CN101363602A - Illuminating device and radiating module thereof - Google Patents
Illuminating device and radiating module thereof Download PDFInfo
- Publication number
- CN101363602A CN101363602A CNA2007101399979A CN200710139997A CN101363602A CN 101363602 A CN101363602 A CN 101363602A CN A2007101399979 A CNA2007101399979 A CN A2007101399979A CN 200710139997 A CN200710139997 A CN 200710139997A CN 101363602 A CN101363602 A CN 101363602A
- Authority
- CN
- China
- Prior art keywords
- heat
- light
- heat pipe
- circuit board
- evaporator section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a light emitting device, which comprises a circuit board, at least a heat conducting element, a plurality of light emitting elements, at least a heat dissipating element and a power element, wherein, the circuit board is provided with at least a groove, and each groove can be used for containing a heat conducting element; furthermore, a plurality of light emitting elements are arranged on the heat conducting element; the heat dissipating element is arranged on the circuit board, and the power element is arranged on the circuit board and is connected with the heat conducting element. The invention also discloses a heat dissipating module of the light emitting device.
Description
Technical field
The present invention relates to a kind of light-emitting device and radiating module thereof, particularly relate to a kind of light-emitting device and radiating module that utilizes heat pipe and radiator to dispel the heat.
Background technology
Because the progress of science and technology, various electronic products are increasing for the demand of function, yet along with properties of product are more and more stronger, the integrated level of employed electronic component (integration) is high more, cause caloric value to improve, so heat dissipation directly influences the reliability and the service life of electronic component.
With light emitting diode (Light-Emitting Diode; LED) be example, because it is little to have volume, and the similarity light source is the characteristic of environmental protection again, therefore, become the focus of the backlight design of backlight module in recent years, yet though the backlight module light source design of lining up array way with LED can increase substantially the dimension that can modulate in the optical design, the thing followed is to produce a large amount of heat history problems, so if no suitable heat dissipating method goes out the hot type on the backlight module, the heat of these generations will influence the characteristics of luminescence on the light-emitting diode (LED) backlight module.As shown in Figures 1 and 2, heat radiation at light emitting diode 91 backlight modules, existing way mostly is greatly and sticks radiator (Heat sink) 93 at the back side of circuit board (PCB) 92, perhaps as shown in Figure 3, use heat pipe (Heat pipe) 94 to be embedded in radiator 93 interior methods and transfer heat to airborne cooling mechanism with active or passive type, and since heat pipe 94 can't be clear and definite differentiation evaporation ends and condensation end, therefore, the heat that light emitting diode produced also can't bring to radiator 93 fast by heat pipe 94 and dispel the heat, and makes the usefulness of heat pipe 94 have a greatly reduced quality relatively.So prior art still has following disappearance:
1. if dispel the heat in the mode of free convection, the volume of the radiating fin of radiator 93 will be very big, take up space very much and weight and cost all very high.
2. because free convection is because the air themperature difference causes the density difference, the density of hot-air is less, make near the air of radiating fin of below up flow because of heat absorption, but when flowing to the top, itself has absorbed a lot of heats, make air themperature raise, near the radiating effect the radiating fin of top can become very poor relatively.Therefore, light emitting diode 91 is gone up a row and next row's temperature difference most, via Simulation result, often up to 10 degree above about.
3. carry out the heat radiation of forced convertion if increase fan, and can be subjected to the design influence of fan motor, make the central point of radiator 93 not have air quantity to pass through, also make the uniform temperature of light emitting diode 91 to be controlled effectively.
Duty is event, and the present invention tests and studies and a spirit of working with perseverance through concentrated in view of the disappearance of prior art, invents out this case " light-emitting device and radiating module thereof " eventually.Below for the brief description of this case.
Summary of the invention
Because above-mentioned problem, the object of the present invention is to provide a kind of can quick heat radiating and dispel the heat uniform light-emitting device and radiating module thereof.
Edge is, for reaching above-mentioned purpose, comprise a circuit board, at least one heat conducting element, a plurality of light-emitting component, at least one heat dissipation element and a source element according to a kind of light-emitting device of the present invention, wherein have configuration and contact mat a plurality of and that configuration links on the surface of circuit board, and a plurality of contact mat can be used as the binding of light-emitting component and circuit connection layout.Left and right halves on this circuit board has the strip groove of a plurality of designs that are arranged in parallel separately, but and heat conducting element of each groove supplying apparatus;
In addition, a plurality of light-emitting components are arranged on the heat conducting element, and heat dissipation element is arranged on a side on the circuit board, and link with this heat conducting element, and source element is arranged on this circuit board, and are connected with this heat conducting element.
