CN101179102B - LED lamp and producing process - Google Patents
LED lamp and producing process Download PDFInfo
- Publication number
- CN101179102B CN101179102B CN2006100635965A CN200610063596A CN101179102B CN 101179102 B CN101179102 B CN 101179102B CN 2006100635965 A CN2006100635965 A CN 2006100635965A CN 200610063596 A CN200610063596 A CN 200610063596A CN 101179102 B CN101179102 B CN 101179102B
- Authority
- CN
- China
- Prior art keywords
- glue
- led
- lamp
- led chip
- cup
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Led Device Packages (AREA)
Abstract
The invention aims to provide a LED lamp and the manufacturing process. The process can decrease the junction temperature of LED lamp remarkably and improve the luminous efficiency. The invention is realized by the processes: LED lamp, lamp cup is also included, LED chip which is placed at the bottom of lamp and coating film which is at the bottom and surrounding of lamp cup; the LED chip is equipped with a layer of glue and the glue is covered with a layer mixture of phosphor and glue; a closed lampshade was formed outside the lamp cup and the lampshade was full of gases inside, sealing by use of gas instead of epoxy resin around the outside of LED chip and the convection produced by gases can transmit heat on the chip out of the lampshade, so the heat emission efficiency is remarkable; moreover, a layer of slim phosphor is covered outside LED chip and can enhance the heat emission efficiency; therefore, the light attenuation rate of LED reduces dramatically and the light intensity improves notably for the same luminescence chip of LED.
Description
Technical field
The present invention relates to a kind of LED lamp and manufacturing process
Background technology
Existing along with expanding economy, increase day by day to energy demand, and the pattern of transformation economic growth, cut down the consumption of energy, fundamentally alleviate the resource environment constraint of restriction sustainable economic development, become a difficult problem of being badly in need of breakthrough, and set up energy-efficient society, become the common recognition of the inevitable and society of development.
Improve the efficient of illumination, reducing the illumination energy consumption is energy-conservation important directions, and light-emitting diode is because its operating voltage is low, power consumption is little, stable performance, in light weight, advantage such as light intensity is high, visual sense good, the visual angle is moderate being employed as light source more and more widely.
Existing LED lamp comprises lamp bracket, on lamp bracket, be provided with Lamp cup 1, led chip 2 is by the bottom of the fixing Lamp cup 1 of some glue, fluorescent material mixing point glue covers on the led chip, and be full of whole cup, hemispheric transparent epoxy resin 8 wraps the top of Lamp cup and lamp bracket, and lamp bracket and Lamp cup are fixed.
Temperature is higher during the led chip of above-mentioned LED lamp luminous, can reach 100-120 degree centigrade, cover led chip gluing and fluorescent material, and the heat radiation of the transparent epoxy resin outside the Lamp cup is relatively poor, cause the junction temperature of LED higher, under 25 degree, the temperature of pin can reach 50-70 degree centigrade in ambient temperature; Because the temperature in the LED lamp is higher, causes the aging speed of led chip and fluorescent material very fast, optical attenuation is higher, and luminous efficiency is low.
Summary of the invention
The object of the invention is to provide a kind of LED lamp and manufacturing process, and it can significantly reduce the junction temperature of LED lamp, and improves luminous efficiency.
The present invention is achieved in that the LED lamp, comprises Lamp cup, and led chip is located at the bottom of Lamp cup, is provided with coatings at the bottom and the periphery of Lamp cup; On led chip, be provided with one deck glue, on glue, also be coated with the mixture of layer of fluorescent powder and glue.
Above-mentioned LED lamp forms a lampshade that seals outside Lamp cup, be full of gas in lampshade.
Above-mentioned LED lamp, above-mentioned glue are PU glue.
Above-mentioned LED lamp, the thickness of the mixture of the outer glue that covers of led chip and glue and fluorescent material is 0.05mm-0.2mm, the top that is coated with the led chip of glue and fluorescent material is lower than the rim of a bowl of Lamp cup.
Above-mentioned LED lamp, coatings are indium.
Gas in the above-mentioned LED lamp, lampshade is inert gas.
Above-mentioned LED lamp, inert gas are nitrogen.
Above-mentioned LED lamp forms Lamp cup above a bronze medal cup, the middle embedding has the support casing of pin to be combined in copper cup periphery, forms one glass of cover on support.
Above-mentioned LED lamp forms Lamp cup on aluminium sheet, led chip is located in the Lamp cup, and the lampshade of sealing places on the aluminium sheet, is provided with circuit on aluminium sheet.
Above-mentioned LED lamp is established one deck heat conductive metal plate at copper cup or aluminium sheet upper bottom portion, bonds with indium or scolding tin between copper cup or aluminium sheet and the metallic plate.
A kind of manufacturing process of LED lamp, comprise shelve, sintering, pressure welding, on LED, put glue, by curing transparent cover, air chamber hot setting in the nitrogen chamber hot setting, air chamber.
1) shelves; Shelving is with the led chip shift position, is placed in the corresponding Lamp cup again.
2) sintering; Led chip is put into the sintering baking oven toasts, make with luminescent film that led chip links to each other on indium dissolve.
3) pressure welding; Pressure welding is that electrode is guided on the led chip, finishes the connection work of outer lead in the product.
4) on LED, put glue; Relevant position point gluing at led chip; The effect of this layer glue is a fixed fluorescent powder.
5) by the nitrogen chamber hot setting; The last chip of crossing colloid is carried out hot setting by nitrogen chamber.
6) curing transparent cover in the air chamber; LED cup and support that pressure welding is good are put into mould, and translucent cover is put into LED forming tank and curing.
7) air chamber hot setting: hot setting is in order to allow translucent cover fully solidify, simultaneously LED to be carried out heat ageing.
Like this, owing to replace epoxy resin to seal with gas in the periphery of led chip, and the convection current that gas produces can go out the heat conduction on the chip outside the lampshade rapidly, radiating effect is quite obvious; The led chip bottom directly contacts with cup in addition, overcome in the prior art led chip and contacted the shortcoming that causes heat-transfer effect not good by a glue and a cup end, make the present invention have splendid radiating effect, under 25 degrees centigrade environment, the temperature that records pin has only 28 degrees centigrade.
In addition, cover the thin fluorescent material of one deck outside led chip, thick reaching only needs 0.05-0.2mm, and the outer fluorescent material that covers of existing led chip and the mixture of glue, general thickness reaches 0.1-0.3mm, has also significantly improved hot conduction, has strengthened radiating effect.
Because the heat radiation of LED lamp is strong, the light decay rate of LED lamp lowers greatly, same LED luminescence chip, and luminous intensity significantly strengthens.
Description of drawings
Fig. 1 is the prior art constructions schematic diagram.
Fig. 2 is a structure chart of the present invention.
Fig. 3 is the structure chart of first kind of embodiment of the present invention.
Fig. 4 is the structure chart of second kind of embodiment of the present invention.
The figure number explanation:
1, Lamp cup; 2, led chip; 3, lampshade; 4, gas; 5, coatings; 6, glue; 7, the mixture of fluorescent material and glue; 8, epoxy resin; 9, cup; 10, support
Embodiment:
With reference to shown in Figure 2, the present invention is achieved in that the LED lamp, comprises Lamp cup 1, and led chip 2 is located at the bottom of Lamp cup 1, forms the lampshade 3 of a sealing outside Lamp cup 1, has been full of gas 4 in lampshade 3.
Lampshade 3 can be quartzy or other transparent materials.
Like this, owing to replace epoxy resin 8 to seal with gas 4 in the periphery of led chip 2, and the convection current that gas 4 produces can go out the heat conduction on the chip 2 outside the lampshade 3 rapidly, radiating effect is quite obvious; The light decay rate of LED lamp lowers greatly, same led chip 2, and luminous intensity significantly strengthens.
Above-mentioned LED lamp is provided with coatings 5 at the bottom and the periphery of Lamp cup 1; On led chip 2, be provided with one deck glue 6, on glue 6, also be coated with the mixture 7 of layer of fluorescent powder and glue.
Bottom and periphery at Lamp cup 1 are provided with coatings 5, and the material of plated film can be indium, aluminium, copper; Certainly indium is reasonable selection, and the launching effect of indium is good, and after the indium dissolving, can bond at the led chip 2 and the cup end.
Owing to be provided with coatings 5, coatings 5 plays fabulous illumination effect, because the luminous of led chip 2 is diversity, can be luminous to any angle, and like this, can collect the astigmatism that led chip 2 sends, improved the luminous efficiency of led chip 2 greatly.
The thickness of the mixture 7 of the led chip 2 outer glue 6 that cover and glue and fluorescent material is 0.05mm-0.2mm; The top of led chip 2 that is coated with the mixture 7 of glue 6 and fluorescent material and glue is lower than the rim of a bowl of Lamp cup 1.
Like this, because led chip 2 bottoms directly contact with Lamp cup 1, overcome that led chip 2 contacts the shortcoming that causes heat-transfer effect not good by glue 6 with Lamp cup 1 in the prior art, make the present invention have splendid radiating effect, under 25 degrees centigrade environment, the temperature that records pin has only 28 degrees centigrade.
In addition, cover the mixture 7 of the thin glue 6 of one deck and fluorescent material and glue outside led chip 2, thick reaching only needs 0.05-0.2mm, and the existing led chip 2 outer fluorescent material that cover and the mixture 7 of glue, general thickness reaches 0.1-0.3mm, has also significantly improved hot conduction, has strengthened radiating effect.
Like this, the light decay rate of LED lowers greatly, same LED luminescence chip, and luminous intensity significantly strengthens.
As shown in Figure 3, form Lamp cup 1 above copper cup 9, the middle embedding has the support 10 of pin to be linked in copper cup 9 peripheries, forms a lampshade 3 on support 10, is filled with inert gas 4 in lampshade 3; Because form Lamp cup 1 on copper cup 9, heat-conducting effect is fairly good, can reduce the junction temperature of led chip 2 greatly; Certainly the copper cup also can substitute with the copper-plated material of aluminium.
As shown in Figure 4, be cup 9 at aluminium sheet, on aluminium sheet, form Lamp cup 1, led chip 2 is located in the Lamp cup 1, is provided with circuit at aluminium sheet; Can on one or more Lamp cups 1, be provided with lampshade 3, in lampshade 3, be filled with inert gas 4.
Establish one deck heat conductive metal plate in the bottom of copper cup 9 or aluminium sheet, between the bottom of copper cup or aluminium sheet and the metallic plate with indium or scolding tin bonding, can certainly be with the metal bonding of other good heat conductivity.
The manufacturing process of above-mentioned LED lamp comprises:
1) shelves; Shelve and comprise manual thorn sheet and shelve automatically that manual thorn sheet is that expansion back led chip is placed on the anchor clamps that sting the sheet platform, Lamp cup is placed under the anchor clamps, led chip is stung on the corresponding position one by one with pin at microscopically.Manual thorn sheet has been compared a benefit with shelving automatically, is convenient to change different chips at any time, is applicable to the product that needs to install various chips; Automatically shelving is with vacuum slot led chip to be picked up the shift position, is placed on the corresponding backing positions again.
2) sintering; The purpose of sintering be make with luminescent film that led chip links to each other on indium dissolve, sintering requires temperature is monitored, and prevents that batch property is bad.
3) pressure welding; The purpose of pressure welding is guided to electrode on the led chip, finishes the connection work of outer lead in the product.The bond technology of LED has two kinds of gold ball bonding and aluminium wire pressure weldings.The process of aluminium wire pressure welding earlier presses first point on the led chip electrode, aluminium wire is moved to corresponding support top again, pulls apart aluminium wire after pressing at second.The gold ball bonding process is then burnt a ball earlier before pressing at first, all the other processes are similar.
4) on LED, put glue; Relevant position point gluing at led chip; The effect of this layer glue is a fixed fluorescent powder.
5) by the nitrogen chamber hot setting; The last chip of crossing colloid is carried out hot setting by nitrogen chamber.
6) curing transparent cover in the air chamber; LED cup and support that pressure welding is good are put into mould, and translucent cover is put into LED forming tank and curing.
7) air chamber hot setting; Hot setting is in order to allow translucent cover fully solidify, simultaneously LED to be carried out heat ageing.Hot setting is extremely important for the adhesive strength that improves translucent cover and support; General condition is 120 ℃, 4 hours.
8) test, packing; Test, the photoelectric parameter of test LED, check overall dimension are carried out sorting according to customer requirement to the LED product simultaneously; Packing is counted packing with finished product, and ultra-bright LED needs antistatic packaging.
Following is the data contrast of the luminous flux and the optical attenuation of the LED lamp of this patent and existing LED lamp, respectively picked at random LED lamp and existing 4 LED lamps of 4 this patents of same model, luminous flux, attenuation rate, temperature are compared:
Experiment condition:
1. environment: room conditioning degree rooms 26
Four of 2.LED tester: ZWL-600E
3. temperature Instrument: TM902C is four
Existing LED operational data
This patent LED operational data
Claims (7)
1. a LED lamp comprises Lamp cup, and led chip is located at the bottom of Lamp cup, it is characterized in that: bottom and periphery at Lamp cup are provided with coatings; On led chip, be provided with one deck glue, on glue, also be coated with the mixture of layer of fluorescent powder and glue, wherein,
Outside Lamp cup, form the lampshade of a sealing, in lampshade, be full of nitrogen;
The thickness of the mixture of the outer glue that covers of led chip and glue and fluorescent material is 0.05mm-0.2mm, and the top that is coated with the led chip of glue and fluorescent material is lower than the rim of a bowl of Lamp cup;
Form Lamp cup above a bronze medal cup, the middle embedding has the support casing of pin to be combined in copper cup periphery, forms one glass of cover on support;
Establish one deck heat conductive metal plate at the copper cup holder bottom, bond with indium or scolding tin between copper cup and the metallic plate.
2. LED lamp as claimed in claim 1 is characterized in that: above-mentioned glue is PU glue.
3. LED lamp as claimed in claim 1 is characterized in that: coatings is an indium.
4. a LED lamp comprises Lamp cup, and led chip is located at the bottom of Lamp cup, it is characterized in that: bottom and periphery at Lamp cup are provided with coatings; On led chip, be provided with one deck glue, on glue, also be coated with the mixture of layer of fluorescent powder and glue, wherein,
Outside Lamp cup, form the lampshade of a sealing, in lampshade, be full of nitrogen;
The thickness of the mixture of the outer glue that covers of led chip and glue and fluorescent material is 0.05mm-0.2mm, and the top that is coated with the led chip of glue and fluorescent material is lower than the rim of a bowl of Lamp cup;
Form Lamp cup on aluminium sheet, chip is located in the Lamp cup, and the lampshade of sealing places on the aluminium sheet, is provided with circuit on aluminium sheet;
Establish one deck heat conductive metal plate in the aluminium sheet bottom, bond with indium or scolding tin between aluminium sheet and the metallic plate.
5. LED lamp as claimed in claim 4 is characterized in that: above-mentioned glue is PU glue.
6. LED lamp as claimed in claim 4 is characterized in that: coatings is an indium.
7. the manufacturing process of a LED lamp comprises and shelves, sintering, pressure welding, puts glue on LED, by curing transparent cover, air chamber hot setting step in nitrogen chamber hot setting, the air chamber;
1) shelves; Shelving is with the led chip shift position, is placed in the corresponding Lamp cup again;
2) sintering; Led chip is put into the sintering baking oven toasts, make with luminescent film that led chip links to each other on indium dissolve;
3) pressure welding; Pressure welding is that electrode is guided on the led chip, finishes the connection work of outer lead in the product;
4) on LED, put glue; Relevant position point gluing at led chip; The effect of this layer glue is a fixed fluorescent powder;
5) by the nitrogen chamber hot setting; The last chip of crossing colloid is carried out hot setting by nitrogen chamber;
6) curing transparent cover in the air chamber; LED cup and support that pressure welding is good are put into mould, and translucent cover is put into LED forming tank and curing;
7) air chamber hot setting; Hot setting is in order to allow translucent cover fully solidify, simultaneously LED to be carried out heat ageing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006100635965A CN101179102B (en) | 2006-11-10 | 2006-11-10 | LED lamp and producing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006100635965A CN101179102B (en) | 2006-11-10 | 2006-11-10 | LED lamp and producing process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101179102A CN101179102A (en) | 2008-05-14 |
| CN101179102B true CN101179102B (en) | 2010-12-01 |
Family
ID=39405267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006100635965A Expired - Fee Related CN101179102B (en) | 2006-11-10 | 2006-11-10 | LED lamp and producing process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101179102B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102278660A (en) * | 2011-04-25 | 2011-12-14 | 缪仙荣 | Headlamp of range hood |
| CN102147070B (en) * | 2011-05-17 | 2013-03-20 | 潘宇强 | Led lamp |
| CN111554789A (en) * | 2020-06-09 | 2020-08-18 | 福建天电光电有限公司 | Multilayer dispensing packaging process based on light-emitting diode cup interior |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1434521A (en) * | 2002-01-21 | 2003-08-06 | 诠兴开发科技股份有限公司 | Method for making white colore LED |
| CN1465106A (en) * | 2001-07-26 | 2003-12-31 | 松下电工株式会社 | Light emitting device using led |
| CN1480510A (en) * | 2003-07-10 | 2004-03-10 | 中国海洋大学 | Method for preparing luminescent powder of light emitting diode in white light with high brightness and adjustable wavelength |
| CN1538534A (en) * | 2003-04-15 | 2004-10-20 | 郑荣彬 | White light illuminating device |
| CN1577907A (en) * | 2003-07-09 | 2005-02-09 | 日亚化学工业株式会社 | Light emitting device, method of manufacturing the same and lighting equipment |
| CN2686102Y (en) * | 2004-03-17 | 2005-03-16 | 佛山市国星光电科技有限公司 | White luminous diode without yellow ring |
| CN1848463A (en) * | 2005-04-15 | 2006-10-18 | 南京汉德森科技股份有限公司 | LED white light source based on metal circuit board |
-
2006
- 2006-11-10 CN CN2006100635965A patent/CN101179102B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1465106A (en) * | 2001-07-26 | 2003-12-31 | 松下电工株式会社 | Light emitting device using led |
| CN1434521A (en) * | 2002-01-21 | 2003-08-06 | 诠兴开发科技股份有限公司 | Method for making white colore LED |
| CN1538534A (en) * | 2003-04-15 | 2004-10-20 | 郑荣彬 | White light illuminating device |
| CN1577907A (en) * | 2003-07-09 | 2005-02-09 | 日亚化学工业株式会社 | Light emitting device, method of manufacturing the same and lighting equipment |
| CN1480510A (en) * | 2003-07-10 | 2004-03-10 | 中国海洋大学 | Method for preparing luminescent powder of light emitting diode in white light with high brightness and adjustable wavelength |
| CN2686102Y (en) * | 2004-03-17 | 2005-03-16 | 佛山市国星光电科技有限公司 | White luminous diode without yellow ring |
| CN1848463A (en) * | 2005-04-15 | 2006-10-18 | 南京汉德森科技股份有限公司 | LED white light source based on metal circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101179102A (en) | 2008-05-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202111151U (en) | Novel TOP LED support and TOP LED device manufactured by using the same | |
| CN202339916U (en) | Novel TOP light emitting diode (LED) bracket and LED device manufactured by using novel TOP LED bracket | |
| CN102064247A (en) | Packaging method and packaging structure for embedded light emitting diode | |
| CN202523753U (en) | Hidden pin high-power LED (light-emitting diode) bracket and packaging structure | |
| CN202076265U (en) | LED module encapsulating structure and lighting device | |
| CN101179102B (en) | LED lamp and producing process | |
| CN104952864A (en) | LED (light emitting diode) lamp filament and manufacturing method thereof | |
| CN2935474Y (en) | Functional lighting LED | |
| CN202513204U (en) | Packaging structure with white light surface attached with light emitting diode | |
| CN2911965Y (en) | White-light LED | |
| CN101800280A (en) | Groove-shaped LED light source substrate as well as production method thereof and fluorescent lamp applying same | |
| CN104022193B (en) | The method for packing and device of Rimless LED | |
| CN101749580A (en) | Novel LED fluorescent lamp with high lighting effect | |
| CN102280555A (en) | Light-emitting diode and manufacturing method thereof | |
| CN205065534U (en) | Three -dimensional encapsulation illuminating source | |
| CN208637457U (en) | A kind of high-power patch-type encapsulation LED crystal lamp | |
| CN204268141U (en) | A kind of LEDbulb lamp of three-dimensional light | |
| CN102208402A (en) | High-color-rendering light-emitting diode (LED) chip module, white light LED device and manufacturing method thereof | |
| CN102544342B (en) | Heat radiator and electrode integrated heat radiating device and manufacturing method thereof | |
| CN102569284B (en) | The LED that New LED luminescence chip and assembling thereof are formed | |
| CN202549839U (en) | Novel LED (Light-Emitting Diode) light-emitting chip and LED lamp formed by assembling same | |
| CN205016559U (en) | LED lamp filament | |
| CN201014240Y (en) | High-performance LED lamp | |
| CN105304792A (en) | Energy-saving LED manufacturing method | |
| CN203179880U (en) | LED tube |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101201 Termination date: 20121110 |