CN101204878B - Ink jet recording cartridge - Google Patents
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- CN101204878B CN101204878B CN2007101611017A CN200710161101A CN101204878B CN 101204878 B CN101204878 B CN 101204878B CN 2007101611017 A CN2007101611017 A CN 2007101611017A CN 200710161101 A CN200710161101 A CN 200710161101A CN 101204878 B CN101204878 B CN 101204878B
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Abstract
An ink jet head includes a recording element substrate includes a plurality of ink supply ports and a supply port partition between adjacent ink supply ports; a substrate supporting portion supporting the recording element substrate at a back side thereof, the substrate supporting portion including ink supply passages corresponding to the ink supply ports and a supply passage partition corresponding to the supply port partition; a sealing material contacted to a side surface of the recording element substrate and to the substrate supporting portion; adhesive material fixing the opening partition and the supply passage partition to each other, wherein back sides of opposite ends of the recording element substrate with respect to an arranging direction of the ink supply ports are unfixed by the adhesive material to the substrate supporting portion.
Description
Technical field
The present invention relates to a kind of ink jet recording cartridge (ink-jet print cartridge) from its mouth spray atomizing of liquids (such as China ink).
Background technology
Under situation according to the print cartridge of the ink-jet recording apparatus of prior art, chip of ink-jet head only is bonded to the chip of ink-jet head support sector of cartridge case (shell) securely by the back side of its substrate, the structural detail with jet orifice (mouth) is formed on (Japanese Patent Application Publication 2000-218803 and 2001-150680) on this substrate.Fig. 9 is the schematic cross sectional views according to the ink gun of prior art.Under the situation of ink gun shown in Figure 9, ink gun uses a little binder 3 to be fixed to chip of ink-jet head support sector 2 (below will be called a support sector 2) by the back side of its substrate 1.In other words, adhesive 3 only puts on the back side of head substrate 1, then ink gun is connected with a support sector 2.
Figure 10 is the schematic cross sectional views according to another ink gun of prior art.Under the situation of ink gun shown in Figure 10, in the head substrate adjacent two public ink supply path 7 separated each parts 4 of ink gun are bonded to the corresponding ink-feed channel partitioned portion 5 of a support sector 2 by means of adhesive 3, and the back side of each end of head substrate 1 is bonded to a support sector 2.In addition, applying adhesive 3 make itself in addition cover the following surface of each public ink supply path 7, promptly with the surperficial adjacent of public ink supply path partitioned portion 4 and in the face of the surface of ink-feed channel partitioned portion 5.
As mentioned above, under the situation according to the manufacturing ink gun method of prior art, when ink gun was fixed (bonding) to support sector 2, adhesive 3 was applied to the whole zone of head substrate 1, and ink gun is bonded to a support sector 2 thus.
Yet, exist following problems with reference to Fig. 9 and 10 described prior aries above:
(1) ink-jet head substrate 1 is formed by silicon usually.Therefore, the linear expansion coefficient of head substrate 1 supports the linear expansion coefficient of the element of ink gun usually less than (by means of head substrate 1).
Therefore, under the situation that the head substrate 1 that is formed by silicon is supported by a support sector 2, if coating will be by the adhesive 3 of heat cure so that it will appear on whole contact areas between a head substrate 1 and the support sector 2, owing to will make adhesive 3 solidify the heat that is applied, head substrate 1 will be subjected to tension force, and the intensity of this tension force is corresponding with the difference of thermal expansion coefficient between a head substrate 1 and the support sector 2.On the other hand, head substrate 1 can be under pressure when the adhesive 3 of heat cure (sclerosis) cools down.Therefore, head substrate 1 is sometimes owing to these power are out of shape.
Figure 11 A and 11B are the head substrate 1 that is out of shape owing to above-mentioned power and the schematic cross sectional views of a support sector 2.Figure 11 A shows a head substrate 1 and a support sector 2, and they are owing to the appearance of the heat that is used for curing adhesive 3 is expanded.
When head substrate 1 and a support sector 2 were in state shown in Figure 11 A, head substrate 1 was gone up and is expanded in the indicated direction of arrow D1 (direction of the suffered tension force of head substrate 1 just) hardly, and reason is that the thermal coefficient of expansion of head substrate 1 is very little.On the other hand, a support sector 2 that is formed by resin has the swell increment bigger than head substrate 1 on the direction shown in the arrow D2 (just in a support sector 2 owing to being used for the direction that the appearance of heat of curing adhesive 3 expands).Adhesive 3 is in the above-mentioned state sclerosis of following time shown in Figure 11 A at a head substrate 1 and a support sector 2.Therefore, a head substrate 1 and a support sector 2 still are under the state shown in Figure 11 A by fixed to one another securely simultaneously.
Figure 11 B shows a head substrate 1 and a support sector 2, and they have been cooled to room temperature after curing adhesive 3 they still are under the state shown in Figure 11 A simultaneously.Expand hardly on the direction D1 of head substrate 1 in Figure 11 A during the heated adhesive 3, and therefore the amount of contraction on the direction shown in the arrow D3 is very little, this being contracted in when head substrate 1, a support sector 2 and adhesive 3 are cooled to room temperature taken place.On the other hand, the thermal expansion amount of a support sector 2 (be shown in to apply when hot occur as Figure 11 A) is greater than head substrate 1.Therefore, when a support sector 2 cool to room temperature in the amount of contraction on the direction shown in the arrow D4 greater than head substrate 1 amount of contraction on direction shown in the arrow D3 during cooling, the amount of contraction that occurs when its cool to room temperature is bigger.Therefore, with regard to the direction vertical with the length direction of public ink supply path 7, head substrate 1 is subjected to along from the power of inward at both ends (the accompanying drawing with the direction shown in the white arrow D3) to its direction effect of exerting pressure.Therefore, with regard to above-mentioned direction, shown in Figure 11 B, head substrate 1 all is out of shape at two ends places sometimes, this make again whole head substrate 1 so that its core away from the mode bending of a support sector 2.