Above-mentioned light-emitting component more comprises a heat-conducting metal portion and a plurality of pin that is arranged at this heat-conducting metal portion side, and wherein heat-conducting metal portion is welded on the heat conducting element, and these a plurality of pins then respectively with circuit board on corresponding contact mat link.
Above-mentioned heat conducting element is a heat pipe heat, comprise one first heat pipe and one second heat pipe, wherein first heat pipe comprises an evaporator section and spontaneous evaporation Duan Yiduan down and a condensation segment that is bent to form continuously outward, and second heat pipe comprises that an evaporator section and spontaneous evaporation Duan Yiduan are down and toward an interior condensation segment that is bent to form continuously; Wherein the condensation segment of first heat pipe and second heat pipe and this heat dissipation element link, and this evaporator section then links with this source element.
Above-mentioned heat dissipation element has at least one embeded slot, in order to the condensation segment in conjunction with first heat pipe and second heat pipe, and has a groove on the heat dissipation element, then in order to a ccontaining fan.
The present invention discloses a kind of radiating module in addition, comprise a circuit board, at least one heat conducting element, a plurality of light-emitting component and at least one heat dissipation element, wherein have configuration and contact mat a plurality of and that configuration links on the surface of circuit board, and these a plurality of contact mats then can be used as the binding of light-emitting component and circuit connection layout.Left and right halves on this circuit board has the strip groove of a plurality of designs that are arranged in parallel separately, but and heat conducting element of this each groove supplying apparatus; In addition, a plurality of light-emitting components are arranged on the heat conducting element; Heat dissipation element is arranged on a side on this circuit board, and links with this heat conducting element; And source element is arranged on this circuit board, and is connected with this heat conducting element.
Description of drawings
Fig. 1 is the cutaway view of existing backlight module;
Fig. 2 is the stereogram of existing backlight module;
Fig. 3 is another embodiment stereogram of existing backlight module;
Fig. 4 is the three-dimensional combination figure of the preferred embodiment of radiating module of the present invention;
Fig. 5 is that radiating module shown in Figure 4 is in the three-dimensional combination figure shown in the other direction;
Fig. 6 is the schematic perspective view of the preferred embodiment of heat pipe of the present invention;
Fig. 7 is the three-dimensional exploded view of the preferred embodiment of radiating module of the present invention;
Fig. 8 is the cutaway view of the preferred embodiment of radiating module of the present invention;
Fig. 9 is the cutaway view of another preferred embodiment of radiating module of the present invention;
Figure 10 is the cutaway view of the preferred embodiment of light-emitting device of the present invention;
Figure 11 is the making flow chart of the preferred embodiment of radiating module of the present invention.
The main element symbol description
1 circuit board, 11 grooves
2 heat pipe heat, 21 first heat pipes
211 evaporator sections, 212 condensation segments
22 second heat pipes, 221 evaporator sections
222 condensation segments, 23 heat pipes
231 evaporator sections, 232 condensation segments
3 radiators, 31 embeded slots
32 fans, 33 grooves
4 light-emitting diode chip for backlight unit, 41 heat-conducting metal portions
42 pins, 5 source elements
91 light emitting diodes, 92 circuit boards
93 radiators, 94 heat pipes
S101～S103 step
The specific embodiment
Technology contents of the present invention and effect will describe in detail in will describing in detail in the preferred embodiment of following conjunction with figs..
Please refer to Fig. 4 and shown in Figure 5, it is the textural association figure of the radiating module of present embodiment, and wherein this radiating module mainly comprises a circuit board 1, a plurality of heat conducting element, two heat dissipation elements and a plurality of light-emitting component.
The circuit board 1 of present embodiment can be general employed printed circuit board (PCB) (PCB) or a LTCC (LTCC) circuit board, wherein on a surface of this circuit board 1, have configuration and contact mat (Contact Pad) a plurality of and that this configuration links, wherein above-mentioned configuration is also unrestricted, can be serial or parallel connection, these a plurality of contact mats then can be used as the binding of configuration on this light-emitting component and this circuit board 1.As shown in Figure 7, the left and right halves on this circuit board 1 has the strip groove 11 of a plurality of designs that are arranged in parallel separately, but and heat conducting element of these each groove 11 supplying apparatus.
