CN100481210C - Apparatus for grounding a magnetic recording head - Google Patents
Apparatus for grounding a magnetic recording head Download PDFInfo
- Publication number
- CN100481210C CN100481210C CNB2003801058438A CN200380105843A CN100481210C CN 100481210 C CN100481210 C CN 100481210C CN B2003801058438 A CNB2003801058438 A CN B2003801058438A CN 200380105843 A CN200380105843 A CN 200380105843A CN 100481210 C CN100481210 C CN 100481210C
- Authority
- CN
- China
- Prior art keywords
- suspension
- coupled
- slide block
- trace
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3109—Details
- G11B5/3116—Shaping of layers, poles or gaps for improving the form of the electrical signal transduced, e.g. for shielding, contour effect, equalizing, side flux fringing, cross talk reduction between heads or between heads and information tracks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
Abstract
Method and apparatus are presented for electrically coupling a slider to ground. In one embodiment, a bonding pad is provided on a side of the slider body separate from the bonding pad(s) used for read/write signals. This separate bonding pad is electrically coupled within the slider body to components that are to be coupled to ground. A separate conductor provided on the suspension (e.g., a trace, a flex circuit, etc.) may be electrically coupled to the separate bonding pad via gold ball bonding. The conductor is also coupled to ground in the hard-disk drive device (e.g., via the preamplifier). The use of the separated bonding pad and trace may negate the need to use a conductive adhesive to electrically ground the slider via its attachment to the tongue of a slider.
Description
The application requires the right of priority of No. the 60/417665th, the U. S. application of on October 11st, 2002 application.
Technical field
The present invention relates to a kind of magnetic hard disk drives.More specifically, the present invention relates to a kind ofly avoid using electroconductive binder and with the method and apparatus of magnetic recording head ground connection.
Background technology
The disk drive that is used to carry out data recording uses magnetic recording head to write on indicator and reading of data.Record-header is structured on the substrate, is called wafer, and it is made by the technology identical with the technology that is used for semiconductor devices by conductive material AlTiC for example.Gold pad on the outside surface of record-header is electrically connected to pen recorder by the internal electric path of creating during the processing of wafer-level.Then wafer is cut into rectangular block, make to have an independent record-header on additional each piece that substrate arranged, it is known as slide block.Then, slide block is installed on the suspension.Described assembly is known as head gimbal assembly, or HGA.Use tackifier that slide block is bonded on the suspension then, described tackifier comprises that electro-conductive adhesive is electrically connected to form between the parts of stainless steel of substrate and suspension.Use comprises that the method for ultrasonic soldering or the welding of tin material produces other electrical connection between gold pad on the record-header and the metal trace on the suspension.At last, HGA is assembled in the hard disk drive device, makes the suspension trace be connected, be typically with prime amplifier and be connected, and the stainless steel parts of suspension is connected with the electrical ground of driver with other electric component.
Usually have two types HGA-wired with wireless.Wired HGA is such one, and the lead that wherein separates is connected between the flexible circuit and read/write head of HAS.Wireless HGA is such one, and wherein conductive trace and flexible beam (flexure) integrate and provide electricity to lead between the read/write head of the flexible circuit of HAS and slide block.Two types wireless suspension is typically arranged in the prior art.In first type, for example trace suspension assemblies (TSA) and integrated circuit suspension (CIS), (for example handle by the removal of on the stainless steel flexible beam, carrying out, etching operation) or by adding processing (for example, spraying plating or deposition processes) make insulation course between trace and flexible beam, make up trace.After the trace setting is gone up in position, so just flexible beam can be soldered to the other parts of suspension.In second type, the flexible beam (FOS) on flexible hanger assembly (FSA) and the suspension for example, trace is structured on the insulation course, covers it to form a flexible circuit with another insulation course then.With regard to useful binders this circuit is attached to suspension then.Selectable, can before being attached to suspension, an additional metal layer that is called ground level be attached to flexible circuit.In FSA, flexible beam integrates together with the integrated trace that is used to be connected with installing plate with load beam.
