CN100561701C - A kind of welding head positioning accuracy detecting system and method thereof - Google Patents
A kind of welding head positioning accuracy detecting system and method thereof Download PDFInfo
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- CN100561701C CN100561701C CNB2007100313769A CN200710031376A CN100561701C CN 100561701 C CN100561701 C CN 100561701C CN B2007100313769 A CNB2007100313769 A CN B2007100313769A CN 200710031376 A CN200710031376 A CN 200710031376A CN 100561701 C CN100561701 C CN 100561701C
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Abstract
The invention discloses a kind of welding head positioning accuracy detecting system, comprise that suction nozzle of bonding tip and control suction nozzle of bonding tip pick up wafer at picking up part, transmit wafer and at the transmission mechanism of dice bonding part weldbonding wafer, wherein, under the dice bonding part reflective mirror is installed, above-mentioned suction nozzle of bonding tip center is provided with a hollow via-hole, the top of hollow via-hole is provided with to the reflective mirror luminous light source, and the image acquisition device of gathering the light signal that reflects by reflective mirror, this image acquisition device also connects the Computerized image processing system of the above-mentioned light signal of a processing.The certainty of measurement height of this welding head positioning accuracy detecting system, nonintervention soldering tip motion and real-time.In addition, the invention also discloses a kind of welding head positioning accuracy detection method.
Description
Technical field
The present invention relates to a kind of welding head positioning accuracy detecting system and method thereof.
Background technology
Characteristics such as the soldering tip mechanism of IC chip die Bonder has at a high speed reciprocal operation, precision height, movement locus complexity, mechanism's Assembly part is many, the suction nozzle of bonding tip volume is little.The task of suction nozzle of bonding tip is that the wafer by wafer cutting and separating on the picking up part is picked up, and under the effect of transmission mechanism wafer handling is being welded to the lead frame of dice bonding part, thereby is finishing actions such as picking up wafer, transmission wafer and weldbonding wafer.The needed stroke that moves both vertically is very little when picking up with the weldbonding wafer, only is 1～3mm, and the stroke of transmission wafer is very big, and general relevant with the diameter of wafer, the wafer current diameter has reached more than 12 inches, promptly surpasses 250mm.In order to enhance productivity, soldering tip mechanism all possesses at a high speed the back and forth characteristics of operation, and for the soldering tip mechanism of this kind high-speed cruising, it is poor positioning accuracy usually to occur, thereby has the low-quality defective of bonding die.In the prior art, contact position transducer commonly used is measured the location of soldering tip, yet because the operating state of soldering tip can be interfered even influence to touch sensor, makes the precision that detects reduce greatly, thereby is difficult to satisfy the requirement that detects.
Summary of the invention
In order to overcome in the prior art contact position transducer to the shortcoming of the location survey low precision of soldering tip, the present invention proposes a kind of contactless welding head positioning accuracy detecting system and method thereof, this detection system and method to the location survey precision height of suction nozzle of bonding tip, do not interfere soldering tip motion and real-time.
The technical solution used in the present invention is: a kind of welding head positioning accuracy detecting system, comprise that suction nozzle of bonding tip and control suction nozzle of bonding tip pick up wafer at picking up part, transmit wafer and at the transmission mechanism of dice bonding part weldbonding wafer, wherein, under the dice bonding part reflective mirror is installed, above-mentioned suction nozzle of bonding tip center is provided with a hollow via-hole, the top of hollow via-hole is provided with to the reflective mirror luminous light source, reach the image acquisition device of gathering by the reflective mirror reflected signal, image acquisition device also connects the computer processing system of the above-mentioned light signal of a processing.
The suction nozzle of bonding tip top also is provided with a lens barrel coaxial with its hollow via-hole, image acquisition device is positioned at the lens barrel top, be provided with pellicle mirror in the lens barrel, light source is positioned at a side of pellicle mirror, the light that light source sends is refracted to reflective mirror through pellicle mirror, by the reflective mirror reflection, via hollow via-hole and lens barrel directive image acquisition device, what image acquisition device obtained is the contour images of suction nozzle endoporus.
The aperture of above-mentioned hollow via-hole is about 0.2mm.
This light source forms normal beam by pellicle mirror.The geometric center of this image acquisition device, lens barrel, soldering tip dice bonding part and reflective mirror is on the same optical axis.
Above-mentioned image acquisition device is made of the ccd video camera that light signal is converted to picture signal, and detection system is made up of graphics processing unit, image acquisition device and control unit.
In addition, the present invention also provides a kind of welding head positioning accuracy detection method, and it may further comprise the steps: the light source that is positioned at the suction nozzle of bonding tip top sends light signal, and light signal is via the reflective mirror reflection that is positioned at dice bonding part, the image acquisition device on the directive suction nozzle of bonding tip; In the time should arriving dice bonding part according to the program suction nozzle of bonding tip, control unit sends trigger impulse, and image acquisition device is gathered light signal, and is converted into the picture signal of suction nozzle internal bore profile; Picture signal is sent to detection system carries out image processing, the pixel unit in the image is converted into measurement unit, and obtain the geometric center coordinate information of image, thereby realize detection the suction nozzle of bonding tip positioning accuracy.
Above-mentioned image acquisition device is a ccd video camera, aforementioned calculation machine treatment system comprises graphics processing unit and control unit, after this control unit sends trigger impulse to image acquisition device and graphics processing unit, this image acquisition device is converted to picture signal with the light signal that collects, this graphics processing unit is handled picture signal, its pixel unit is converted into measurement unit, obtains the geometric center coordinate information of image.
Above-mentioned suction nozzle of bonding tip is per when arriving dice bonding part twice, and control unit sends a trigger impulse to image acquisition device and graphics processing unit, finishes the collection and the processing procedure of image.
During to treatment of picture, adopt the vernier caliper mode of demarcating that the image that is collected is demarcated, adjust the distance of the two chis pincers opening of vernier caliper, gather the image of two chis pincers opening, the distance of two chis pincers opening is contrasted with the pixel that two chis clamp the opening image, obtain the proportionate relationship between measurement size and the pixel.
Further comprising the steps of when this detection system is handled image:
The figure image intensifying: adopt the histogram index processing, and adopt LUT (Look-Up Table) conversion, gradation of image is carried out specific calculation and conversion, wherein indexing is 1.5;
Carrying out image threshold segmentation (binaryzation): this image is carried out binaryzation again one time, gray level image is changed into black and white image, target object extracting waste after the binary conversion treatment, background is got black;
Image mathematics morphologization: fill in the zone, and the image after native system adopts morphologic basic operation to binaryzation carries out the zone fills, so that discontinuous partially enclosed in the image; Closed operation, native system adopt morphologic closed operation that image is further handled, and make image resultant edge smoothing behind thresholding, and closed operation adopts 3 * 3 structural elements to carry out logical operation; The convex hull functional operation, image is further level and smooth after the closed operation, again image is carried out the convex hull functional operation;
Particle analysis (centering coordinate): the needed detection geological information of object is listed by electrical form;
Soldering tip detection system interface and error analysis: image of the every collection of system, all carry out once above-mentioned image processing to image, and the result behind the particle analysis shown and be kept in the Excel form.
Welding head positioning accuracy detecting system of the present invention and method thereof, utilized image acquisition device that the suction nozzle endoporus picture signal that suction nozzle of bonding tip arrives dice bonding part is gathered, and image is handled by graphics processing unit, thereby draw the geometric center coordinate information of suction nozzle endoporus image, realize measuring with non-contacting detection mode to high-speed motion soldering tip mechanism location is accurate, and during to treatment of picture, be to adopt the vernier caliper mode of demarcating that the image that is collected is demarcated, the precision of images that is obtained is higher; This welding head positioning accuracy detecting system is simple in structure, and is easy to adjust, only needs the parameter and the program of control system are set and can be controlled this detection system.
Description of drawings
Fig. 1 is the composition diagram of the welding head positioning accuracy detecting system of the embodiment of the invention 1;
Fig. 2 is the workflow of welding head positioning accuracy detection method of the present invention;
Fig. 3 is an image processing flow chart of the present invention;
Fig. 4 is the composition diagram of the welding head positioning accuracy detecting system of the embodiment of the invention 2.
Embodiment
As shown in Figure 1, a kind of welding head positioning accuracy detecting system, comprise that suction nozzle of bonding tip 3 and control suction nozzle of bonding tip 3 pick up wafer at picking up part 2, transmit wafer and at the transmission mechanism 8 of dice bonding part weldbonding wafer, wherein, this dice bonding part is equipped with reflective mirror 12 times, under vacuum negative pressure condition, inhale and pick up wafer in order to implement suction nozzle of bonding tip 3, above-mentioned suction nozzle of bonding tip 3 centers are provided with a hollow via-hole, the top of hollow via-hole is provided with the light source 4 to reflective mirror 1 emission light signal, reach the image acquisition device of gathering by reflective mirror 1 reflected signal 6, this image acquisition device 6 also connects the computer processing system 7 of the above-mentioned light signal of a processing.
This light source 4 is launched light signal to reflective mirror 1, and forms hot spot on reflective mirror 1, and light spot image is reflected back image acquisition device 6 again.In the time should arriving dice bonding part 2 according to program suction nozzle of bonding tip 3, system sends the detection pulse.Image acquisition device 6 is converted to the picture signal of suction nozzle internal bore profile with the light signal that collects, and is sent to computer processing system 7, and 7 pairs of picture signals of computer processing system are handled, and obtains the geometric coordinate information of suction nozzle 3 location.
Above suction nozzle of bonding tip 3 hollow via-holes, also be provided with a lens barrel 5 coaxial with hollow via-hole, image acquisition device 6 is positioned at lens barrel 5 tops, be provided with pellicle mirror 9 in the lens barrel 5, light source 4 is positioned at pellicle mirror 9 one sides, the light that light source 4 sends is through pellicle mirror 9 refraction, forms the light coaxial with lens barrel 5 in lens barrel 5, and light is again via hollow via-hole directive reflective mirror 1, and at reflective mirror 1 formation hollow via-hole internal diameter profile hot spot, light spot image reflexes on the image acquisition device 6 via hollow via-hole again.The aperture of above-mentioned hollow via-hole is about 0.2mm.
Above-mentioned light source 4 forms normal beam by pellicle mirror 9, and the geometric center of this image acquisition device, lens barrel, soldering tip dice bonding part and reflective mirror is on the same optical axis.
Above-mentioned image acquisition device 6 is made of the ccd video camera that light spot image is converted to picture signal, and this computer processing system 7 is made up of graphics processing unit 10, image acquisition device 6 and control unit 11.Wherein, this control unit 11 is controlled its work by the mode to image acquisition device 6 and graphics processing unit 10 transmission trigger impulses.
The present invention also provides a kind of welding head positioning accuracy detection method, and as shown in Figure 2, it may further comprise the steps:
1) beginning
Detection system brings into operation, be located at the light source 4 of pellicle mirror 9 one sides in the lens barrel 5 and launch light, under the effect of pellicle mirror 9, in lens barrel 5, form the light coaxial with lens barrel 5, light is again via hollow via-hole directive reflective mirror 1, and reflexes to image acquisition device 6 through reflective mirror 1.Transmission mechanism 8 is sent to suction nozzle of bonding tip 3 on the dice bonding part 2, and when suction nozzle of bonding tip 3 should arrive moment of dice bonding part 2 according to program, control unit is sent out 11 and gone out trigger impulse, and image acquisition device 6 is gathered the internal diameter profile light spot image of suction nozzle of bonding tip hollow via-holes.Wherein, suction nozzle of bonding tip 3 is about 30ms (adjustable in 10 to 100ms scopes) in the time that dice bonding part 2 stops.
2) system initialization
3) image is demarcated
It is that this detection system is carried out based measurement that image is demarcated.Because the image that image acquisition device 6 is gathered is to be unit with the pixel, and object is unit with the millimeter in the reality, must be converted into measurement unit to pixel unit, therefore need carry out rationally and accurate the demarcation measuring system of picture, demarcate by image the pixel unit of image is converted into actual measurement units.
The mode that image adopts vernier caliper to demarcate is demarcated.Adjust the distance of the two chis pincers opening of vernier caliper before measuring earlier, the distance of present embodiment split shed is made as 2mm, gather the image of two chis pincers opening, clamp the distance of opening and the ratio that two chis clamp the pixel of opening image, obtain pixel distance between the two chis pincers opening by two chis.In the present embodiment, by in the distance between the two chis pincers edge of opening pixel 544.61pixel being arranged, and actual slide calliper rule are standard 2mm, can draw that a pixel is 0.0037mm in the native system.
4) judged whether triggering signal
When determining control unit 11 when trigger impulse is arranged, this image acquisition device 6 beginning images acquired, and the light signal that collects is converted to picture signal, and be sent to graphics processing unit 10 and handle.
When determining control unit 11 triggerless pulses, detection system is got back to step 4), waits for the arrival of trigger impulse.
5) image processing
This graphics processing unit 10 is handled the picture signal that receives, image processing flow process as shown in Figure 3, and it may further comprise the steps:
A) figure image intensifying:
The figure image intensifying is used to adjust the contrast of image, and the material particular in the outstanding image is improved visual quality.Native system adopts the histogram index processing, and to strengthen picture contrast, minimizing is because of bluring that exposure deficiency and vibration produce.Adopt look-up table (Look-Up Table) conversion, gradation of image is carried out specific calculation and conversion.Wherein indexing is 1.5.
B) carrying out image threshold segmentation, carry out binary conversion treatment:
More clearly through the image outline after the LUT processing, but still have fuzzy in a small amount and discontinuous.This image is carried out binaryzation again one time, gray level image is changed into black and white image, so that the processing to part disturbing factor in the image also is convenient in the analysis of subsequent target image simultaneously.Target image extracting waste after the binary conversion treatment, background is got black, thereby makes clarification of objective more obvious.What native system adjustment gray scale was selected for use is the manual threshold value of bimodal method, and it is 150-255 that threshold range is set.
C) image mathematics morphologization:
(Fill holes) filled in the zone
Image after native system adopts morphologic basic operation to binaryzation carries out the zone fills, so that discontinuous partially enclosed in the image after strengthening.
Closed operation (closing)
In order to make image resultant edge smoothing behind thresholding, native system adopts morphologic closed operation that image is further handled.Closed operation adopts 3 * 3 structural elements to carry out logical operation.
Convex hull functional operation (Convex Hull)
Image is further level and smooth after the closed operation, again image is carried out the convex hull functional operation.
D) particle analysis, the centering coordinate:
Particle analysis is that the geological information of the required detection of target image is listed by electrical form.
E) soldering tip detection system interface and error analysis:
Image of the every collection of system all carries out once above-mentioned image processing to image, and the result behind the particle analysis shown and is kept in the Excel form.
6) judge to detect whether finish
Judge according to the parameter that computer processing system 7 is set whether detection finishes, when detection finishes, this computer processing system 7 output results, and finish to gather and processing image, detection of end; When detection does not finish, get back to step 3).
In the above-mentioned welding head positioning accuracy detection method, because suction nozzle of bonding tip 3 is high-speed motions, the speed of image acquisition device 6 collections and converted image does not catch up with the motion of suction nozzle of bonding tip 3.Therefore, this detection system adopts when suction nozzle of bonding tip 3 is per to arrive dice bonding part 2 twice, this control unit 11 sends a trigger impulse to image acquisition device 6, thereby solve the problem that image acquisition device 6 is gathered and converted image speed does not catch up with, promptly adopt the positional precision that detects a suction nozzle of bonding tip 3 when suction nozzle of bonding tip 3 is per to arrive dice bonding part 2 twice, rather than the method that at every turn all detects, thereby can solve image blurring problem after image acquisition device 6 is gathered and changed effectively.
As shown in Figure 4, can save lens barrel 5 and the pellicle mirror 9 that is arranged in the lens barrel 5 in the present embodiment, symmetrical light sources 4 illuminations of suction nozzle of bonding tip 3 both sides are located in utilization, make image acquisition device 6 can collect the information of the endoporus geometric coordinate of suction nozzle on dice bonding part 2 exactly, finish the detection and localization of suction nozzle of bonding tip 3.
Certainly, manual adjustment can be carried out in the position of above-mentioned light source 4, can adjust direction and angle that light source 4 sends light signal, forms good illuminating effect and avoids suction nozzle of bonding tip 3 interference to light source in high-speed cruising, thereby influence the images acquired signal.
Claims (8)
1. welding head positioning accuracy detecting system, comprise that suction nozzle of bonding tip (3) and control suction nozzle of bonding tip (3) pick up wafer at picking up part, transmit wafer and at the transmission mechanism (8) of dice bonding part weldbonding wafer, it is characterized in that: reflective mirror (1) is installed under the dice bonding part (2), above-mentioned suction nozzle of bonding tip (3) center is provided with a hollow via-hole, the top of hollow via-hole is provided with to reflective mirror (1) luminous light source (4), reach the image acquisition device of gathering by the light signal of reflective mirror (1) reflection (6), image acquisition device (6) also connects the computer processing system (7) of the above-mentioned light signal of a processing.
2. welding head positioning accuracy detecting system according to claim 1, it is characterized in that: suction nozzle of bonding tip (3) top is provided with a lens barrel (5) coaxial with its hollow via-hole, image acquisition device (6) is positioned at lens barrel (5) top, be provided with pellicle mirror (9) in the lens barrel (5), light source (4) is positioned at a side of pellicle mirror (9), and its light that sends is through pellicle mirror (9) refraction and via hollow via-hole directive reflective mirror (1), after reflection still via this hollow via-hole and lens barrel (5) directive image acquisition device (6).
3. welding head positioning accuracy detecting system according to claim 1, it is characterized in that: image acquisition device (6) is made of the ccd video camera that light signal is converted to picture signal, and this computer processing system (7) is made up of graphics processing unit (10) and control unit (11).
4. a welding head positioning accuracy detection method is characterized in that using the described welding head positioning accuracy detecting system of claim 1, and it may further comprise the steps:
1) light source (4) of being located at suction nozzle of bonding tip (3) top emits beam, and light is via reflective mirror (1) reflection that is positioned at dice bonding part (2) under, and directive is located at the image acquisition device (6) above the suction nozzle of bonding tip (3).In the time should arriving dice bonding part according to program suction nozzle of bonding tip (3), control unit (11) sends trigger impulse, and image acquisition device (6) collects the contour images of suction nozzle endoporus;
2) image acquisition device (6) is gathered light signal, and is converted into picture signal;
3) picture signal is sent to computer processing system (7) and carries out image processing, the pixel unit in the image is converted into measurement unit, and obtain the geometric center coordinate information of image, thereby realize detection suction nozzle of bonding tip (3) positioning accuracy.
5. welding head positioning accuracy detection method according to claim 4, it is characterized in that: in step 2) and 3) in, this image acquisition device (6) is a ccd video camera, this computer processing system (7) comprises graphics processing unit (10) and control unit (11), after this control unit (11) sends trigger impulse to image acquisition device (6) and graphics processing unit (10), graphics processing unit (10) is handled picture signal, its pixel unit is converted into measurement unit, obtains the geometric center coordinate information of image.
6. welding head positioning accuracy detection method according to claim 5, it is characterized in that: during the per twice arrival dice bonding part of suction nozzle of bonding tip (3) (2), this control unit (11) sends a trigger impulse to image acquisition device (6) and graphics processing unit (10), finishes the collection and the processing procedure of image.
7. welding head positioning accuracy detection method according to claim 4, it is characterized in that: in step (3), during to treatment of picture, adopt the vernier caliper mode of demarcating that the image that is collected is demarcated, adjust the distance of the two chis pincers opening of vernier caliper, gather the image of two chis pincers opening, the pixel apart from size and corresponding two chis pincers opening image by two chis pincers opening obtains the size of measurement image and the proportionate relationship between the pixel.
8. according to each described welding head positioning accuracy detection method of claim 4 to 7, it is characterized in that: this computer processing system (7) is further comprising the steps of when image is handled:
A. figure image intensifying:
Adopt the histogram index processing, gradation of image is carried out specific calculation and conversion;
B. carrying out image threshold segmentation, carry out binary conversion treatment:
This image is carried out binaryzation again one time, gray level image is changed into black and white image, target object extracting waste after the binary conversion treatment, background is got black;
C. image mathematics morphologization:
Image after native system adopts morphologic basic operation to binaryzation carries out the zone fills, so that discontinuous partially enclosed in the image;
Native system adopts morphologic closed operation that image is further handled, and makes image resultant edge smoothing behind thresholding, and closed operation adopts 3 * 3 structural elements to carry out logical operation;
Image is further level and smooth after the closed operation, again image is carried out the convex hull functional operation;
D. particle analysis, the centering coordinate:
The needed detection geological information of object is listed by electrical form;
E. soldering tip detection system interface and error analysis:
Image of the every collection of system all carries out once above-mentioned image processing to image, and the result behind the particle analysis is shown and preservation.
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| CNB2007100313769A CN100561701C (en) | 2007-11-13 | 2007-11-13 | A kind of welding head positioning accuracy detecting system and method thereof |
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| CNB2007100313769A CN100561701C (en) | 2007-11-13 | 2007-11-13 | A kind of welding head positioning accuracy detecting system and method thereof |
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5789436B2 (en) * | 2011-07-13 | 2015-10-07 | ファスフォードテクノロジ株式会社 | Die bonder |
| CN103177975B (en) * | 2013-03-22 | 2015-08-26 | 江苏艾科瑞思封装自动化设备有限公司 | Swing arm soft landing method |
| US9263352B2 (en) * | 2014-01-03 | 2016-02-16 | Asm Technology Singapore Pte Ltd | Singulation apparatus comprising an imaging device |
| CN104282597A (en) * | 2014-07-31 | 2015-01-14 | 深圳市恒睿智达科技有限公司 | Double-welding-head die bonder |
| CN106202730B (en) * | 2016-07-11 | 2019-09-24 | 广东工业大学 | A kind of motion planning process positioning accuracy judgment method based on energy envelope line |
| CN108115303A (en) * | 2017-12-30 | 2018-06-05 | 安徽泉盛化工有限公司 | A kind of automatic welding adjusted based on height regulates and controls method |
| CN109191464B (en) * | 2018-11-21 | 2024-02-13 | 南京钜力智能制造技术研究院有限公司 | Rechecking method and intelligent rechecking equipment for PC (polycarbonate) component |
| CN111490147B (en) * | 2020-04-21 | 2021-03-26 | 深圳新益昌科技股份有限公司 | Full-automatic planar IC die bonder and die bonding method |
| CN114516540A (en) * | 2020-11-19 | 2022-05-20 | 联策科技股份有限公司 | Optical identification suction nozzle system |
| CN112992697B (en) * | 2021-05-13 | 2021-08-10 | 中科长光精拓智能装备(苏州)有限公司 | Visualization-based semiconductor chip packaging method and system |
| CN117351477A (en) * | 2023-10-27 | 2024-01-05 | 重庆富世恒睿物联网科技有限公司 | Embedded water meter reading identification method, identification device and electronic equipment |
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Inventor after: Chen Xin Inventor after: Li Ketian Inventor after: Liu Jian Inventor after: Zhang Li Inventor after: Huang Xiangxiu Inventor before: Li Ketian Inventor before: Liu Jian Inventor before: Chen Xin Inventor before: Huang Xiangxiu |
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