Cooperate shown in Figure 6ly, it is a heat pipe heat (Heat pipe) 2 that the heat conducting element of present embodiment is preferably, for example a pulsating heat pipe (Pulsating Heat Pipe) or a loop heat pipe (Loop Heat Pipe), and its thermal conductivity factor is about more than the 6000W/mK.Because being a kind of utilize in the phase transition process, heat pipe heat 2 absorbs or the character of distribute heat is carried out cooling technology; In detail, this heat pipe 2 is a vacuum body, and fills to be easy to evaporated liquid (evaporating temperature and environment temperature are close) in right amount, is sealed again.Each heat pipe heat 2 of the present invention comprises first heat pipe 21 and second heat pipe 22, wherein first heat pipe 21 more comprises an evaporator section 211 and from these evaporator section 211 1 ends down and a condensation segment 212 that is bent to form continuously outward, and second heat pipe 22 more comprise an evaporator section 221 and from these evaporator section 221 1 ends down and toward an interior condensation segment 222 that is bent to form continuously, and when this heat pipe 21,22 evaporator section 211,221 when being heated, this liquid carburation by evaporation, steam flows to the condensation segment 212 of the other end under small pressure reduction, 222 and emit heat and condense into this liquid, this liquid flows back to evaporator section 211 by capillarity again, 221, so just form a loop of going round and beginning again, reach the purpose that continues heat radiation, so be applicable to the heat radiation of this light-emitting component of any power, be particularly useful for the heat radiation of high-power light-emitting component.
The heat dissipation element of present embodiment can be a radiator (heat sink) 3 with a plurality of radiating fins, and this radiator 3 is main in order to shedding from the thermal source that this heat pipe heat 2 is imported; Therefore, cooperate the quantity of this heat pipe heat 2 and binding site on each radiator 3 and correspondingly be provided with a plurality of embeded slots 31, and this each embeded slot 31 is in order to the condensation segment 212,222 in conjunction with this first heat pipe 21 and second heat pipe 22, and after combination, the evaporator section 221 of this second heat pipe 22 is attached at the surface of this radiator 3, and is in same plane with the evaporator section 211 of this first heat pipe 21; Moreover, more can load a fan 32 again on this each radiator 3, therefore, the corresponding groove 33 that is provided with is embedded in wherein to hold this fan 32 on the radiating fin of this radiator 3; Whether be provided with or the quantity of its setting can decide according to the heat that this light-emitting component sent as for this fan 32.
The light-emitting component of present embodiment is a light-emitting diode chip for backlight unit (LED) 4, High Power LED (High Power LED for example, HP LED), light emitting diode matrix (LED Array), Organic Light Emitting Diode (OLED) or organic LED array (OLED Array) etc., and this light-emitting diode chip for backlight unit 4 comprises a heat-conducting metal portion 41 (slug) and a plurality of pin 42 that is arranged at these heat-conducting metal portion 41 sides.
See also Fig. 7 and shown in Figure 8, for radiating module preferred embodiment of the present invention exploded view and cutaway view, wherein be circuit board 1 foremost, each groove 11 of left side on this circuit board 1 and right-hand part can be respectively bury, adhere with edge or in mode such as welding is arranged on for a heat pipe heat 2, and 212,222 of the condensation segments of this first heat pipe 21 and second heat pipe 22 respectively bending to the behind of corresponding circuit board 1; Wherein no matter the set-up mode of these a plurality of heat pipe heat 2 is arranged on left side or the right-hand part on the circuit board 1, take first heat pipe 21 corresponding at circuit board 1 inboard and second heat pipe 22 corresponding in circuit board 1 outside set-up mode and be arranged in this groove 11, make the left side of this circuit board 1 and the direction of a plurality of heat pipe heat 2 that right-hand part is buried underground be reverse.