As shown in Figure 1, a head gimbal assembly 40 provides a plurality of degree of freedom to slide block usually, for example perpendicular separation, pitch angle and roll angle, and they have explained the flying height of slide block.As shown in Figure 1, suspension 74 remains on HGA40 on the displacement disc 76 (having the edge) and on by the direction shown in the arrow 80 and moves.When disc drive operation shown in Figure 1, actuator 72 mobile HGA on circular arc 78 strides across the various diameters (for example, internal diameter (ID), mid diameter (MD) and external diameter (OD)) of dish 760.
A typical prime amplifier links to each other with described magnetic head write head is provided write current and from the read head received current.Prime amplifier is present in the accessory of the flexible preposition amplifier module of so-called actuator (AFPA).Prime amplifier is soldered to flexible circuit usually.This flexible circuit provides such zone: the HGA trace will be connected to this zone so that this circuit is connected to prime amplifier the read-write elements of described head.
Suspension provides two functions: mechanical support and provide electrical connection between head and prime amplifier.With to use physical cord that head is connected to prime amplifier opposite, normally used is metal trace on the suspension.
Use electro-conductive adhesive that the record-header substrate is had many shortcomings with the method for electric means ground connection.Topmost, the resistance of electro-conductive adhesive is insecure and restive.Described resistance may be very high and may taking place to change widely between the each several part during handling making.In addition, the restive flatness that is installed to the slide block on the HGA, it is another key parameter.In addition, in order to apply in HGA and the curing conductive tackifier, assembling process needs many processing, thereby has increased the cost and the cycle of manufacturing process.
Use the stainless steel suspension as HGA be provided at electrical grounding between the electrical ground in the disk drive and connect and also may have defective.Sizable variation may take place in the resistance of stainless steel suspension between this parts.If electric resistance of stainless is high, in ground connection passage (for example, actuator), will there be very insecure the connection so with other metal construction.
Consider above-mentionedly, need a kind of improved method and apparatus make read/write head/slider ground connection to overcome the shortcoming of these known systems.
Summary of the invention
The invention provides a kind of device that is used for magnetic recording head ground connection.
According to an aspect of the present invention, a kind of suspension comprises:
Substrate;
Be arranged in described on-chip dielectric layer;
Be coupled to a plurality of metal trace of described dielectric layer, it couples mutually with read/write circuit on the slider part that is coupled to described suspension; With
The independent trace segments that will be electrically coupled to described slider part, described independent trace segments is coupled to described substrate by an opening in the described dielectric layer.
According to another aspect of the present invention, a kind of suspension comprises:
The flexible hanger assembly comprises:
Ground plane;
Dielectric layer;
Be coupled to a plurality of metal trace of the read/write circuit in the slider part; With
Be electrically coupled to an independent trace segments of described slider part, described independent trace segments is electrically coupled to described ground plane by an opening in the described dielectric layer.
According to a further aspect of the invention, a kind of disk drive comprises:
Head suspension assembly comprises:
The slide block that comprises read/write circuit;
Be coupled to a plurality of traces of the pad on the described slide block, described slide block couples mutually with described read/write circuit;
Be coupled to the independent trace segments of described slide block;
Dielectric layer; With
Metal substrate makes described independent trace segments be electrically coupled to described metal substrate.
According to a further aspect of the invention, a kind of slide block comprises:
Slider body, comprise substrate, on indicator the write and read data circuit, transmit at least one welded gasket of read/write signal and be electrically coupled to the independent grounding welded gasket of described substrate, wherein said slider body comprises forward position, tail edge and side edge, and described independent ground connection welded gasket is positioned at the forward position or the side edge of described slide block.
Description of drawings
Fig. 1 represent configuration well known in the prior art be used for from the actuating arm of the hard disk drive device of reading and writing to magnetic hard disk;
Fig. 2 represents the gold goal welded structure used in embodiments of the present invention;
Fig. 3 is used for skeleton view with the part of the suspension of the welded gasket of read/write head/slider ground connection and trace for expression according to being added with of first embodiment of the invention;
Fig. 4 is used for skeleton view with the part of the suspension of the welded gasket of read/write head/slider ground connection and trace for expression according to being added with of second embodiment of the invention;
Fig. 5 is used for skeleton view with the part of the suspension of the welded gasket of read/write head/slider ground connection and trace for expression according to being added with of second embodiment of the invention;
Fig. 6 is used for the skeleton view with the suspension of the segmented trace of slider part ground connection for expression is added with according to an embodiment of the invention;
Fig. 7 is the sectional view of expression according to the suspension of the electrical connection between the stainless steel substrate of trace segments and suspension of first embodiment of the invention;
Fig. 8 is the sectional view of expression according to the suspension of the electrical connection between the stainless steel substrate of trace segments and suspension of second embodiment of the invention;
Fig. 9 is the sectional view of expression according to the suspension of the earth terminal that is electrically connected and substrate is connected to prime amplifier between trace segments and stainless steel substrate of the present invention.
Embodiment
With reference to Fig. 2, it shows a typical ball bonding structure.As mentioned above, slide block 5 comprises electric component and impels from storage medium and for example rotate the hard disk reading of data and data are write the parts of storage medium.Be connected to other parts in the disk drive for the ease of the electric component that will read and write " head ", provide an outside weldings pad 13 in the outside of slide block.Similarly, suspension also comprises the electric component of the read-write parts that are coupled to slide block.Typically, these electric components comprise the metal trace that is attached in the suspension 11, or are connected to the flexible circuit of the separation of suspension.Under any situation, welded gasket 9 typically is provided on the surface of suspension 11.One conductive material, for example gold goal or solder ball etc. are stacked on the welded gasket 13 of slide block 5 and on the welded gasket 9 of suspension 11.In the present embodiment, use gold goal 7 in a conventional manner.Similarly, welded gasket 9 and 13 also is made of gold.
According to one embodiment of present invention, can obtain the substrate of record-header 5 more reliably and the ground connection of good control by the electrical connection between the extra ground connection gold pad on the extra ground connection trace on the suspension 11 and the record-header/slide block, described extra ground connection gold pad is electrically connected to substrate by the inner conductive path that is structured in record-header/slide block on the processing of wafers grade.The same procedure that is used to connect other gold solder connection pad and suspension trace can be used for being connected ground connection gold solder connection pad and suspension ground connection trace, compares with using electro-conductive adhesive, and this method can be reliable more and well-controlled.And then use the identical or similar method that other trace is connected to other electric component (being typically prime amplifier) in the disk drive, just suspension ground connection trace can be electrically connected to the electrical ground of hard disk drive.
With reference to Fig. 3, it shows the first embodiment of the present invention.In this embodiment, the trailing edge that slide block 201 is arranged in slide block comprises the read-write electric component.Be used for the read-write electric component is electrically connected to electric component on the suspension being furnished with welded gasket 209 and 211 on the slide block.In this embodiment, the electric component of suspension comprises four conductive traces 205,207, and they are coupled to welded gasket 215,217 respectively and are used for read/write signal.In the known typical suspension of prior art, conductive trace 205,207 can and in suspension 221, perhaps can be independent be created in the flexible circuit or similar device that couples with suspension.In addition, the trace electric component (for example, prime amplifier, specific is not shown in Fig. 3) that can be electrically connected to disk drive is used for control and writes storage medium from the storage medium reading of data with data.
According to this embodiment of the invention, slide block 201 in a conventional manner the tongue piece 203 of (for example, use electrical isolation bonding agent) and suspension couple.One independent welded gasket 213 is arranged on the outside surface of slide block 201.For example, welded gasket can couple mutually with the electric component that will be coupled to electrical ground in the slide block 201.One independent ground pad 220 is arranged on the suspension the electrical grounding parts in the disc drive apparatus are provided conductive path (for example, passing through prime amplifier) together with ground connection trace 219.After slide block 201 is attached to tongue piece 203, can the welded gasket 209,211,213 of slide block be electrically connected to the welded gasket 217,215,220 of suspension by for example gold goal welded structure shown in Fig. 2.Other electrically connected method be can use, ultrasonic soldering and soldering comprised.
