CN101358034B - 一种尺寸稳定性型聚酰亚胺薄膜及其制备方法 - Google Patents
一种尺寸稳定性型聚酰亚胺薄膜及其制备方法 Download PDFInfo
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- CN101358034B CN101358034B CN200810196134XA CN200810196134A CN101358034B CN 101358034 B CN101358034 B CN 101358034B CN 200810196134X A CN200810196134X A CN 200810196134XA CN 200810196134 A CN200810196134 A CN 200810196134A CN 101358034 B CN101358034 B CN 101358034B
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- dimethylacetamide
- polyimide film
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- 229920001721 polyimide Polymers 0.000 title claims abstract description 23
- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000002904 solvent Substances 0.000 claims abstract description 18
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims abstract description 12
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 14
- 238000006243 chemical reaction Methods 0.000 claims description 12
- 229920000642 polymer Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 229910000831 Steel Inorganic materials 0.000 claims description 8
- 238000007334 copolymerization reaction Methods 0.000 claims description 8
- 239000010959 steel Substances 0.000 claims description 8
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 7
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims description 7
- 206010039424 Salivary hypersecretion Diseases 0.000 claims description 4
- 238000012661 block copolymerization Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 150000004985 diamines Chemical class 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 229920005575 poly(amic acid) Polymers 0.000 claims description 4
- 238000005096 rolling process Methods 0.000 claims description 4
- 208000026451 salivation Diseases 0.000 claims description 4
- 238000007601 warm air drying Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 3
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 abstract 3
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 abstract 3
- 229920001577 copolymer Polymers 0.000 abstract 3
- 229940113088 dimethylacetamide Drugs 0.000 abstract 3
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 abstract 1
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- MHABMANUFPZXEB-UHFFFAOYSA-N O-demethyl-aloesaponarin I Natural products O=C1C2=CC=CC(O)=C2C(=O)C2=C1C=C(O)C(C(O)=O)=C2C MHABMANUFPZXEB-UHFFFAOYSA-N 0.000 description 24
- 150000004986 phenylenediamines Chemical class 0.000 description 12
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 7
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
Description
| 性能 | 单位 | 高拓公司普通型 | 高拓公司尺寸稳定性型 | 钟渊化工25μmNPI尺寸稳定型 | 测试条件 | 测试方法 |
| 模量 | GPa | 3.0 | 4.0 | 4.0 | 23℃ | ASTM-D882 |
| 拉伸强度 | MPa | 200 | 300 | 320 | 23℃ | ASTM-D882 |
| 断裂伸长率 | ％ | 90 | 60 | 70 | 23℃ | ASTM-D882 |
| 热收缩率 | ％ | 0.1 | 0.06 | 0.05 | 200℃1h | ASTM-D882 |
| 热膨胀系数 | PPm/℃ | 32 | 18 | 16 | 50-200℃ | ASTM-D882 |
| 体积电阻率 | Ω.cm | >10<sup>15</sup> | >10<sup>15</sup> | >10<sup>15</sup> | 23℃ | ASTM-D257 |
| 交流电气强度 | V/μm | 200 | 260 | 300 | 23℃60HZ | ASTM-D149 |
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810196134XA CN101358034B (zh) | 2008-09-16 | 2008-09-16 | 一种尺寸稳定性型聚酰亚胺薄膜及其制备方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810196134XA CN101358034B (zh) | 2008-09-16 | 2008-09-16 | 一种尺寸稳定性型聚酰亚胺薄膜及其制备方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101358034A CN101358034A (zh) | 2009-02-04 |
| CN101358034B true CN101358034B (zh) | 2010-09-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810196134XA Active CN101358034B (zh) | 2008-09-16 | 2008-09-16 | 一种尺寸稳定性型聚酰亚胺薄膜及其制备方法 |
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| Country | Link |
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| CN (1) | CN101358034B (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106893121A (zh) * | 2015-12-17 | 2017-06-27 | 深圳瑞华泰薄膜科技有限公司 | 一种高尺寸稳定型聚酰亚胺薄膜及其制备方法 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102391532B (zh) * | 2011-08-26 | 2012-11-14 | 朱宏清 | 挠性印刷电路板基材用双向拉伸聚酰亚胺薄膜及制备方法 |
| CN102729561A (zh) * | 2012-07-19 | 2012-10-17 | 宜兴市高拓高分子材料有限公司 | 一种用于制造无胶系柔性线路板的聚酰亚胺薄膜及其制备方法 |
| CN104073155B (zh) * | 2013-03-25 | 2016-09-07 | 北京化工大学 | 一种240级共混聚酰亚胺漆包线漆的制备方法 |
| CN104788694B (zh) * | 2015-04-29 | 2018-06-08 | 江苏亚宝绝缘材料股份有限公司 | 一种超低收缩率的聚酰亚胺薄膜 |
| CN109628005B (zh) * | 2018-11-20 | 2019-10-18 | 深圳市弘海电子材料技术有限公司 | 无线充电用超薄黑色覆盖膜及其制备方法 |
| CN117285735B (zh) * | 2023-11-24 | 2024-02-20 | 烟台泰和新材高分子新材料研究院有限公司 | 一种聚酰亚胺膜及其连续化生产系统和方法以及绝缘材料 |
-
2008
- 2008-09-16 CN CN200810196134XA patent/CN101358034B/zh active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106893121A (zh) * | 2015-12-17 | 2017-06-27 | 深圳瑞华泰薄膜科技有限公司 | 一种高尺寸稳定型聚酰亚胺薄膜及其制备方法 |
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| Publication number | Publication date |
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| CN101358034A (zh) | 2009-02-04 |
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Address after: Yang Xiang Zhen Huang Jia Cun 214200 Jiangsu city of Yixing province Yixing Gaotuo polymer material Co Ltd Patentee after: Wuxi high extension new material Limited by Share Ltd Address before: Yang Xiang Zhen Huang Jia Cun 214200 Jiangsu city of Yixing province Yixing Gaotuo polymer material Co Ltd Patentee before: Yixing Goto Macromolecule Materials Co., Ltd. |
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