Cooperate shown in Figure 6, wherein can select suitable scolder and best reflow program (reflowprocess) for use, with the mode of utilizing surperficial adhesion technology (SMT) evaporator section 211 at first heat pipe 21 and second heat pipe 22, weld a plurality of light-emitting diode chip for backlight unit 4 on 221, and corresponding contact mat on the pin 42 of each light-emitting diode chip for backlight unit 4 and this circuit board 1 is linked by routing (WireBonding) mode, to transmit as electrical, again by the configuration in this circuit board 1, make this each light-emitting diode chip for backlight unit 4 can be in parallel, any-modes such as the series connection or the utilization simultaneously of also connecting link together, because the layout of circuit is the prior art in the affiliated field, yet non-emphasis of the present invention is not so give unnecessary details.The last filler of inserting an encapsulation usefulness again and will this above-mentioned light-emitting diode chip for backlight unit 4 and this contact mat be encapsulated on this circuit board 1; This light-emitting diode chip for backlight unit 4 after the encapsulation can avoid outside aqueous vapor or dust to invade and damage, and then promotes the reliability of this light-emitting device and this circuit board 1; Wherein this filler and unrestricted can be plastic cement, resin, for example: epoxy resin (epoxy resin) or silica gel (Silica gel) etc.
In addition, the condensation segment 22 of these radiating module both sides can connect a heat dissipation element more respectively, wherein the condensation segment 211,221 of first heat pipe 21 and second heat pipe 22 can embed on this radiator 3 in the corresponding embeded slot 31, make circuit board 1 both sides that are provided with a plurality of heat pipe heat 2 can load onto one group of radiator 3 separately, and also can reinstall a fan 32 to strengthen radiating effect on this each group radiator 3, and the air-flow that mounted fan 31 separately can be produced brushes, to promote heat radiation function.Moreover, the above-mentioned mode that light-emitting diode chip for backlight unit 4 is set directly at heat pipe heat 2, it mainly is when these light-emitting diode chip for backlight unit 4 runnings, the thermal source that this light-emitting diode chip for backlight unit 4 produces can directly be absorbed by heat pipe heat 2 and via this heat pipe heat 2 this radiator 3 is guided out and be sent to this thermal source from this light-emitting diode chip for backlight unit 4, to reduce the thermal resistance between light-emitting diode chip for backlight unit 4 and the heat pipe heat 2.
See also shown in Figure 9, cutaway view for another preferred embodiment of radiating module of the present invention, wherein the form of this heat pipe 23 also can be as shown in Figure 9, this heat pipe 23 comprise an evaporator section 231 equally and from these evaporator section 231 1 ends down and toward an interior condensation segment 232 that is bent to form continuously, can utilize the mode of surperficial adhesion technology (SMT) on this evaporator section 231, to weld a plurality of light-emitting diode chip for backlight unit 4 on this evaporator section 231, and the part of this condensation segment 232 also can be in conjunction with a radiator 3; The design of above-mentioned radiating module, form (left and right each one) owing to used less heat pipe 23, therefore, the length of its heat pipe 23 is shorter with respect to the composition of first heat pipe 21 of Fig. 8 and second heat pipe 22, and can use in the light-emitting device of general reduced size (as undersized LCD TV etc.).
See also shown in Figure 10, structure cutaway view for the present embodiment light-emitting device, wherein this light-emitting device comprises a radiating module and a source element 5, wherein this source element 5 is arranged in the space between 1 liang of side radiator 3 of circuit board, providing this light-emitting device luminous required power, and so design and can effectively save the space of use.
See also shown in Figure 11ly, also can utilize suitable scolder and temperature to follow between the condensation segment 212,222 of this each heat pipe heat 2 and the radiating fin of radiator 3, therefore, the reflow program on processing procedure (reflow process) step comprises:
Step S101: select suitable scolder for use, for example: scolders such as tin-bismuth solder or other scolders;
Step S102: this scolder is coated on the radiating fin of the condensation segment 212,222 of heat pipe heat 2 of radiating module and radiator 3, and the condensation segment 212,222 of heat pipe heat 2 and the radiating fin of radiator 3 are followed.
Step S103: the heat-conducting metal portion 41 (slug) and pin position 42 that this scolder are coated light-emitting diode chip for backlight unit 4, and radiating module and light-emitting diode chip for backlight unit 4 are welded simultaneously, make the heat-conducting metal portion of light-emitting diode chip for backlight unit 4 can be then on heat pipe heat 2, and the pin position 42 of this light-emitting diode chip for backlight unit 4 be then on circuit board 1;
Wherein the execution sequence of above-mentioned steps S102 and S103 can be changed, and with which step does not need to carry out as restriction earlier.
In addition, about the heat-conducting metal portion 41 of light-emitting diode chip for backlight unit 4 and following of heat pipe heat 2, also can use other materials or mode to follow, for example: heat-conducting cream (thermal grease), heat conduction adhesive tape (thermal tape), phase change glue (phase change paste), joint filling adhesive tape (gap filler tape) etc., therefore, no matter with which kind of material or mode follow, the heat-conducting metal portion 41 that all should be covered by light-emitting diode chip for backlight unit 4 is directly then in the notion on heat pipe heat 2 surfaces.Again the welding of the pin position 42 of light-emitting diode chip for backlight unit 4 do not limit with surface adhesion technology (SMT) mode, plug-in type or or even increase other fasteners and fix, and all should be covered by direct the following of heat-conducting metal portion of auxiliary light emission diode chip for backlight unit 4 in the notion on heat pipe heat 2 surfaces.
In sum, the present invention directly contacts this light-emitting component with this heat conducting element, so when long-time the use, the thermal source that single or multiple light-emitting component distributes can be via this heat conducting element simultaneously, fast and be sent to the condensation segment (cold junction) of this heat conducting element equably from this heat conducting element and the contacted evaporator section of this light-emitting component (hot junction) with same direction, thermal source is sent on this heat dissipation element again so that thermal source is shed, this kind mode not only can reach the effect of heat radiation at short notice fast, and make this circuit board integral body have uniform temperature, and promote the reliability and the heat dissipation of light-emitting device.
The above only is preferred embodiment of the present invention, and the foregoing description only is used for illustrating but not in order to limit claim of the present invention, category of the present invention is defined by following claim.All equalizations of doing according to claim of the present invention change and modify, and all should belong to covering scope of the present invention.
Claims (16)
1. light-emitting device comprises:
Circuit board has at least one groove;
At least one heat conducting element is arranged in this groove;
A plurality of light-emitting components are arranged on this heat conducting element;
At least one heat dissipation element is arranged on this circuit board, and links with this heat conducting element; And
Source element is arranged on this circuit board, and is connected with this light-emitting component, in order to provide this light-emitting device running required power.
2. light-emitting device as claimed in claim 1 wherein have configuration and contact mat a plurality of and that this configuration links on the surface of this circuit board, and these a plurality of contact mats is as the binding of this light-emitting component and this circuit connection layout.
3. light-emitting device as claimed in claim 2, wherein this light-emitting component more comprises heat-conducting metal portion and a plurality of pin that is arranged at this heat-conducting metal portion side, and this heat-conducting metal portion and this heat conducting element link, and this a plurality of pins respectively with this circuit board on corresponding contact mat binding.
4. light-emitting device as claimed in claim 1, wherein this heat conducting element is a heat pipe heat, comprise first heat pipe and second heat pipe, and this first heat pipe has evaporator section and from this evaporator section one end down and the condensation segment that is bent to form continuously outward, and this second heat pipe has evaporator section and from this evaporator section one end down and toward the interior condensation segment that is bent to form continuously, and the condensation segment of this first heat pipe and this second heat pipe is combined in the corresponding embeded slot on this heat dissipation element.
5. light-emitting device as claimed in claim 4, wherein this heat conducting element take this first heat pipe corresponding at this circuit board inboard and this second heat pipe corresponding in this circuit board outside set-up mode and be arranged in this groove.
6. light-emitting device as claimed in claim 1, wherein this heat conducting element is a heat pipe, and this heat pipe has evaporator section and from this evaporator section one end down and toward the interior condensation segment that is bent to form continuously, and this condensation segment is combined in the embeded slot on this heat dissipation element.
7. light-emitting device as claimed in claim 1 wherein has groove on this heat dissipation element, in order to ccontaining fan.
8. light-emitting device as claimed in claim 1 wherein more comprises a filler, in order to this light-emitting component is encapsulated on this circuit board.
9. radiating module comprises:
Circuit board has at least one groove;
At least one heat conducting element is arranged in this groove;
A plurality of light-emitting components are arranged on this heat conducting element; And
At least one heat dissipation element is arranged on this circuit board, and links with this heat conducting element.
10. radiating module as claimed in claim 9 wherein have configuration and contact mat a plurality of and that this configuration links on the surface of this circuit board, and these a plurality of contact mats is as the binding of this light-emitting component and this circuit connection layout.
11. radiating module as claimed in claim 10, wherein this light-emitting component more comprises heat-conducting metal portion and a plurality of pin that is arranged at this heat-conducting metal portion side, and this heat-conducting metal portion and this heat conducting element link, and this a plurality of pins respectively with this circuit board on corresponding contact mat binding.