Fig. 4 shows one of the present invention can select embodiment.In this embodiment, an independent ground pad 225 is arranged on the side surface of slide block, rather than the tail that is arranged in slide block 201 is along on the side.As the embodiment of Fig. 3, the parts that will be electrically connected to ground wire in ground mat 225 and the slide block 201 carry out electric coupling.Similarly, an independent ground mat 227 is arranged on the suspension 221 welded gasket 225 is electrically connected to the electrical ground in the hard disk drive device together with conductive trace 223.As the embodiment of Fig. 3, can use gold goal as shown in Figure 2 to weld the welded gasket 217,215,227 that the welded gasket 209,211,225 of slide block 201 is electrically connected to suspension.
Various embodiments of the present invention shown in so far can obtain many benefits.At first, can make stake resistance become very low and consistently.The second, the slide block flatness control will improve.In addition, can simplify the HGA assembling greatly handles.For example, in manufacture process, can eliminate electro-conductive adhesive and use processing.Pin stick set handling also can obtain simplifying, because can not need to use conductive epoxy resin.
Foregoing invention is not limited to these embodiment.For example, described independent ground mat can be placed on the position except that the position shown in Fig. 3 and 4 on the slide block.For example, described pad can be placed on the leading edge of slide block.In addition, can use the conductor the trace in the either side that is incorporated into suspension, comprise the lead of separation.In an embodiment of Fig. 3 and 4, independent pad is connected with the substrate of slide block makes that it can ground connection.Independent pad can be as required with slide block in other parts couple.Equally, described independent pad can couple with other parts in the disc drive apparatus.When the tail that is in slide block when read/write circuit and independent pad along the time (as Fig. 3), in the wafer fabrication processes process, can use any in the various known separation techniques that the read/write circuit of electrical connection from slide block from described pad to the slide block substrate kept apart.In addition, Fig. 3 and 4 embodiment are only used for illustrative purposes, and they are not necessarily drawn in proportion.
With reference to Fig. 5, it shows an additional embodiment of the present invention.As mentioned above, can manage by the electroconductive binder that slide block is bonded to HGA electrical grounding to be set between the ground outside of slide block and slide block connects.In the embodiment of Fig. 5, the ground mat 251 on the suspension 252 couples with the ground plane 254 in the suspension bodies.In this embodiment, suspension 252 comprises the metal flat that can be connected to ground wire (for example, passing through prime amplifier).Ground mat 251 can be realized (for example, gold-plated through hole connects 253) by in the various known method any to the connection between the ground plane 254.
With reference to Fig. 6-9, it shows additional embodiments of the present invention, and these embodiment for example relate to the application that is used for the segmented trace of slide block ground connection.
With reference to Fig. 6, suspension 261 is shown having an integrated flexure 262 and an attached slider part 263.In the present embodiment, slider part 263 comprises four pad 265a-d, and these pads provide the read and write signal of the recording head section 268 of slide block 263 in a conventional manner.These pads 265a-d is electrically connected to other pad on the flexible beam 262, and next the pad on the flexible beam 262 is connected with the read/write traces 267a-d that is connected to prime amplifier 269.In the present embodiment, suspension comprises that stainless steel substrate 271 carries out dielectric layer 273 that electricity isolate with trace 267a-d from stainless steel substrate 271 with helping.
According to one embodiment of present invention, provide segmented trace to electrically couple a slider to ground wire.In the present embodiment, slide block comprises aforesaid ground mat 273.When slide block 263 was coupled to flexible beam 262, the ground mat 273 of slide block can carry out electric coupling with the corresponding ground mat 274 on the flexible beam.First section 275 of trace is electrically connected to ground mat 274.In addition, be electrically connected to ground wire (for example, the earth terminal 275 of prime amplifier) for second of trace section 276.Described first and second sections traces 275,276 can get up by stainless steel substrate 271 electric couplings of suspension as described below 261.
With reference to Fig. 7, it shows first embodiment of method that is used for trace segments is electrically connected to the stainless steel substrate of suspension.In the embodiment of Fig. 7, the trace that is used to electrically couple the preamplifier to slide block for example handles by removal that trace suspension assemblies (TSA) makes up.In TSA, suspension comprises three layers at least: top conductor layer 283 (for example, being made of copper), intermediate dielectric layer 282 and basal layer 286 (for example, being made by stainless steel).Then, just can remove material (for example, by etching) to form trace conductor (for example, with the form shown in Fig. 6).According to one embodiment of present invention, produce an opening 280 and/or produce an edge 284 by copper layer 283 and intermediate dielectric layer 282 to expose stainless steel substrate 286.Then, can deposit in the opening 280 with conductive material 281 (for example, gold, scolding tin) or edge 284 is sentenced just to produce between copper tracing wire 283 and stainless steel substrate and is electrically connected.Refer back to Fig. 6 again, this electrical connection will be created in described first and second trace segments and sentence just generation electrical connection between slide block (for example, ground mat 273) and earth terminal 275.
With reference to Fig. 8, it shows second embodiment that is used for a trace segments is electrically connected to stainless steel substrate.In the present embodiment, handle by the interpolation of for example in integrated circuit suspension (CIS), carrying out and produce trace.In a kind of like this interpolation was handled, dielectric layer 291 was deposited on the stainless steel substrate 292, then conductive trace 293 is deposited on the top of dielectric layer 291.In the present embodiment, in dielectric layer 291, produce an opening 290.For example, after depositing to dielectric layer 291 on the stainless steel substrate 292, can opening 290 be formed in the dielectric layer by etch processes.Selectable, dielectric layer 291 is so that form an opening to substrate 292 during deposition processes in such a way.After producing opening, conductive trace 293 is deposited in the described opening so that produce electrical connection (for example, between one of trace segments in Fig. 6 275,276 and the stainless steel substrate 271).
With reference to Fig. 9, it shows the 3rd embodiment that is used for trace segments is electrically connected to stainless steel substrate.In this embodiment, copper tracing wire is formed the part of flexible hanger assembly (FSA).With reference to Fig. 9, FSA comprises copper ground plane 301, dielectric layer 303 and comprises the metal trace of trace segments 305.In case form, just FSA can be attached to suspension 315 then, described suspension integral body is made by stainless steel.The flexible beam that just slide block 307 can be attached to suspension then also passes through the lip-deep independent grounding pad 308 and copper trace segment electric coupling of slide block 307.In the present embodiment, an opening 310 is formed on and makes trace segments 305 to electrically contact with 301 generations of copper ground plane in the dielectric layer 303.As the embodiment shown in Fig. 7, can produce electrical connection so that trace segments is connected to ground plane in opening by independent, conductive material (for example, gold goal or solder ball) is provided.Equally, use the embodiment of Fig. 8, can cross over opening and form copper trace segment 305 to be connected to the copper ground plane.Though can provide independent trace segments to be coupled to stainless steel substrate 315 with the earth terminal with prime amplifier 317, in the present embodiment, copper ground plane 301 can directly be coupled to earth terminal 316.
Though note one or two trace segments only is provided in the above embodiments, the present invention is not limited to this.Can between slide block and ground wire, use a plurality of trace segments.In addition, illustrated and used trace segments that slide block is connected to the earth terminal of prime amplifier, but can use this trace segments that other parts are electrically connected.For example, can use trace segments that slide block is connected to other grounded parts in the disk drive.In addition, trace segments also can be used for the circuit in the slide block is connected to other parts in the disk drive.
Though specifically describe and several embodiment have been described, be to be appreciated that under the situation that does not break away from spirit of the present invention and desired extent various modifications of the present invention and distortion can be contained and in the scope of appended claim by top instruction herein.
Claims (20)
1. suspension comprises:
Substrate;
Be arranged in described on-chip dielectric layer;
Be coupled to a plurality of metal trace of described dielectric layer, it couples mutually with read/write circuit on the slider part that is coupled to described suspension; With
The independent trace segments that will be electrically coupled to described slider part, described independent trace segments is coupled to described substrate by an opening in the described dielectric layer.
2. suspension as claimed in claim 1, wherein said substrate is made by stainless steel.
3. suspension as claimed in claim 2 further comprises:
Be electrically coupled to second trace segments of described substrate.
4. suspension as claimed in claim 3, wherein said second trace will be coupled to the electric component in the disk drive.
5. suspension as claimed in claim 3, wherein said second trace will be coupled to the earth terminal of prime amplifier.
6. suspension as claimed in claim 5 further comprises:
The slide block that comprises read/write circuit, described read/write circuit are electrically coupled to described a plurality of traces and the trace segments on the described suspension.
7. suspension as claimed in claim 1, the edge that wherein said independent trace segments is crossed described dielectric layer is coupled to described substrate.
8. suspension as claimed in claim 7, wherein said substrate is made by stainless steel.
9. suspension as claimed in claim 8 further comprises:
Be electrically coupled to second trace segments of described substrate.
10. suspension as claimed in claim 9, wherein said second trace segments will be coupled to the earth terminal of prime amplifier.
11. suspension as claimed in claim 4 further comprises:
The slide block that comprises read/write circuit, described read/write circuit are electrically coupled to described a plurality of traces and the trace segments on the described suspension.
12. a suspension comprises:
The flexible hanger assembly comprises:
Ground plane;
Dielectric layer;
Be coupled to a plurality of metal trace of the read/write circuit in the slider part; With
Be electrically coupled to an independent trace segments of described slider part, described independent trace segments is electrically coupled to described ground plane by an opening in the described dielectric layer.
13. suspension as claimed in claim 12, wherein said independent trace segments will be electrically coupled to the ground pad on the described slider part.
14. suspension as claimed in claim 13 further comprises:
Be coupled to the substrate of described flexible hanger assembly.
15. suspension as claimed in claim 14, wherein said ground plane will be coupled to the earth terminal on the prime amplifier parts in the disk drive.
16. suspension as claimed in claim 14 further comprises:
The slide block that comprises read/write circuit, described read/write circuit are electrically coupled to described a plurality of traces and the described independent trace segments on the described flexible hanger assembly.
17. a disk drive comprises:
Head suspension assembly comprises:
The slide block that comprises read/write circuit;
Be coupled to a plurality of traces of the pad on the described slide block, described slide block couples mutually with described read/write circuit;
Be coupled to the independent trace segments of described slide block;
Dielectric layer; With
Metal substrate makes described independent trace segments be electrically coupled to described metal substrate.
18 disk drives as claimed in claim 17 further comprise:
Prime amplifier comprises the earth terminal of the metal substrate that is electrically coupled to described head suspension assembly.
19 disk drives as claimed in claim 18, wherein said head suspension assembly further comprises:
Be coupled in second trace segments between the metal substrate of the earth terminal of described prime amplifier and described head suspension assembly.
20. disk drive as claimed in claim 17, wherein said head suspension assembly further comprise the ground plane between described metal substrate and described dielectric layer, the earth terminal electric coupling on wherein said ground plane and the described prime amplifier.
21. a slide block comprises:
Slider body, comprise substrate, on indicator the write and read data circuit, transmit at least one welded gasket of read/write signal and be electrically coupled to the independent grounding welded gasket of described substrate, wherein said slider body comprises forward position, tail edge and side edge, and described independent ground connection welded gasket is positioned at the forward position or the side edge of described slide block.
22. slide block as claimed in claim 21, wherein said independent ground connection welded gasket and the described electrical wiring between the described substrate and other circuit electricity in the slide block are isolated.
