CN101009318A - Organic light-emitting display device and method for fabricating the same - Google Patents
Organic light-emitting display device and method for fabricating the same Download PDFInfo
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- CN101009318A CN101009318A CNA2007100082092A CN200710008209A CN101009318A CN 101009318 A CN101009318 A CN 101009318A CN A2007100082092 A CNA2007100082092 A CN A2007100082092A CN 200710008209 A CN200710008209 A CN 200710008209A CN 101009318 A CN101009318 A CN 101009318A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
本发明提供了一种有机发光显示装置。根据本发明一个实施例的有机发光显示装置包括：第一基底；第二基底，包括与第一基底相对的内表面；有机发光像素的阵列，形成在第一基底和第二基底之间，所述阵列包括面向第二基底的顶部表面；玻璃料密封件，位于第一基底和第二基底之间并包围所述阵列；膜结构，包括一层或多层膜，膜结构包括位于所述阵列和第二基底之间的部分，膜结构接触所述内表面和所述顶部表面，其中，第二基底包括内表面上的凹陷。
The invention provides an organic light emitting display device. An organic light emitting display device according to an embodiment of the present invention includes: a first substrate; a second substrate including an inner surface opposite to the first substrate; an array of organic light emitting pixels formed between the first substrate and the second substrate, the The array includes a top surface facing the second substrate; a frit seal located between the first substrate and the second substrate and surrounding the array; a film structure comprising one or more films, the film structure comprising A portion between the second substrate, the membrane structure contacts the inner surface and the top surface, wherein the second substrate includes a depression on the inner surface.
Description
The application requires the priority and the rights and interests of 10-2006-0007961 number of submitting on January 25th, 2006 and the 10-2006-0034899 korean patent application of submitting on April 18th, 2006, and disclosing of these applications is contained in this by reference fully.
Technical field
The present invention relates to a kind of display unit, more particularly, relate to a kind of organic light-emitting display device.
Background technology
Recently, for example liquid crystal indicator, organic light-emitting display device, plasma display flat-panel monitors such as (PDP) receive much concern.Because LCD is a passive device, rather than emitter, therefore be difficult to make LCD to have high brightness and contrast, wide visual angle and large-sized screen.And PDP is an emitter, compares with other display, and PDP Heavy Weight, power consumption height also need complicated manufacturing process.
Simultaneously, because organic light-emitting display device (OLED) is an emitter, so it has wide visual angle and high-contrast.In addition, because that OLED does not need is backlight, so OLED can be made in light weight, miniaturization and low in energy consumption.In addition, OLED can drive, have fast response speed with low dc voltage and be made by solid material fully.As a result, OLED has the ability to resist the temperature of external impact and wide region, and can be with low cost by the straightforward procedure manufacturing.
Summary of the invention
An aspect of of the present present invention provides a kind of organic light-emitting display device, and described organic light-emitting display device can comprise: first substrate; Second substrate comprises and the described first substrate interior surface opposing; The array of organic light emission pixel is formed between described first substrate and described second substrate, and described array comprises towards the top surface of described second substrate; Glass frit seal between described first substrate and described second substrate, is surrounded described array; Membrane structure comprises one or more layers film, and described membrane structure comprises the part between described array and described second substrate, and described membrane structure contacts described inner surface and described top surface; Wherein, described second substrate comprises the depression on the described inner surface.
In said apparatus, described membrane structure can not contact described glass frit seal.Described inner surface can be smooth basically, has to be substantially equal to or greater than the size of the size of described top surface.Can be formed in the described depression to the described membrane structure of small part.Described membrane structure can extend in the described depression.Described membrane structure can also comprise between described first substrate and described second substrate and other parts between described array and described second substrate not.Described membrane structure can cover the entire portion of described top surface substantially.Described membrane structure can comprise resin.Described resin can be ultraviolet-curing type or heat solidifiable type resin.Described resin can comprise select at least a from the group of being made of acrylic resin and polyimide resin.Described resin can comprise urethane acrylic resin.To the described membrane structure of small part can substantially transparent for visible light.Described array can be launched the visible light that passes described second substrate.
Still in said apparatus, described depression can be extended along the part of described glass frit seal.Described depression can be basically parallel to the described part of described glass frit seal.Described depression can form loop.Described inner surface can be smooth basically, and described depression can comprise the inclined-plane with respect to described inner surface, makes the described direction that is recessed in the periphery of the described inner surface of mind-set from described inner surface become steeper.Described inner surface can be smooth basically, described depression can comprise with respect to first inclined-plane of described inner surface and second inclined-plane, describedly be recessed to form paddy, wherein, described first inclined-plane can be than described second inclined-plane near described center, wherein, with respect to described inner surface, described second inclined-plane can be steeper than described first inclined-plane.Described second inclined-plane can be vertical with described inner surface basically.Described array can comprise first electrode, second electrode and the luminous organic material between described first electrode and described second electrode, wherein, described first electrode and described first substrate can have first distance, described second electrode and described first substrate can have second distance, wherein, described second distance can be greater than described first distance, and wherein, described top surface can be the surface of described second electrode.
Also in said apparatus, described membrane structure can comprise the passivation layer between described array and described organic resin layer, and wherein, described layer can be constructed to suppress basically described organic resin layer and be diffused in the described array.Described depression can have the degree of depth of measuring from described inner surface, and wherein, the described degree of depth can be from about 20 μ m to about 300 μ m.Described depression can have the width of measuring on described inner surface on the direction parallel with the edge of described inner surface, wherein, described width can be to about 5mm from about 0.1mm.Described glass frit seal can comprise from by magnesium oxide (MgO), calcium oxide (CaO), barium monoxide (BaO), lithia (Li
2O), (Na is received in oxidation
2O), potassium oxide (K
2O), boron oxide (B
2O
3), vanadium oxide (V
2O
5), zinc oxide (ZnO), tellurium oxide (TeO
2), aluminium oxide (Al
2O
3), silicon dioxide (SiO
2), lead oxide (PbO), tin oxide (SnO), phosphorous oxide (P
2O
5), ruthenium-oxide (Ru
2O), rubidium oxide (Rb
2O), rhodium oxide (Rh
2O), iron oxide (Fe
2O
3), cupric oxide (CuO), titanium oxide (TiO
2), tungsten oxide (WO
3), bismuth oxide (Bi
2O
3), antimony oxide (Sb
2O
3), one or more materials of selecting in the group formed of lead borate glass, phosphoric acid tin glass, vanadate glass and borosilicate.
Another aspect of the present invention provides a kind of method of making organic light emitting apparatus, the step that described method can comprise is: first substrate is provided, in described first substrate, form the array of organic light emitting pixel, between described first substrate and described array, be with or without layer; Second substrate is provided, forms curable resin on the surface of described second substrate, described second substrate comprises described lip-deep depression; Arrange described first substrate and described second substrate, make described resin between described array and described second substrate; Described first substrate and described second substrate are interconnected with frit, make described frit surround described array; Curable resin is solidified, and to form membrane structure, to make described membrane structure comprise one or more layers film that contains the resin that is cured, described membrane structure contacts described second substrate and described array.In said method, can flow in the described depression to the described resin of small part.The described resin of part at least can stop and flow in the described depression.
Description of drawings
From the reference accompanying drawing to the description below the certain exemplary embodiments, of the present invention above and others and feature with clear, wherein:
Fig. 1 is the cutaway view of exemplary organic light-emitting display device;
Fig. 2 to Fig. 5 is the cutaway view of organic light-emitting display device according to an exemplary embodiment of the present invention;
Fig. 6 A is the schematic, exploded according to the passive matrix organic light-emitting display device of an embodiment;
Fig. 6 B is the schematic, exploded according to the active matrix type organic light emitting display unit of an embodiment;
Fig. 6 C is the schematic top plan view according to the organic light emitting display of an embodiment;
Fig. 6 D is the cutaway view along the organic light emitting display of Fig. 6 C of line D-D intercepting;
Fig. 6 E is the perspective schematic view according to the batch process of the organic light emitting apparatus of an embodiment.
Embodiment
Now, come to describe more fully various embodiment of the present invention below with reference to accompanying drawings, exemplary embodiment of the present invention has been shown in the accompanying drawing.
Organic light emitting display (OLED) is the display unit that includes the array of OLED.Organic Light Emitting Diode is to produce and radiative solid state device when comprising organic material and being suitable for that it is applied suitable electromotive force.
According to the layout that exciting current is provided, OLED can be divided into two kinds of fundamental types usually.Fig. 6 A schematically shows the exploded view of the simplified structure of passive matrix OLED 1000.Fig. 6 B schematically shows the simplified structure of active array type OLED 1001.In two kinds of structures, OLED 1000, OLED 1001 comprise the OLED pixel that is formed on substrate 1002 tops, and the OLED pixel comprises anode 1004, negative electrode 1006 and organic layer 1010.When antianode 1004 applied suitable electric current, electric current flow through pixel, from the organic layer visible emitting.
With reference to Fig. 6 A, passive matrix OLED (PMOLED) design comprises prolongation band and the organic layer anode 1004 and negative electrode 1006 between of the prolongation of common and negative electrode 1006 with vertically arranged anode 1004.The cross section of the band of negative electrode 1006 and anode 1004 defines independent OLED pixel, and suitably during the band of the correspondence of excitation anode 1004 and negative electrode 1006, the OLED pixel produces also emission light.PMOLED provides and has made simple relatively advantage.
With reference to Fig. 6 B, active matrix OLED (AMOLED) comprises the drive circuit 1012 that is arranged between substrate 1002 and the OLED pel array.The independent pixel of AMOLED be limited to common cathode 1006 and and the anode 1004 of other anode electric insulation between.Each drive circuit 1012 combines with the anode 1004 of OLED pixel, and also combines with data wire 1016 and scan line 1018.In an embodiment, scan line 1018 is supplied with the sweep signal of the row of selecting drive circuit, and 1016 pairs of specific drive circuits of data wire are supplied with data-signal.Data-signal and sweep signal excitation local drive circuits 1012, excitation anode 1004 thus, thereby luminous by their corresponding pixels.
In the AMOLED that illustrates, local drive circuits 1012, data wire 1016 and scan line 1018 are embedded in the planarization layer 1014, and planarization layer 1014 is between pel array and substrate 1002.Planarization layer 1014 provides the smooth top surface that forms array of organic light emitting pixels thereon.Planarization layer 1014 can be formed by organic material or inorganic material, although planarization layer 1004 is depicted as individual layer, planarization layer 1014 can be by two-layer or two-layer above formation.Local drive circuits 1012 is formed with thin-film transistor (TFT) usually and is grid or array in OLED pel array arranged beneath.Local drive circuits 1012 can be made by organic material at least in part, comprises organic tft.AMOLED has short advantage of response time, has improved when being used for display data signal the satisfaction to them.In addition, AMOLED has the advantage littler than passive matrix OLED power consumption.
With reference to the common feature of PMOLED and AMOLED design, 1002 pairs of OLED pixels of substrate and circuit provide support structure.In various embodiments, substrate 1002 can comprise rigidity or flexible material and opaque or transparent material, for example plastics, glass and/or paper tinsel.As mentioned above, each OLED pixel or diode are formed with anode 1004, negative electrode 1006 and the organic layer 1010 between anode 1004 and negative electrode 1006.When antianode 1004 applied suitable electric current, negative electrode 1006 injected electronics, anode 1004 injected holes.In a particular embodiment, anode 1004 and negative electrode 1006 are put upside down, that is, negative electrode is formed in the substrate 1002, and anode is relatively arranged.
One or more layers organic layer is between negative electrode 1006 and anode 1004.More specifically, one deck emission layer or luminescent layer at least are set between negative electrode 1006 and anode 1004.Luminescent layer can comprise one or more luminous organic compounds.Usually, luminescent layer is constructed to, redness for example blue, green with solid color or white emission visible light.In the illustrated embodiment, one deck organic layer 1010 is formed between negative electrode 1006 and the anode 1004 and as luminescent layer.Other layer that can be formed between anode 1004 and the negative electrode 1006 can comprise hole transmission layer, hole injection layer, electron transfer layer and electron injecting layer.
Hole transmission layer and/or hole injection layer can be between luminescent layer 1010 and anodes 1004.Electron transfer layer and/or electron injecting layer can be between negative electrode 1006 and luminescent layers 1010.By reducing to inject from negative electrode 1006 work function of electronics, electron injecting layer helps to inject electronics from negative electrode 1006 to luminescent layer 1010.Similarly, hole injection layer helps from anode 1004 to luminescent layer 1010 injected holes.Hole transmission layer and electron transfer layer help from the motion of each electrode to the charge carrier of luminescent layer injection.
In certain embodiments, individual layer can play that electronics injects and the effect of electric transmission or can play the effect of hole injection and hole transport.In certain embodiments, lack one deck or multilayer in these layers.In certain embodiments, with one or more materials that help the injection of charge carrier and/or transmission one or more layers organic layer that mixes.Only form between negative electrode and anode among the embodiment of one deck organic layer, organic layer not only can comprise organic luminophor but also can include help the specific functional material that charge carrier injects or transmits in this layer.
Developed the multiple organic material that is used in these layers that comprise luminescent layer.In addition, developing multiple other the organic material that is used in these layers.In certain embodiments, these organic materials can be for comprising the macromolecule of oligomer and polymer.In certain embodiments, the organic material of these layers can be less relatively molecule.Every layer the suitable material that those skilled in the art can select to be used for these layers according to the desired function and the used material of adjacent layer of each layer in particular design.
In operation, circuit provides suitable electromotive force between negative electrode 1006 and anode 1004.This makes electric current flow to negative electrode 1006 through middle organic layer from anode 1004.In one embodiment, negative electrode 1006 provides electronics to adjacent organic layer 1010.Anode 1004 is to organic layer 1010 injected holes.Hole and electronics are compound and produce the energy particle be called " exciton " in organic layer 1010.Exciton is given luminous organic material in the organic layer 1010 with their energy delivery, and described energy is used for from the luminous organic material visible emitting.Produce and the spectral characteristic of the light of emission depends on the character of the organic molecule in the organic layer and forms by OLED 1000, OLED 1001.Can select forming of one or more layers organic layer by those skilled in the art to adapt to the needs of application-specific.
The OLED device also can be according to luminous direction classification.In the type of a kind of being known as " top-emission " type, the OLED device is by negative electrode or top electrodes 1006 luminous and display images.In these embodiments, negative electrode 1006 is made by material transparent for visible light or partially transparent at least.In a particular embodiment, can pass any light of anode or bottom electrode 1004 for fear of loss, anode can be made by the material of reflect visible light basically.Second type OLED device is luminous and be known as " bottom emission " type by anode or bottom electrode 1004.In bottom emissive type OLED device, anode 1004 by for visible light at least the material of partially transparent make.Usually, in bottom emissive type OLED device, negative electrode 1006 is made by the material of reflect visible light basically.The OLED device of the third type is for example luminous on both direction by anode 1004 and negative electrode 1006.According to light emission direction, substrate can be formed by material transparent for visible light, opaque or reflection.
In many examples, comprise that the OLED pel array 1021 of a plurality of organic light emission pixels is arranged in the substrate 1002, as shown in Fig. 6 C.In an embodiment, by the pixel in the drive circuit (not shown) array of controls 1021, make its conducting and end, a plurality of pixels are display message or image on array 1021 as a whole.In a particular embodiment, OLED pel array 1021 is arranged with respect to other assembly (for example driving and control electronic device), to limit viewing area and non-display area.In these embodiments, the zone of OLED pel array 1021 is represented to be formed with in the substrate 1002 in the viewing area.Non-display area is represented the remaining area of substrate 1002.In an embodiment, non-display area can contain logical circuit and/or power circuit.It should be understood that being arranged in the viewing area to small part of control/components of drive circuit.For example, in PMOLED, conductive component will extend in the viewing area, provide suitable electromotive force with antianode and negative electrode.In AMOLED, data wire/scan line that combines with drive circuit and local drive circuits will extend in the viewing area, to drive and to control the independent pixel of AMOLED.
According to a kind of design of OLED device with make, the specific organic material layer of OLED device can be owing to being exposed to moisture, oxygen or other pernicious gas is damaged or accelerated deterioration.Therefore, common sense be, with OLED device sealing or seal, with stop it to be exposed to make or operating environment in the moisture and oxygen or other pernicious gas that exist.Fig. 6 D schematically shows the section of the OLED device of sealing 1011 of layout with Fig. 6 C and the line D-D intercepting in Fig. 6 C.In this embodiment, smooth top board or bottom substrate 1061 engages with seal 1071 usually, and seal 1071 also engages with base plate or bottom substrate 1002, so that OLED pel array 1021 is surrounded or seals.In other embodiments, form one or more layers on top board 1061 or base plate 1002, seal 1071 combines with bottom substrate 1002 or bottom substrate 1061 through such layer.In the illustrated embodiment, seal 1071 extends along the periphery of OLED pel array 1021 or the edge of base plate 1002 or top board 1061.
In an embodiment, seal 1071 is made by frit material, will further discuss below.In various embodiments, top board 1061 and base plate 1002 comprise materials such as plastics, glass and/or the metal forming that obstruction can be provided the passage of oxygen and/or water, thereby protection OLED pel array 1021 avoids being exposed in these materials.In an embodiment, at least one material by substantial transparent in top board 1061 and the base plate 1002 forms.
In order to prolong the life-span of OLED device 1011, expect that usually seal 1071 and top board 1061,1002 pairs of oxygen of base plate and steam provide impervious basically sealing, and provide and be sealed shut space 1081 basically.In application-specific, be expressed as, 1071 pairs of oxygen of seal of the frit material that combines with top board 1061 and base plate 1002 provide barrier, and the transmitance that makes oxygen is less than about 10
-3Cc/m
2My god, providing barrier to water, the transmitance that makes water is less than 10
-6G/m
2My god.Suppose that some oxygen and moisture can be penetrated in the enclosure space 1081, the material that then can absorb oxygen and/or moisture in certain embodiments is formed in the enclosure space 1081.
In the illustrated embodiment, seal 1071 has common rectangular cross section.Yet, in other embodiments, seal 1071 can have other various shape of cross sections, for example common square cross section, common trapezoidal cross-section, the cross section on limit with one or more roundings or other structure of being represented by the needs of application-specific.In order to improve sealing, usually expectation increase seal 1071 and bottom substrate 1002 or bottom substrate 1061 or be formed on bottom substrate 1002 or bottom substrate 1061 on layer interfacial area that directly contacts.In certain embodiments, the shape of seal can be designed, thereby interfacial area can be increased.
As mentioned above, in a particular embodiment, utilization comprises that the frit material of meticulous glass particle or " frit or the glass powder " of abbreviation form seal 1071.The frit particle comprises magnesium oxide (MgO), calcium oxide (CaO), barium monoxide (BaO), lithia (Li
2O), (Na is received in oxidation
2O), potassium oxide (K
2O), boron oxide (B
2O
3), vanadium oxide (V
2O
5), zinc oxide (ZnO), tellurium oxide (TeO
2), aluminium oxide (Al
2O
3), silicon dioxide (SiO
2), lead oxide (PbO), tin oxide (SnO), phosphorous oxide (P
2O
5), ruthenium-oxide (Ru
2O), rubidium oxide (Rb
2O), rhodium oxide (Rh
2O), iron oxide (Fe
2O
3), cupric oxide (CuO), titanium oxide (TiO
2), tungsten oxide (WO
3), bismuth oxide (Bi
2O
3), antimony oxide (Sb
2O
3), in lead borate glass, phosphoric acid tin glass, vanadate glass and borosilicate etc. one or more.In an embodiment, the size of these particles alternatively, in from about 5 μ m to the scope of about 10 μ m, but is not limited only to this in from about 2 μ m to the scope of about 30 μ m.Described particle is can be approximately the same big with the bottom substrate 1061 and the bottom substrate 1002 of glass frit seal 1071 contacts or the distance that is formed between these two suprabasil random layers.
The frit material that is used to form seal 1071 can also comprise one or more fillers or add material.Described filler can be provided or add the absorption characteristic of material with the incident radiant energy of the overall thermal expansion characteristics of regulating seal 1071 and/or the frequency of regulating 1071 pairs of selections of seal.Filler or interpolation material can also comprise conversion product (inversion) and/or additional filler, to regulate the thermal coefficient of expansion of frit.For example, filler or interpolation material can comprise transition metal, for example chromium (Cr), iron (Fe), manganese (Mn), cobalt (Co), copper (Cu) and/or vanadium.Other material that is used for filler or additive comprises ZnSiO
4, PbTiO
3, ZrO
2, eucryptite.
In an embodiment, comprise about 20wt% to the about glass particle of 90wt% as the frit material of the component of doing, remainder comprises filler and/or additive.In certain embodiments, the paste of frit comprises the inorganic material of organic material and the about 70-90wt% of about 10-30wt%.In certain embodiments, the paste of frit comprises the inorganic material of organic material and the about 80wt% of about 20wt%.In certain embodiments, organic material can comprise the adhesive of about 0-30wt% and the solvent of about 70-100wt%.In certain embodiments, in organic material, approximately 10wt% is an adhesive, and approximately 90wt% is a solvent.In certain embodiments, inorganic material can comprise the additive of about 0-10wt%, the approximately filler of 20-40wt% and the approximately glass powder of 50-80wt%.In certain embodiments, in inorganic material, approximately 0-5wt% is an additive, and approximately 25-30wt% is a filler, and approximately 65-75wt% is a glass powder.
