside.
Also have, the 2nd position 32b forms the opening portion 32d that makes led light source 2 exposures in half position of its short transverse.
In this case, with installation base plate 21 laterally inserted cross sections be
(U) in the heat conductivity elastomeric element 32 of word shape.
In addition, when disposing installation base plate 21 in heat conductivity elastomeric element 32, the opening portion 32d that forms in the 2nd position 32b is all opening on the both direction up and down, configuration installation base plate 21 under this state.And, also can go into installation base plate 21 from side one side pressure of heat conductivity elastomeric element 32.
In the structure of Figure 16 (c),, therefore can improve heat conduction efficiency because 4 faces of installation base plate 21 are covered in fact by heat conductivity elastomeric element 32.
And,, also can seize heat conductivity elastomeric element 32 on both sides by the arms from upside by the basket 4 (with reference to Fig. 1) of liquid crystal indicator.Installation base plate 21, owing to covered from 4 faces by heat conductivity elastomeric element 32, so thermal diffusivity, resistance to impact are all very good.
Thickness about heat conductivity elastomeric element 32 describes below.Because heat conductivity elastomeric element 32, for installation base plate 21 and heat-radiating substrate 5 crimping clampings, so the external dimensions of heat conductivity elastomeric element 32 compare with the inside dimension of heat-radiating substrate 5 can be a little greatly.
Because heat conductivity elastomeric element 32 is flexible, the surperficial trickle concaveconvex shape of installation base plate 21 and heat-radiating substrate 5 can be absorbed, therefore between installation base plate 21 and heat conductivity elastomeric element 32 or heat conductivity elastomeric element 32 and the heat-radiating substrate 5, almost do not get involved air layer, be close to reliably and carry out the face contact.
And, the heat-radiating substrate 5 that contacts with the outside of heat conductivity elastomeric element 32, the side angle portion that falls within it in some cases, adds at metal distortion or stress metal and can produce curved surface (R) man-hour, and this curved surface is absorbed by the elastic characteristic of heat conductivity elastomeric element 32.
In addition, under situation about not absorbed by elastic characteristic, make corner, the outside portion chamfering of the heat conductivity elastomeric element 32 that contacts with this inside bend portion become the C face, just can avoid this curved surface R, heat conductivity elastomeric element 32 and heat-radiating substrate 5 just can be close to reliably and carry out the face contact.
Also can metal shell be installed in the outside of the heat conductivity elastomeric element 32 of above explanation.
Figure 17 (a)～Figure 17 (c) is the oblique view of the shape of the metal shell 33 of expression encirclement heat conductivity elastomeric element 32.
Above-mentioned cross section is
(U) the heat conductivity elastomeric element 32 of word shape, its outside is covered by these metal shells 33.
The cross section is
(U) the heat conductivity elastomeric element 32 of word shape and metal shell 33 are combined closely by contact-making surface.In the metal shell 33, with heat conductivity elastomeric element 33 similarly, form the shortcoming part 33a that the light-emitting area make led light source 2 is exposed.
In addition, for metal shell 33, has the such effect of utilization ratio that improves led light source.Specifically, from the light incident of led light source 2 after LGP 3, some light be not from LGP 3 emission to LCDs 1 one sides, but after the metallic reflection plate R reflection that is provided with by end face, turn back to end face one side (with reference to Figure 15) of led light source 2 at LGP 3.
At this moment,, can absorb such light to the heat conductivity elastomeric element 32 of black, cause light loss as grey if when heat conductivity elastomeric element 32 is configured in the end face of its LGP 3.
Here, get involved metal shell 33, by metal shell 33, make light can return LGP 3, and can effectively utilize light by outside at heat conductivity elastomeric element 32.
In addition, among Figure 17 (a)～Figure 17 (c), metal shell 33 is processed to form the cross section by metal and is
(U) word shape, however also can be for example with the cross section
(U) structure of the integral body of the heat conductivity elastomeric element 32 of word shape encirclement is cross section mouth shape.
In addition, preferred, according to not entering air layer between heat conductivity elastomeric element 32 and the metal shell 33, it is close to.For example bonding agent (for example heat conductivity splicing tape No.8805 of SUMITOMO CHEMICAL ス リ-エ system (limited company) production) is filled between heat conductivity elastomeric element 32 and the metal shell 33.
And metal shell 33 can adopt the heat conductivity adhesive to be fixed on the heat-radiating substrate 5, and the heat of heat conductivity elastomeric element 32 is delivered on the heat-radiating substrate 5 easily like this.And then if metal shell 33 and heat-radiating substrate 5 becoming one, then the heat of metal shell 33 directly transmits to heat-radiating substrate 5.As the adhesive of above-mentioned heat conductivity, can adopt for example heat conductivity adhesive SE4420 of this East of Ri レ ダ ウ コ-ニ Application グ シ リ コ-Application (limited company) production.
Figure 18 represents the general profile chart of liquid crystal indicator of the present invention in other embodiment.The parts identical with Figure 15 adopt same label.Below, just the difference with Figure 15 describes.
In the present embodiment, the 2nd position 32b of heat conductivity elastomeric element 32 is close to the end face of LGP 3.
The heat of the heat that discharges around the led light source 2 or installed surface one side of installation base plate 21 from the 2nd position 32b of heat conductivity elastomeric element 32, directly transmits to the end face of LGP 3, therefore can reach LGP 3.And heat by the 3rd position 32c, can arrive heat-radiating substrate 5.Also have, after transmitting, can arrive heat-radiating substrate 5 from the 1st position 32a at the 1st position 32a between the end face of installation base plate 21 and LGP 3 by the 3rd position 32c.
Here, about the 1st position 32a, the 2nd position 32b of heat conductivity elastomeric element 32, with above-mentioned same, respectively than the design of installation base plate 21 and heat-radiating substrate 5 at interval, the design of installation base plate 21 and LGP 3 is thick a little at interval.Like this, the 2nd position 32b by crimping clamping reliably, does not have air layer to enter therebetween, efficiently release heat between the end face of installation base plate 21 and LGP 3.
Figure 19 is the general profile chart of liquid crystal indicator in the other embodiment of the present invention.The parts identical with Fig. 1 adopt same label.Below, just the difference with Fig. 1 describes.
In the present embodiment, heat-radiating substrate 5 is essentially plane, and installation base plate 21 is arranged on the horizontal plane of heat-radiating substrate 5.
Also have, the LED container 23b of led light source 2 is installed in its 1 side on the installation base plate 21 as the LED installed surface.
Therefore, the light emission direction of led light source 2 as shown in figure 20, is the direction parallel with the installed surface of installation base plate 21.
Led light source 2 then, and above it and the back side (face of light-emitting area opposition side) covered by heat conductivity elastomeric element 34.
This heat conductivity elastomeric element 34 as shown in figure 21, has the shape at the opening portion 34a of lower opening of holding led light source 2, is enclosed and is formed by 4 remaining after the side that will remove the led light source 2 that combines with installation base plate 21 and light-emitting area bread.
Heat conductivity elastomeric element 34 by upside basket 4, towards installation base plate 21, promptly is pressed and keeps from the upside of Figure 19.
And, simultaneously,,, be pressed and keep to the end face of LGP 3 from the back side one side of led light source by upside basket 4 and heat-radiating substrate 5.
Therefore, the heat of led light source 2, the boss 32b by the heat conductivity elastomeric element 34 of existence around led light source 2 can arrive upside basket 4 or heat-radiating substrate 5.
Like this,, be difficult to accumulate heat in led light source 2 or the installation base plate 21, therefore can suppress the rising of led light source 2 and peripheral temperature thereof effectively because the heat that is produced by led light source 2 effectively is discharged into the external world.
In addition, the opening portion 34a of heat conductivity elastomeric element 34 as shown in figure 21, be provided with the window shape opening corresponding with a plurality of led light source 2, in such heat conductivity elastomeric element 34, under the situation of configuration installation base plate 21, then can as long as make on installation base plate 21 mounted LEDs light source 2 be positioned at opening portion 34a.
Here, about the thickness of heat conductivity elastomeric element 34, can be thicker a little at interval than the design of installation base plate 21 and upside basket 4, opening portion 34a also can equate with the installation thickness of led light source 2.
Reach optimization like this by the thickness that makes heat conductivity elastomeric element 34, then can make the installed surface of above-mentioned installation base plate 21 and on installation base plate 21 above the mounted LEDs light source, being close to mounting has heat conductivity elastomeric element 34.
Here, importantly, heat conductivity elastomeric element 34 has elasticity.Like this, the bending or the concaveconvex shape of installation base plate 21 and heat-radiating substrate 5 are absorbed, and heat conductivity elastomeric element 34 and installation base plate 21, heat-radiating substrate 5, upside basket 4 are not almost got involved air layer and be close to reliably and carry out face contact.
Heat conductivity elastomeric element 34, be provided with the opening portion 34a that holds led light source 2, because the LED installed surface of boss 34b and installation base plate 21 retaining connects, therefore the light generation shading beyond the direction that the end face of LGP 3 advances is reflected, prevent that light from leaking, and improves the light utilization ratio simultaneously.
In addition, because the heat by 21 metal driving wiring 24 led light sources that transmitted 2 that form from the 23c of splicing ear portion to installation base plate is maximum, heat conductivity elastomeric element 34 is contacted with the metal driving wiring 24 of installation base plate 21, and then then radiating effect is better as if being connected with the 23c of splicing ear portion.
Then, just installing on the installation base plate 21 under the situation of led light source 2, raising describes from the embodiment of led light source 2 to the heat-conductive characteristic of installation base plate 21.
In the present embodiment, led light source 2, good and have the heat radiation adhesives 30 of cementability by heat dispersion as shown in Figure 6, be installed on the installation metal film 22 of installation base plate 21.
The effect that this heat radiation adhesives 30 is got involved between led light source 2 and the installation base plate 21 is as follows.
Usually, led light source 2 and installation base plate 21 only adopt electroconductive component, scolding tin to connect in 2 places of splicing ear 23c.
Therefore, the heat by the led chip 23a of led light source 2 produces is transmitting to installation base plate 21 by the 23c of splicing ear portion from LED container 23b in the past, and then the external world around the LED container discharges in addition.
To this, among the present invention, behind the LED container 23b and the gap (air layer) between the installation base plate 21 of eliminating led light source 2, fill heat radiation adhesives 30.Like this, the heat of accumulating among the LED container 23b can be transmitted to the installation metal film 22 of installation base plate 21 effectively, and transmit to heat radiating metal film 26 effectively by a plurality of metallic vias 27.
And, by making metal film 22 and metal film pattern 25 being integral are installed, and, even metal film 22 and metal film pattern 25 are installed as forming separately respectively, and by making heat radiation adhesives 30 stride across both and with its covering, then also the heat of LED container 23b can be passed to effectively installation base plate 21 1 sides, adopt a plurality of metallic vias 27 to transmit then to heat transmission metal film 26.
As above, adopt heat radiation adhesives 30, form metallic vias 27 with the structure of installation base plate 21 till from LED installed surface one side to its reverse side, for improving the heat-transfer effect of these metallic vias 27, can metal film 22 be installed by being provided with in LED installed surface one side, metal film pattern 25, adopt heat transmission metal film 26 at its reverse side, and adopt the good material of copper class heat-conductive characteristic to form these metal films 22,26, metal film pattern 25, metallic vias 27, just can be stably with the heat of the LED container 23b of led light source 2, and pass to the heat transmission metal film 26 of installation base plate 21 efficiently, and be suppressed at the temperature rising on every side of led chip 21a effectively.
In addition, the adhesives 30 that preferably should dispel the heat except that having as above-mentioned thermal diffusivity, the adhesivity, for the portion of terminal 23c that prevents led light source 2, the short circuit between the 23c, has insulating properties.
In addition, heat radiation adhesives 30 as shown in figure 22, is removed metal driving that portion of terminal 23c, 23c engage and is connected up outside 24 zones, begins to extend from the formation zone that metal film 22 is installed, till the formation zone of metallic vias 27 and form.
Like this, the heat of accumulating among the LED container 23b of led light source 2 not only transmits to metal film 22 is installed by heat radiation adhesives 30, but directly transmits heat to metal film 25, and through most metallic vias 27, transmit to the heat transmission metal film 26 of the rear side of installation base plate 21.
Therefore, the heat of accumulating among the LED container 23b of led light source 2 can arrive the heat transmission metal film 26 of installation base plate 21 efficiently.
For obtaining same effect, as shown in figure 23, also can make and metal film 22 is installed is extended to and metal film pattern 25 forming as one (combining of installation metal film 22 and metal film pattern 25) in fact.
Then, just replace other embodiment of heat radiation adhesives 30 to describe.
Under the situation of in the past surface mounting LED light source 2, make the portion of terminal 23c that is provided with in the both sides of led light source 2 and the given metal driving wiring 24 of installation base plate 21, aim at given position, connect by methods such as scolding tin Reflow Solderings.
Hold between the LED container 23b of led chip 23a of led light source 2 and the installation base plate 21 and can produce the abominable bubble cavity of pyroconductivity fully.
Among the present invention, distribute coating method by adopting, so that mobile high (viscosity is low) adhesive 35 to be provided at this blank part.
For example, led light source 2 is installed on the installation base plate 21, from the side coating infiltration adhesive 35 of LED container.Importantly should the high adhesive 35 of flowability, be mobile high material that can not the corroding metal wiring.
Therefore, the heat by led light source 2 produces can carry out heat transmission with installation base plate 21 effectively by adhesive 35 and portion of terminal 23c.
And, the mechanical cohesive bond of led light source 2 and installation base plate 21, not only can be undertaken bonding by portion of terminal 23c, adhesive 35 by configuration between LED container 23b and installation base plate 21 also can be realized bonding, therefore can also improve the mechanical cohesive bond intensity of led light source 2 and installation base plate 21, become the good liquid crystal indicator of a kind of resistance to vibration.
More than, be described with regard to embodiments of the present invention, but enforcement of the present invention also is not limited to above-mentioned embodiment.For example, in many embodiments so far, LGP 3 is compared with the thickness of the end face of configuration led light source 2 one sides, the thinner thickness of the end face of facing mutually, it is identical that yet two end faces also can be used as identical flat-panel component thickness, and, the downside basket of double as heat-radiating substrate 5 too, the size of the depth direction of its side also can be identical.And then, by double as heat-radiating substrate 5 and downside basket, rear side at liquid crystal indicator, the metal material of heat-radiating substrate 5 is exposed, for cooperating the outward appearance of upside basket 4, heat-radiating substrate 5 can be made of different parts with the downside basket, also can make resin mold moulding at the face that exposes side of heat-radiating substrate 5.
(embodiment 1)
With regard to heat conductivity flexure strip 31, can use cross section to be the flexure strip of L word shape (SUMITOMO CHEMICAL ス リ-エ system (limited company) produce model be No.5509) with heat dissipation characteristics, with regard to heat-radiating substrate 5, but used thickness is the aluminium of 2mm, and installation base plate 21 is fixed for face contacts with heat-radiating substrate 5 with heat conductivity flexure strip 31.
The pyroconductivity of various here use materials, the installation base plate of being made up of glass epoxy resin 21 is 0.45W/mk, heat conductivity flexure strip 31 is 5W/mk, is 236W/mk as the aluminium of heat-radiating substrate 5.
And,, can be magnesium, iron as heat-radiating substrate 5.Have, the pyroconductivity of magnesium is 157W/mk again, and the pyroconductivity of iron is 83.5W/mk, under the relatively poor situation of thermal diffusivity, if increase plate thickness, fin perhaps is set also can.
By led light source 2 luminous produced simultaneously heats,, after transmitting, heat-radiating substrate 5 heat are released through installation base plate 21, heat conductivity flexure strip 31.And, also transmit heat and release to heat-radiating substrate 5 from the lower surface of installation base plate 21.
Here, because that the pyroconductivity of installation base plate 21 or heat conductivity flexure strip 31 is compared with the aluminium of heat-radiating substrate 5 is very low, for improving the heat conduction, effective method is the unlimited attenuation of thickness that makes installation base plate 21 and heat conductivity flexure strip 31.
Employing is 4.7 inches LCDs 1 as the viewing area size, 2 arrangements of 16 led light sources are installed on the installation base plate 21, under normal temperature (25 ℃) state, there is the 20mA electric current to flow in each led light source 2, and carries out the mensuration of the peripheral temperature of led light source 2.
Its result, the peripheral temperature of led light source 2 can be suppressed at 40 ℃ as can be known, and the life-span of inferring of led light source may extend to about 7500 hours.And, about the luminous efficiency of led light source, though small, the tendency of improvement is arranged.
On the other hand, under the situation of removing heat conductivity flexure strip 31, the peripheral temperature of led light source is 44 ℃, and the life-span of inferring of led light source only is about 6600 hours as can be known.
According to above-mentioned experimental verification result as can be known, by heat conductivity flexure strip 31 is combined closely with installation base plate 21 and heat-radiating substrate 5, and improvement heat conduction, the heat that led light source 2 is produced discharges to heat-radiating substrate 5 effectively, can reduce the heat of accumulating in led light source 2 and the installation base plate 21 like this, and led light source 2 and peripheral temperature rising thereof are diminished.
(embodiment 2)
Between installation base plate 21 and the heat conductivity flexure strip 31, between heat conductivity flexure strip 31 and the heat-radiating substrate 5, be coated with fluid 17 (heat conduction compound), and carry out temperature measuring similarly to Example 1.
Just heat is conducted compound, the SC102 that can use this East of Ri レ ダ ウ コ-ニ Application グ シ リ コ-Application (limited company) to produce, and installation base plate 21 is fixed for face contacts with heat conductivity flexure strip 31 and heat-radiating substrate 5.The pyroconductivity of heat conduction compound is 0.8W/mk.
Heat conduction compound, make the high ceramic molecule of pyroconductivity etc., the lubricant component high with viscosity mixes under the claylike state, and contained lubricant component is with small concavo-convex corresponding and combination the time, get involved the high ceramic particle of pyroconductivity, make heat-conductive characteristic become good.
Employing is 4.7 inches a LCDs 1 as the viewing area size, 16 led light sources 2 is arranged be installed on the installation base plate 21, has the 20mA electric current to flow under normal temperature (25 ℃) state in each led light source 2, and carries out the mensuration of led light source 2 peripheral temperature.
Its result, the peripheral temperature that can suppress led light source 2 as can be known are at 39 ℃, and the life-span of inferring of led light source extends to about 7700 hours.And, about the luminous efficiency of led light source, though small, the tendency of improvement is arranged.
On the other hand, under the situation of removing heat conductivity flexure strip 31, heat conduction compound, the peripheral temperature of led light source becomes 44 ℃ as can be known, and the life-span of inferring of led light source only had an appointment 6600 hours.
According to above-mentioned experimental verification result as can be known, make heat conduction compound, get involved the contact-making surface of heat conductivity flexure strip 31 and installation base plate 21, and the contact-making surface of heat conductivity flexure strip 31 and heat-radiating substrate 5, by these face safety are close to, can make by the heat transmission of led light source 17 to be further improved to heat-radiating substrate 5.
(embodiment 3)
Except that the structure of embodiment 1, in addition, append heat conductivity elastomeric element 20, and carry out temperature measuring similarly to Example 1.
Heat conductivity elastomeric element 20 can use the tabular flexure strip (the model No.5509 that SUMITOMO CHEMICAL ス リ-エ system (limited company) is produced) with heat dissipation characteristics, and installation base plate 21 is fixed for face contacts with the light incident side end face of LGP 3.
By led light source 2 luminous and produced simultaneously heats, also pass through installation base plate 21, heat conductivity elastomeric element 20, also discharge to LGP 3.Therefore, the heat that transmits to heat-radiating substrate 5 from installation base plate 21 can be from the installed surface and the back side of installation base plate 21, and these 3 circuits heat radiations of lower surface.
Employing is 4.7 inches LCDs 1 as the viewing area size, 2 arrangements of 16 led light sources are installed on the installation base plate 21, under normal temperature (25 ℃) state, there is the 20mA electric current to flow in each led light source 2, and carries out the mensuration of led light source 2 peripheral temperature in the backlight.
Its result as can be known, the peripheral temperature that can suppress led light source 2 is at 36 ℃, the life-span of inferring of led light source extends to about 8500 hours.And, about the luminous efficiency of led light source, though small, the tendency of improvement is arranged.
On the other hand, under the situation of removing heat conductivity elastomeric element 20, heat conductivity flexure strip 31, the peripheral temperature of led light source becomes 44 ℃ as can be known, and the life-span of inferring of led light source only had an appointment 6600 hours.
According to above-mentioned experimental verification result, make heat conductivity elastomeric element 20, heat conductivity flexure strip 31 as can be known, be close to installation base plate 21 and heat-radiating substrate 5, can improve pyroconductivity, the heat that led light source 2 is produced effectively discharges to LGP 3 and heat-radiating substrate 5.
(embodiment 4)
Employing makes heat conductivity elastomeric element 20 and heat conductivity flexure strip 31 becoming one, and the cross section with heat dissipation characteristics is
(U) the heat conductivity elastomeric element 32 of word shape (the model No.5509 that SUMITOMO CHEMICAL ス リ-エ system (limited company) is produced), installation base plate 21 is fixed for face contacts with heat-radiating substrate 5 with heat conductivity elastomeric element 32, and carried out temperature measuring similarly to Example 3.
Then, employing is 4.7 inches LCDs 1 as the viewing area size, 2 arrangements of 16 led light sources are installed on the installation base plate 21, under normal temperature (25 ℃) state, have the 20mA electric current to flow in each led light source 2, and carry out the mensuration of led light source 2 peripheral temperature.
Its result as can be known, the peripheral temperature that can suppress led light source 2 is at 34 ℃, the life-span of inferring of led light source array extends to about 9000 hours.And, about the luminous efficiency of led light source array, though small, the tendency of improvement is arranged.
On the other hand, under the situation of removing heat conductivity elastomeric element 32, the peripheral temperature of led light source 2 is 45 ℃ as can be known, and the life-span of inferring of led light source array only had an appointment 6400 hours.
According to above-mentioned experimental verification result as can be known, make the cross section be by employing
(U) the heat conductivity elastomeric element 32 of word shape is close to installation base plate 21 and heat-radiating substrate 5 and LGP 3, and heat-conductive characteristic is further improved.
And, because heat conductivity elastomeric element 32 is seized the inside at heat-radiating substrate 5 on both sides by the arms, therefore can installation base plate 21 be remained on given position highly stablely, and, even apply impact, also can impact absorption be fallen, therefore the dislocation that can not produce led light source 2 by heat conductivity elastomeric element 32 from the outside of basket 6, perhaps damaged, become the high liquid crystal indicator of a kind of reliability.
(embodiment 5)
As shown in figure 19, about installation base plate 21 being arranged on the horizontal plane of heat-radiating substrate 5,1 side of the LED container 23b of led light source 2 as the LED installed surface, and is installed in liquid crystal indicator on the installation base plate 21, carries out temperature measuring similarly to Example 1.
With regard to heat conductivity elastomeric element 34, can use tabular flexure strip with heat dissipation characteristics (SUMITOMO CHEMICAL ス リ-エ system (limited company) produce model be No.5509), carry out face with led light source 2, heat-radiating substrate 5, upside basket 4 and contact and be fixed.
By led light source 2 luminous and produced simultaneously a part of heats,, discharge by heat conductivity elastomeric element 34 from LED container 23b from upside basket 4, also can discharge from side one side of heat-radiating substrate 5.
Employing is 4.7 inches LCDs 1 as the viewing area size, 2 arrangements of 16 led light sources are installed on the installation base plate 21, under normal temperature (25 ℃) state, there is the 20mA electric current to flow in each led light source 2, and carries out the mensuration of led light source 2 peripheral temperature in the backlight.Its result can make the peripheral temperature of led light source 2 be suppressed at 36 ℃ as can be known, and the life-span of inferring of led light source 2 extends to about 8500 hours.And, about the luminous efficiency of led light source 2, though small, the tendency of improvement is arranged.
On the other hand, under the situation of removing heat conductivity elastomeric element 34, the peripheral temperature of led light source becomes 44 ℃, and the life-span of inferring of led light source 2 only had an appointment 6600 hours.
According to above-mentioned experimental verification result as can be known, the heat that led light source 2 produces by heat conductivity elastomeric element 34, can effectively discharge to above-mentioned basket 4 and heat-radiating substrate 5.
(embodiment 6)
As shown in Figure 6, the thickness of installation base plate 21 is 0.1mm, disposes various metal films 22,26, metal film pattern 25, metal driving wiring 24 on its two sides, and as metal film, used thickness is the Copper Foil of 35 μ m.Metallic vias 27 is provided with the through hole that diameter is 0.2mm, and at the inner ring of through hole, the thickness that carries out as plated material is the copper facing of 2.5 μ m.
And the heat transmission metal film 26 of installation base plate 21 is compared with other installation metal films 22, the metal film pattern 25 of LED installed surface one side, changes thickness into 60 μ m from 35 μ m, is the structure of carrying out heat conduction and diffusion easily.The surface of the metal film of copper product is soldering-tin layer 28 coverings of 20 μ m by thickness.Like this, can not only improve above-mentioned radiating effect, also on installation base plate 21, easily led light source 2 or its driver part etc. be carried out scolding tin and install, can prevent the oxidation on each copper surface or the variable color and the corrosion of copper simultaneously.
Because the pyroconductivity of installation base plate 21 is compared with the metal material that uses in metal film 22,26 or metal film pattern 25 or the heat-radiating substrate 5, for very little, for improving the heat conduction of heat-radiating substrate 5, effective method is the unlimited attenuation of thickness that makes substrate.Employing has insulating reliability, the glass epoxy substrate of cutting down cost.
As heat-radiating substrate 5, used thickness is that the material of 2mm is the rectangular slab of aluminium, is L word shape according to carrying out with the heat transmission metal film 26 of installation base plate 21 that face contacts and bend to the cross section, and screw is fixed on the installation base plate 21.The pyroconductivity of various here use materials, the installation base plate of being made up of glass cloth substrate epoxy resin (body portion of installation base plate) is 0.45W/mk, copper is 403W/mk.Aluminium is 236W/mk, and scolding tin is 62.1W/mk, and the heat radiation adhesives is 0.92W/mk.
Luminous produced simultaneously heat among the led chip 23a of led light source 2 transmits to installation base plate 21 by the heat radiation adhesives 30 of filling configuration between the LED of led light source 2 container 23b and installation base plate 21.
As this heat radiation adhesives 30, can adopt this East of heat radiation resin (Ri レ ダ ウ SE4420 that コ-ニ Application グ シ リ コ-Application (limited company) is produced).
Employing is 5.7 inches a rectangle LCDs 1 as the size of liquid crystal indicator, with linearity 5 led light sources 2 is installed on installation base plate 21, has the 250mA electric current to flow in each led light source 2, and the temperature of measuring the LED installed surface of installation base plate 21 rises.
Its result can suppress temperature and rise below 25 ℃, and the temperature of the back side one side rises below 18 ℃.Compare with the normal temperature luminous efficiency of the led light source that contains led light source 2 and only to have reduced by 2% luminous efficiency, realize bright the demonstration.
Like this, in liquid crystal indicator with LED-backlit source, installation base plate, especially the environment temperature of led light source rises and becomes big, and the temperature of LED installed surface one side of installation base plate rises to more than 50 ℃, and then the luminous efficiency of led light source reduces more than 4%, be that normal temperature (25 ℃) is compared with the environment for use of liquid crystal indicator simultaneously, if be 70 ℃, then the temperature of installation base plate becomes 120 ℃, becomes the state that LED can envision the damage of optron.
According to above-mentioned experimental verification result as can be known, various structures according to the metal film 22,26 of the mounting structure of led light source 2 (by heat radiation adhesives 30), installation base plate 21, metal film pattern 25, metallic vias conductor 27, improve the heat conduction, the heat that led light source 2 is produced effectively discharges to heat-radiating substrate 5.
(embodiment 7)
Replace heat radiation adhesives 30, adopt adhesive 35, carry out temperature measuring similarly to Example 6.And, also adopt heat conductivity elastomeric element 32 similarly to Example 4.
With regard to adhesive 35, adopt this East of Ri レ ダ ウ SE9176L that コ-ニ Application グ シ リ コ-Application (limited company) is produced.
The conductivity of air is 0.024W/mk, and illustrative adhesive 35 is compared with air has bigger thermal conduction effect.
And, if adhesive 35 gap of infiltration LED container 23b and installation base plates 21 rapidly, and in can the scope of deaeration, then preferably contain insulation molecule material etc., and further improve the adhesive of pyroconductivity.
Employing is 4.7 inches LCDs 1 as the viewing area size, with 16 led light source 2 alignment arrangements on installation base plate 21, under normal temperature (25 ℃) state, there is the 20mA electric current to flow in each led light source 2, and carries out the mensuration of led light source 2 peripheral temperature in the backlight.
Its result can be suppressed at the peripheral temperature of led light source 2 40 ℃ as can be known, and the life-span of inferring of led light source extends to about 7500 hours.And, about the luminous efficiency of led light source, though small, the tendency of improvement is arranged.
On the other hand, under the situation of removing adhesive 35 and heat conductivity elastomeric element 32, the peripheral temperature of led light source 2 is 44 ℃, and the life-span of inferring of led light source only had an appointment 6600 hours.
According to above-mentioned experimental verification result as can be known, gap adhesive coating 35 between the LED of led light source 2 container 23b and installation base plate 21, heat conductivity elastomeric element 32 and installation base plate 21 and heat-radiating substrate 5 are close to, can improve the heat conduction, the heat that led light source 2 is produced discharges to heat-radiating substrate 5 effectively.
Claims (15)
1, a kind of light supply apparatus has backlight and transmission from the heat-radiating substrate of the heat of this backlight, it is characterized in that:
Described backlight comprises: LGP, at the led light source of the end face of this LGP configuration and the installation base plate of this led light source being installed and being had insulating properties;
Between described installation base plate and described heat-radiating substrate, get involved the adhesive of conduction heat.