Between 23 slide blocks as claimed in claim 21, the wherein said electrical wiring parts in independent ground connection welded gasket and slide block.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US41766502P | 2002-10-11 | 2002-10-11 | |
| US60/417,665 | 2002-10-11 | ||
| US10/414,233 | 2003-04-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1726534A CN1726534A (en) | 2006-01-25 |
| CN100481210C true CN100481210C (en) | 2009-04-22 |
Family
ID=35925186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2003801058438A Expired - Fee Related CN100481210C (en) | 2002-10-11 | 2003-10-14 | Apparatus for grounding a magnetic recording head |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20040077294A1 (en) |
| CN (1) | CN100481210C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7410410B2 (en) * | 2005-10-13 | 2008-08-12 | Sae Magnetics (H.K.) Ltd. | Method and apparatus to produce a GRM lapping plate with fixed diamond using electro-deposition techniques |
| CN101383154B (en) * | 2007-09-04 | 2011-09-28 | 新科实业有限公司 | Connection structure and manufacturing method thereof, magnetic head tab combination, magnetic head driving crane combination and hard disk driving unit |
| US11062731B1 (en) * | 2020-05-11 | 2021-07-13 | Western Digital Technologies, Inc. | Solder bump height stabilization for micro and fine pitch electrode pads |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3291738A (en) * | 1960-09-02 | 1966-12-13 | Rca Corp | Materials for preparing etch resists |
| US4037367A (en) * | 1975-12-22 | 1977-07-26 | Kruse James A | Grinding tool |
| US4821461A (en) * | 1987-11-23 | 1989-04-18 | Magnetic Peripherals Inc. | Textured lapping plate and process for its manufacture |
| US5509556A (en) * | 1994-11-17 | 1996-04-23 | International Business Machines Corporation | Process for forming apertures in a metallic sheet |
| US5897424A (en) * | 1995-07-10 | 1999-04-27 | The United States Of America As Represented By The Secretary Of Commerce | Renewable polishing lap |
-
2003
- 2003-10-10 US US10/683,927 patent/US20040077294A1/en not_active Abandoned
- 2003-10-14 CN CNB2003801058438A patent/CN100481210C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US20040077294A1 (en) | 2004-04-22 |
| CN1726534A (en) | 2006-01-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7064928B2 (en) | Method and apparatus for providing an additional ground pad and electrical connection for grounding a magnetic recording head | |
| US7059868B1 (en) | Connection of trace circuitry in a computer disk drive system | |
| US6704165B2 (en) | Attachment of a head-gimbal assembly to a printed circuit board actuator arm using Z-axis conductive adhesive film | |
| JP2006503402A5 (en) | ||
| US6252743B1 (en) | Read/write positioning arm with interspaced amplifier chips | |
| US7414814B1 (en) | Disk drives, head stack, head gimbal and suspension assemblies having a compliant suspension tail design for solder reflow | |
| KR100288806B1 (en) | Integrated head-electronics interconnection suspension for a data recording disk drive | |
| EP0888610B1 (en) | Adjustable solder bump spacer for slider-suspension attachment | |
| US20090207529A1 (en) | Flexible printed cable, head stack assembly with the same and manufacturing method thereof | |
| US20020043894A1 (en) | Piezoelectric actuator | |
| US6487047B1 (en) | Trace interconnect array having increased bandwidth by selective etching of traces and dielectric substrate | |
| US20030128474A1 (en) | Low electrical impedance slider grounding | |
| CN100481210C (en) | Apparatus for grounding a magnetic recording head | |
| JP5974824B2 (en) | Suspension substrate, suspension, suspension with head, hard disk drive, and method for manufacturing suspension substrate | |
| US20080080096A1 (en) | Head slider supporting device and storage device | |
| US20060087768A1 (en) | Method and apparatus for electrically coupling a slider to a wireless suspension substrate | |
| US20110090601A1 (en) | Suspension with flexure tail and manufacturing method thereof, head stack assembly and disk drive unit with the same | |
| JPH0954930A (en) | Magnetic head supporting mechanism | |
| JP2004164813A (en) | Low impedance electrical grounding for slider | |
| US20100214697A1 (en) | Suspension design for high shock performance soldering ball bonding | |
| US20050117255A1 (en) | FPC design and HGA assembly process | |
| US7881015B2 (en) | Overpass structure of flexible printed cable (FPC) signal lines with suspension signal lines for a hard disk drive | |
| JPH09265740A (en) | Head suspension assembly and its assembling method | |
| JPS63298809A (en) | Magnetic head device | |
| JP2001236620A (en) | Head support |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1087831 Country of ref document: HK |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| REG | Reference to a national code |
Ref country code: HK Ref legal event code: GR Ref document number: 1087831 Country of ref document: HK |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090422 Termination date: 20171014 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |