CN101094540A - Miniature acoustic transducer - Google Patents
Miniature acoustic transducer Download PDFInfo
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- CN101094540A CN101094540A CN 200710102555 CN200710102555A CN101094540A CN 101094540 A CN101094540 A CN 101094540A CN 200710102555 CN200710102555 CN 200710102555 CN 200710102555 A CN200710102555 A CN 200710102555A CN 101094540 A CN101094540 A CN 101094540A
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Abstract
A technique using a new diaphragm structure and support design is provided herein for microphones or structure designs for pressure sensing. The structure includes a set of capacitive structures. The capacitive structure has a combination of a diaphragm structure, a back plate structure and a surrounding micro-structure for fixing the diaphragm. After the diaphragm structure has deformed due to a pressure load, a gap between the back plate and the diaphragm is changed accordingly, and variation occurs in the capacitance value between the two parallel plates. By using the principle of the effect of capacitance value variation, the capacitive sensor causes the capacitance value to vary with the change in the sound, thus accomplishing the object of measuring.
Description
Technical field
The present invention relates to a kind of miniature acoustic transducer, particularly relate to a kind of miniature acoustic transducer with low spring constant structure, it has the usefulness of high sensitivity and deflection.
Background technology
The Electret Condencer Microphone chip is integrated the sonic sensor (Acoustic Transducer) that forms with silicon Micrometer-Nanometer Processing Technology and integrated circuit (IC) manufacture craft technology, have advantages such as light weight, volume is little, signal quality is good, on people's livelihood household appliances are used, because the demand order of mobile phone benefit increases and sound quality requires to increase day by day, it is flourish to add that the market of hearing aids and technology have begun, and the Electret Condencer Microphone chip has become the main flow of microphone chip gradually.With regard to the angle in market, according in the report of Digitimes company market trend about the mobile phone handsets part, estimate North America microphone chip (Microphone Chips) market in 2004, to reach 500,000,000 level, and from 2004 to 2009 every year will grow up towards market stability with 20%.The application of the microphone on the mobile phone belongs to main flow in the market.
Owing to the ic manufacturing process that with silicon is base material is more cheap, be used in the electronic product in large quantities, and application constantly expands outwardly, it is the manufacture craft making of base material with silicon that a large amount of application meetings is more arranged in the future, and collocation CMOS manufacture craft will read circuit and directly be integrated on the chips, add that Taiwan has become 60～70% the foundry rate that global first semiconductor foundries is about existing market, but in the future certainly will volume production and quicken its commercialization time-histories.Therefore if on the layout of microphone, avoid and separate the element design of each big factory of family, must obtain the novel designs of member end earlier and make first chance, just can win the advantage on microphone element market, with the ability of carving up occupation rate.
At present on the volume production that is applied in product of microphone element structure, only limit to a little several structure, this also is because the manufacturer of MEMS (Microelectromechanical Systems) microphone of entering at present has only a little event of manufacturer of a few family of number, as Knowles company, Infineon company or Sonion company etc., and most on the market packaged type still with Knowles exploitation be designed to main.
Please refer to Fig. 1 to Fig. 3, it illustrates the microphone structure design of Knowles company.This sonic sensor (Acoustic Transducer) 10 comprises conductive film (Conductive Diagram) 12 and the member (Perforated Member) 40 with perforation, supported by substrate 30, and by 20 isolation in air gap (AirGap).An extremely thin air gap 22 then exists between conductive film 12 and the substrate 30, so that this film 12 can freely be moved up and down, and makes film 12 reduce vibrations (Decouple) from substrate 30.Many projections (Indentation) 13 then are formed under the film 12, to avoid the adsorption phenomena between film 12 and the substrate 30.
Laterally moving of film 12 limited by the support sector 41 of member 40, and this can be as being the suitable beginning space of opening between film 12 and the member 40, and this support sector 41 can be annulus (Ring) structure or many projections (Bump) construct.If support sector 41 is annulus structures, then when film 12 leans against in the support sector 41, then can form acoustical seal space closely, can cause sonic sensor to have control extraordinary low frequency rate of descent (Roll-off).Has a dielectric layer 31 between film 12 and the substrate 30.And conductive electrode (Conducting Electrode) the 42nd is fixed on non-conductive member 40 times.And this member 40 has several holes 21, and film 12 also has several holes, forms the path 14 that sound flows in order to the hole 21 with member 40.
The microphone structure design of Knowles company mainly is the finger support formula structural design at backboard (back plate), increases the intensity of backboard, to reduce the backboard impedance.And film (Membrane) is adopted the design that reduces residual stress (residual stress), takes general circular membrane design.Film is only done in simple support, and is though its structure can be avoided the problem of residual stress and higher natural frequency response, not enough but the effective deformation amount of its design and sensitivity are still still disliked.
Please refer to Fig. 4, it illustrates another microphone structure design of Knowles company.Basically the structure with Fig. 1-3 is identical, unique difference is that this film 12 is to be connected on the substrate 30 by several spring structures (Spring) 11, so that alleviate film inherent strain (Intrinsic Stress), and from substrate 30 or the back stress that is produced of device encapsulation.
The conventional microphone element design adopts the film design of simple fixation, though the method for designing that increases film sensitivity is arranged, as referring to support formula (Finger) structure, please refer to shown in Figure 5ly, and wherein film 510 has the structure that refers to support.Or fold formula (corrugated) structure, please refer to shown in Figure 6ly, wherein film 610 has the structure of fold.But most design all has its shortcoming, refers to the film of the formula that supports, and its film is softer comparatively sensitive, but but is the lower frequency resonance response of tool, and is easy to fracture.Fold formula film design though can effectively reduce the influence of residual stress, make the bigger of film sensitivity change, but its manufacture craft is complicated, and processing is difficult for, and it is limited to increase sensitivity.
Summary of the invention
The objective of the invention is to propose a miniature acoustic transducer, it can increase film sensitivity (compliance), and produce the structure of low spring constant with the structural design of innovation, make sonic sensor (Acoustic Transducer) have more the usefulness of high sensitivity and deflection.
The object of the present invention is achieved like this, a kind of miniature acoustic transducer promptly is provided, comprise a condenser type sound press sensing element, and above-mentioned condenser type sound press sensing element comprise the conduction material is arranged on two or more parallel version to constitute electric capacity, open sound hole on wherein at least one parallel-plate, and in other parallel-plate, have a spring structure at least one parallel-plate.
A kind of miniature acoustic transducer structure proposed by the invention is formed, and comprises substrate (Substrate) and backboard (Black plate) on it and film (Diaphragm).Its dorsulum has most sound press holes (Acoustic hole), and film surface has one or more raised structures (Indentation).This raised structures will contact backboard becomes supporting construction, and another surface of above-mentioned film has the bridge-like structure of cutting open, when sound press transfers to film, bridge-like structure can produce distortion because of the support of raised structures, therefore film increases the deflection of displacement, with so that the Electric Field Distribution of electric capacity is between film and backboard, after sound press caused deformation of thin membrane and bridge-like structure displacement, the capacitance change that causes was the principle of sensing.
For above and other objects of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Description of drawings
Fig. 1～Fig. 3 is existing microphone structure design diagram;
Fig. 4 is another kind of existing microphone structure design diagram;
Fig. 5 is a kind of film design schematic diagram with finger support formula (Finger) structure in the existing microphone structure;
Fig. 6 is a kind of film design schematic diagram with fold formula (corrugated) structure in the existing microphone structure;
Fig. 7 A and Fig. 7 B are the sonic sensor generalized sections with bridge shape spring structure of explanation a preferred embodiment of the present invention;
Fig. 8 and Fig. 9 are the sonic sensor solid and the cutaway views with bridge shape spring structure of explanation a preferred embodiment of the present invention.
The main element symbol description:
10: sonic sensor (Acoustic Transducer)
12: conductive film (ConductiVe Diagram)
40: member (Perforated Member) with perforation
30: substrate
20,22: air gap (Air Gap)
41: support sector
31: dielectric layer
11: spring structure (Spring)
510,610: film
700: substrate (substrate)
710: backboard (back plate) structure
712: sound hole (Acoustic hole)
720: insulating barrier
730: film
732: suspension beam structure
734: projection (indentation)
736: pedestal
810: back board structure
812: sound hole
820: film
830: bridge-like structure
832 and 834: cantilever
836: the bridge core
Embodiment
The present invention proposes a kind of sonic sensor (Acoustic Transducer), be to utilize the spring structure notion, producing special structure plan and the raised structures on the film on the pressure-sensing film when supporting, framework goes out the structure of similar bridge shape spring, to improve the performance of sonic sensor.And its principle can change the design configuration of film for if will effectively increase sensitivity with simple structure, can produce structure effect as the spring-like by supporting construction (SupportStructure), and increases the sensitivity of film.The present invention proposes a kind of miniature acoustic transducer structure, can apply to for example mini microphone (Microphone) element, or any electronic installation that sound need be converted to signal, for example mobile phone or mini microphone etc., or the variation of any detecting air pressure and being converted in the electronic installation of signal.
A kind of miniature acoustic transducer structure proposed by the invention is formed, and comprises a kind of condenser type sound press sensing element.This condenser type sound press sensing element comprises the parallel-plate that electric conducting material is arranged on two or more and constitutes electric capacity, opens sound hole on wherein at least one parallel-plate, and in other parallel-plate construction spring structure at least one parallel-plate.
A kind of miniature acoustic transducer proposed by the invention can be applicable on the devices such as pressure sensor, acceleration transducer or ultrasonic sensor.
In one embodiment, a kind of miniature acoustic transducer structure proposed by the invention is formed, and comprises substrate (Substrate) and backboard (Black plate) on it and film (Diaphragm).Its dorsulum has most sound press holes (Acoustic hole), and film surface has one or more raised structures (Indentation).This raised structures will contact backboard becomes supporting construction, and above-mentioned film surface has the bridge-like structure of cutting open, when sound press transfers to film, bridge-like structure can produce distortion because of the support of raised structures, therefore film increases the deflection of displacement, with so that the Electric Field Distribution of electric capacity is between film and backboard, after sound press caused deformation of thin membrane and bridge-like structure displacement, the capacitance change that causes was the principle of sensing.
And this film is a kind of deformation film-sensing unit, for example can be the design with one or more special bridge shapes (Bridge) or overarm (Beam).In addition, have structures single or most projections (Indentation) on the film surface, will be as the usefulness of film support.And the raised structures under each bridge shape or the cantilever design forms the effect of a category springy, and the structure of many categories springy effect will be arranged on film, is referred to as bridge shape spring or cantilever spring.
When air pressure is sent to film, film can produce distortion, and the raised structures of film lower surface contacts support with backboard, bridge shape on the film or cantilever design can significantly be out of shape because of the support force of raised structures, the dull and stereotyped distortion that can therefore produce upper and lower displacement of film this moment, so will increase distortion and displacement between two flat boards, and increase the capacitance variations value between flat board indirectly, this design will increase the sensitivity of film greatly.And the film of microphone and the capacitance variations between backboard will be sent out measured signal by the conduction design.
And above-mentioned deformation film-sensing unit and back board structure can use one or more material to form, comprise with carbon being the polymer (Carbon-based polymers) of matrix, silicon (Silicon), silicon nitride (Silicon nitride), compound crystal silicon (Polycrystalline silicon), amorphous silicon (Amorphoussilicon), silicon dioxide (Silicon dioxide), carborundum (Silicon carbide), germanium (Germanium), gallium (Gallium), arsenide (Arsenide), carbon (Carbon), titanium (Titanium), gold (Gold), iron (Iron), copper (Copper), chromium (Chromium), tungsten (Tungsten), aluminium (Aluminum), platinum (Platinum), nickel (Nickel), tantalum (tantalum) or its alloy or the like.
Proposed by the invention have bridge shape spring or an isostructural sonic sensor of cantilever spring, its framework please refer to shown in Fig. 7 A and Fig. 7 B in one embodiment, in addition also with reference to figure 8, the solid test schematic diagram with bridge Like spring structure of sonic sensor proposed by the invention is described, and explanation in the lump down below.The structure that on substrate (substrate) 700, has two-layer parallel-plate, one is backboard (back plate) structure 710, and in addition with one be sensing film 730 (as Fig. 8 820), and back board structure 710 (as Fig. 8 810) and film 730 (as Fig. 8 820) between be separated by a silicon oxide layer for example by an insulating barrier 720.Back board structure 710 have a plurality of sound holes (Acoustic hole) 712 (as Fig. 8 812).And film 730 (as Fig. 8 820) but be a kind of film-sensing unit of deformation, for example can be have special bridge shape (Bridge) or the overarm (Beam) structure design.
Film 730 (as Fig. 8 820) have the structure of single or multiple bridge shape or overarm on the surface.For example, shown in Fig. 7 A, one position 722 of insulating barrier 720 and film 730 (as Fig. 8 820) pedestal 736 combine, and by the pedestal 736 film suspension beam structure 732 that stretches out, and on this film suspension beam structure 732 with form the structure of single or plural projection (indentation) 734 on the back board structure 710 corresponding sides, as the usefulness of these film suspension beam structure 732 supports.Certainly, as previously mentioned, the part on this film suspension beam structure 732 is 830 structure as indicating number among Fig. 8, can be the structure of a bridge Like or cantilever, and is beneath with bridge-like structure 830 explanations.And this this bridge-like structure 830 and its projection 734 form the effect of a category springy.
At sonic sensor proposed by the invention, configurable one group or the structure of many categories springy effect are called bridge shape or cantilever spring at this on film 730.When air pressure transmits film 730, film 730 can produce distortion, and projection 734 structures of suspension beam structure 732 lower surfaces contact support with back board structure 710, bridge-like structure 830 on the film 730 can be out of shape significantly because of the support force of projection 734 structures, this moment, therefore film 730 meetings produced the distortion of upper and lower displacement, so will increase distortion and displacement between 730 liang of flat boards of back board structure 710 and film, increase the capacitance variations value between two flat boards indirectly.And via the conductive material that is configured on the film 730, and cloth is implanted in the conductive layer 714 of whole layer on the substrate 700, and induction and record this capacitance variations.In the above-mentioned conduction design, also can be designed to back board structure 710 and all be formed, and constitute two parallel poles of capacitor by conductive material with 730 liang of flat boards of film.Will increase the sensitivity of film greatly by above design.And the film of microphone and the capacitance variations between backboard will be exported by such conduction design.
Please refer to Fig. 8, on substrate, have the structure of two-layer parallel-plate, comprise back board structure 810 and film 820.Back board structure 810 has a plurality of sound holes 812.Have four bridge shape spring structures 830 on film 820 surfaces, so needs on this quantity viewable design and adjusting.And this bridge-like structure 830 comprises two cantilevers 832 and 834, and bridge core 836 belows are formed by 734 projections (indentation) structure.And the structure of formation 734 projections (indentation) on this bridge-like structure 830 and the back board structure 810 corresponding sides.734 raised structures of bridge shape spring structure 830 lower surfaces contact support with back board structure 810, and make bridge-like structure 830 and its 734 projection form the effect of a category springy, just the bridge-like structure on the film 820 830 can significantly be out of shape because of the support force of 734 raised structures, this moment, therefore film 820 meetings produced the distortion of upper and lower displacement, so will increase distortion and displacement between 820 liang of flat boards of back board structure 810 and film, increase the capacitance variations value between two flat boards indirectly.Fig. 9 then bridge-like structure dorsulum structure 810 of key diagram 8 sonic sensors has the structure of a plurality of sound holes 812.
This case proposes one to increase film sensitivity (compliance), and produce the structure of low spring constant with the structural design of innovation, make sonic sensor (Acoustic Transducer), microphone element for example has more the usefulness of high sensitivity and deflection.
Though disclosed the present invention in conjunction with above preferred embodiment; yet it is not in order to limiting the present invention, anyly is familiar with this operator, without departing from the spirit and scope of the present invention; can do some change and retouching, thus protection scope of the present invention should with enclose claim was defined is as the criterion.
Claims (16)
1. miniature acoustic transducer, comprise a condenser type sound press sensing element, and above-mentioned condenser type sound press sensing element comprise the conduction material is arranged on two or more parallel version to constitute electric capacity, open sound hole on wherein at least one parallel-plate, and in other those parallel-plates, have a bridge-like structure at least one this parallel-plate.
2. miniature acoustic transducer as claimed in claim 1, wherein above-mentioned bridge-like structure is a cantilever structure.
3. miniature acoustic transducer as claimed in claim 1, wherein above-mentioned bridge-like structure are pulled tension brace type large bridge-like structures.
4. miniature acoustic transducer comprises:
One substrate, have backboard and film on it, wherein above-mentioned backboard has a plurality of sound press hole, and above-mentioned pellicular front has one or more raised structures to a side surface of above-mentioned backboard, when sound press transfers to above-mentioned film, above-mentioned raised structures will contact above-mentioned backboard becomes a supporting construction, and another surface of above-mentioned film has the bridge-like structure of cutting open, bridge-like structure can produce distortion because of the support of raised structures, therefore and make above-mentioned film increase the deflection of displacement, with so that the Electric Field Distribution of electric capacity is between above-mentioned film and backboard and change.
5. miniature acoustic transducer as claimed in claim 4, wherein above-mentioned supporting construction are that a kind of elastic structure by the tool elastic characteristic is formed.
6. miniature acoustic transducer as claimed in claim 4, wherein above-mentioned bridge-like structure is a cantilever structure.
7. miniature acoustic transducer as claimed in claim 4, wherein above-mentioned bridge-like structure are pulled tension brace type larges or refer to support formula (finger) bridge-like structure.
8. miniature acoustic transducer as claimed in claim 4, the spacing between wherein above-mentioned backboard and the film are the distances with distortion that the bridge-like structure that supports above-mentioned film makes.
9. miniature acoustic transducer as claimed in claim 4, wherein above-mentioned backboard and above-mentioned film are parallel to each other, and the direction that makes progress with respect to vertical aforesaid substrate surface, above-mentioned backboard below, and above-mentioned film is positioned at the top.
10. miniature acoustic transducer as claimed in claim 9, wherein above-mentioned back shaped being formed on the aforesaid substrate is the part of aforesaid substrate.
11. miniature acoustic transducer as claimed in claim 9, wherein above-mentioned film is formed on the aforesaid substrate.
12. miniature acoustic transducer as claimed in claim 4, wherein above-mentioned backboard and above-mentioned film are parallel to each other, and the direction that makes progress with respect to vertical aforesaid substrate surface, above-mentioned backboard up, and above-mentioned film is positioned at the below.
13. miniature acoustic transducer as claimed in claim 12, wherein above-mentioned film is formed on the aforesaid substrate.
14. miniature acoustic transducer as claimed in claim 12, wherein above-mentioned back shaped being formed on the aforesaid substrate is the part of aforesaid substrate.
15. miniature electro-acoustic element as claimed in claim 4, wherein above-mentioned film and above-mentioned backboard are by the polymer that is matrix (Carbon-based polymers) with carbon, silicon (Silicon), silicon nitride (Siliconnitride), compound crystal silicon (Polycrystalline silicon), amorphous silicon (Amorphous silicon), silicon dioxide (Silicon dioxide), carborundum (Silicon carbide), germanium (Germanium), gallium (Gallium), arsenide (Arsenide), carbon (Carbon), titanium (Titanium), gold (Gold), iron (Iron), copper (Copper), chromium (Chromium), tungsten (Tungsten), aluminium (Aluminum), platinum (Platinum), nickel (Nickel), tantalum (tantalum) or its alloy are formed.