12. radiating module as claimed in claim 9, wherein this heat conducting element is a heat pipe heat, comprise first heat pipe and second heat pipe, and this first heat pipe has an evaporator section and from this evaporator section one end down and the condensation segment that is bent to form continuously outward, and this second heat pipe has evaporator section and from this evaporator section one end down and toward the interior condensation segment that is bent to form continuously, and the condensation segment of this first heat pipe and this second heat pipe is combined in the corresponding embeded slot on this heat dissipation element.
13. radiating module as claimed in claim 12, wherein this heat conducting element take this first heat pipe corresponding at this circuit board inboard and this second heat pipe corresponding in this circuit board outside set-up mode and be arranged in this groove.
14. radiating module as claimed in claim 9, wherein this heat conducting element is a heat pipe, and this heat pipe has evaporator section and from this evaporator section one end down and toward the interior condensation segment that is bent to form continuously, and this condensation segment is combined in the embeded slot on this heat dissipation element.
15. radiating module as claimed in claim 9 wherein has groove on this heat dissipation element, in order to ccontaining fan.
16. radiating module as claimed in claim 9 wherein more comprises filler, in order to this light-emitting component is encapsulated on this circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101399979A CN101363602A (en) | 2007-08-07 | 2007-08-07 | Illuminating device and radiating module thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101399979A CN101363602A (en) | 2007-08-07 | 2007-08-07 | Illuminating device and radiating module thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101363602A true CN101363602A (en) | 2009-02-11 |
Family
ID=40390118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101399979A Pending CN101363602A (en) | 2007-08-07 | 2007-08-07 | Illuminating device and radiating module thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101363602A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102889566A (en) * | 2011-07-19 | 2013-01-23 | 宁波福民照明科技有限公司 | Cooling and thermal protection device of light-emitting diode (LED) lamp |
| CN105338792A (en) * | 2015-11-16 | 2016-02-17 | 余原生 | Heat conducting structure of heat pipe and preparation process thereof |
| CN105953192A (en) * | 2016-06-22 | 2016-09-21 | 东莞市闻誉实业有限公司 | Efficient LED heat dissipation equipment |
-
2007
- 2007-08-07 CN CNA2007101399979A patent/CN101363602A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102889566A (en) * | 2011-07-19 | 2013-01-23 | 宁波福民照明科技有限公司 | Cooling and thermal protection device of light-emitting diode (LED) lamp |
| CN105338792A (en) * | 2015-11-16 | 2016-02-17 | 余原生 | Heat conducting structure of heat pipe and preparation process thereof |
| CN105953192A (en) * | 2016-06-22 | 2016-09-21 | 东莞市闻誉实业有限公司 | Efficient LED heat dissipation equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7581856B2 (en) | High power LED lighting assembly incorporated with a heat dissipation module with heat pipe | |
| US6152213A (en) | Cooling system for electronic packages | |
| US7198386B2 (en) | Versatile thermally advanced LED fixture | |
| US20090034275A1 (en) | Light-emitting device and heat-dissipating module thereof | |
| US7942194B2 (en) | Heat sink | |
| US20080062694A1 (en) | Heat dissipation device for light emitting diode module | |
| US20070090737A1 (en) | Light-emitting diode assembly and method of fabrication | |
| CN101619840B (en) | Light source module and LED lamp using same | |
| US20080025023A1 (en) | Light-emitting heat-dissipating device and manufacturing method thereof | |
| US20090059604A1 (en) | Heat dissipation device for light emitting diode module | |
| KR101010351B1 (en) | heatsink using Nanoparticles | |
| CN103185246B (en) | Lighting device | |
| US20140184050A1 (en) | Lighting Apparatus | |
| CN101363602A (en) | Illuminating device and radiating module thereof | |
| CN202631938U (en) | Laser light source and related projection system | |
| CN101415312B (en) | Radiating device | |
| CN101123226A (en) | Luminescent and heat radiation device and its making method | |
| CN101123227A (en) | Luminescent and heat radiation device and its encapsulation making method | |
| KR101272748B1 (en) | Led headlamp for vehicle | |
| CN102802379B (en) | Radiating subassembly and electronic equipment | |
| TWI385343B (en) | Light source and passive thermal heat dissipation apparatus thereof | |
| JP2018174184A (en) | Cooler and lighting device including cooler | |
| CN203453861U (en) | Water-cooling heat dissipation type high-power LED device | |
| CN108430158A (en) | A kind of flexible circuit board of the mobile phone with fixing device | |
| CN217160294U (en) | Metal substrate electronic component with radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20090211 |