(2) common, the back side of head substrate 1 by skim since thermal oxide or oxide that autoxidation produced covered.The level of adhesion of these oxidation films and adhesive 3 is not as the plane silicon chip.Therefore, such as according to a kind of ink gun adhesive bonding method of the above-mentioned ink gun adhesive bonding method of prior art (its by applying adhesive 3 ink gun being bonded to a support sector 2 so that adhesive 3 will only be between the appropriate section of the back side of head substrate 1 and a support sector 2), after curing adhesive 3, allow head substrate 1 to separate sometimes with a support sector 2.
(3) each one or more part 4 of all adjacent two public ink supply paths 7 being separated is separated with a support sector 2 corresponding ink-feed channel and has been caused following problem separating of portion 5 after curing adhesive 3:
Under the situation of the ink gun that sprays the different China inks of multiple color, just the color of the China ink of 7 conductings of public ink supply path of ink gun is not simultaneously, sometimes the China ink in adjacent two public ink supply paths 7 can mix each other mutually, therefore makes to be difficult to ink gun is remained on predetermined level with regard to picture quality.
And, constitute by single substrate 1 and structure member is bonded to substrate 1 and has under the situation of many row's jet orifice (mouth) (color of the China ink that these jet orifice are sprayed is identical) at ink gun, the amount of the China ink that is sprayed from jet orifice (mouth) also can become inhomogeneous sometimes, causes ink gun to produce low-quality image.
Summary of the invention
It is a principal object of the present invention to provide a kind of ink jet recording cartridge, by a kind of (bonding) inventive process to chip of ink-jet head support sector that is used for chip of ink-jet head fixed is provided, the substrate of the chip of ink-jet head of this ink jet recording cartridge can not be out of shape or separate with the chip of ink-jet head support sector of the housing (shell) of ink jet recording cartridge, the characteristics of this method are, to be bonded to the method for chip of ink-jet head support sector different with being used for other zone with inkjet recording head substrate to be used for method that some zone with ink-jet head substrate is bonded to chip of ink-jet head support sector, so as by in fact eliminating (perhaps minimizing) since the stress value in the substrate of chip of ink-jet head and the substrate that the linear expansion coefficient difference between the chip of ink-jet head support sector appears at chip of ink-jet head prevent the base plate deformation of chip of ink-jet head or separate with chip of ink-jet head support sector.
According to an aspect of the present invention, provide a kind of ink gun, described ink gun comprises: recording element substrate, and it comprises a plurality of ink supply ports and the ink supply port separating part between adjacent ink supply port; Support the substrate support sector of recording element substrate at substrate back, this substrate support sector comprise with the corresponding ink-feed channel of ink supply port and with the corresponding ink-feed channel separating part of ink supply port separating part; The contacted encapsulant in side and substrate support sector with recording element substrate; With ink supply port separating part and ink-feed channel separating part adhesive material fixed to one another, wherein the back side of the opposed end of recording element substrate for the arranged direction of ink supply port is not fixed to substrate support sector by adhesive material.
After considering below in conjunction with the description of accompanying drawing for the preferred embodiment of the present invention, these and other target of the present invention, characteristics and advantage will become more apparent.
Description of drawings
Fig. 1 is the perspective view according to typical ink jet recording cartridge of the present invention.
Fig. 2 A and 2B are the decomposition diagrams according to typical ink jet recording cartridge of the present invention shown in Figure 1, wherein show the structure and the parts of ink jet recording cartridge.
Fig. 3 is the perspective schematic view according to typical chip of ink-jet head of the present invention.
Fig. 4 is the diagrammatic vertical cross-section view according to the substrate of the chip of ink-jet head of ink jet recording cartridge of the present invention and chip of ink-jet head support sector, and how the substrate that wherein shows chip of ink-jet head is bonded to chip of ink-jet head support sector.
Fig. 5 A-5C is the diagrammatic vertical cross-section view according to the substrate of the chip of ink-jet head of the ink jet recording cartridge of prior art and chip of ink-jet head support sector, wherein shows the substrate deformation of the chip of ink-jet head that occurs during the manufacturing according to ink jet recording cartridge of the present invention.
Fig. 6 A and 6B are the diagrammatic vertical cross-section view of one of a plurality of adhesion areas between the substrate of chip of ink-jet head and the chip of ink-jet head support sector, wherein show the part between adjacent two the public ink supply paths of substrate in the substrate of chip of ink-jet head and be how to be bonded to the appropriate section between adjacent two ink-feed channel of chip of ink-jet head support sector in the chip of ink-jet head support sector.
Fig. 7 is the chart that is illustrated in according to the deflection that occurs in the substrate of chip of ink-jet head of the present invention and occur in the substrate according to the chip of ink-jet head of prior art.
Fig. 8 is the perspective schematic view according to the substrate of the chip of ink-jet head of prior art, wherein shows public ink supply path and how to be out of shape.
Fig. 9 is the schematic cross sectional views according to the chip of ink-jet head of prior art.
Figure 10 is the schematic cross sectional views according to another chip of ink-jet head of prior art.
Figure 11 A and 11B are the schematic cross sectional views according to the chip of ink-jet head of prior art, and how the substrate that wherein shows chip of ink-jet head when chip of ink-jet head is bonded to chip of ink-jet head support sector is out of shape.
The specific embodiment
The present invention relates to a kind of ink jet recording cartridge, it utilizes a kind of base plate deformation that can prevent chip of ink-jet head or makes with the manufacture method that the chip of ink-jet head support sector of cartridge case (shell) is separated, this method will be fixed to chip of ink-jet head support sector by which part according to the substrate of chip of ink-jet head and use different adhesives and different adhesive bonding methods, so that in fact eliminate (perhaps minimizing) owing to the substrate of chip of ink-jet head and the linear expansion coefficient difference between the chip of ink-jet head support sector come across stress in chip of ink-jet head and the chip of ink-jet head support sector.
Below, a preferred embodiment of the present invention is described with reference to the accompanying drawings.
Ink jet recording cartridge 10 shown in Fig. 1 and 2 comprises by substrate 11 and fluid passage and forms the ink jet print head chip 1 (hereinafter will abbreviate chip of ink-jet head as) that plate 8 is constituted.Chip of ink-jet head also is provided with a plurality of electrothermal conversioning elements 9, and fluid passage form plate 8 be provided with a plurality of jet orifice and with a plurality of one to one inner ink-feed channel of described a plurality of jet orifice.Jet orifice is arranged so that its opening 6 lines up three rows (row's number also can be two rows or four row or more rows) at the end face place (among Fig. 3) that fluid passage forms plate 8.Fluid passage formation plate 8 is formed on the substrate 11 and aims at correspondingly with the electrothermal conversioning element 9 on the substrate 11 so that fluid passage forms a plurality of liquid feeding channels and the spray hole 6 of plate 8.This chip of ink-jet head 1 is the record head chip that sprays ink droplet by means of the heat energy that electrothermal conversioning element 9 is produced.
Below, this ink-jet recording apparatus print cartridge 10 and structure member thereof will be described.
Fig. 1 is the perspective view of ink-jet recording apparatus print cartridge 10, and Fig. 2 is the decomposition diagram of ink-jet recording apparatus print cartridge 10.Ink jet recording cartridge 10 is made of chip of ink-jet head 1, flexible PCB 14, ink container keeper 18 and ink container 20, ink container keeper cover plate 12 etc.
Fig. 3 is the perspective schematic view of chip of ink-jet head 1 local excision, and shows the structure of chip of ink-jet head 1.The substrate 11 of chip of ink-jet head 1 is that a slice thickness is the silicon wafer of 0.5mm to 1mm.It has a plurality of public ink supply paths 7, and each all is long and narrow through hole.Public ink supply path 7 constitutes the part of the liquid feeding channel that leads to spray hole 6.Its utilization forms such as methods such as anisotropic etching (utilizing the crystal orientation of silicon), sandblasts.
Many row's electrothermal conversioning elements 9 (being used to produce the element of hydrojet energy) are arranged on the main surface of the substrate 11 of chip of ink-jet head 1.Three pairs of electrothermal conversioning elements in a row 9 are arranged here, and be positioned with a public ink supply path 7 between every pair of electrothermal conversioning element in a row 9.The (not shown) that connects up in addition on the substrate 11 of chip of ink-jet head 1, it is used to supply power to electrothermal conversioning element 9.Wiring is made of aluminium or analog.
Electrothermal conversioning element 9 and wiring can form with a kind of known film formation technology.
Ink jet recording cartridge 10 will spray by the China ink that public ink supply path 7 is carried by spray hole 6.More specifically, liquid (China ink) passage form in the ink passage of plate 8 with jet orifice 6 one to one electrothermal conversioning element 9 produce when hot, in the ink passage of correspondence, produce bubble.So by means of owing to generate the pressure that bubble produced, the small volume of ink in the corresponding ink passage is by hydrojet (China ink) hole 6 ejections relative with electrothermal conversioning element 9.
The details that is electrically connected between circuit board 14 and the chip of ink-jet head 1 is as follows: the electrical connection section 12 of chip of ink-jet head 1 is provided with the connection projection, and is electrically connected the predetermined relationship of keeping simultaneously between the lead 17 that is formed at connection projection and circuit board 14 between projection and the lead 17.
The route that China ink is supplied to chip of ink-jet head 1 comprise ink container keeper 18 ink-feed channel 21, be used for China ink is supplied to the hole of chip of ink-jet head 1.The public ink supply path 7 of the substrate 11 of chip of ink-jet head 1 is connected to the ink-feed channel 21 of ink container keeper 18.Chip of ink-jet head 1 be bonded to securely ink container keeper 18 chip of ink-jet head support sector 2 so that the part 4 in the substrate 11 of chip of ink-jet head 1 (each part 4 is separated two adjacent public ink supply paths 7 of the substrate 11 of chip of ink-jet head 1) by means of adhesive correspondingly good bond to the part 5 (each part 5 is separated chip of ink-jet head support sector 2 adjacent two feed flows (China ink) passages 21) of chip of ink-jet head support sector 2 (Fig. 4).
Expectation is used for the relative higher and oil resistant China ink of hardness after (sclerosis) lacked, solidified to time that adhesive 3a viscosity is lower, hardening temperature is lower, curing (sclerosis) is required that the ink-feed channel partitioned portion 5 of the public ink supply path partitioned portion 4 of substrate 11 and chip of ink-jet head support sector 2 is bonding securely.For the selection of the adhesive that is used as adhesive 3a, the various hot setting adhesives that for example mainly are made of epoxy resin are arranged.