16. miniature acoustic transducer as claimed in claim 4, wherein having the raised structures that supports above-mentioned film can be on above-mentioned back board structure.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US81537406P | 2006-06-20 | 2006-06-20 | |
| US60/815,374 | 2006-06-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101094540A true CN101094540A (en) | 2007-12-26 |
| CN101094540B CN101094540B (en) | 2012-06-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101025557A Active CN101094540B (en) | 2006-06-20 | 2007-05-14 | Miniature acoustic transducer |
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|---|---|
| CN (1) | CN101094540B (en) |
| TW (1) | TWI334734B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012013027A1 (en) * | 2010-07-30 | 2012-02-02 | 上海丽恒光微电子科技有限公司 | Micro-electro-mechanical microphone and manufacturing method thereof |
| CN101494814B (en) * | 2008-01-21 | 2012-11-21 | 财团法人工业技术研究院 | Voltage variation capacitance device |
| CN102879463A (en) * | 2012-10-08 | 2013-01-16 | 中国矿业大学 | Gas outburst sensor based on sound wave principle |
| CN101656906B (en) * | 2008-08-20 | 2013-01-23 | 财团法人工业技术研究院 | Speaker monomer structure |
| CN103297907A (en) * | 2012-02-23 | 2013-09-11 | 苏州敏芯微电子技术有限公司 | Capacitive mini-type microphone and manufacturing method thereof |
| CN103607687A (en) * | 2013-11-29 | 2014-02-26 | 上海集成电路研发中心有限公司 | MEMS microphone defect monitoring structure and manufacturing method thereof |
| CN110324772A (en) * | 2018-03-30 | 2019-10-11 | 台湾积体电路制造股份有限公司 | Senser element and its manufacturing method |
| CN111684252A (en) * | 2017-11-17 | 2020-09-18 | 希奥检测有限公司 | Capacitive pressure sensor and other devices with suspended membrane and rounded corners at anchor edges |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100092992A (en) * | 2009-02-11 | 2010-08-24 | 주식회사 비에스이 | Method of making sound hole in case of condenser microphone and the condenser microphone case |
| TWI392641B (en) * | 2010-01-21 | 2013-04-11 | Richwave Technology Corp | Microelectromechanical system (mems) device and methods for fabricating the same |
| TWI487886B (en) * | 2014-03-26 | 2015-06-11 | Univ Nat Kaohsiung Applied Sci | Integrated Sensing Device with Ultrasonic Transducer and Microphone and Its Method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| GB1580087A (en) * | 1977-11-22 | 1980-11-26 | Standard Telephones Cables Ltd | Electroacoustic transducer device |
| US4182937A (en) * | 1978-09-21 | 1980-01-08 | International Standard Electric Corp. | Mechanically biased semiconductor strain sensitive microphone |
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2006
- 2006-12-29 TW TW95149965A patent/TWI334734B/en active
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2007
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101494814B (en) * | 2008-01-21 | 2012-11-21 | 财团法人工业技术研究院 | Voltage variation capacitance device |
| CN101656906B (en) * | 2008-08-20 | 2013-01-23 | 财团法人工业技术研究院 | Speaker monomer structure |
| US8955212B2 (en) | 2010-07-30 | 2015-02-17 | Lexvu Opto Microelectronics Technology (Shanghai) Ltd | Method for manufacturing a micro-electro-mechanical microphone |
| CN102348155A (en) * | 2010-07-30 | 2012-02-08 | 江苏丽恒电子有限公司 | Micro-electromechanical microphone and manufacturing method thereof |
| WO2012013027A1 (en) * | 2010-07-30 | 2012-02-02 | 上海丽恒光微电子科技有限公司 | Micro-electro-mechanical microphone and manufacturing method thereof |
| CN102348155B (en) * | 2010-07-30 | 2014-02-05 | 上海丽恒光微电子科技有限公司 | Micro-electromechanical microphone and manufacturing method thereof |
| CN103297907A (en) * | 2012-02-23 | 2013-09-11 | 苏州敏芯微电子技术有限公司 | Capacitive mini-type microphone and manufacturing method thereof |
| CN102879463A (en) * | 2012-10-08 | 2013-01-16 | 中国矿业大学 | Gas outburst sensor based on sound wave principle |
| CN103607687A (en) * | 2013-11-29 | 2014-02-26 | 上海集成电路研发中心有限公司 | MEMS microphone defect monitoring structure and manufacturing method thereof |
| CN103607687B (en) * | 2013-11-29 | 2018-10-16 | 上海集成电路研发中心有限公司 | A kind of MEMS microphone defect monitoring structure and its manufacturing method |
| CN111684252A (en) * | 2017-11-17 | 2020-09-18 | 希奥检测有限公司 | Capacitive pressure sensor and other devices with suspended membrane and rounded corners at anchor edges |
| CN111684252B (en) * | 2017-11-17 | 2022-02-01 | 希奥检测有限公司 | Capacitive pressure sensor and other devices with suspended membrane and rounded corners at anchor edges |
| US11248976B2 (en) | 2017-11-17 | 2022-02-15 | Sciosense B.V. | Capacitive pressure sensors and other devices having a suspended membrane and having rounded corners at an anchor edge |
| CN110324772A (en) * | 2018-03-30 | 2019-10-11 | 台湾积体电路制造股份有限公司 | Senser element and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101094540B (en) | 2012-06-27 |
| TW200803576A (en) | 2008-01-01 |
| TWI334734B (en) | 2010-12-11 |
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