CN1010754B - Copper-based polybasic alloy soldering materials - Google Patents
Copper-based polybasic alloy soldering materialsInfo
- Publication number
- CN1010754B CN1010754B CN 89102186 CN89102186A CN1010754B CN 1010754 B CN1010754 B CN 1010754B CN 89102186 CN89102186 CN 89102186 CN 89102186 A CN89102186 A CN 89102186A CN 1010754 B CN1010754 B CN 1010754B
- Authority
- CN
- China
- Prior art keywords
- copper
- solder
- rare earth
- present
- earth element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to copper-base multielement alloy solder. The present invention begins to successfully replace silver-bearing copper solder in the soldering of crystal lattice tube holders at present, and the cost is only smaller than one third of the cost of the silver-bearing copper solder. The copper-base multielement alloy solder has the components by weight of 6 to 7% of Sn, 4 to 6% of Zn, 0.2 to 0.4% of P and 0.1 to 0.15% of rare earth elements; the priority selection components are 6.5% of Sn, 5% of Zn, 0.3% of P and 0.12% of rare earth elements.
Description
The present invention is a kind of copper-based polybasic alloy soldering materials that contains tin, phosphorus, zinc, rare earth element, is applicable to that mother metal is the soldering of part in addition of copper and steel, cast iron.
Chinese patent 85109459 discloses a kind of " copper-phosphorus-Xi-Cu-P-Sn-rare earth welding ", and its composition (percentage by weight) is a stanniferous 0.7～1.5%, phosphorus 5.5～7.5%, and mishmetal 0.08～0.2%, all the other are copper.It can substitute silver wire, still, such as the soldering of the base of transistor, must adopt filler metal sheet, and past is employing Ag72% usually, Cu28% or contain Ag50%, the silver-bearing copper weld tabs of Cu50%, still do not have a kind of fully not the weld tabs of argentiferous can replace it.
Purpose of the present invention, be to make a kind of mechanical strength height, electrical property and engaging force can reach the multicomponent alloy solder by copper, tin, phosphorus, zinc and rare earth element combination of soldering processes requirement, and it can be processed into the weld tabs of thickness less than 0.13mm, in order to substitute the silver-bearing copper weld tabs.
Copper-based polybasic alloy soldering materials provided by the invention contains (by weight): 6～7%Sn, 4～6%Zn, 0.2～0.4%P, 0.1～0.15% rare earth element.The preferential selection: 6.5%Sn, 5%Zn, 0.3%P, 0.12% rare earth element.This solder fusing point is 948 ℃, resistivity＜0.129 Ω mm
2/ m.
Solder of the present invention has the following advantages:
1. this solder has higher mechanical strength.Tensile strength when rolling thickness is 0.20mm, σ b:40～43kgf/mm
2Reach or a little more than the mechanical strength of ag-cu solder.Be enough to guarantee the requirement of strength of weld seam.
2. this solder has good plasticity.Percentage elongation when rolling thickness is 0.20mm, δ %:37～42%.Can be processed into thickness is the strip material of 0.11～0.12mm, adapts to the brazing filler metal technological requirement of those play movement＜0.13mm.
Embodiment:
The present invention is a raw material with cathode copper, a tin, No. two zinc, phosphor bronze alloys, and rare-earth element cerium (Ce) is an additive.The preferential composition of alloy (by weight) is: 6.5%Sn, and 5%Zn, 0.3%P, 0.12%Ce, surplus is Cu.Be smelted into casting by this prescription in intermediate frequency (IF) smelting stove or Elema electric furnace and split, take the technology of split rolling method-homogenizing annealing-roughing-intermediate annealing-finish rolling then, being processed into thickness is the solder band of 0.11～0.12mm.Also can be processed into the solder of other shapes and specification according to this.
The fusion temperature scope of solder of the present invention is 948 ℃～980 ℃, and liquidus curve is 980 ℃, is suitable for furnace brazing.Promptly the punching out of this solder is become the weld tabs of specific dimensions and shape,, can be positioned between two kinds of soldered mother metals, in being connected with the electric furnace of protective gas, carry out soldering through after the cleaning treatment.
Claims (3)
1, a kind of copper-based polybasic alloy soldering materials that contains tin, phosphorus, rare earth element, it is characterized by scolder is 6～7%Sn by weight percentage, 4～6%Zn, 0.2～0.4%P, 0.1～0.15% rare earth element, all the other are Cu.
2, solder according to claim 1 is characterized in that the scolder optimal components contains (by weight) 6.5%Sn, 5%Zn, and 0.3%P, 0.12% rare earth element, all the other are Cu.
3, solder according to claim 1 and 2 is characterized in that rare earth element is a cerium, is additive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 89102186 CN1010754B (en) | 1989-04-08 | 1989-04-08 | Copper-based polybasic alloy soldering materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 89102186 CN1010754B (en) | 1989-04-08 | 1989-04-08 | Copper-based polybasic alloy soldering materials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1039986A CN1039986A (en) | 1990-02-28 |
| CN1010754B true CN1010754B (en) | 1990-12-12 |
Family
ID=4854574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 89102186 Expired CN1010754B (en) | 1989-04-08 | 1989-04-08 | Copper-based polybasic alloy soldering materials |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1010754B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1325222C (en) * | 2002-07-30 | 2007-07-11 | 乔治洛德方法研究和开发液化空气有限公司 | Brazing copper heat exchanger and method for mfg. it through soldering |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1055882C (en) * | 1997-12-12 | 2000-08-30 | 北京有色金属研究总院 | High-temp solder alloy powder for welding stain-less steel container and its preparation process |
| CN1055883C (en) * | 1997-12-22 | 2000-08-30 | 北京有色金属研究总院 | High-smelting point and low-vapor pressure solder alloy powder for soldering stain-less steel container and its preparation |
| CN1108896C (en) * | 1998-07-01 | 2003-05-21 | 洪若锋 | Special crystalline soldering flux and its manufacture method |
| CN100389215C (en) * | 2005-12-05 | 2008-05-21 | 金李梅 | Multi-element alloy copper-base brazing filler material |
| CN101342644B (en) * | 2007-07-13 | 2012-05-23 | 浙江信和科技股份有限公司 | High-plasticity environment-friendly silver-saving medium-temperature brazing filler metal |
| CN101554687B (en) * | 2009-05-21 | 2011-01-05 | 浙江新锐焊接材料有限公司 | Novel middle-temperature aluminum cored solder wire |
| CN101664864B (en) * | 2009-09-24 | 2011-08-03 | 哈尔滨工业大学 | Moderate temperature copper based brazing filler metal and preparation method thereof |
| CN103801855A (en) * | 2013-12-02 | 2014-05-21 | 青岛蓝图文化传播有限公司市南分公司 | Novel silver-free copper solder |
| CN114952078A (en) * | 2022-05-25 | 2022-08-30 | 浙江亚通焊材有限公司 | Preparation method of copper-based solder for brazing stainless steel and red copper and copper-based solder |
-
1989
- 1989-04-08 CN CN 89102186 patent/CN1010754B/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1325222C (en) * | 2002-07-30 | 2007-07-11 | 乔治洛德方法研究和开发液化空气有限公司 | Brazing copper heat exchanger and method for mfg. it through soldering |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1039986A (en) | 1990-02-28 |
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Legal Events
| Date | Code | Title | Description |
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C13 | Decision | ||
| GR02 | Examined patent application | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |