CN101241874B - Package device and its base plate carrier - Google Patents
Package device and its base plate carrier Download PDFInfo
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- CN101241874B CN101241874B CN2008100805363A CN200810080536A CN101241874B CN 101241874 B CN101241874 B CN 101241874B CN 2008100805363 A CN2008100805363 A CN 2008100805363A CN 200810080536 A CN200810080536 A CN 200810080536A CN 101241874 B CN101241874 B CN 101241874B
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- bearing frame
- substrate
- keeper
- cover plate
- base board
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Abstract
The invention provides a substrate bearing tool, applied to bear a subsrate. The substrate carrying tool comprises a bearing frame and a cover plate. The bearing frame is suitable for bearing the substrate and has a reinforced rib and a plurality of location elements. The reinforced rib is connected to two side edges corresponding to the bearing frame. The first location element is configured on the bearing frame. The cover plate is arranged on the bearing frame to press the substrate. The cover plate has a plurality of second location elements corresponding to the first location element. Respective second location element can be fixed on the corresponding first location element to make the cover plate fixed on the bearing frame.
Description
Technical field
The present invention relates to a kind of sealed in unit and base board carrier thereof, and particularly relevant for a kind of sealed in unit and base board carrier thereof that covers brilliant substrate that be applicable to.
Background technology
In recent years, along with making rapid progress of electronic technology, coming out one after another of high-tech electronic industry makes electronic product more humane, with better function constantly weed out the old and bring forth the new, and towards light, thin, short, little trend design.In the middle of manufacture of semiconductor, base plate type carrier (substrate typecarrier) is the structure arrangement that often uses at present, and it mainly is divided into the substrate of storehouse laminated type (laminated) and lamination type (built-up) two major types.Wherein, substrate (substrate) mainly is made of a plurality of patterned line layer and a plurality of insulating barrier institute that alternately coincides, and the surface of substrate has a plurality of contacts, as the medium, input/output that connects chip or external circuit.Because substrate has advantages such as wiring is fine and closely woven, assembling is compact and functional, has become one of structure arrangement indispensable in chip package (the Flip Chip Package) structure.
In addition; each cuts formed bare chip (die) by wafer (wafer); step via sticking brilliant (diebond); bare chip is adhered to above-mentioned covering on the brilliant substrate; follow formed weld pad (bonding pad) on the bare chip; joint by projection (bump); the weld pad of bare chip and the contact of substrate are electrically connected; with an encapsulating material bare chip is being coated again afterwards; to prevent that bare chip is subjected to moisture, The noise; and the protection bare chip, the processing procedure of promptly finishing Chip Packaging like this.
In existing encapsulation technology, covering brilliant substrate all is to be formed by a sheet of substrate cut.Therefore, in the chip bonding processing procedure, each assembly all is one one cube structure, so, can be difficult in and transmit between the board and operation.
For addressing the above problem, just derive directly after finishing flip chip assembly process on large-sized substrate, be cut into the mode of composite packing structure one by one again, be beneficial to the carrying out of flip chip assembly process.Yet if large-size substrate easily produces the phenomenon of warpage, and then reduces the yield of the composite packing structure that completes in flip chip assembly process when not having suitable carrier to support.
Summary of the invention
The purpose of this invention is to provide a kind of base board carrier, be suitable for bearing substrate in flip chip assembly process, to solve in the existing chip package technology, the problem of warpage easily takes place in large-size substrate.
Another object of the present invention provides a kind of sealed in unit, design by the contour projection on the hull bottom supporting seat (under boat support) of aforesaid substrate carrier and sealed in unit, make large-size substrate in inhaling the process of vacuum, keep smooth, with the problem of avoiding large-size substrate in the prior art to produce vacuum Lou and can't adsorb because of warpage.
For reaching above-mentioned or other purpose, the present invention proposes a kind of base board carrier, is applicable to carrying one substrate.This base board carrier comprises a bearing frame and a cover plate.Bearing frame is suitable for bearing substrate, and has a ribs and a plurality of first keeper.This ribs is to be connected in the corresponding dual side-edge of bearing frame, and these first keepers are to be disposed on the bearing frame.Cover plate is disposed on the bearing frame, with the pressing substrate.Wherein, this cover plate has a plurality of second keepers that correspond respectively to above-mentioned first keeper, and each second keeper can be fixed on corresponding first keeper, so that cover plate is fixed on the bearing frame.
In one embodiment of this invention, each first keeper is an alignment pin, and each second keeper is a location hole, and this alignment pin can be arranged in the location hole.
In one embodiment of this invention, bearing frame more comprises a plurality of resigning holes, is positioned at the inner edge of bearing frame.
For reaching above-mentioned or other purpose, the present invention proposes a kind of sealed in unit in addition, is applicable to semiconductor packing process.This sealed in unit comprises a hull bottom supporting seat and a base board carrier.One loading end of hull bottom supporting seat is provided with a plurality of vacuum and inhales hole, a groove and a plurality of contour projection.Base board carrier is suitable for carrying a substrate, and this base board carrier is to be placed on the hull bottom supporting seat, and adsorbs this substrate by these vacuum suction holes, so that substrate is carried out the semiconductor encapsulation procedure.This base board carrier comprises a bearing frame and a cover plate.Substrate is to be placed on the bearing frame, and bearing frame has a ribs, a plurality of first keeper and a plurality of resigning hole.Ribs is connected in the corresponding dual side-edge of bearing frame, and these first keepers are to be disposed on the bearing frame, and these resigning holes are the inner edges that are positioned at bearing frame.Wherein, ribs can be chimeric to groove, and these contour projections pass respectively above-mentioned resigning hole and with a lower surface of loading end supporting substrate in the lump.Cover plate is disposed on the bearing frame, with the pressing substrate.This cover plate has a plurality of second keepers that correspond respectively to above-mentioned first keeper, and each second keeper can be fixed on corresponding first keeper, so that cover plate is fixed on the bearing frame.
In one embodiment of this invention, above-mentioned contour projection is the edge that is positioned at loading end.
In one embodiment of this invention, each first keeper is an alignment pin, and each second keeper is a location hole, and this alignment pin can be arranged in the location hole.
Base board carrier of the present invention be collocation by bearing frame and cover plate with the large-sized substrate of clamping, make substrate unlikely warpage in encapsulation procedure.In addition, by this base board carrier bearing substrate, can make substrate transmission and operation between different sealed in units easily, the convenience during with the lifting operation.
Moreover, for some that makes that above-mentioned base board carrier is applicable to flip chip assembly process has the sealed in unit of hull bottom supporting seat, the present invention also is provided with ribs and the resigning hole that a groove and a plurality of contour projection correspond respectively to bearing frame on the hull bottom supporting seat, make large-size substrate in inhaling the process of vacuum, keep smooth, and then the problem of avoiding large-size substrate in the prior art to produce vacuum Lou and can't adsorb because of warpage.
For above and other objects of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Description of drawings
Figure 1A illustrates and is the perspective exploded view according to a kind of base board carrier of one embodiment of the invention;
Figure 1B illustrates the schematic perspective view for the base board carrier carrying large-size substrate that utilizes Figure 1A;
Fig. 2 illustrate into according to a kind of sealed in unit of one embodiment of the invention and with the schematic perspective view of the bearing frame of its collocation;
Fig. 3 A～3C illustrates when utilizing sealed in unit of the present invention that substrate is carried out manufacture of semiconductor, the illustrative view of hull bottom supporting seat.
[primary clustering symbol description]
100: base board carrier
110: bearing frame
112: ribs
114: the first keepers
116: resigning hole
120: cover plate
122: the second keepers
200: sealed in unit
210: the hull bottom supporting seat
2102: vacuum is inhaled the hole
2104: groove
2106: contour projection
300: substrate
S: loading end
Embodiment
Figure 1A illustrates and is the perspective exploded view according to a kind of base board carrier of one embodiment of the invention; Figure 1B illustrates the schematic perspective view for the base board carrier carrying large-size substrate that utilizes Figure 1A.Please also refer to shown in Figure 1A and the 1B, this base board carrier 100 comprises a bearing frame 110 and a cover plate 120, by this bearing frame 110 and cover plate 120 clamping large-size substrates 300, make substrate 300 in flip chip assembly process, keep smooth and unlikely generation warpage, and then promote the yield of product.Below collocation is illustrated assembly that base board carrier 100 comprised and the annexation between the assembly.
When substrate 300 is desired to carry out flip chip assembly process, shown in Figure 1B, can earlier substrate 300 be placed on the bearing frame 110; Afterwards, again cover plate 120 is placed on the substrate 300, and its second keeper 122 is fixed in corresponding first keeper 114, can push down substrate 300 and make its unlikely double swerve, and also can keep the evenness of whole base plate 300.Can make substrate 300 transmission and operation between different sealed in units easily by this base board carrier 100, and also can avoid the situation of substrate 300 warpages to take place.
In addition, shown in Figure 1A, also be provided with a plurality of resigning holes 116 at the inner edge place of bearing frame 110.These resigning holes 116 are provided with for the sealed in unit that cooperates in the chip bonding processing procedure some to have hull bottom supporting seat (underboat support), for example: cover brilliant sticking brilliant machine (flip chip bonder), Underfill board ... etc., substrate 300 can flatly be attached on the hull bottom supporting seat.Below situation when collocation illustrated base board carrier 100 and be applied to this sealed in unit.
Fig. 2 illustrate into according to a kind of sealed in unit of one embodiment of the invention and with the schematic perspective view of the bearing frame of its collocation.Please refer to shown in Figure 2ly, this sealed in unit 200 is applicable to semiconductor packing process, for example: and flip chip assembly process, and have a hull bottom supporting seat 210 and above-mentioned base board carrier 100.The loading end S of hull bottom supporting seat 210 is provided with a plurality of vacuum and inhales hole 2102, a groove 2104 and a plurality of contour projection 2106.Base board carrier 100 is to be placed on the hull bottom supporting seat 210, and inhales hole 2102 these substrates 300 of absorption by these vacuum, so that substrate 300 is carried out the semiconductor encapsulation procedure, for example: chip bonding, some glue ... etc.Wherein, the groove 2104 of hull bottom supporting seat 210 is to be provided with corresponding to the position of ribs 112.And the resigning hole 116 of bearing frame 110 is to be provided with corresponding to the position of the contour projection 2106 on the hull bottom supporting seat 210.
When desire utilizes 200 pairs of substrates of this sealed in unit 300 to carry out the semiconductor processing procedure, at first, as shown in Figure 3A, base board carrier 100 with bearing substrate 300 is placed on the hull bottom supporting seat 210 earlier, and makes ribs 112 and resigning hole 116 aim at the groove 2104 and the contour projection 2106 of hull bottom supporting seat 210 respectively.Then, shown in Fig. 3 B, when hull bottom supporting seat 210 makes progress jack-up, can avoid bearing frame 110 and with substrate 300 and cover plate 120 jack-up simultaneously, at this moment, ribs 112 can be chimeric to groove 2104, and contour projection 2106 can pass respectively on the bearing frame 110 resigning hole 116 and with the lower surface of loading end S supporting substrate in the lump 300.Because substrate 300 can be pushed down by the weight of cover plate 120, therefore, substrate 300 flatly is attached on the hull bottom supporting seat 210.Shown in Fig. 3 C, cover plate 120 can be distributed in weight average on four contour projections 2106, and this cover plate 120 also can slide up and down by first keeper 114 on the bearing frame 110, substrate 300 can be return on the base board carrier 100 once again when hull bottom supporting seat 210 is fallen, substrate 300 can arbitrarily not rocked and avoid it to drop.
In sum, base board carrier of the present invention mainly is that collocation by bearing frame and cover plate is with the large-sized substrate of clamping, substrate can be transmitted and operation between different sealed in units easily, and also can avoid the situation of substrate generation warpage, and then promote the yield of product.
In addition, for some that makes that above-mentioned base board carrier is applicable to flip chip assembly process has the sealed in unit of hull bottom supporting seat, the present invention also is provided with ribs and the resigning hole that a groove and a plurality of contour projection correspond respectively to bearing frame on the hull bottom supporting seat, make large-size substrate in inhaling the process of vacuum, keep smooth, and then the problem of avoiding large-size substrate in the prior art to produce vacuum Lou and can't adsorb because of warpage.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; anyly have the knack of this skill person; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking accompanying the claim person of defining.
Claims (5)
1. a base board carrier is applicable to cooperate a hull bottom supporting seat to carry a substrate, and a loading end of this hull bottom supporting seat is provided with a plurality of vacuum and inhales hole, a groove and a plurality of contour projection, it is characterized in that this base board carrier comprises:
One bearing frame, be suitable for carrying this substrate, this bearing frame has a ribs, a plurality of first keeper and a plurality of resigning hole, wherein this ribs is connected in the corresponding dual side-edge of this bearing frame, and described first keeper is disposed on this bearing frame, and described resigning hole is positioned at the inner edge of this bearing frame, and wherein this ribs is chimeric to this groove, and described contour projection passes described resigning hole respectively and supports a lower surface of this substrate in the lump with this loading end; And
One cover plate, be disposed on this bearing frame, with this substrate of pressing, wherein this cover plate has a plurality of second keepers that correspond respectively to described first keeper, and respectively this second keeper can be fixed on corresponding this first keeper, so that this cover plate is fixed on this bearing frame.
2. base board carrier as claimed in claim 1 is characterized in that, respectively this first keeper is an alignment pin, and respectively this second keeper is a location hole, and this alignment pin can be arranged in this location hole.
3. a sealed in unit is applicable to semiconductor packing process, it is characterized in that, this sealed in unit comprises:
One hull bottom supporting seat, a loading end of this hull bottom supporting seat are provided with a plurality of vacuum and inhale hole, a groove and a plurality of contour projection; And
One base board carrier is suitable for carrying a substrate, and this base board carrier is placed on this hull bottom supporting seat, and adsorbs this substrate by described vacuum suction hole, and so that this substrate is carried out the semiconductor encapsulation procedure, this base board carrier comprises:
One bearing frame, this substrate is placed on this bearing frame, and this bearing frame has a ribs, a plurality of first keeper and a plurality of resigning hole, this ribs is connected in the corresponding dual side-edge of this bearing frame, those first keepers are to be disposed on this bearing frame, and those resigning holes are positioned at the inner edge of this bearing frame, and wherein this ribs is chimeric to this groove, and those contour projections pass those resigning holes respectively and support a lower surface of this substrate in the lump with this loading end; And
One cover plate, be disposed on this bearing frame, with this substrate of pressing, wherein this cover plate has a plurality of second keepers that correspond respectively to those first keepers, and respectively this second keeper is fixed on corresponding this first keeper, so that this cover plate is fixed on this bearing frame.
4. sealed in unit as claimed in claim 3 is characterized in that described contour projection is positioned at the edge of this loading end.
5. sealed in unit as claimed in claim 3 is characterized in that, respectively this first keeper is an alignment pin, and respectively this second keeper is a location hole, and this alignment pin can be arranged in this location hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100805363A CN101241874B (en) | 2008-02-21 | 2008-02-21 | Package device and its base plate carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100805363A CN101241874B (en) | 2008-02-21 | 2008-02-21 | Package device and its base plate carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101241874A CN101241874A (en) | 2008-08-13 |
| CN101241874B true CN101241874B (en) | 2010-09-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100805363A Active CN101241874B (en) | 2008-02-21 | 2008-02-21 | Package device and its base plate carrier |
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| Country | Link |
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| CN (1) | CN101241874B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102496589B (en) * | 2011-12-22 | 2014-01-29 | 南通富士通微电子股份有限公司 | Cushion block device for track of chip mounting machine |
| CN104517881B (en) * | 2013-09-30 | 2017-11-14 | 无锡华润安盛科技有限公司 | One kind bonding fixture |
| CN104377156A (en) * | 2014-09-26 | 2015-02-25 | 南通富士通微电子股份有限公司 | Fixing device |
| CN109277227A (en) * | 2017-07-21 | 2019-01-29 | 致伸科技股份有限公司 | Rotary spraying system and its jig |
| CN109427596A (en) * | 2017-09-05 | 2019-03-05 | 浙江德汇电子陶瓷有限公司 | Base of ceramic and preparation method thereof |
| CN108470703A (en) * | 2018-04-02 | 2018-08-31 | 华进半导体封装先导技术研发中心有限公司 | The carrier of silicon wafer warpage after a kind of improvement reflow ovens |
| CN110828345A (en) * | 2019-11-14 | 2020-02-21 | 广州市晶鑫光电科技有限公司 | COB light source color uniformity control process |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5201451A (en) * | 1987-03-11 | 1993-04-13 | International Business Machines Corp. | Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate |
| US6182828B1 (en) * | 1996-02-19 | 2001-02-06 | Kabushiki Kaisha Toshiba | Reel tape for provisionally supporting a bare chip |
| US6329224B1 (en) * | 1998-04-28 | 2001-12-11 | Tessera, Inc. | Encapsulation of microelectronic assemblies |
| US6977434B2 (en) * | 2003-10-20 | 2005-12-20 | Hewlett-Packard Development Company, L.P. | Semiconductor assembly and spring member therefor |
-
2008
- 2008-02-21 CN CN2008100805363A patent/CN101241874B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5201451A (en) * | 1987-03-11 | 1993-04-13 | International Business Machines Corp. | Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate |
| US6182828B1 (en) * | 1996-02-19 | 2001-02-06 | Kabushiki Kaisha Toshiba | Reel tape for provisionally supporting a bare chip |
| US6329224B1 (en) * | 1998-04-28 | 2001-12-11 | Tessera, Inc. | Encapsulation of microelectronic assemblies |
| US6977434B2 (en) * | 2003-10-20 | 2005-12-20 | Hewlett-Packard Development Company, L.P. | Semiconductor assembly and spring member therefor |
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| CN101241874A (en) | 2008-08-13 |
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