2, a kind of light supply apparatus has backlight and transmission from the heat-radiating substrate of the heat of this backlight, it is characterized in that:
Described backlight comprises: LGP, at the led light source of the end face of this LGP configuration and the installation base plate of this led light source being installed and being had insulating properties;
Between described installation base plate and described heat-radiating substrate, get involved the splicing tape of conduction heat.
3, light supply apparatus according to claim 1 and 2 is characterized in that:
Also has intervention between described LGP and described heat-radiating substrate and the adhesive of conduction heat.
4, light supply apparatus according to claim 1 and 2 is characterized in that:
Also has intervention between described LGP and described heat-radiating substrate and the splicing tape adhesive of conduction heat.
5, light supply apparatus according to claim 1 and 2 is characterized in that:
Also has intervention between described installation base plate and described heat-radiating substrate and the elastic sheet of conduction heat.
6, light supply apparatus according to claim 5 is characterized in that:
Described installation base plate also has the metal driving wiring that drive current is provided and contacts with described elastic sheet to described led light source.
7, light supply apparatus according to claim 1 and 2 is characterized in that:
Described installation base plate also has by the metal film pattern that etchant resist covered of white.
8, light supply apparatus according to claim 1 and 2 is characterized in that:
Described installation base plate also has: the installation metal film of described led light source is installed, is positioned at the heat transmission metal film and the metallic vias conductor that is connected described installation metal film and described heat transmission metal film of opposing face of the installed surface of described led light source.
9, light supply apparatus according to claim 8 is characterized in that:
The thickness of described heat transmission metal film is bigger than the thickness of described installation metal film.
10, light supply apparatus according to claim 8 is characterized in that:
Also have the heat radiation adhesives of intervention between described installation metal film and described led light source.
11, light supply apparatus according to claim 8 is characterized in that:
Also has intervention between described installation metal film and described led light source and mobile high adhesive.
12, light supply apparatus according to claim 11 is characterized in that:
Described adhesive contains heat conductivity insulation microparticle material.
13, light supply apparatus according to claim 8 is characterized in that:
Also has the soldering-tin layer that covers described installation metal film, described heat transmission metal film and described metallic vias conductor.
14, light supply apparatus according to claim 1 and 2 is characterized in that:
Described heat-radiating substrate has the heat conductivity hole in the zone of facing with described LGP.
15, a kind of liquid crystal indicator is characterized in that, has:
Claim 1 or 2 described light supply apparatuses, and with the described backlight of this light supply apparatus LCDs in the face of configuration.
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004191226 | 2004-06-29 | ||
| JP2004191226A JP2006011242A (en) | 2004-06-29 | 2004-06-29 | Liquid crystal display device |
| JP2004203498 | 2004-07-09 | ||
| JP2004221387 | 2004-07-29 | ||
| JP2004221289 | 2004-07-29 | ||
| JP2004243630 | 2004-08-24 | ||
| JP2004281696 | 2004-09-28 | ||
| JP2004343099 | 2004-11-26 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100814833A Division CN100439999C (en) | 2004-06-29 | 2005-06-29 | Liquid crystal display device |
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| Publication Number | Publication Date |
|---|---|
| CN101430067A true CN101430067A (en) | 2009-05-13 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810174602 Expired - Fee Related CN101430068B (en) | 2004-06-29 | 2005-06-29 | Liquid crystal display device |
| CNB2005100814833A Expired - Fee Related CN100439999C (en) | 2004-06-29 | 2005-06-29 | Liquid crystal display device |
| CNA2008101746019A Pending CN101430067A (en) | 2004-06-29 | 2005-06-29 | Liquid crystal display device |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
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| CN 200810174602 Expired - Fee Related CN101430068B (en) | 2004-06-29 | 2005-06-29 | Liquid crystal display device |
| CNB2005100814833A Expired - Fee Related CN100439999C (en) | 2004-06-29 | 2005-06-29 | Liquid crystal display device |
Country Status (2)
| Country | Link |
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| JP (1) | JP2006011242A (en) |
| CN (3) | CN101430068B (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN100439999C (en) | 2008-12-03 |
| CN101430068A (en) | 2009-05-13 |
| CN1716041A (en) | 2006-01-04 |
| JP2006011242A (en) | 2006-01-12 |
| CN101430068B (en) | 2011-10-05 |
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Application publication date: 20090513 |