In forming frit-sealed process, fluent material is added in the dried frit material, to form the paste of frit.Any organic or inorganic solvent that has or do not have additive can be used as fluent material.In an embodiment, solvent comprises one or more organic compounds.For example, spendable organic compound is ethyl cellulose, nitrocellulose, hydroxypropyl cellulose, butyl carbitol acetate (butyl carbitol acetate), terpineol, ethylene glycol monobutyl ether (butyl cellusolve), acrylate compounds.Then, the paste of the frit of Xing Chenging can be coated on top board 1061 and/or the base plate 1002 thus, to form the seal 107 of definite shape.
In one exemplary embodiment, the shape of seal 1071 is formed by the paste of frit and at first between top board 1061 and base plate 1002.In a particular embodiment, seal 1071 can be solidified or in advance on sintering in top board 1061 and base plate 1002 in advance.Utilize seal 1071 assembling top board 1061 and the base plates 1002 between top board 1061 and base plate 1002 subsequently, optionally the part of heated sealant spare 1071 makes the frit material that forms seal 1071 melt at least in part.Then, seal 1071 is solidified again, thereby between top board 1061 and base plate 1002, form firm connection, thereby stop besieged OLED pel array 1021 to be exposed in oxygen or the water.
In an embodiment, finish frit-sealed selectivity heating by the irradiation of light (for example, laser or directed infrared lamp).As previously mentioned, form seal 1071 frit material can with one or more additives or filler (for example, in order to improve to the absorption of the light of irradiation and the material selected) combination, helping heating and melt frit material, thus formation seal 1071.
In certain embodiments, produce OLED device 1011 in batches.In the embodiment shown in Fig. 6 E, in common floor substrate 1101, form a plurality of independent OLED arrays 1021.In the illustrated embodiment, the frit that each OLED array 1021 is formed surrounds, and forms seal 1071.In an embodiment, public bottom substrate (not shown) is placed on common floor substrate 1101 and is formed on the top of the structure in the common floor substrate 1101, make OLED array 1021 and the paste of the frit that is shaped between common floor substrate 1101 and public bottom substrate.For example OLED array 1021 is sealed and sealed by the previously described encapsulating process (enclosure process) that is used for single OLED display unit.Products obtained therefrom comprises a plurality of OLED devices that keep together owing to common floor substrate and public bottom substrate.Then, products obtained therefrom is cut into many, the OLED device 1011 among every pie graph 6D.In a particular embodiment, single OLED device 1011 is the additional encapsulation operation of experience also subsequently, the sealing that is formed by glass frit seal 1071 and bottom substrate 1061, bottom substrate 1002 with further improvement.
Fig. 1 is the cutaway view of exemplary organic light-emitting display device.With reference to Fig. 1, the substrate 100 with base plate 1002 equivalences is provided, substrate 100 is provided with OLED or pixel 110.Organic Light Emitting Diode 110 comprises first electrode, has the organic layer and second electrode of emission layer at least.In addition, Organic Light Emitting Diode 110 can also comprise have semiconductor layer, the thin-film transistor of gate electrode, source electrode and drain electrode.
Then, provide with top board 1061 equivalences seal substrate 120.In substrate 100 or seal and form glass powder 130 on the surface of substrate 120, substrate 100 invests seals substrate 120.Then, to glass powder 130 irradiating lasers,, thereby make organic light-emitting display device with fusing and curing glass powder 130.Glass powder forms usually has about 14 μ m or littler height.Therefore, when utilizing glass powder to engage substrate and sealing substrate, the central part branch that seals substrate is out of shape about 7 μ m to about 8 μ m, makes that sealing substrate has curvature.As a result, substrate and the air gap of sealing between the substrate become irregular, form concentric circles sealing on the emitting surface of substrate,, produce Newton's ring that is.In addition, the inner space of organic light-emitting display device is filled for example N of inert gas usually
2Deng, therefore, described device can have the littler resistance of opposing external impact.
In order to address the aforementioned drawbacks, can prevent Newton's ring and because the possible damage that external impact causes by the inner space of filling organic light-emitting display device with material or sealant (for example, urethane acrylic acid (urethane acryl) etc.).Yet the filling of this inner space can make described material contact glass powder.In addition, during fusing or being solidificated in substrate again and sealing the process of the frit of sealing usefulness between the substrate, described material or sealant can pollute frit.For example, when to the glass powder irradiating laser of sealing usefulness, can pass through LASER HEATING sealant (as, organic material), sealant becomes or produces the chemical compound that may be harmful to glass powder.In addition, this organic material can flow in the zone that forms glass powder, forms film between glass powder and substrate, thereby may reduce the adhesion strength between glass powder and the substrate.
Fig. 2 to Fig. 5 is the cutaway view of organic light-emitting display device according to an exemplary embodiment of the present invention.With reference to Fig. 2, provide with base plate 1002 equivalence and have the substrate 200 of pixel region I and non-pixel region II.Insulating glass, plastics or conductive substrates can be used as substrate 200.
In a particular embodiment, Organic Light Emitting Diode 210 is formed among the pixel region I of substrate 200.Organic Light Emitting Diode 210 comprises first electrode 220, has the organic layer 230 and second electrode 240 of emission layer at least.In Organic Light Emitting Diode 210, first electrode 220 can be formed by tin indium oxide (ITO) or indium zinc oxide (IZO).In addition, under the situation of top emission structure, Organic Light Emitting Diode can also comprise the reflector.Organic layer 230 can comprise emission layer at least, can also comprise the one deck at least in hole injection layer, hole transmission layer, electron transfer layer and the electron injecting layer.Second electrode 240 can be by at least a formation of selecting in the low Mg of merit, Ag, Al, Ca and the alloy thereof.In addition, Organic Light Emitting Diode 210 can also comprise have semiconductor layer, the thin-film transistor of gate electrode, source electrode and drain electrode.Thin-film transistor can be arranged on the top grid type of semiconductor layer top or be arranged on the bottom gate type of semiconductor layer below for gate electrode for gate electrode.Can form the passivation layer 250 that is coated with OLED 210.Passivation layer 250 plays the effect that protection Organic Light Emitting Diode 210 is avoided outside chemistry and chemical stimulation, can be formed by organic layer, inorganic layer or its composite bed.
With reference to Fig. 3, provide with top board 1061 equivalences seal substrate 260.Seal substrate 260 and can be insulating glass or plastic-substrates.In certain embodiments, groove or cave in 270 is formed in the specific region of sealing substrate 260.For example, groove or cave in and 270 be formed on and seal in the substrate 260 makes depression 270 form the loop of the base closed that surrounds the zone direct relative with the pixel region I of substrate 200.Groove preferably forms and surrounds pixel region I fully, but is not limited thereto.In addition, depression 270 forms and is positioned at and will forms the zone of frit.
In a particular embodiment, groove or cave in 270 can be by etching, sandblast or molded formation, but be not limited thereto.Depression 270 can form various cross sectional shapes.Depression 270 cross sectional shape can be generally rectangle, square, triangle etc.The one or more edges that form depression 270 can be linear or shaped form.In a particular embodiment, depression 270 can comprise the one or more surfaces with respect to the inner surface inclination that forms depression in the substrate.
In the illustrated embodiment, depression 270 first inclined-plane 272 and second inclined-planes 274 that comprise with respect to the inner surface 262 of sealing substrate 260.272 to the second inclined-planes 274, first inclined-plane are near the center of sealing the inner surface of substrate 260.274 to the first inclined-planes 272, second inclined-plane are near the periphery of sealing substrate 260.In the illustrated embodiment, with respect to inner surface, 274 to the first inclined-planes 272, second inclined-plane are precipitous.Therefore, sealant can successfully flow in the groove by first inclined-plane, thereby and sealant is not easy to overflow second inclined-plane is not easy to contact with glass powder.In certain embodiments, first inclined-plane 272 of depression 270 is about 0.1 °, 0.2 °, 0.3 °, 0.4 °, 0.5 °, 0.7 °, 1 °, 2 °, 3 °, 4 °, 5 °, 6 °, 7 °, 8 °, 9 °, 10 °, 12 °, 15 °, 20 °, 25 °, 30 °, 35 °, 40 °, 45 ° or 50 ° with respect to the angle of the inner surface 262 of sealing substrate 260.In a particular embodiment, second inclined-plane 274 of depression 270 can be about 90 °, 88 °, 86 °, 84 °, 82 °, 80 °, 78 °, 76 °, 73 °, 70 °, 65 °, 60 °, 55 °, 50 ° or 45 ° with respect to the angle of the inner surface 262 of sealing substrate 260.
In an embodiment, groove 270 preferably has the degree of depth of about 20 μ m to about 300 μ m, but is not limited thereto.In a particular embodiment, groove or cave in and 270 have the degree of depth of about 10,20,30,40,50,70,100,150,200,250,300,350,400,450,550,600,700,800,900 or 1000 μ m.In an embodiment, groove 270 preferably has the width of about 0.1mm to about 5mm, but is not limited thereto.In a particular embodiment, groove or cave in and 270 have about 0.1,0.2,0.3,0.4,0.5,0.7,1,1.5,2,3,4,5,6,7,8,9 or the width of 10mm.
In an embodiment, sealant 290 is substantially transparents.Therefore, can pass from the light of Organic Light Emitting Diode 210 emission and seal substrate 260 and outwards launch.That is, can realize the organic light-emitting display device of top-emission, but be not limited thereto.In other embodiments, organic light-emitting display device can be bottom emissive type, and light passes substrate 200 emissions.In optional embodiment, organic light-emitting display device can be two emission types, and light passes substrate 200 and seals substrate 260 emissions.
With reference to Fig. 4, be provided with on it form glass powder 280 and sealant 290 seal substrate 260, make glass powder 280 and sealant 290 towards substrate 200.To substrate 200 with seal substrate 260 and exert pressure, seal will seal substrate 200 as shown in Figure 5 and to seal substrate 260.Then, sealant 290 covers the Organic Light Emitting Diode 210 that is formed in the substrate 200.In an embodiment, when exerting pressure, the part of sealant 290 can flow to the outside of pixel region I.Yet the described part of sealant becomes with groove 270 and contacts and stay in the groove 270.Therefore, prevent that sealant 290 from flowing to contact glass powder 280.Therefore, can prevent that glass powder 280 or sealant 290 are contaminated.In other words, groove 270 can be controlled flowing of sealant 290.Therefore, can prevent that glass powder 280 is contaminated, can prevent the glass powder delamination, and the damage that can cause of the high heat that produces can avoid the glass powder irradiating laser time of sealant.
After arranging substrate 200 and sealing substrate 260, to glass powder 280 irradiating lasers, with fusing and curing glass powder 280, then substrate 200 invests and seals substrate 260.To sealant 290 heating or irradiation ultraviolet radiations, with curing sealant 290.According to some embodiments of the present invention,, then the sealant irradiation ultraviolet radiation is solidified the glass powder irradiating laser.Yet, in other embodiments, can come curing sealant to the sealant irradiation ultraviolet radiation, then can melt and the curing glass powder the glass powder irradiating laser.
As a result, made organic light-emitting display device according to an exemplary embodiment of the present invention.As mentioned above, in sealing substrate, form groove, basically sealant and frit are separated.Therefore, can prevent that the heat that sealant is used for melt frit by to the frit irradiating laser time from damaging.The adhesion strength that can prevent the gained frit is because the deterioration that the frit of delamination causes.
Although described aspect of the present invention and feature with reference to certain exemplary embodiments of the present invention, but those skilled in the art should understand that, under situation about not breaking away from, can make various modifications and variations here to the embodiment that mentions by claim and the spirit or scope that equivalent limited thereof.
Claims (27)
1, a kind of organic light-emitting display device comprises:
First substrate;
Second substrate comprises and the described first substrate interior surface opposing;
The array of organic light emission pixel is formed between described first substrate and described second substrate, and described array comprises towards the top surface of described second substrate;
Glass frit seal between described first substrate and described second substrate, is surrounded described array;
Membrane structure comprises one or more layers film, and described membrane structure comprises the part between described array and described second substrate, and described membrane structure contacts described inner surface and described top surface;
Wherein, described second substrate comprises the depression on the described inner surface.
2, device as claimed in claim 1, wherein, described membrane structure does not contact described glass frit seal.
3, device as claimed in claim 1, wherein, described inner surface is smooth basically, and has and be substantially equal to or greater than the size of the size of described top surface.
4, device as claimed in claim 1 wherein, is formed in the described depression to the described membrane structure of small part.
5, device as claimed in claim 1, wherein, described membrane structure extends in the described depression.
6, device as claimed in claim 1, wherein, described membrane structure also comprises between described first substrate and described second substrate and other parts between described array and described second substrate not.
7, device as claimed in claim 1, wherein, described membrane structure covers the entire portion of described top surface substantially.
8, device as claimed in claim 1, wherein, described membrane structure comprises resin.
9, device as claimed in claim 8, wherein, described resin is ultraviolet-curing type or heat solidifiable type resin.
10, device as claimed in claim 8, wherein, described resin comprises select at least a from the group of being made up of acrylic resin and polyimide resin.
11, device as claimed in claim 10, wherein, described resin comprises urethane acrylic resin.
12, device as claimed in claim 1, wherein, to the described membrane structure of small part substantially transparent for visible light.
13, device as claimed in claim 1, wherein, the visible light of described second substrate is passed in described array emission.
14, device as claimed in claim 1, wherein, described depression is extended along the part of described glass frit seal.
15, device as claimed in claim 14, wherein, described depression is basically parallel to the described part of described glass frit seal.
16, device as claimed in claim 1, wherein, the described loop that is recessed to form.
17, device as claimed in claim 1, wherein, described inner surface is smooth basically, and described depression comprises the inclined-plane with respect to described inner surface, makes the described direction that is recessed in the periphery of the described inner surface of mind-set from described inner surface become darker.
18, device as claimed in claim 1, wherein, described inner surface is smooth basically, described depression comprises with respect to first inclined-plane of described inner surface and second inclined-plane, describedly is recessed to form paddy, wherein, described first inclined-plane is than the center of the close described inner surface in described second inclined-plane, wherein, with respect to described inner surface, described second inclined-plane is steeper than described first inclined-plane.
19, device as claimed in claim 18, wherein, described second inclined-plane is vertical with described inner surface basically.
20, device as claimed in claim 1, wherein, described array comprises first electrode, second electrode and the luminous organic material between described first electrode and described second electrode, wherein, described first electrode and described first substrate have first distance, and described second electrode and described first substrate have second distance, wherein, described second distance is greater than described first distance, and wherein, described top surface is the surface of described second electrode.
21, device as claimed in claim 10, wherein, described membrane structure comprises the passivation layer between described array and described organic resin layer, wherein, described layer is constructed to suppress basically described organic resin layer and is diffused in the described array.
22, device as claimed in claim 1, wherein, described depression has the degree of depth of measuring from described inner surface, and wherein, the described degree of depth is from about 20 μ m to about 300 μ m.
23, device as claimed in claim 1, wherein, described depression has the width of measuring on described inner surface on the direction parallel with the edge of described inner surface, and wherein, described width is to about 5mm from about 0.1mm.
24, device as claimed in claim 1, wherein, described glass frit seal comprises from one or more materials of being received by magnesium oxide, calcium oxide, barium monoxide, lithia, oxidation, selecting potassium oxide, boron oxide, vanadium oxide, zinc oxide, tellurium oxide, aluminium oxide, silicon dioxide, lead oxide, tin oxide, phosphorous oxide, ruthenium-oxide, rubidium oxide, rhodium oxide, iron oxide, cupric oxide, titanium oxide, tungsten oxide, bismuth oxide, antimony oxide, lead borate glass, phosphoric acid tin glass, vanadate glass and the borosilicate.
25, a kind of method of making organic light emitting apparatus, the step that described method comprises is:
First substrate is provided, in described first substrate, forms the array of organic light emitting pixel, between described first substrate and described array, be with or without layer;
Second substrate is provided, forms curable resin on the surface of described second substrate, described second substrate comprises described lip-deep depression;
Arrange described first substrate and described second substrate, make described resin between described array and described second substrate;
Described first substrate and described second substrate are interconnected with frit, make described frit surround described array;
Curable resin is solidified, and to form membrane structure, to make described membrane structure comprise one or more layers film that contains the resin that is cured, described membrane structure contacts described second substrate and described array.
26, method as claimed in claim 25 wherein, flows in the described depression to the described resin of small part.
27, method as claimed in claim 26, wherein, the described resin of part at least stops and flows in the described depression.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20060007961 | 2006-01-25 | ||
| KR1020060007961 | 2006-01-25 | ||
| KR1020060034899 | 2006-04-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101009318A true CN101009318A (en) | 2007-08-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100082092A Pending CN101009318A (en) | 2006-01-25 | 2007-01-25 | Organic light-emitting display device and method for fabricating the same |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR100712177B1 (en) |
| CN (1) | CN101009318A (en) |
| TW (1) | TWI348237B (en) |
Cited By (6)
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| CN101989613A (en) * | 2009-07-29 | 2011-03-23 | Tdk株式会社 | Organic el display apparatus |
| CN102450097A (en) * | 2009-06-29 | 2012-05-09 | 夏普株式会社 | Organic el display device and method for manufacturing same |
| CN103490016A (en) * | 2013-09-24 | 2014-01-01 | 京东方科技集团股份有限公司 | Packaging structure of OLED device |
| CN103681748A (en) * | 2012-08-31 | 2014-03-26 | 三星显示有限公司 | Display panel and manufacturing method of the same |
| CN105683111A (en) * | 2013-12-04 | 2016-06-15 | 株式会社日立制作所 | Sealed structure, multi-layer heat-insulating glass and glass container |
| CN108428802A (en) * | 2018-03-27 | 2018-08-21 | 京东方科技集团股份有限公司 | A kind of display panel and its packaging method, OLED device |
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| KR100922354B1 (en) * | 2008-01-31 | 2009-10-21 | 삼성모바일디스플레이주식회사 | Organic light emitting display |
| KR101465478B1 (en) | 2008-02-18 | 2014-11-26 | 삼성디스플레이 주식회사 | Organic light emitting display device and method for manufacturing the same |
| KR101572136B1 (en) * | 2008-03-13 | 2015-11-26 | 주식회사 동진쎄미켐 | Top emission display sealing method |
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| KR101100955B1 (en) | 2010-03-11 | 2011-12-29 | 삼성모바일디스플레이주식회사 | Organic light emitting display device and manufacturing method |
| TWI591871B (en) * | 2010-12-16 | 2017-07-11 | 半導體能源研究所股份有限公司 | Light-emitting device and lighting device |
Family Cites Families (1)
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| KR20030080895A (en) * | 2002-04-11 | 2003-10-17 | 엘지전자 주식회사 | Sealing method of organic electroluminescence device |
-
2006
- 2006-04-18 KR KR1020060034899A patent/KR100712177B1/en not_active IP Right Cessation
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2007
- 2007-01-04 TW TW096100376A patent/TWI348237B/en active
- 2007-01-25 CN CNA2007100082092A patent/CN101009318A/en active Pending
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| CN101989613B (en) * | 2009-07-29 | 2012-12-26 | 双叶电子工业株式会社 | Organic el display apparatus |
| CN101989613A (en) * | 2009-07-29 | 2011-03-23 | Tdk株式会社 | Organic el display apparatus |
| CN103681748A (en) * | 2012-08-31 | 2014-03-26 | 三星显示有限公司 | Display panel and manufacturing method of the same |
| CN103681748B (en) * | 2012-08-31 | 2018-09-21 | 三星显示有限公司 | Display panel and its manufacturing method |
| CN103490016B (en) * | 2013-09-24 | 2016-10-05 | 京东方科技集团股份有限公司 | A kind of encapsulating structure of OLED |
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| CN105683111A (en) * | 2013-12-04 | 2016-06-15 | 株式会社日立制作所 | Sealed structure, multi-layer heat-insulating glass and glass container |
| CN105683111B (en) * | 2013-12-04 | 2018-09-14 | 株式会社日立制作所 | The manufacturing method of seal structure and seal structure |
| US20160257610A1 (en) * | 2013-12-04 | 2016-09-08 | Hitachi, Ltd. | Sealed structural body and method for manufacturing the same |
| US10392296B2 (en) | 2013-12-04 | 2019-08-27 | Hitachi, Ltd. | Sealed structural body and method for manufacturing the same |
| CN108428802A (en) * | 2018-03-27 | 2018-08-21 | 京东方科技集团股份有限公司 | A kind of display panel and its packaging method, OLED device |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI348237B (en) | 2011-09-01 |
| TW200739989A (en) | 2007-10-16 |
| KR100712177B1 (en) | 2007-04-27 |
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