Electric connection between the electrical connection section 12 of the lead 17 of circuit board 14 and the substrate 11 of chip of ink-jet head 1 is covered by one deck or two layer sealing agents, just, the sealant layer that sealant layer 13 and another composition and sealant layer 13 are different is so that prevent that electric connection from being corroded and/or exterior mechanical impacts.
More specifically, the intersection between the chip of ink-jet head support sector 2 of the side of the substrate 11 of sealant layer 13 jet of sealed head chips 1 and ink container keeper 18.And sealant layer 13 plays a part end with the substrate 11 of chip of ink-jet head 1 and is maintained on the direction vertical with the length direction of public ink supply path 7 and is retained to chip of ink-jet head support sector 2.
The opposite side (away from chip of ink-jet head support sector 2) that cover plate 19 is soldered to ink container keeper 18 spills from ink container keeper 18 to prevent China ink.
Below, the preferred embodiments of the present invention will be described in more detail.
In this embodiment of the present invention, the substrate 11 of chip of ink-jet head 1 is provided with and is a plurality ofly intersecting the upwardly extending public ink supply path 7 in side of (vertical) with the bearing of trend of jet orifice 6 in a row.Each public ink supply path 7 is connected to a plurality of jet orifice 6 by a plurality of special ink passages that fluid passage forms in the plate 8.And, chip of ink-jet head 1 is provided with a plurality of electrothermal conversioning elements 9, they are positioned on the substrate 11 of chip of ink-jet head 1 so that their position is corresponding one by one with a plurality of ink passages that fluid passage forms in the plate 8, and make them relative correspondingly with jet orifice 6.Electrothermal conversioning element 9 is energy generating element, produces the energy that is used for liquid droplets.Just, electrothermal conversioning element 9 is created in the heat energy that forms bubble in the liquid (China ink), and drop is by means of spraying owing to pressure that air bubble growth produced.For the selection of energy generating element, it can be to produce mechanical strain (distortion) and the piezoelectric element that makes the drop injection when being subjected to electric field.Two adjacent public feed flow paths 7 are separated by a part 4, just the public feed flow path partitioned portion of the substrate 11 of chip of ink-jet head 1.
The chip of ink-jet head support sector 2 (wall of ink container keeper 18) that the substrate 11 of chip of ink-jet head 1 is supported from the back side of the substrate 11 of chip of ink-jet head 1 is provided with a plurality of ink-feed channel 21.Adjacent two ink-feed channel 21 are separated by an ink-feed channel partitioned portion 5 of chip of ink-jet head support sector 2 to each other.Chip of ink-jet head 1 is bonded to chip of ink-jet head support sector 2 so that the public ink supply path partitioned portion 4 of the substrate 11 of chip of ink-jet head 1 is bonded to the ink-feed channel partitioned portion 5 of chip of ink-jet head support sector 2 correspondingly, so that the public ink supply path 7 of the substrate 11 of chip of ink-jet head 1 is connected to correspondingly the ink-feed channel of chip of ink-jet head support sector 2.Ink-feed channel is formed the Mo Buhui that makes in the ink-feed channel and mixes with China ink in the adjacent ink-feed channel.And chip of ink-jet head 1 is bonded to chip of ink-jet head support sector 2 so that relative at least two sides (they are parallel to the length direction of public ink supply path 7) of the substrate 11 of chip of ink-jet head 1 are covered by sealant layer 13 securely by the back side of its substrate 11.In order to describe the method that is used for the substrate 11 of chip of ink-jet head 1 is firmly-fixed to chip of ink-jet head support sector 2 in more detail, heat-setting sealant is applied to the intersection between the chip of ink-jet head support sector 2 of each and ink container keeper 18 in the two opposite side surfaces (they are parallel to the length direction of public ink supply path 7) of the substrate 11 of chip of ink-jet head 1 at least, so that sealant contacts with two surfaces at least, the side of the substrate 11 of chip of ink-jet head 1 just, and the surface of facing mutually with the substrate 11 of chip of ink-jet head 1 in the chip of ink-jet head support sector 2.Then, with the sealant heat cure.
With regard to the bearing of trend of public ink supply path 7, the end at the back side of the substrate 11 of chip of ink-jet head 1 is not bonded to chip of ink-jet head support sector 2 securely with adhesive 3a.In fact, their sealed dose of layers 13 are retained to chip of ink-jet head support sector 2 securely.For the end at the back side of the substrate 11 of illustrating chip of ink-jet head 1 not with bonding securely this expression of adhesive 3a, here exist adhesive 3a wherein do not put at all chip of ink-jet head 1 substrate 11 the back side the end situation and wherein the bonding strength of adhesive 3b be lower than the situation of adhesive 3a (more specifically, bonding strength is not enough to chip of ink-jet head 1 remained and is bonded to chip of ink-jet head support sector 2 securely).
Describe the adhesive 3b that bonding strength is lower than adhesive 3a in more detail, adhesive 3a and adhesive 3b are heat-setting adhesives, and its main component is an epoxy resin.Yet the epoxy radicals number of adhesive 3b per molecule is less than adhesive 3a, and the reaction acceleration rate of curing agent under predetermined solidification temperature that perhaps is used for adhesive 3b is lower than the curing agent that is used for adhesive 3a.Thereby, adhesive 3a obtains by the main component selecting to be fit to and/or suitable curing agent, consider material simultaneously as the material of the substrate 11 of chip of ink-jet head 1 and chip of ink-jet head support sector 2, and the size of substrate 11 and chip of ink-jet head support sector 2, separate with chip of ink-jet head support sector 2 so that apply the part of adhesive 3b in the chip of ink-jet head support sector 2 (and/or substrate 11).
At least above the public ink supply path partitioned portion 4 to the surface of ink-feed channel partitioned portion 5 and above the ink-feed channel partitioned portion 5 to the surface of public ink supply path partitioned portion 4 (just by adhesive 3a, the adhesive that bonding strength is enough) coated, so that public ink supply path partitioned portion 4 and ink-feed channel partitioned portion 5 are still bonding securely to each other.Adhesive 3a can be applied for the surface in the face of ink-feed channel partitioned portion 5 that makes on the not only public feed flow path partitioned portion 4 and be covered by adhesive 3a, and the bottom of its side (in the accompanying drawing) also is capped the bottom on the surface of just public feed flow path 7 (in the accompanying drawing).With adhesive 3a be applied as make adhesive 3a not only cover on the public ink supply path partitioned portion 4 in the face of the surface of ink-feed channel partitioned portion 5, but also cover the bottom on the surface of public feed flow path 7, this has just increased the overall dimension in bonding (contact) zone between adhesive 3a and the public ink supply path partitioned portion 4, thereby has increased the bonding strength between public ink supply path partitioned portion 4 and the ink-feed channel partitioned portion 5.And the adhesional energy between public ink supply path partitioned portion 4 and the ink-feed channel partitioned portion 5 makes its surperficial not oxidized thing cover and further increase by public ink supply path 7 is formed.
As mentioned above, the substrate 11 of chip of ink-jet head 1 and chip of ink-jet head support sector 2 (the chip of ink-jet head stayed surface of ink container keeper 18) by means of on each public feed flow path partitioned portion 4 in the face of the surface on the surface of chip of ink-jet head support sector 2 and the ink-feed channel partitioned portion 5 in the face of the substrate 11 of chip of ink-jet head 1 (except lower area, promptly with regard to public ink supply path 7 bearing of trends of substrate 11 (with the vertical direction of bearing of trend of mouth spray in a row) end face of substrate 11 to the zone of chip of ink-jet head support sector 2) and bonding securely to each other.And, the end of substrate 11 with regard to public ink supply path 7 bearing of trends is kept to chip of ink-jet head support sector 2 by means of sealant layer 13 (replace adhesive 3a), so that minimize the each several part of substrate 11 of chip of ink-jet head 1 and the thermal stress that chip of ink-jet head support sector 2 is subjected to owing to variation of ambient temperature (for example environment temperature reduction) afterwards in sealant layer 13 heat cures (sclerosis).Just, with regard to actual, the above-mentioned end of the substrate 11 of chip of ink-jet head 1 is retained to chip of ink-jet head support sector 2 by sealant layer 13.The sealant that is used to form sealant layer 13 puts on each opposite flank with regard to the direction vertical with the length direction of public ink supply path 7 of substrate 11 of chip of ink-jet head 1 and the intersection between the chip of ink-jet head support sector 2, not only substrate 11 is retained to chip of ink-jet head support sector 2, but also prevents that China ink from entering the electrical connections of chip of ink-jet head 1.Incidentally, sealant can be applied for the edge that has electrical connections on the substrate 11 that makes resulting sealant layer 13 cover chip of ink-jet head 1.
Fig. 4 is according to the substrate 11 of the chip of ink-jet head 1 of ink jet recording cartridge 10 of the present invention and the diagrammatic vertical cross-section view of chip of ink-jet head support sector.Adhesive 3a is heat-setting adhesive.The bonding strength of adhesive 3b is less than adhesive 3a.Adhesive 3b can be heat-setting adhesive.
The whole back side of the substrate 11 of chip of ink-jet head 1 (in the face of the surface of chip of ink-jet head support sector 2, just being bonded to the surface of chip of ink-jet head support sector 2 in the substrate 11 of chip of ink-jet head 1 thus) is covered by the oxide that thermal oxide produced or the oxide of Lock-in.And the surface of the public ink supply path 7 of the substrate 11 of chip of ink-jet head 1 (side of public ink supply path partitioned portion 4) made by planar silicon.
And, as mentioned above, chip of ink-jet head support sector 2 is provided with ink-feed channel 21 and ink-feed channel partitioned portion 5, they are located such that ink-feed channel 21 is aimed at correspondingly with the public ink supply path 7 of substrate 11 when the substrate 11 of chip of ink-jet head 1 and chip of ink-jet head support sector 2 are joined together, and ink-feed channel partitioned portion 5 is aimed at correspondingly with the public ink supply path partitioned portion 4 of substrate 11.
Assembling for ink jet recording cartridge, at first, the chip of ink-jet head support sector 2 of the substrate 11 of chip of ink-jet head 1 and ink container keeper 18 orientates as relative to each other and makes public ink supply path partitioned portion 4 aim at (public ink supply path 7 is aimed at correspondingly with ink-feed channel 21) correspondingly with ink-feed channel partitioned portion 5.Then, adhesive 3a (just the public ink supply path of intensity sufficient to guarantee partitioned portion 4 still keeps adhesive bonded to each other with ink-feed channel partitioned portion 5) is applied to the above-mentioned surface of each public ink supply path partitioned portion 4, but except the end with regard to the direction vertical with the length direction of public ink supply path 7 that adhesive 3b is applied thereto.Expectation adhesive 3b is applied for and makes its not side of covered substrate 11.
Incidentally, the end with regard to the direction vertical with the bearing of trend of public ink supply path 7 at the back side of the substrate 11 of chip of ink-jet head 1 need not by adhesive 3a or adhesive 3b coated.
Fig. 5 A-5B is the diagrammatic vertical cross-section view of ink gun shown in Figure 4, wherein shows the substrate 11 of chip of ink-jet head 1 and the distortion that chip of ink-jet head support sector 2 occurs during the manufacturing of ink jet recording cartridge.Arrow D5-D8 among Fig. 5 shows the direction of substrate 11 and chip of ink-jet head support sector 2 thermal expansion when adhesive 3a hardens, and the direction that they shrink when chip of ink-jet head 1 cooling.
At first, with reference to Fig. 5 A, be heated with when sclerosis at adhesive 3a, substrate 11 and chip of ink-jet head support sector 2 expand on the direction shown in arrow D5 and the D6 in the accompanying drawings owing to exist the heat that applies curing adhesive 3a.The thermal expansion amount that takes place of substrate 11 is compared very for a short time with the thermal expansion amount that chip of ink-jet head support sector 2 takes place during this period, and reason is that the linear expansion coefficient of the substrate 11 that formed by silicon is compared very little with the chip of ink-jet head support sector 2 that is formed by resinous substances.
Then, with reference to Fig. 5 B, finish heated adhesive 3a with the operation that makes it to harden after, substrate 11 and chip of ink-jet head support sector 2 can cool down and be reduced to room temperature up to their temperature.During this period, substrate 11 and chip of ink-jet head support sector 2 shrink on the direction shown in arrow D7 and the D8 respectively.Particularly, the amount of contraction of the longitudinal end of substrate 11 is greater than the amount of contraction of the core of substrate 11.And the end of substrate 11 is with adhesive 3b (in some cases, not applying adhesive) at all and only be bonded to chip of ink-jet head support sector 2 on substrate back, and is covered (sealing) by sealant layer 13.And the back side of substrate 11 covers with the oxide that is attributable to heat or autoxidation, therefore not too is adapted to adhesive.Therefore, bonding (the adhesive 3b at the back side with the end that puts on substrate 11 implements) between the end of substrate 11 and the chip of ink-jet head support sector 2 can not be born the pressure (compression force) that puts on adhesive 3b when substrate 11 and chip of ink-jet head support sector 2 are cooled to room temperature.Thereby the end of substrate 11 separates (coming off) with chip of ink-jet head support sector 2.Do not put under the situation of end of substrate 11 end of substrate 11 even before their cooling begins, separate (coming off) with chip of ink-jet head support sector 2 at adhesive at all.
Therefore, the end of substrate 11 can be moved on the direction shown in the arrow D9 in Fig. 5 C with respect to chip of ink-jet head support sector 2, alleviates the stress of ink gun, thereby prevents substrate 11 distortion.On the other hand, the part of adjoining mutually with the surface that public ink supply path partitioned portion 4 is faced chip of ink-jet head support sector 2 on the surface of the surface of facing chip of ink-jet head support sector 2 on the public ink supply path partitioned portion 4 and public ink supply path 7 is covered by adhesive 3a.Therefore, bonding very strong between public ink supply path partitioned portion 4 and the ink-feed channel partitioned portion 5.Therefore, in the sclerosis or the cooling period of adhesive 3 situation that public ink supply path partitioned portion 4 separates with ink-feed channel partitioned portion 5 can not appear.
Fig. 6 is one of a plurality of adhesion areas between the chip of ink-jet head support sector 2 of the substrate 11 of chip of ink-jet head 1 shown in Figure 4 and ink container keeper 18 and near diagrammatic vertical cross-section view thereof, and how the public ink supply path partitioned portion 4 (just substrate 11 is between the part between adjacent two public ink supply paths 7) that wherein shows substrate 11 is bonded to corresponding ink-feed channel partitioned portion 5 (part of chip of ink-jet head support sector 2 between adjacent two ink-feed channel 21 of chip of ink-jet head support sector 2 just).Fig. 6 A shows public ink supply path partitioned portion 4 and just applying adhesive 3a and the ink-feed channel partitioned portion 5 aimed at public ink supply path partitioned portion 4.Have the substrate 11 and the chip of ink-jet head support sector 2 of aiming at like that as mentioned above, substrate 11 is in the adhesive 3a of chip of ink-jet head support sector 2 reductions on the public ink supply path partitioned portion 4 immersion ink-feed channel partitioned portions 5 of substrate 11, and its degree of depth is shown in Fig. 6 B.With regard to the direction shown in the arrow D10 (it is perpendicular to the length direction of public ink supply path 7), in the face of the width W on the surface of the ink-feed channel partitioned portion 5 of public ink supply path partitioned portion 4
BGreater than width W in the face of the surface of the public ink supply path partitioned portion 4 of ink-feed channel partitioned portion 5
ATherefore, guaranteed when substrate 11 reduces that when substrate 11 and chip of ink-jet head support sector 2 located as mentioned above like that, public ink supply path partitioned portion 4 was bonded to ink-feed channel partitioned portion 5 securely.And, be a bit larger tham in the face of the surface of the ink-feed channel partitioned portion 5 of public ink supply path partitioned portion 4 with in the face of the surperficial bonding required appropriate amount of the public ink supply path partitioned portion 4 of ink-feed channel partitioned portion 5 by the amount that makes the adhesive 3a that puts on ink-feed channel partitioned portion 5, just can make adhesive 3a cover the lip-deep of public ink supply path 7 with the lower part, surperficial adjacent to ink-feed channel partitioned portion 5 above this part and the public ink supply path partitioned portion 4, and can not cause that adhesive 3a expands on the edge of ink-feed channel partitioned portion 5.Incidentally, the surface of public ink supply path 7 is made by planar silicon, and is therefore better with regard to bonding between the surf zone that is coated with oxide on adhesive 3a and the substrate 11.Therefore, the situation that public ink supply path partitioned portion 4 separates with ink-feed channel partitioned portion 5 in the time of can not appearing at adhesive 3a sclerosis or cooling.
Incidentally, with reference to Fig. 5 A, under the situation of the ink gun of present embodiment, parallel with the length direction of public ink supply path 7 and seal by using the sealant layer 13 that constitutes by heat-setting sealant to cover in the substrate 11 of chip of ink-jet head 1 perpendicular to each side and the intersection between the chip of ink-jet head support sector 2 of chip of ink-jet head support sector 2.The elasticity of sealant layer 13 is very high, is easy to flexibly to be out of shape to be adapted to substrate 11 and chip of ink-jet head support sector 2 because chip of ink-jet head 1 suffered caused distortion of stress when cooling off after adhesive is heated with sclerosis or heating.
And in the present embodiment, sealant layer 13 was sealed between the hardening period of adhesive 3a may appear at the above-mentioned end of substrate 11 and the slit in the contact area between the chip of ink-jet head support sector 2.Therefore, the situation that China ink spills by above-mentioned contact area can not appear.And after adhesive 3a sclerosis, separate with chip of ink-jet head support sector 2 partly the end of sealant 13 and substrate 11.Yet sealant layer 13 is flexible.Therefore, appear at the end of substrate 11 and the stress between the chip of ink-jet head support sector 2 and alleviated, between sealant layer 13 and chip of ink-jet head support sector 2, do not form the slit.Therefore, end and interface chip of ink-jet head support sector 2 between of China ink by substrate 11 can not occur spills ink jet recording cartridge 10 or enters in the ink jet recording cartridge 10.
Fig. 7 be illustrate between arranging as the crow flies along a side of a public ink supply path 7 so that the electrothermal conversioning element 9 that they are aimed at one by one with the jet orifice 6 of arranging as the crow flies along the same side of same public ink supply path 7 become with opposite side along same public ink supply path 7 another arrange point-blank so that they with respective electrical thermal conversion element 9 that the jet orifice 6 of arranging as the crow flies along the same side of same public ink supply path 7 is aimed at one by one between the chart of measurement result of distance. From Fig. 7 clearly, under situation with ink jet recording cartridge made according to the method for the present invention, chip of ink-jet head support sector 2 for the substrate 11 and the ink container keeper 18 of bonding chip of ink-jet head 1, with regard to the direction vertical with the length direction of public ink supply path 7, distance between adjacent two electrothermal conversioning elements 9 of the end of chip of ink-jet head 1 and central part is roughly the same, and under the situation of using the ink jet recording cartridge of making according to the method for prior art, for substrate 11 is bonded to chip of ink-jet head support sector 2, with regard to the direction vertical with the length direction of public ink supply path 7, the distance between adjacent two electrothermal conversioning elements 9 of the central part of chip of ink-jet head 1 is less than the end of chip of ink-jet head 1.
This has proved, under the situation of using the ink jet recording cartridge of making according to the method for prior art, for substrate 11 is bonded to chip of ink-jet head support sector 2, in the cooling period of adhesive 3a, the central part of substrate 11 by the power that on direction shown in the arrow D11 vertical direction of length direction of the public ink supply path 7 of substrate 11 (just with), applies as shown in Figure 8 towards the center distortion of substrate 11.By contrast, under situation with ink jet recording cartridge made according to the method for the present invention, for adhesive base plate 11 and chip of ink-jet head support sector 2, even the cooling period at adhesive 3a has applied pressure on the direction shown in the arrow D11, also separate with chip of ink-jet head support sector 2 by pressure caused stress between substrate 11 and chip of ink-jet head support sector 2 and to alleviate by the end of substrate 11, and therefore, in fact substrate 11 does not deform, even it is perhaps deform, also little as can to ignore.
Use description to make method below according to ink-jet print cartridge of the present invention.
At first, preparation has the substrate 11 of a plurality of public ink supply paths 7 and a plurality of public ink supply path partitioned portions 4, and from the back support chip of ink-jet head 1 of substrate 11 and have with a plurality of one to one ink-feed channel 21 of public ink supply path 7 and with the chip of ink-jet head support sector 2 of public ink supply path partitioned portion 4 a plurality of one to one ink-feed channel partitioned portions 5.
Then, adhesive 3a is put on above the public ink supply path partitioned portion 4 and to the surface of ink-feed channel partitioned portion 5 and above the ink-feed channel partitioned portion 5 one of surface of public ink supply path partitioned portion 4 to be gone up or two surfaces all apply.
Then, bonding strength is applied in each the back side in two ends (with regard to the direction vertical with the length direction of public ink supply path 7) of the substrate 11 of chip of ink-jet head 1 less than the adhesive 3b of adhesive 3a, and/or the appropriate section of chip of ink-jet head support sector 2.
Then, the chip of ink-jet head support sector 2 of the substrate 11 of chip of ink-jet head 1 and ink container keeper 18 is orientated as relative to each other make the public ink supply path 7 of substrate 11 and public ink supply path partitioned portion 4 aim at correspondingly with chip of ink-jet head support sector 2 corresponding ink-feed channel 21 and ink-feed channel partitioned portion 5.
Incidentally, carry out the step apply adhesive 3a, the step that applies adhesive 3b and with substrate 11 and chip of ink-jet head support sector 2 relative to each other the order of localization step be optional.
Then, substrate 11 and chip of ink-jet head support sector 2 betweens are existed under the situation of adhesive 3a and adhesive 3b and engage each other, simultaneously they are remained as mentioned above like that relative to each other location correctly.
Then, with adhesive 3a thermmohardening with bonding securely public ink supply path partitioned portion 4 and ink-feed channel partitioned portion 5 correspondingly.
And, when heat treated adhesive 3a cools down, sealant puts on substrate 11 each opposite flank vertical with the length direction of public ink supply path 7 and the intersection between the chip of ink-jet head support sector 2, thereby to form sealant layer 13 that substrate 11 and chip of ink-jet head support sector 2 is fastening relative to each other.Yet during this period, the end (it is bonded to chip of ink-jet head support sector 2 with adhesive 3b) of substrate 11 (with regard to regard to the vertical direction of the length direction of public ink supply path 7) will be separated with chip of ink-jet head support sector 2.Therefore, the stress that results from the substrate 11 when adhesive 3a cools off will alleviate.
Incidentally, in above-mentioned steps, the step that applies adhesive 3b can be omitted the ink-jet print cartridge that does not have adhesive 3b to make.
Though described the present invention with reference to structure disclosed herein, the present invention is not limited to described details, and the application is intended to cover those and occurs or modification within the scope of the appended claims or variation under improved purpose.
Claims (5)
1. ink gun comprises:
Recording element substrate, described recording element substrate comprise a plurality of ink supply ports and the ink supply port separating part between adjacent ink supply port;
In the substrate support sector of the described recording element substrate of back support of described recording element substrate, described substrate support sector comprise with the corresponding ink-feed channel of described ink supply port and with the corresponding ink-feed channel separating part of described ink supply port separating part;
The contacted encapsulant in side and described substrate support sector with described recording element substrate;
With described ink supply port separating part and described ink-feed channel separating part first adhesive material fixed to one another;
The opposed end of wherein said recording element substrate arranges along the arranged direction of described ink supply port, and the back side of the opposed end of described recording element substrate for the arranged direction of described ink supply port is fixed to described substrate support sector by a kind of encapsulant.
2. according to the ink gun of claim 1, the inner surface of wherein said ink supply port comprises silicon, and described first adhesive material is from extending to the inner surface of described ink supply port between described ink supply port separating part and the described ink-feed channel separating part.
3. ink gun comprises:
Recording element substrate, described recording element substrate comprise a plurality of ink supply ports and the ink supply port separating part between adjacent ink supply port;
In the substrate support sector of the described recording element substrate of back support of described recording element substrate, described substrate support sector comprise with the corresponding ink-feed channel of described ink supply port and with the corresponding ink-feed channel separating part of described ink supply port separating part;
The contacted encapsulant in side and described substrate support sector with described recording element substrate;
With described ink supply port separating part and described ink-feed channel separating part first adhesive material fixed to one another;
The opposed end of wherein said recording element substrate arranges along the arranged direction of described ink supply port, and second adhesive material that viscosity is lower than described first adhesive material is applied between the back side and described substrate support sector of loose described opposed end to each other.
4. according to the ink gun of claim 3, wherein said first and second adhesive materials are with the thermosetting adhesive agent material of epoxide resin material as main material, and the epoxy radicals number of the per molecule amount of described second adhesive material is littler than the epoxy radicals number of the per molecule amount of described first adhesive material.
5. according to the ink gun of claim 3, wherein said first and second adhesive materials are with the thermosetting adhesive agent material of epoxide resin material as main material, and the curing materials that is used for described second adhesive material has a reactivity, and this reactivity is compared littler with the reactivity of described first adhesive material under its solidification temperature.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006-339975 | 2006-12-18 | ||
| JP2006339975 | 2006-12-18 | ||
| JP2006339975 | 2006-12-18 | ||
| JP2007-297957 | 2007-11-16 | ||
| JP2007297957 | 2007-11-16 | ||
| JP2007297957A JP2008173960A (en) | 2006-12-18 | 2007-11-16 | Ink-jet head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101204878A CN101204878A (en) | 2008-06-25 |
| CN101204878B true CN101204878B (en) | 2010-08-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101611017A Active CN101204878B (en) | 2006-12-18 | 2007-12-18 | Ink jet recording cartridge |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2008173960A (en) |
| CN (1) | CN101204878B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4732535B2 (en) | 2009-06-09 | 2011-07-27 | キヤノン株式会社 | Liquid discharge recording head and manufacturing method thereof |
| JP6066747B2 (en) | 2012-03-02 | 2017-01-25 | キヤノン株式会社 | Method for manufacturing liquid discharge head and liquid discharge head manufactured by this manufacturing method |
| US9573369B2 (en) | 2012-09-19 | 2017-02-21 | Hewlett-Packard Development Company, L.P. | Fluid ejection assembly with controlled adhesive bond |
| JP6033104B2 (en) * | 2013-02-01 | 2016-11-30 | キヤノン株式会社 | Method for manufacturing liquid discharge head |
| JP6147013B2 (en) * | 2013-02-01 | 2017-06-14 | キヤノン株式会社 | Method for manufacturing liquid discharge head |
| JP6265663B2 (en) * | 2013-09-05 | 2018-01-24 | キヤノン株式会社 | Mixed color inspection method, mixed color inspection apparatus, and recording apparatus |
| JP7297514B2 (en) * | 2018-06-04 | 2023-06-26 | キヤノン株式会社 | Manufacturing method of liquid ejection head |
| JP7512118B2 (en) | 2020-07-30 | 2024-07-08 | キヤノン株式会社 | LIQUID EJECTION HEAD, METHOD OF MANUFACTURING LIQUID EJECTION HEAD, AND IMAGE RECORDING APPARATUS |
-
2007
- 2007-11-16 JP JP2007297957A patent/JP2008173960A/en active Pending
- 2007-12-18 CN CN2007101611017A patent/CN101204878B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101204878A (en) | 2008-06-25 |
| JP2008173960A (en) | 2008-07-31 |
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