CN101295854A - Optoelectronic element encapsulation structure with temperature compensation - Google Patents
Optoelectronic element encapsulation structure with temperature compensation Download PDFInfo
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- CN101295854A CN101295854A CNA2007100977350A CN200710097735A CN101295854A CN 101295854 A CN101295854 A CN 101295854A CN A2007100977350 A CNA2007100977350 A CN A2007100977350A CN 200710097735 A CN200710097735 A CN 200710097735A CN 101295854 A CN101295854 A CN 101295854A
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Abstract
The invention discloses a photoelectric element packaging structure with temperature compensation, which comprises a substrate, a first light emission element arranged on the substrate, a second light emission element, a photo-sensitive element and a driving element. In an embodiment, the first light emission element, the second light emission element, the photo-sensitive element and the driving element can be provided with an inner space formed by a first shell and joined together with a second shell. In another embodiment, the second light emission element and the photo-sensitive element are positioned in the inner space of a third shell. The first light emission element and the second light emission element emit light by being driven by the driving element. The photo-sensitive element arranged adjacent to a second position is used for sensing the light emission strength of the second light emission element. Therefore, the second light emission element is arranged to ensure that the photo-sensitive element can sense the light emission strength more accurately in the environment without other interference so as to feed back the current working state of the light emission elements and fulfill the function of temperature compensation by a laser driver, thereby reducing effect generated by temperature on the light emission elements and ensuring that the light emission elements can emit light accurately and rightly.
Description
Technical field
The present invention relates to a kind of optoelectronic component encapsulation construction, particularly a kind of optoelectronic component encapsulation construction that does not have joint with temperature-compensating with temperature-compensating.
Background technology
Prior art discloses a kind of photoelectric cell shown in Figure 1A～Fig. 1 C.Shown in Figure 1A, it mainly is made up of clamshell 101 and 102 of joints (HEADER), and clamshell 101 is socketed on the joint 102.Traditional photoelectric cell encapsulation is because of airtight demand, and on the structure of joint design, the processing procedure of taking metal to combine with glass makes the metal pin can be fixed on the joint 102.The metal pin then further is connected with printed circuit board (PCB) so that the electronic component on the printed circuit board (PCB) with can electrically link up with photoelectric cell.
Shown in Fig. 1 C, but the light-emitting component that laser diode 107 and photodiode 108 are integrated into be arranged in the space that joint (HEADER) upper metal pin crossed, photodiode 108 is in order to the luminous intensity of sensing laser diode 107.After the metal pin of this laser diode 107 and photodiode 108 and joint top welds with gold thread, after the metal pin of joint below and the external circuit binding, can make electronic signal pass through the running of this photoelectric cell with optical signal transmission.
Because the space that joint (HEADER) upper metal pin is crossed is limited, and the size of photodiode 108 is usually greater than laser diode 107, therefore, laser diode 107 and photodiode 108 and other relevant circuit element to be set in limited space, will cause the size of joint to increase.Shown in Figure 1B, joint 104 has eight pin positions, and the joint 106 shown in Fig. 1 C has ten pin positions, when the size of joint (HEADER) becomes big, clamshell 103 also can be unfavorable for the development trend of present consumer products miniaturization along with increase with the size of clamshell 105.
In addition, prior art also faces the test of issues of temperature compensation, shown in Figure 1A～disclosed photoelectric cell of Fig. 1 C, when being applied to one-way transmission, because the relation that light can produce scattering that laser diode 107 is launched, photodiode 108 possibly can't receive the luminous intensity of correct proportions; Same, when being applied to transmitted in both directions, the luminous intensity that photodiode 108 is received may comprise light and another incident light that laser diode 107 is sent especially, therefore, under the situation that can't receive correct reflection light quantity, the luminous intensity of desiring to be sensed with photodiode 108 compensates and may produce mistake and can't correctly compensate, and then makes the signal strength signal intensity of transmission be affected.
Further problem is the energy attenuation that the laser chip temperature influence is caused, therefore when temperature increases, the luminous intensity of laser diode 107 will weaken thereupon, and then make photodiode 108 sense the intensity that weakens, may cause compensating circuit or drive circuit further to increase the luminous intensity of the power of driving laser diode 107 with increase laser diode 107, so the light signal that is transmitted then can't react actual situation and further produce error.
Summary of the invention
Technical problem to be solved by this invention is, discloses a kind of optoelectronic component encapsulation construction with temperature-compensating.
In order to realize above-mentioned purpose, the invention provides a kind of optoelectronic component encapsulation construction with temperature-compensating, include a substrate; One first light-emitting component is arranged at a primary importance of substrate; One second light-emitting component is arranged at the second place of substrate; One driving element is in order to drive first light-emitting component and second light-emitting component is luminous; And a photo-sensitive cell, it is adjacent to second light-emitting component, in order to the luminous intensity of sensing second light-emitting component; One first clamshell is fixedly arranged on the substrate, and first clamshell has an inner space and one first joint; One second clamshell has one second joint, a collar and an eyeglass, second joint and first connector engages, and the collar is in order to accept outer member, and eyeglass is arranged at the collar bottom of second clamshell, in order to transmit the light that first light-emitting component is launched.Wherein the primary importance and the second place are arranged in the inner space of first clamshell.
This encapsulating structure more includes one the 3rd clamshell, is fixedly arranged on the substrate, and the 3rd clamshell has an inner space, and the second place is arranged in the inner space of the 3rd clamshell.
In order to realize above-mentioned purpose, the present invention also provides a kind of optoelectronic component encapsulation construction with temperature-compensating, includes a substrate; One first light-emitting component is arranged at a primary importance of substrate; One second light-emitting component is arranged at the second place of substrate; One driving element is in order to drive first light-emitting component and second light-emitting component is luminous; One photo-sensitive cell, its position are adjacent to second light-emitting component, in order to the luminous intensity of sensing second light-emitting component; And a clamshell, being fixedly arranged on the substrate, clamshell has an inner space is arranged, a collar and an eyeglass, and the collar is in order to accept an outer member, and eyeglass is arranged at the collar bottom of clamshell, in order to transmit the light that first light-emitting component is launched.Wherein the primary importance and the second place are arranged in the inner space of clamshell.
This encapsulating structure more includes one second clamshell, is fixedly arranged on the substrate, and second clamshell has an inner space, and the second place is arranged in the inner space of second clamshell.
First light-emitting component and second light-emitting component are selected from the laser diode of being produced by same chip, and because of it has similar optical semiconductor electrical characteristics, the photoelectric characteristic under variations in temperature also has similar performance.
By one group of reponse system is set, that is second light-emitting component and photo-sensitive cell, and by second light-emitting component and photo-sensitive cell with sensing and feed back the present operating state of first light-emitting component, and the selection of cooperation laser driver, reach reponse system with temperature-compensating, to reduce temperature, make the intensity that first light-emitting component can be precisely correct luminous to the influence that first light-emitting component is produced.
The present invention has following useful effect is arranged: the present invention is by increasing by second light-emitting component, make photo-sensitive cell can be in not having the environment of other interference sensing luminous intensity more accurately, and via the present operating state of reponse system feedback light emitting element, reach temperature compensation function by laser driver again, to reduce temperature, make the intensity that light-emitting component can be precisely correct luminous to the influence that light-emitting component was produced.Otherwise prior art only has a light-emitting component, so photo-sensitive cell often can't sensing accurate light emission intensity, and the precision control that more leisure opinion is follow-up when carrying out temperature-compensating.
Further, the present invention directly with the photoelectric cell gluing, be packaged on the circuit board, significantly reduce complicated operation, and can on circuit board, required circuit be set the actual needs according to circuit, can increase the integrality and the conformability of system.Structure that the present invention in addition discloses can be applicable to the encapsulation procedure of printed circuit board (PCB), also makes automated production become possibility.
For enabling further to understand feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet accompanying drawing only provide with reference to and the explanation usefulness, be not to be used for the present invention is limited.
Description of drawings
Figure 1A～Fig. 1 C is the schematic diagram of the disclosed optoelectronic component encapsulation construction of prior art.
Fig. 2 is the structural representation of first embodiment of the disclosed optoelectronic component encapsulation construction of the present invention.
Fig. 3 is the structural representation of second embodiment of the disclosed optoelectronic component encapsulation construction of the present invention.
Fig. 4 is the structural representation of the 3rd embodiment of the disclosed optoelectronic component encapsulation construction of the present invention.
Fig. 5 is the structural representation of the 4th embodiment of the disclosed optoelectronic component encapsulation construction of the present invention.
Wherein, Reference numeral:
The 101-clamshell
The 102-joint
The 103-clamshell
The 104-joint
The 105-clamshell
The 106-joint
The 107-laser diode
The 108-photodiode
The 210-substrate
220-first clamshell
221-first joint
The 222-inner space
230-second clamshell
231-second joint
The 232-collar
The 240-eyeglass
251-first light-emitting component
252-second light-emitting component
The 253-driving element
The 254-photo-sensitive cell
260-the 3rd clamshell
The 261-inner space
The 271-primary importance
The 272-second place
273-the 3rd position
The 274-second place
The 310-substrate
The 320-clamshell
The 322-inner space
The 332-collar
The 340-eyeglass
351-first light-emitting component
352-second light-emitting component
The 353-driving element
The 354-photo-sensitive cell
360-second clamshell
The 361-inner space
The 371-primary importance
The 372-second place
373-the 3rd position
The 374-second place
Has the body execution mode
Below in execution mode, be described in detail detailed features of the present invention, its content is enough to make any related art techniques person of haveing the knack of to understand technology contents of the present invention and implements according to this, and according to the disclosed content of this specification, claim and accompanying drawing, any related art techniques person of haveing the knack of can understand purpose and the advantage that the present invention is correlated with easily.Following embodiment further describes viewpoint of the present invention, but non-to limit category of the present invention anyways.
Please refer to Fig. 2, it is the disclosed first embodiment schematic diagram with optoelectronic component encapsulation construction of temperature-compensating of the present invention.As shown in the figure, optoelectronic component encapsulation construction includes a substrate 210, one first clamshell 220, one second clamshell 230, an eyeglass 240, first light-emitting component 251, one second light-emitting component 252, a driving element 253 and a photo-sensitive cell 254.
One first light-emitting component 251, one second light-emitting component 252, a driving element 253 and a photo-sensitive cell 254 are set on the substrate 210.First light-emitting component 251, second light-emitting component 252, driving element 253 and a photo-sensitive cell 254 all are arranged in the inner space 220 of first clamshell 220.In one embodiment, first light-emitting component 251 and second light-emitting component 252 are a laser diode.In one embodiment, driving element 253 is the chip for driving of a driving laser diode.Photo-sensitive cell 254 is a photodiode.
First light-emitting component 251 is arranged at the primary importance 271 on the substrate 210, this primary importance 271 is arranged in the inner space 222 of first clamshell 220, is sent to outer member so that the light that first light-emitting component 251 is launched can not stopped by the inwall of first clamshell 220.Second light-emitting component 252 is arranged at a second place 272 that is different from primary importance 271 on the substrate 210, and the second place 272 is arranged in the inner space 222 of first clamshell 220 equally.Second light-emitting component 252 is only as luminous use, not as the element that transmits light signal.Be arranged at the light that second light-emitting component 252 of the second place 272 sent and stopped that by the inwall of first clamshell 220 back reflection can not be sent to the outside to its luminous intensity of photo-sensitive cell 254 sensings.
In the present embodiment, driving element 253 is arranged at one the 3rd position 273 on the substrate 210.In another embodiment, driving element 253 is arranged at substrate 210 other positions, and this position is not in the inner space 222 of first clamshell 220 (not being shown among the figure).Driving element 253 is in order to accepting the control of a signal of telecommunication, to drive first light-emitting component 251 and second light-emitting component 252 is luminous.First light-emitting component 251 and second light-emitting component 252 are selected from the laser diode of being produced by same chip, and because of it has similar optical semiconductor electrical characteristics, the photoelectric characteristic under variations in temperature also has similar performance.
In the present embodiment, photo-sensitive cell 254 is arranged at a side of second light-emitting component 252 and adjacent with second light-emitting component 252, in another embodiment can the stack manner setting (as Fig. 3 to embodiment shown in Figure 5).The size of photo-sensitive cell 254 is greater than the size of second light-emitting component 252.Therefore, the luminous intensity of utilizing photo-sensitive cell 254 sensings second light-emitting component 252 to be launched, can corresponding learn the luminous intensity of present first light-emitting component 251, and the luminous intensity of institute's sensing fed back to driving element 253, so that driving element 253 can be adjusted drive current to drive first light-emitting component 251 according to the luminous intensity of institute's sensing, according to this framework, whether second light-emitting component 252 and photo-sensitive cell 254 be in order to as a feedback module, normal to feed back the present operating state of first light-emitting component 251.
Please refer to Fig. 3, it is for the second embodiment schematic diagram of the disclosed optoelectronic component encapsulation construction of the present invention.Its main element and function and first embodiment are similar, and difference has been more than second embodiment one the 3rd clamshell 260.
The 3rd clamshell 260 is fixedly arranged on the substrate 210, normally in the gluing mode the 3rd clamshell 260 is installed on the substrate.Certainly, with functional different, clamshell also can adopt welding manner to be fixedly arranged on the substrate according to the material of clamshell.The 3rd clamshell 260 has has an inner space 261, the second light-emitting components 252 and photo-sensitive cell 254 to be arranged on the substrate 210 in the inner space 261 of the 3rd clamshell 260 second place 274 promptly shown in Figure 3.In the present embodiment, second light-emitting component 252 is stacked in the top of photo-sensitive cell 254, certainly, its side by side mode arrange.
Please refer to Fig. 4, it is for the 3rd embodiment schematic diagram of the disclosed optoelectronic component encapsulation construction of the present invention.As shown in the figure, optoelectronic component encapsulation construction includes a substrate 310 and a clamshell 320.
One first light-emitting component 351, one second light-emitting component 352, a driving element 353 and a photo-sensitive cell 354 are set on the substrate 310.First light-emitting component 351, second light-emitting component 352, driving element 353 and a photo-sensitive cell 354 all are arranged in the inner space 322 of clamshell 320.In one embodiment, first light-emitting component 351 and second light-emitting component 352 are a laser diode, and driving element 353 is the chip for driving of a driving laser diode, and photo-sensitive cell 354 is a photodiode.
First light-emitting component 351 is arranged at the primary importance 371 on the substrate 310, this primary importance 371 is arranged in the inner space 322 of clamshell 320, is sent to outer member so that the light that first light-emitting component 351 is launched can not stopped by the inwall of clamshell 320.Second light-emitting component 352 is arranged at a second place 372 that is different from primary importance on the substrate 310, and the second place 372 is arranged in the inner space 322 of clamshell 320 equally.Second light-emitting component 352 is only as luminous use, not as the element that transmits light signal.Being arranged at the light that second light-emitting component 352 of the second place 372 sent can be stopped back reflection to photo-sensitive cell 354 by the inwall of clamshell 320, and can not be sent to the outside.
In one embodiment, driving element 353 is arranged at one the 3rd position 373 on the substrate 310.In another embodiment, driving element 353 is arranged at substrate 310 other positions, and this position is not in the inner space 322 of clamshell 320.Driving element 353 is in order to accepting the control of a signal of telecommunication, to drive first light-emitting component 351 and second light-emitting component 352 is luminous.First light-emitting component 351 and second light-emitting component 352 are selected from the laser diode of being produced by same chip, thereby it has similar optical semiconductor electrical characteristics, and the photoelectric characteristic under variations in temperature also has similar performance is arranged.
In the present embodiment, second light-emitting component 352 is stacked in the top of photo-sensitive cell 354, and mode is provided with side by side in another embodiment.The size of photo-sensitive cell 354 is greater than the size of second light-emitting component 352.The luminous intensity of utilizing photo-sensitive cell 354 sensings second light-emitting component 352 to be launched, can corresponding learn the luminous intensity of present first light-emitting component 351, and the luminous intensity of institute's sensing fed back to driving element 353, so that driving element 353 can be adjusted drive current to drive first light-emitting component 351 according to the luminous intensity of institute's sensing.By above explanation, second luminous yuan 352 with photo-sensitive cell 354 in order to as a feedback module, whether normal to feed back the present operating state of first light-emitting component 351.
Please refer to Fig. 5, it is for the 4th embodiment schematic diagram of the disclosed optoelectronic component encapsulation construction of the present invention.Its main element and function and the 3rd embodiment are similar, and difference is that the 4th embodiment has one second clamshell 360.
The disclosed embodiment according to the present invention, it utilizes the characteristic of laser diode, the laser diode that selection is produced by same chip, because of it has similar optical semiconductor electrical characteristics, the photoelectric characteristic under variations in temperature also has similar performance is arranged.
In sum, the present invention is by increasing by second light-emitting component, make photo-sensitive cell can be in not having the environment of other interference sensing luminous intensity more accurately, and via the present operating state of reponse system feedback light emitting element, reach temperature compensation function by laser driver again, to reduce temperature, make the intensity that light-emitting component can be precisely correct luminous to the influence that light-emitting component was produced.Otherwise prior art only has a light-emitting component, so photo-sensitive cell often can't sensing accurate light emission intensity, and the precision control that more leisure opinion is follow-up when carrying out temperature-compensating.
Further, the present invention directly with the photoelectric cell gluing, be packaged on the circuit board, significantly reduce complicated operation, and can on circuit board, required circuit be set the actual needs according to circuit, can increase the integrality and the conformability of system.Structure that the present invention in addition discloses can be applicable to the encapsulation procedure of printed circuit board (PCB), also makes automated production become possibility.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; being familiar with those of ordinary skill in the art ought can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (10)
1. one kind has the photoelectric element-packaging structure that temperature-compensating is arranged, and it is characterized in that, this encapsulating structure includes:
One substrate;
One first light-emitting component is arranged at a primary importance of this substrate;
One second light-emitting component is arranged at the second place of this substrate;
One driving element is arranged on this substrate, in order to drive this first light-emitting component and this second light-emitting component is luminous;
One photo-sensitive cell, it is arranged at this second place and adjacent to this second light-emitting component, in order to the luminous intensity of this second light-emitting component of sensing; And
One clamshell, be fixedly arranged on this substrate, this clamshell has an inner space is arranged, a collar and an eyeglass, and this collar is in order to accept an outer member, this eyeglass is arranged at this collar bottom of this clamshell, in order to transmit light that this first light-emitting component launches to this outer member.
2. encapsulating structure according to claim 1 is characterized in that, this primary importance and this second place are arranged in this inner space of this clamshell.
3. encapsulating structure according to claim 1 is characterized in that, this encapsulating structure more includes one second clamshell, and it is fixedly arranged on this substrate, and this second light-emitting component and this photo-sensitive cell are positioned on this second place of this second clamshell.
4. encapsulating structure according to claim 1 is characterized in that, this first light-emitting component and this second light-emitting component production are from same chip.
5. encapsulating structure according to claim 1 is characterized in that, the size of this photo-sensitive cell is greater than the size of this second light-emitting component and be stacked in the below of this second light-emitting component.
6. one kind has the photoelectric element-packaging structure that temperature-compensating is arranged, and it is characterized in that, this encapsulating structure includes:
One substrate;
One first light-emitting component is arranged at a primary importance of this substrate;
One second light-emitting component is arranged at the second place of this substrate;
One driving element is arranged on this substrate, in order to drive this first light-emitting component and this second light-emitting component is luminous;
One photo-sensitive cell is arranged at this second place and adjacent to this second light-emitting component, in order to the luminous intensity of this second light-emitting component of sensing;
One first clamshell is fixedly arranged on this substrate, and this first clamshell has an inner space and one first joint are arranged; And
One second clamshell, have one second joint, a collar and an eyeglass, this second joint and this first connector engages, this collar is in order to accept an outer member, this eyeglass is arranged at this collar bottom of this second clamshell, in order to transmit the light that this first light-emitting component is launched.
7. encapsulating structure according to claim 6 is characterized in that, this primary importance and this second place are arranged in this inner space of this first clamshell.
8. encapsulating structure according to claim 1 is characterized in that, this encapsulating structure more includes one the 3rd clamshell, and it is fixedly arranged on this substrate, and this second light-emitting component and this photo-sensitive cell are positioned on the second place of the 3rd clamshell.
9. encapsulating structure according to claim 6 is characterized in that, this first light-emitting component and this second light-emitting component production are from same chip.
10, encapsulating structure according to claim 6 is characterized in that, the size of this photo-sensitive cell is greater than the size of this second light-emitting component and be stacked in the below of this second light-emitting component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710097735A CN100592586C (en) | 2007-04-28 | 2007-04-28 | Optoelectronic element encapsulation structure with temperature compensation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710097735A CN100592586C (en) | 2007-04-28 | 2007-04-28 | Optoelectronic element encapsulation structure with temperature compensation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101295854A true CN101295854A (en) | 2008-10-29 |
| CN100592586C CN100592586C (en) | 2010-02-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200710097735A Expired - Fee Related CN100592586C (en) | 2007-04-28 | 2007-04-28 | Optoelectronic element encapsulation structure with temperature compensation |
Country Status (1)
| Country | Link |
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| CN (1) | CN100592586C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9518715B2 (en) | 2010-02-12 | 2016-12-13 | Cree, Inc. | Lighting devices that comprise one or more solid state light emitters |
| US9605812B2 (en) | 2010-02-12 | 2017-03-28 | Cree, Inc. | Light engine module with removable circuit board |
-
2007
- 2007-04-28 CN CN200710097735A patent/CN100592586C/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9518715B2 (en) | 2010-02-12 | 2016-12-13 | Cree, Inc. | Lighting devices that comprise one or more solid state light emitters |
| US9605812B2 (en) | 2010-02-12 | 2017-03-28 | Cree, Inc. | Light engine module with removable circuit board |
| US10119660B2 (en) | 2010-02-12 | 2018-11-06 | Cree, Inc. | Light engine modules including a support and a solid state light emitter |
| US10222004B2 (en) | 2010-02-12 | 2019-03-05 | Cree, Inc. | Lighting devices that comprise one or more solid state light emitters |
| US10451224B2 (en) | 2010-02-12 | 2019-10-22 | Cree, Inc. | Lighting devices that comprise one or more solid state light emitters |
| US11402071B2 (en) | 2010-02-12 | 2022-08-02 | Creeled, Inc. | Lighting devices that comprise one or more solid state light emitters |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100592586C (en) | 2010-02-24 |
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