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CN101147233A - Method and apparatus for vertical transfer of semiconductor substrates in a cleaning module - Google Patents

Method and apparatus for vertical transfer of semiconductor substrates in a cleaning module Download PDF

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Publication number
CN101147233A
CN101147233A CNA2006800094619A CN200680009461A CN101147233A CN 101147233 A CN101147233 A CN 101147233A CN A2006800094619 A CNA2006800094619 A CN A2006800094619A CN 200680009461 A CN200680009461 A CN 200680009461A CN 101147233 A CN101147233 A CN 101147233A
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CN
China
Prior art keywords
base material
robot
module
cleaning
cleaning module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2006800094619A
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Chinese (zh)
Inventor
J·尤多夫斯基
H·陈
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Applied Materials Inc
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Applied Materials Inc
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Publication of CN101147233A publication Critical patent/CN101147233A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37608—Center and diameter of hole, wafer, object
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

A substrate handler is provided. In one embodiment, the substrate handler includes a first and second carriage coupled to a rail. A first robot having at least two grippers is attached to the first carrier. A second robot having at least one gripper is coupled to the second carriage. The first carriage is independently positionable along the rail relative to the second carriage. As each carriage has a separate actuator, the movements of the first and second robot are decoupled, thereby allowing increased throughput. The substrate handler is particularly suitable for using in a planarization system having an integrated substrate cleaner.

Description

Be used for method and apparatus at cleaning module vertical transitions semiconductor substrate
Technical field
The embodiment of the invention roughly is about being used to handle the method and apparatus of semiconductor substrate.
Background technology
In the processing procedure of making modern semiconductors integrated circuit (ICs), generally need the different material layer that develops on formerly formed layer and the structure.Yet previous formation usually can stay the happy fluctuating of seeing (topography) at the upper surface of material layer position thereafter.For example, when formed layer is formerly gone up the little shadow pattern that printing has little geometry, can need the shallow depth of focus.Therefore, can there be flat surfaces quite important, otherwise the situation that some pattern has other pattern of focusing then not have can occur with regard to what become.In addition, if do not flatten irregular part at particular process step preceding, it is more irregular that the surface undulation meeting of base material becomes, and can cause more problems of giving birth to during described layer stack during further processing procedure.The size that depends on die type and contained geometry, surface irregularity can make yield deterioration and components performance variation.Therefore, generally all wish during the integrated circuit manufacturing, can reach certain type smooth or grinding or film.
A kind of method that during the integrated circuit manufacturing, is used for the planarization thin layer be cmp (Chemical Mechanical Polishing, CMP).Generally speaking, CMP comprises base material and abuts against relatively moving of grinding-material, to remove the surface imperfection part from base material.Grinding-material can soak into lapping liquid, and lapping liquid contains at least a of abrasive material or chemical grinding composition usually.This processing procedure can be done electrically auxiliary with planarize conductive material on base material electrochemically.
In case after grinding, it is the cleaning module of row that semiconductor substrate can be sent to one, to remove polishing particles and/or other pollutant that attaches on the base material after the grinding.Described cleaning module must solidify and form defective on base material at the grinding-material of any remnants reach removes.These cleaning modules may comprise as ultrasonic waves washer, washer or washer group and drier.The described cleaning module that base material can be supported with vertical direction is advantageous particularly then, because of they also utilize gravity the removing of enhanced particles during the cleaning processing procedure, and also comparatively simplifies usually.
Though present CMP processing procedure is known as more durable and reliable system, the configuration of system equipment still needs base material to clean with linear process sequence.When using single substrate handler to move base material through cleaner, base material can be limited by the transfer rate of cleaner.In addition, in the configuration that utilizes single substrate handler, the chemicals of cleaning module and/or interlayer disturb (cross-talk) to detract and clean the effect of processing procedure.
Therefore, industry still has demand for multi-functional (versatile) substrate handler that is used for auto cleaning system.
Summary of the invention
The present invention provides a kind of substrate handler.In an embodiment, this substrate handler comprise one first and second year part, can locate along a guide member.One first robot with two grasping parts then is connected to this first year part.One second robot with at least one grasping part then is coupled to this second year part.This first year part can be located along this guide member independently with respect to second year part.Because each year, part had independently actuator, moving of first and second robot just can be separately to increase output.Substrate handler is specially adapted to have the planarization systems of integrated substrate cleaner.
In another embodiment, the invention provides another substrate handler.This substrate handler comprises a track, at least and is coupled to second robot that first robot and that one first year part of this track and one second year part, be coupled to this first year part and have at least two grasping parts is coupled to this second year part and has at least one grasping part, and wherein this first year part can be located along this track independently with respect to this second year part.
In another embodiment, provide a kind of base material cleaning systems.These base material cleaning systems comprise several cleaning modules at least; The robot of one first perpendicular positioning is located on several cleaning modules; And the robot of one second perpendicular positioning, be located on these several cleaning modules, wherein this first and second robot optionally is positioned each person's of several cleaning modules top, and wherein this first and second robot can vertically move, and does the interface contact with each person (not being subjected to the influence of other cleaning module) with those cleaning modules.
In another embodiment, the present invention provides a kind of method that is used to clean a base material.This method comprises one first shifting axle location, one first and second robot along several cleaning module tops at least; Obtain a base material from an input module, and this base material is placed one first cleaning module by this first robot; Obtain this base material from this first cleaning module, and this base material is placed this second cleaning module by this first robot; Obtain this base material from this second cleaning module, and this base material is placed the 3rd cleaning module by this first robot; Obtain this base material from the 3rd cleaning module, and this base material is placed a drier by this second robot; And this drier is obtained this base material certainly, and by this second robot this base material is placed an output module.
In another embodiment, provide a kind of method, it comprises use at least two robots described base material is moved the cleaner through a grinding system, wherein a robot can make all base material conveyers arrive the irradiation modules of this cleaner.
Description of drawings
But aforementioned manner detail knowledge feature of the present invention, further instruction of the present invention can be with reference to execution mode and additional illustration, its etc. some be to be illustrated in the claim.It should be noted that so additional illustration only is used to illustrate the general embodiment of this case, thus should not be considered as the restriction of its scope, and other any equivalent embodiment is also contained in the present invention.
Fig. 1 is the vertical view of grinding of explanation semiconductor substrate and cleaning systems;
Fig. 2 is the front view that illustrates an embodiment of substrate handler;
Fig. 3 is the vertical view of Fig. 2 substrate handler;
Fig. 4 is the end view of an embodiment of grasping part; And
Fig. 5 A-l is the summary icon of substrate handler in an operator scheme.
For ease of understanding, indicate same components with equal reference numbers as far as possible among the figure.In addition, the assembly of embodiment also may favourable being applicable among aforementioned other embodiment.
The primary clustering symbol description
100 planarization systems, 102 factor interface
104 load robot 106 planarization modules
108 controllers, 110 CPU
112 internal memories 114 are supported circuit
116 cleaners, 118 wafer cassettes
120 interface robots, 122 base materials
124 input modules, 126 planarized surfaces
128 electrochemical machinery planarization stations 130 the 2nd ECMP platform
132 1 CMP platforms, 134 rotating platforms
136 transfer stations, 138 first sides
140 machinery beds, 142 output buffered stations
144 input buffering stations, 146 transfer robots
148 load cup assembly 150 several support arms
A 152 planarizations assembly, 156 output modules
158 dividing plates, 160 cleaning modules
162 drier 164A, first cleaning module
The 164B second brush module 164C first brush module
166 substrate handler, 168 first robots
170 second robots, 172 tracks
174 substrate grippers, 176 second grasping parts
178 grasping parts, 180 gauging systems
182 adjusting devices 188 enclose part through the envelope of environment control
202 years part 204 mounting panels
206 actuators, 208 motors
210 conveyer belts, 212 pulleys
216A parallel orbit 216B parallel orbit
252 years part 254 mounting panels
256 actuators, 258 motors
260 screw, 272 tracks
302 nuts, 402 base material gripping devices
404 the first arms, 410 the first arms
412 second arms, 414 carriages
416 pins, 418 grasping part actuators
522,524,526,528 base materials 560 base material that is untreated
562 base materials
Embodiment
The present invention provides and is used to transmit the Apparatus and method for of base material by the cleaning module of cmp (CMP) system.Though system describes to have at least two treating stations that are suitable for planarization one setting around the base material of central base material conveyer, should understand this system also can other configuration mode arrangement.In addition, though following embodiment relates generally to remove material (for example mode of planarization or grinding) from a base material, teaching also can be used for other process system but should understand herein, for example, needs in the electroplating system base material was effectively transmitted locating of integrated cleaning module.
Fig. 1 is the plane graph of an embodiment of planarization systems 100, and this planarization systems 100 has an equipment that is used for electrochemical treatments one base material.This illustrative system 100 roughly comprises a factor interface 102, and loads a robot 104 and a planarization module 106.This loading robot 104 is adjacent to factory interface 102 and this planarization module 106, transmits therebetween in order to base material 122.
108 settings of controller are in order to the described module of control and integration system 100.This controller 108 comprises a CPU (Central Processing Unit, CPU) 110, one internal memory 112 and several support circuit 114.This controller 108 is coupled to the different parts of system 100, in order to processing procedures such as control example such as planarization, cleaning and transmission.
Factor interface 102 generally includes a cleaner 116 and one or more wafer cassettes 118.120 of interface machine people are in order to transmit base material 122 between wafer cassettes 118, cleaner 116 and input module 124.This input module 124 is through being provided with in order to transmitting base material 122 between 106 grades of factor interface 102 of planarization module by grasping part (for example, vacuum grip portion or mechanical clamp).
Planarization module 106 comprise at least one chemical-mechanical planarization (Chemical MechanicalPlanarizing, CMP) or pad chemical machinery smooth platform.In an embodiment, this planarization module 106 comprises smooth (the Electrochemical MechanicalPlanarizing of at least one large-scale electrochemical machinery, ECMP) platform 128, and also alternatively, comprise at least one known chemical-mechanical planarization platform 132, be located at through the envelope of environment control and enclose in 188.Planarization module 106 examples of the present invention that are suitable for receiving benefits comprise MIRRA , MlRRA MESA TM, REFLEXION , REFLEXION  LK and REFLEXION LK Ecmp TMChemical mechanical planarization systems, its grade lists a company by California holy Plutarch La La city Applied Materials.Other comprises the planarization module of described use processing procedure liner, planarization silk screen or its composition and describedly base material also can be able to be indebted to the present invention with respect to the planarization module that flat surfaces moves (with rotation, linear or other plane motion).
In embodiment illustrated in fig. 1, this planarization module 106 comprises a main ECMP platform 128, one the 2nd ECMP platform 130 and a CMP platform 132.It is to carry out in large-scale ECMP platform 128 places via electrochemical dissolution process that electric conducting material is moved from mainly removing of base material.After large-scale ECMP platform 128 removed, remaining electric conducting material can remove in remaining ECMP platform 130 place via one second electrochemical machinery processing procedure at main material.So should will be understood that, also can use more than one residue ECMP platform 130 in the planarization module 106.
Known chemical mechanical planarization is to handle the back at residue ECMP platform 130 to carry out in planarization platform 132 places.The known CMP processing procedure example that is used to remove copper is to be described in No. the 6th, 451,697, the United States Patent (USP) issued on September 17th, 2002, and it is to be herein incorporated for your guidance in full.Should will be understood that other CMP processing procedure also can hocket.Because the CMP platform has been known in essence, will omit its thin portion explanation for simplicity's sake.
Exemplary planarization module 106 also comprises a transfer station 136 and a rotating platform 134, and its grade is located on the going up of mechanical pedestal 140 or first side 138.In an embodiment, transfer station 136 comprises an input buffering station 144, output buffered station 142, a transfer robot 146 and a load cup.Factor interface 102 can receive base material from factor interface by loading robot 104.Loading robot 104 also can be used for the base material through grinding is sent and returns to factor interface 102 from exporting buffered station 142.146 of this transfer robots are in order to be displaced into base material between buffered station 144,142 and the load cup assembly 148.
In an embodiment, transfer robot 146 comprises two gripper assemblies, respectively has pneumatic type and grasps pawl, with the fixing substrate edge.The base material that transfer robot 146 can be handled desire synchronously is sent to load cup assembly 148 from input buffering station 144, simultaneously treated base material is sent to output buffered station 142 from load cup assembly 148.The transfer station example that can effectively utilize is to be described in No. the 6th, 156,124, the U.S. Patent application authorizing Tobin on December 5th, 2000, and it is to be herein incorporated for your guidance in full.
This rotating platform 134 is located in the base 140 in the heart.This rotating platform 134 generally includes several arms 150, and each person can support an assembly 152 of a planarization.Two support arms 150 shown in Figure 1 all are represented by dotted lines, so that see the planarized surface 126 and the transfer station 136 of large-scale ECMP platform 128.Rotating platform 134 should signable (indexable) to make a planarization assembly 152 removable between planarization platform 128,132 and transfer station 136.A kind of rotating platform that can favourable use is to be described in No. the 5th, 804,507, the United States Patent (USP) authorizing people such as Perlov on September 8th, 1998, and it is to be herein incorporated for your guidance in full.
Adjusting device 182 can be located on the base 140, contiguous each planarization platform 128,132.This adjusting device 182 can periodically be adjusted set smoothing material in the described platform 128,132, to keep uniform smooth effect.
Also alternatively, leave on can be in the factor interface 102 set gauging system 180 of the base material of cleaner 116 and test.This gauging system 180 can comprise optical measurement instrument, for example the NovaScan420 that is gone on the market by the Nova Measuring Instruments company in California Sen Niweier city.This gauging system 180 can comprise that a buffered station (not shown) is in order to base material turnover optical measurement instrument or other measurement apparatus.One of aforementioned suitable buffered station is to be described in to authorize in the 6th, 244, No. 931 cases of United States Patent (USP) of people such as Pinson June 12 calendar year 2001, and it is to be herein incorporated for your guidance in full.
The base material that cleaner 116 can be hung oneself after grinding removes grinding residues and/or lapping liquid.During cleaning, base material moves through several cleaning modules 160 by substrate handler 166 usually.Can be indebted to a kind of cleaner of the present invention is to be described in the 10/286th, No. 404 case of U.S. Patent application of being applied on November 1st, 2002, and it is to be herein incorporated for your guidance in full.In an embodiment, this cleaner 116 comprises several single base material cleaning modules 160, the substrate handler 166 that reaches input module 124, drier 162 and be located at several cleaning module 160 tops.This input module 124 can be used as the transfer station between this factor interface 102, this cleaner 116 and the planarization module 106.This drier 162 can dry leave the base material of cleaner 116, and is beneficial to base material and is transmitted between this cleaner 116 and the factor interface 102.This drier 162 can be and revolves the wetting drier of cloth (spin-rinse-dryer).In another embodiment, the drier 162 that is suitable for mainly can be MESA TMAnd Desica  base material cleaner, both go on the market by the holy Plutarch La La in California city Applied Materials company.
In embodiment illustrated in fig. 1, this cleaner 116 comprises three cleaning modules 160, illustrates with ultrasonic waves cleaning module 164A, the first brush module 164B and the second brush module 164C.Yet what should understand is that the present invention also can use the cleaning systems in conjunction with any number of modules.Each person of described module 164A-C be configured to handle vertically to base material, that is, in lapped face one on the approximate vertical plane.
In operation, system 100 is started base material 122 by interface machine people 120 from a mode that is sent to input module 124 of blocking casket 118.This robot 104 then with base material from input module 124 shift out and will be sent to planarization module 106, make base material do the grinding of horizontal direction simultaneously in this place.After in case base material grinds, robot 104 can from planarization module 106 base material 122 is taken out and with vertical direction will put into input module 124.This substrate handler 166 can be taken out base material from input module 124, and indicates base material via at least one cleaning module 160 of this cleaner 116.During whole cleaning processing procedure, each person of module 160 is suitable for the vertical direction support base material.In case through cleaning, substrate handler 166 can be sent to output module 156 with base material, turn to level orientation in this place and send and return to one of described card casket by interface robot 120.In another embodiment, this drier 162 can be by deflection base material to a horizontal level, and with interface machine people 120 will on move in the mode that is sent to card casket 118 and do the base material transmission.Also alternatively, this interface machine people 120 or substrate handler 166 can be back to the preceding of card casket 118 at base material base material is sent to gauging system 180.
Substrate handler 166 roughly comprises one first robot 168 and one second robot 170.This first robot 168 comprises at least one grasping part (illustrating two grasping parts 174,176) and is to be configured to transmit base material at least between this input module 124 and this cleaning module 160.This second robot 170 comprises at least one grasping part (illustrating a grasping part 178), and is to be configured to transmit base material between one of this cleaning module 160 at least and this drier 162.Also alternatively, this second robot 170 can be configured to transmit base material between this drier 162 and this gauging system 180.
In embodiment illustrated in fig. 1, this substrate handler 166 comprises a track 172, is coupled to one and will blocks the dividing plate 158 that casket 118 and interface robot 120 and cleaner 116 are separated.This robot the 168, the 170th is configured to laterally move along track 172, in order to turnover this cleaning module 160, drier 162 and input module 124.
Fig. 2-the 3rd illustrates forward sight and vertical view according to the substrate handler 166 of one embodiment of the invention.This first robot 168 of this substrate handler 166 comprises one year part 202, a mounting panel 204 and substrate grippers 174,176.This year, part 202 was to be installed on slidably on the track 172, and the first shifting axle A that is defined along this track 172 by actuator 206 1Make horizontal drive.This actuator 206 comprises a motor 208, is coupled to a conveyer belt 210.This year, part 202 was connected to this conveyer belt 210.When motor 208 advances on every side conveyer belt 210 of pulleys 212 (being positioned an end of cleaner 116), carry part 202 and can move with selectivity along track 172 and locate this first robot 168.This motor 208 can comprise that an encoder (not shown) correctly is positioned at this first robot 168 on input module 124 and the various cleaning module 160 assisting.Perhaps, this actuator 206 can be any may command and carries rotation or the linear actuators of part 202 along the position of track 172.In an embodiment, this year, part 202 was with linear actuator drives, and this actuator has a conveyer belt conveyer, for example the GL15B linear actuators that gone on the market of Tokyo THK company.In an embodiment, this conveyer belt 210 can be surrounded by a cover piece (a for example housing), suffers the pollution (because of it may touch conveyer belt 210) of the material of residue and other possibility adjacent base material processor 166 to avoid conveyer belt.In an embodiment, this conveyer belt 210 can be enclosed in the track, so that it is not subjected to the pollution of residue and other material.
Mounting panel 204 is coupled to and carries part 202.This mounting panel 204 comprises at least two parallel rail 216A-B, and grasping part 174,176 can be along second and third shifting axle A along the position of track 2, A 3Independent actuation.This second and third shifting axle A 2, A 3The orientation is perpendicular to first A 1
Fig. 4 is the end view of an embodiment of second grasping part 1 76.These grasping part 174,178 tool similar configuration.This second grasping part 176 comprises a base material gripping device 402 and an actuator 404.This actuator 404 can be screw, cylinder or other be suitable for locating gripping device 402 along track 216A (with the second shifting axle A 2The machinery of the upright position direction that is defined).In an embodiment, this actuator 404 is the screw slide assemblies, and it is also gone on the market by THK company.
This gripping device 402 comprises a first arm 410 and one second arm 412, is configured to grasp vertical outward flange (as shown in Figure 4) to base material.Perhaps, gripping device 402 can be the machine formula, have electrostatic chuck, the end effector of vacuum cup, edge clamp or other base material gripping device.In embodiment illustrated in fig. 4, this first arm 410 is to extend from carriage 414, and side by side two arms 412 rotate around a pin 416 that extends through carriage 414.Grasping part actuator 418 is to be coupled to second arm 412 with the rotation of control arm 412 around pin 416, with selectivity along axle A 6Grasp and discharge base material 122 (being represented by dotted lines) between the end of arm 410,412.
Second robot 170 of substrate handler 166 comprises one year part 252, a mounting panel 254 and grasping part 178.This year, part 252 was installed on the track 172, and with actuator 256 along the track 172 defined first shifting axle A 1Horizontal drive.In 1-3 figure illustrated embodiment, this actuator 256 comprises a motor 258 and screw 260.When motor 258 rotated, being connected to the nut 302 (being shown in Fig. 3 with dotted line) that carries part 202 can advance along screw 260, locatees second robot 170 in order to move a year part 252 along track 172 with selectivity.Motor 258 can comprise that the sign indicating number device correctly is positioned at second robot 170 at least one of output module 156, drier 162 and cleaning module 160 with assistance on one side.In 1-3 figure illustrated embodiment, this second robot 170 is configured to all base materials are transmitted between the second brush module 164C and the drier 162.This conventional approaches can effectively reduce drier 162 and be exposed among the first cleaning module 164A, the 164B chemicals and other material that the base material that grinds of the pollutant of majority can being hung oneself removes.Perhaps, actuator 256 can be any and is suitable for controlling and carries linearity or the rotational actuator of part 252 along track 172 positions.
Mounting panel 254 is coupled to and carries part 252.Mounting panel 254 comprises a track 272, and grabber 178 can be along the 4th shifting axle A along the position of this track 4Control.The 4th shifting axle A 4Parallel this second and third shifting axle A 2, A 3And vertical this first A in orientation 1This grasping part 178 can be vertically to moving and grasp base material, the narration relevant as grasping part as described in relevant Fig. 4 176.With regard to itself, grasping part 174,176 and 178 upright position and grasp action and can control independently of one another.
With reference to Fig. 2-3, first and second robot 168,170 of this of this substrate handler 166 can move along at least three shifting axles with respect to cleaner 116: a level (X-axis-along this track 172, see first A 1) and at least three vertical (y axle-respectively be used for the gripping devices 174,176,178 of three independent controls is seen second, third and the 4th A 2, A 3, A 4).In addition, each gripping device has an additional shifting axle (Z axle-that is, with substrate plane zone copline, be used for a grasping part person as shown in Figure 4), to grasp base material along this plane, wherein should additional shifting axle perpendicular to axle A1-A4.
One advantage of substrate handler 166 of the present invention is that the gripping device of each grasping part 174,176,178 can move independently from one another, and therefore can change the process sequence (that is base material is by order of module 160) in the cleaner.In addition, two gripping devices 206 on an arm 204 may carry out the base material exchange in a cleaning module, and unlikely processing procedure or the operation that influences in other module.
In addition, when using same rail 174 as first robot in second robot 170, compared to the conveyer with comparability ability, the cost of substrate handler 166 can reduce.In addition, when the moving range of second robot 170 and required quality during less than first robot 168, accurate ball screw actuator just is suitable for the mobile control of second robot 170.More advantageously, the ball screw actuator have can repeat, high precision moves and can produce less particle (comparing with belt drive).In addition, when the mobile separation of first and second robot 168,170 (that is, be able to independently carry out substrate transfer tasks), the base material conveyer demand of first robot 168 is compared with the substrate handler with single robot and can be reduced by 25 percent, in order to effective increase substrate throughput.In another embodiment of the present invention, the dedicated substrate that the second brush module 164C and drier are 162 transmits can reduce cross pollution, particularly involve the first brush module 164A, 164B and have under the situation of chemical pollutant, in order to reduce base material contamination of heavy during drying at Supersonic.
A kind of pattern of handle substrate processor 166 is that synoptic diagram is marked in Fig. 5 A-I.Though cleaner 116 simplified schematic illustration are the cleaning module 164A-C with three adjacency, should understand the cleaning module 160 that cleaner 116 can comprise any number in Fig. 5 A-I.
Fig. 5 A illustrates the cleaner 116 that self-grind module 106 is returned during the general processing base material.In Fig. 5 A illustrated embodiment, treated base material 522,524,526,528 places input module 124 respectively, megasonic module 164A and first and second brush module 164B-C.This first robot 168 is positioned on the input module 124, and this second robot 170 is positioned on the second brush module 164C simultaneously.
Shown in Fig. 5 B, base material 522 can be obtained in second grasping part 162 of first robot 168.Second robot 170 can obtain base material 528 from the second brush module 164C.This first robot 168 can laterally move to the position on the megasonic module 164A, and second robot 170 laterally moves the position on this drier 162 simultaneously.
Shown in Fig. 5 C, the base material that places megasonic module 164A can be obtained in this first grasping part 174.In case base material 524 shifts out from megasonic module 164A, second grasping part 176 can be placed among the megasonic module 164A with the base material that will take from input module 124 in extension.Simultaneously, second robot 170 can extend its grasping part 178 to be put to drier 162 with the base material that will take from the second brush module 164C, shown in Fig. 5 D.
Shown in Fig. 5 E-G, the base material 528 of drying is to be taken out by drier 162 by first grasping part 178 of second robot 170, and laterally moves to a position on output module 156.Then extend base material being placed in output module 156 grasping part 178 of second robot 170, and do access in this place by interface machine people 120.
Shown in Fig. 5 E-G, this first robot 168 can laterally move base material is positioned first brush module 164B top equally.This second grasping part 176 can be extended to take out the base material 526 among the first brush module 164B.Then extend so that the base material 524 of megasonic module 164A taking-up is put to this first brush module 164B first grasping part 174 of this first robot 168.
Refer again to Fig. 5 E-G and Fig. 1, undressed base material 560 can be sent to input module 124 by interface machine people 120, and 522,524,526,528 of treated base materials advance past cleaner 116 simultaneously.Wet robot 104 then takes out base material 560 from input module 124, and base material 500 is sent to planarization module 106 to handle.Though 5E-G figure shows that this loads the order of planarization module 106, undressed base material also can block casket 118 certainly in other operating period and be sent to planarization module 106.
Get back to Fig. 5 H-l, first robot 168 can move to the base material 526 of taking from the first brush module 164B position of second brush module 164C top.This second grasping part 176 can be extended so that base material 526 is placed among the second brush module 164C.At the same time, the base material 562 that is returned by planarization module 106 after processing can place input module 124, and automatically cleaning device 116 is back to state shown in Fig. 5 I.The above-mentioned reference step can then repeat to continue to transmit base material each module 160 by cleaner 116.
Therefore, the present invention proposes the great improvement of semiconductor substrate cleaning and field of milling.Substrate handler is suitable for supporting and transmitting the base material of vertical direction, makes it can cooperate cleaning systems to use and reduces and take up room.In addition, processor can be made the vertical moving of multiaxis, makes its more polynary and easier being useful in the various base material treatment programs.
Though aforementioned is about described embodiment of the present invention, the present invention other and further embodiment can be in not modifying down departing from its essence spirit, and its scope should be determined by claim.

Claims (23)

1. substrate handler, it comprises at least:
One track;
One first year part and one second year part all are coupled to this track;
One first robot is coupled to this first year part and has at least two grasping parts; And
One second robot is coupled to this second year part and has at least one grasping part, and wherein this first year part can be made location-independent with respect to second year part along this track.
2. substrate handler as claimed in claim 1, wherein at least two grasping parts of this first robot are to be configured to transmit a base material between at least one input module and one first cleaning module, or between at least one first cleaning module and one second cleaning module.
3. substrate handler as claimed in claim 1, wherein at least one grasping part of this second robot is to be configured to transmit a base material between an at least one cleaning module and a drier.
4. substrate handler as claimed in claim 1, wherein this first and second robot is configured to laterally move along this track, is beneficial to pass in and out several modules.
5. substrate handler as claimed in claim 4, at least one of wherein said module are cleaning module.
6. substrate handler as claimed in claim 4, wherein this year, part was to be installed on slidably on this track, and made horizontal drive by an actuator along one first shifting axle that this track defined.
7. substrate handler as claimed in claim 6, wherein this actuator comprises that one is coupled to the motor of a conveyer belt, locatees this first robot to advance this year part along this first shifting axle.
8. substrate handler as claimed in claim 7, wherein this conveyer belt is to enclose with cover piece envelope.
9. substrate handler as claimed in claim 7, wherein at least two grasping parts of this first robot are along second and third shifting axle independent actuation.
10. substrate handler as claimed in claim 9, wherein this second and third shifting axle orientation is vertical this first.
11. substrate handler as claimed in claim 1, wherein this first and second robot is suitable for being moved horizontally along first shifting axle by this actuator.
12. base material cleaning systems, it comprises at least:
Several cleaning modules;
The robot of one first perpendicular positioning is located at several cleaning module tops; And
The robot of one second perpendicular positioning, be located at several cleaning module tops, wherein this first and second robot alternative is positioned each person's of several cleaning modules top, but and wherein this first and second robot vertical moving do interface contact with each person (not being subjected to the influence of other cleaning module) with several cleaning modules.
13. base material cleaning systems as claimed in claim 12, wherein this first robot more comprises at least two grasping parts, and this second robot more comprises at least one grasping part.
14. base material cleaning systems as claimed in claim 12, it more comprises:
Several located lateral carry the part assembly, couple with first and second robot, and a motor that is used to locate this year of part assembly.
15. base material cleaning systems as claimed in claim 12, wherein at least two grasping parts of this first robot are the base materials that is configured to send from least one input module and one first cleaning module, or will be sent to one second cleaning module from the base material of first cleaning module.
16. base material cleaning systems as claimed in claim 13, wherein at least one grasping part of this second robot is to be configured to transmit base material to a drier from least one cleaning module, or this drier transmits this base material to one output module certainly.
17. base material cleaning systems as claimed in claim 16, wherein this drier is suitable for by this base material to one horizontal level of deflection and then assists base material to transmit by an interface machine people with moving on it to be sent to a card casket.
18. base material cleaning systems as claimed in claim 12, wherein this first and second robot is configured to laterally move along this track, in order to several modules of turnover.
19. base material cleaning systems as claimed in claim 12, at least one of wherein said module are cleaning module.
20. a method that is used to clean a base material, it comprises at least:
Along one first shifting axle one first and one second robot is positioned on several cleaning modules;
Obtain a base material from an input module, and this base material is placed in one first cleaning module by this first robot;
Obtain this base material from this first cleaning module, and this base material is placed in this second cleaning module by this first robot;
Obtain this base material from this second cleaning module, and this base material is placed one the 3rd cleaning module by this first robot;
Obtain this base material from the 3rd cleaning module, and this base material is placed a drier by this second robot; And
Obtain this base material from this drier, and this base material is placed an output module by this second robot.
21. substrate handler as claimed in claim 20, wherein this first robot more comprises at least two grasping parts, is configured to transmit a base material between at least one input module and one first cleaning module.
22. substrate handler as claimed in claim 20, wherein this second robot more comprises at least one grasping part, is configured to transmit a base material between at least one second cleaning module and a drier.
23. a method that is used to clean a base material, it comprises at least:
Utilize at least one first and second robot to move the cleaner of described base material by a grinding system, wherein this second robot is suitable for transmitting the irradiation modules of all base materials to this cleaner.
CNA2006800094619A 2005-05-12 2006-05-11 Method and apparatus for vertical transfer of semiconductor substrates in a cleaning module Pending CN101147233A (en)

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TW200731368A (en) 2007-08-16
CN101409226A (en) 2009-04-15
US20090025749A1 (en) 2009-01-29
US20060254715A1 (en) 2006-11-16
WO2006124472A3 (en) 2007-03-08
KR20070112397A (en) 2007-11-23
TWI379349B (en) 2012-12-11
WO2006124472A2 (en) 2006-11-23

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