CN100446977C - Fluid jetting device and production method thereof - Google Patents
Fluid jetting device and production method thereof Download PDFInfo
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- CN100446977C CN100446977C CNB2004100564852A CN200410056485A CN100446977C CN 100446977 C CN100446977 C CN 100446977C CN B2004100564852 A CNB2004100564852 A CN B2004100564852A CN 200410056485 A CN200410056485 A CN 200410056485A CN 100446977 C CN100446977 C CN 100446977C
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- fluid ejection
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Abstract
The present invention relates to a fluid jetting device and a manufacturing method thereof, wherein the fluid jetting device comprises a basement, a structure layer formed on the basement, a manifold branch arranged in the basement to supply fluid, a plurality of fluid chambers with the same lengths and a plurality of jetting holes, and the fluid chambers with the same lengths are formed between the basement and the structure layer and are communicated with the manifold branch to contain the fluid to be jetted. The jetting holes pass through the structure layer and are communicated with the fluid chambers to jet the fluid, and the distances between the jetting holes and the manifold branch are almost different. The present invention also comprises the manufacturing method of the fluid jetting device.
Description
Technical field
The present invention relates to a kind of semiconductor device, particularly relate to a kind of fluid ejection apparatus and manufacture method thereof.
Background technology
At present, fluid ejection technique be widely used in various sciemtifec and technical spheres in, the sci-tech product of ink-jet head of printer, fuel injection equipment (FIE) or biomedical system such as drug injection mechanism etc. for example.
Known fluid ejection apparatus can be illustrated referring to Fig. 1.Fig. 1 shows United States Patent (USP) the 6th, 102, the fluid ejection apparatus that is disclosed for No. 530, this fluid ejection apparatus comprises a silicon substrate 38, a manifold 26, to carry fluid, fluid cavity 14, is located at a side of manifold 26, in order to hold this fluid, spray orifice 18, be located at the surface of fluid cavity 14, use, be located at around the spray orifice 18 for this fluid ejection and ejection assemblies 20,22.
Below be illustrated especially at the manufacture method of fluid cavity in the technique of above liquor ejecting device 14, consult Fig. 2 a to Fig. 2 c.Shown in Fig. 2 a, provide a substrate 38 that comprises upper and lower two protective layers 42,44.Then, shown in Fig. 2 b, the back side with anisotropic wet etch method etching substrate 38, to form a manifold 26, and expose substitutable layer 40, afterwards, remove substitutable layer 40 with the etching of hydrofluoric acid (HF) solution again, and reuse KOH base material 38 is etched with the making of finishing a fluid cavity 14, shown in Fig. 2 c.
Yet, shown in Fig. 3 a and 3b, wherein Fig. 3 a is the photomask pattern for a fluid cavity, Fig. 3 b then is the schematic diagram behind the etching fluid cavity, when making fluid cavity 14 with the anisotropic wet etch method, because anisotropic etching has different etching speeds to the different crystalline lattice plane, so certainly will produce etching action to the base material part 30 that separates fluid cavity in the process, cause fluid cavity length and design difference to some extent, cause the phase mutual interference (cross talk) between fluid cavity, simultaneously when etching cusp 31 occurs, also have the effect that stress is concentrated, to structural strength and also can cause service life and seriously influence, and physical dimension is more little, and this phenomenon is just beneficial more serious.
Summary of the invention
In view of this, the objective of the invention is to disclose a kind of fluid ejection apparatus, plan is by the design of same fluid cavity length, to improve the phenomenon of phase mutual interference (cross talk) in backfill (refill) process.
In order to achieve the above object, the invention provides a kind of fluid ejection apparatus, comprising: a substrate; One is formed at this suprabasil structure sheaf; One manifold, this manifold are arranged in this substrate, with accommodating fluid; A plurality of fluid cavitys with equal length, described a plurality of fluid cavitys with equal length are formed between this substrate and this structure sheaf and with this manifold and are communicated with, to hold the fluid that will spray; A plurality of passages, described a plurality of tunnel-shaped are formed between described these fluid cavitys and this manifold, and wherein each passage two ends connects a fluid cavity and this manifold respectively; And a plurality of spray orifices, described a plurality of spray orifices pass this structure sheaf and are communicated with described these fluid cavitys, to spray fluid.Described these spray orifices are different substantially with the distance of this manifold.
According to the design of fluid ejection apparatus of the present invention, when the fluid backfill, because the sleeve configuration passage that forms between fluid cavity and the manifold makes contiguous mutually fluid cavity can not produce phenomenon interfering with each other again because of flow disturbance is excessive.
The present invention provides a kind of manufacture method of fluid ejection apparatus in addition, and these a plurality of spray orifices comprise the following steps: to provide a substrate; Form a graphical substitutable layer in this substrate, this graphical substitutable layer is as predetermined a plurality of passages and a plurality of zone with equal length fluid cavity of forming; Form a patterned structures layer in this substrate, and cover this graphical substitutable layer; Form a manifold and pass this substrate, and expose this graphical substitutable layer; Remove this substitutable layer, to finish the making of described these passages and described these fluid cavitys, wherein this fluid cavity is communicated with this manifold by this passage; And this structure sheaf of etching, to form the spray orifice that a plurality of and described these fluid cavitys are communicated with, wherein said these spray orifices are different substantially with the distance of this manifold.
For above-mentioned purpose of the present invention, feature and advantage can be become apparent,, and in conjunction with the accompanying drawings, be described in detail below below especially exemplified by a preferred embodiment:
Description of drawings
Fig. 1 is United States Patent (USP) the 6th, 102, the schematic diagram of fluid ejection apparatus in No. 530.
Fig. 2 a to Fig. 2 c is United States Patent (USP) the 6th, 102, the generalized section that fluid ejection apparatus is made in No. 530.
Fig. 3 a and Fig. 3 b are known photomask pattern and anisotropic etching schematic diagram.
Fig. 4 a to Fig. 4 d is the schematic diagram of making for according to the fluid ejection apparatus of the first embodiment of the present invention.
Fig. 5 a and Fig. 5 b are photomask pattern and the etching schematic diagrames for according to a second embodiment of the present invention fluid ejection apparatus.
Fig. 6 a and Fig. 6 b are the photomask pattern of the fluid ejection apparatus of a third embodiment in accordance with the invention and etching schematic diagram.
Fig. 7 a and Fig. 7 b are the photomask pattern of the fluid ejection apparatus of a fourth embodiment in accordance with the invention and etching schematic diagram.
The reference numeral explanation:
Known part (Fig. 1, Fig. 2 a to Fig. 2 c and Fig. 3 a and 3b)
14～fluid cavity;
18～spray orifice;
20,22～ejection assemblies;
26～manifold;
30,38～base material;
31～etching cusp;
40～substitutable layer;
42,44～protective layer.
The embodiment of the invention is (Fig. 4 a to Fig. 4 c, Fig. 5 a and Fig. 5 b, Fig. 6 a and Fig. 6 b and Fig. 7 a and Fig. 7 b) partly
Lc～fluid cavity length;
Ln～neck structure length;
Wch～junction width;
Wn～neck structure width;
400～substrate;
405～substitutable layer;
410,510,610,710～manifold;
420,520,620,720～fluid cavity;
430～passage;
525,625,725～neck structure;
530～junction;
440～structure sheaf;
450～resistive layer;
460～separation layer;
470～conductive layer;
480～protective layer;
490～signal transmission lines contact hole;
495～spray orifice;
θ～angle;
The specific embodiment
Embodiment 1
The constitutive characteristic of present embodiment fluid ejection apparatus is that shown in Fig. 4 d, formation one gallery 430 makes the length (Lc) of described these fluid cavitys 420 keep identical between fluid cavity 420 and the manifold 410.
Consult Fig. 4 b (generalized section) and Fig. 4 d (schematic top plan view), the formation of present embodiment fluid ejection apparatus is described, wherein Fig. 4 b is the profile of Fig. 4 d along the 4b-4b cutting line.Shown in Fig. 4 b, this fluid ejection apparatus comprises a substrate 400, a manifold 410, fluid cavity 420, passage 430, a structure sheaf 440, a resistive layer 450, a separation layer 460, a conductive layer 470, a protective layer 480, a plurality of signal transmission lines contact hole 490 and a plurality of spray orifice 495.Wherein manifold 410 is formed in the substrate 400, and fluid cavity 420 and passage 430 are formed between substrate 400 and the structure sheaf 440, and because the design of passage 430 makes the length of fluid cavity 420 all consistent, shown in Fig. 4 d.
Then consult Fig. 4 a to Fig. 4 c, the making of the fluid ejection apparatus of one embodiment of the invention is described.At first, shown in Fig. 4 a, provide a substrate 400, a silicon base for example, the thickness of substrate 400 is substantially between 625～675 microns.Then, carry out a characterization step of present embodiment, the making of graphical substitutable layer 405 at first, forms a substitutable layer on one first 4001 of substrate 400, afterwards, with a photomask with passage and fluid cavity pattern layout, shown in Fig. 4 c, this substitutable layer is exposed, promptly form a graphical substitutable layer 405 that comprises a passage figure and a fluid cavity figure after developing, the length that wherein forms the fluid cavity figure is unanimity all.
Then form a patterned structures layer 440 in substrate 400, and cover graphics substitutable layer 405, structure sheaf 440 can be for by the formed silicon oxynitride layer of chemical vapour deposition technique (CVD), and the thickness of structure sheaf 440 is substantially between 1.5～2 microns.In addition, structure sheaf 440 is a low-stress material, and its stress value cardinal principle is between the tension of 100～20,000 ten thousand handkerchiefs (MPa).
Then, form a graphical resistive layer 450 on structure sheaf 440, to be heater for example as ejection actuators, fluid is driven via jet actuator after, spray by the spray orifice of follow-up making, resistive layer 450 is by HfB
2, TaAl, TaN or TiN constitute, and are preferable selection with TaAl wherein.
Form a graphical separation layer 460 again, cover substrate 400, structure sheaf 440 and resistive layer 450, and form after the heater contact hole, form a patterned conductive layer 470 on separation layer 460, and insert the heater contact hole, to form the signal transmission lines.At last, form a protective layer 480 on separation layer 460 and conductive layer 470, and form signal transmission lines contact hole 490, conductive layer 470 is exposed, in order to follow-up packaging operation.
Next, referring to Fig. 4 b, begin to carry out a series of etching, to form final fluid ejection apparatus.At first, with the wet etch method of anisotropic, etching solution for example is potassium hydroxide (KOH) solution, and graphical substitutable layer 405, forming a manifold 410, and is exposed in the back side of etching substrate 400 by promptly one second 4002.
The narrow opening width of manifold 410 is substantially between 160～200 microns, wide A/F is substantially between 1100～1200 microns, its inwall and horizontal line angle theta are roughly 54.74 degree, so the manifold 410 after the etching is a low wide and up narrow shape and structure, and manifold 410 is interconnected with a fluid accumulator tank downwards.
Then use the wet etch method of hydrofluoric acid containing (HF) solution, etched figure substitutable layer 405 afterwards, for example is the wet etch method etching substrate 400 of potassium hydroxide (KOH) solution with etching solution once again, enlarging the zone that graphical substitutable layer 405 is emptied, and form fluid cavity 420 and passage 430.Passage 430 is formed between fluid cavity 420 and the manifold 410, and because the particular design of passage 430 makes the length (Lc) of described these fluid cavitys 420 all identical, shown in Fig. 4 d.
At last, etch protection layer 480, separation layer 460 and structure sheaf 440 in regular turn, to form the spray orifice 495 that is communicated with fluid cavity 420, wherein spray orifice 495 and manifold 410 is different apart from cardinal principle.Etching is to utilize plasma etching, chemical gas etching, reactive ion etching or laser-induced thermal etching method.So far, promptly finish the making of a fluid injection apparatus.
Present embodiment utilizes the special connection configuration of manifold-passage on the photomask-fluid cavity, etch-rate faster direction compensate, and kept the uniformity of length between fluid cavity, obviously improve the phenomenon of easily disturbing adjacent fluid chamber ink-jet effect when fluid is backfilled to a certain fluid cavity.
Embodiment 2
The constitutive characteristic of present embodiment fluid ejection apparatus is, shown in Fig. 5 b, form a neck structure 525 between fluid cavity 520 and the manifold 510, make the length (Lc) of described these fluid cavitys 520 keep identical, and neck structure 525 is inwardly also kept identical with the width (Wch) of manifold 510 junctions 530, the difference of present embodiment and embodiment 1 is, the length that embodiment 1 only keeps fluid cavity 420 is identical, and present embodiment is except that all fluid cavity 520 identical length are same, the neck structure 525 that other adds, it is inwardly also all identical with the width (Wch) of manifold 510 junctions 530.
The step of the manufacturing step of present embodiment fluid ejection apparatus and embodiment 1 is identical substantially, and only the figure at graphical substitutable layer forms difference to some extent, below promptly partly explains with regard to the difference of present embodiment and embodiment 1.Forming a substitutable layer after on one first of substrate, with a photomask with neck structure and fluid cavity pattern layout, shown in Fig. 5 a, this substitutable layer is exposed, promptly form a graphical substitutable layer that comprises a neck structure figure and a fluid cavity figure after developing, the length that wherein forms the fluid cavity figure is unanimity all.
After each semiconductor layer is finished deposition step, begin to carry out a series of etching, to form final fluid ejection apparatus.Form fluid cavity 520 and neck structure 525 after the etching.Neck structure 525 is formed between fluid cavity 520 and the manifold 510, because the particular design of neck structure 525 makes the length (Lc) of described these fluid cavitys 520 all identical, neck structure 525 is inwardly also all identical with the width (Wch) of manifold 510 junctions 530 in addition, shown in Fig. 5 b.
The photomask of present embodiment manifold-neck structure-special connection configuration of fluid cavity, it is rectangular, the neck structure of long and narrow design, make fluid cavity keep a fixed dimension, and neck structure is inside and the same widths of manifold junction, also obviously improve the interference phenomenon of adjacent cavity, in addition, the appearance that has effectively slowed down the etching wedge angle because of the area that increases by 30 front end positions, interval shown in Fig. 3 b in the photomask.
Embodiment 3
The constitutive characteristic of present embodiment fluid ejection apparatus is, shown in Fig. 6 b, form a neck structure 625 between fluid cavity 620 and the manifold 610, make the length (Lc) of described these fluid cavitys 620 keep identical, and the length of neck structure 625 (Ln) is also all identical, the difference of present embodiment and embodiment 2 is that embodiment 2 does not set the length of neck structure 525, and the length (Ln) that present embodiment then designs neck structure 625 is all identical.
The step of the manufacturing step of present embodiment fluid ejection apparatus and embodiment 2 is identical substantially, and only the figure at graphical substitutable layer forms difference to some extent, below promptly partly explains with regard to the difference of present embodiment and embodiment 2.Forming a substitutable layer after on one first of substrate, with a photomask with neck structure and fluid cavity pattern layout, shown in Fig. 6 a, this substitutable layer is exposed, after developing, promptly form a graphical substitutable layer that comprises a neck structure figure and a fluid cavity figure, the length that wherein forms the fluid cavity figure is all consistent, and the length of neck structure figure is also all identical.
After each semiconductor layer is finished deposition step, begin to carry out a series of etching, to form final fluid ejection apparatus.Form fluid cavity 620 and neck structure 625 after the etching.Neck structure 625 is formed between fluid cavity 620 and the manifold 610 because the particular design of neck structure 625 makes the length (Lc) of described these fluid cavitys 620 all identical, in addition the length of neck structure 625 also keep identical, shown in Fig. 6 b.
The photomask of present embodiment manifold-neck structure-special connection configuration of fluid cavity, the design of its neck structure makes fluid cavity keep a fixed dimension, and the neck structure of this equal length, except that improving the phenomenon of disturbing, also benefits a lot of to the control flow resistance.
Embodiment 4
The constitutive characteristic of present embodiment fluid ejection apparatus is, shown in Fig. 7 b, form a neck structure 725 between fluid cavity 720 and the manifold 710, make the length (Lc) of described these fluid cavitys 720 all identical, and the length of neck structure 725 (Ln) is also all identical, and its width (Wn) increases with the distance of fluid cavity 720 away from manifold 710, the difference of present embodiment and embodiment 3 is, embodiment 3 does not set the width of neck structure 625, and the width of neck structure 725 (Wn) increases with the distance of fluid cavity 720 away from manifold 710 in the present embodiment.
The step of the manufacturing step of present embodiment fluid ejection apparatus and embodiment 3 is identical substantially, and only the figure at graphical substitutable layer forms difference to some extent, below promptly partly explains with regard to the difference of present embodiment and embodiment 3.Forming a substitutable layer after on one first of substrate, with a photomask with neck structure and fluid cavity pattern layout, shown in Fig. 7 a, this substitutable layer is exposed, after developing, promptly form a graphical substitutable layer that comprises a neck structure figure and a fluid cavity figure, the length that wherein forms the fluid cavity figure is all consistent, and the length of neck structure figure is also all identical, and the width of neck structure figure increases away from the distance that will form the manifold position future with the fluid cavity figure in addition.
After each semiconductor layer is finished deposition step, begin to carry out a series of etch process, to form final fluid ejection apparatus.Form fluid cavity 720 and neck structure 725 after the etching.Neck structure 725 is formed between fluid cavity 720 and the manifold 710, because the particular design of neck structure 725 makes the length (Lc) of described these fluid cavitys 720 all identical, and the length of neck structure 725 is also kept identical, the width of neck structure 725 increases with the distance of fluid cavity 720 away from manifold 710 in addition, Wn3＞Wn2＞Wn1 for example is shown in Fig. 7 b.
The photomask of present embodiment manifold-neck structure-special connection configuration of fluid cavity, the design of its neck structure makes fluid cavity keep a fixed dimension, and the change of neck structure width, accurately control the flow resistance of each fluid cavity, significantly improved the ink-jet quality of injection apparatus.
Though the present invention with preferred embodiment openly as above; yet it is not in order to limit the present invention; any those skilled in the art; without departing from the spirit and scope of the present invention; certainly can do to change and retouching, so protection scope of the present invention should be with being as the criterion that claims scope is defined.
Claims (18)
1. a fluid ejection apparatus comprises: a substrate; One manifold, this manifold are arranged in this substrate, with accommodating fluid; A plurality of fluid cavitys; And a plurality of spray orifices, it is characterized in that this fluid ejection apparatus also comprises:
One is formed at this suprabasil structure sheaf; And
One passage is formed between this manifold and each fluid cavity;
Wherein, described a plurality of fluid cavitys have equal length, and are formed between this substrate and this structure sheaf and with this manifold and are communicated with, to hold the fluid that will spray; And
Described a plurality of spray orifice passes this structure sheaf and is communicated with described these fluid cavitys, to spray fluid.
2. fluid ejection apparatus as claimed in claim 1 is characterized in that: described a plurality of spray orifices are different to the distance of this manifold.
3. fluid ejection apparatus as claimed in claim 1 is characterized in that: described passage comprises a neck structure.
4. fluid ejection apparatus as claimed in claim 3 is characterized in that: this neck structure is a rectangle.
5. fluid ejection apparatus as claimed in claim 3 is characterized in that: the length of described these neck structures is identical.
6. fluid ejection apparatus as claimed in claim 3 is characterized in that: the length difference of described these neck structures.
7. fluid ejection apparatus as claimed in claim 3 is characterized in that: the width of described these neck structures is identical.
8. fluid ejection apparatus as claimed in claim 3 is characterized in that: the width difference of described these neck structures.
9. fluid ejection apparatus as claimed in claim 3 is characterized in that: described these passages are identical with the width that this manifold engages.
10. fluid ejection apparatus as claimed in claim 3 is characterized in that: described these passages are different with the width that this manifold engages.
11. fluid ejection apparatus as claimed in claim 3 is characterized in that: described a plurality of spray orifices are different to the distance of this manifold.
12. fluid ejection apparatus as claimed in claim 3 is characterized in that: the width of described neck structure increases with the distance of described a plurality of fluid cavitys away from this manifold.
13. fluid ejection apparatus as claimed in claim 12 is characterized in that: this neck structure is a rectangle.
14. fluid ejection apparatus as claimed in claim 12 is characterized in that: the length of described these neck structures is identical.
15. fluid ejection apparatus as claimed in claim 12 is characterized in that: the length difference of described these neck structures.
16. fluid ejection apparatus as claimed in claim 12 is characterized in that: described these passages are identical with the width that this manifold engages.
17. fluid ejection apparatus as claimed in claim 12 is characterized in that: described these passages are different with the width that this manifold engages.
18. fluid ejection apparatus as claimed in claim 12 is characterized in that: described a plurality of spray orifices are different to the distance of this manifold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100564852A CN100446977C (en) | 2004-08-11 | 2004-08-11 | Fluid jetting device and production method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100564852A CN100446977C (en) | 2004-08-11 | 2004-08-11 | Fluid jetting device and production method thereof |
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| Publication Number | Publication Date |
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| CN1733481A CN1733481A (en) | 2006-02-15 |
| CN100446977C true CN100446977C (en) | 2008-12-31 |
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| JP7545623B2 (en) * | 2020-03-16 | 2024-09-05 | 株式会社東芝 | Ink head unit |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59199256A (en) * | 1983-04-28 | 1984-11-12 | Canon Inc | Liquid jet recording method |
| JPS62169657A (en) * | 1986-01-22 | 1987-07-25 | Canon Inc | Liquid jet recording head |
| JPS62225364A (en) * | 1986-03-27 | 1987-10-03 | Nec Corp | Printing head for ink jet printer |
| US5751317A (en) * | 1996-04-15 | 1998-05-12 | Xerox Corporation | Thermal ink-jet printhead with an optimized fluid flow channel in each ejector |
| US5757391A (en) * | 1994-07-20 | 1998-05-26 | Spectra, Inc. | High-frequency drop-on-demand ink jet system |
| US6102530A (en) * | 1998-01-23 | 2000-08-15 | Kim; Chang-Jin | Apparatus and method for using bubble as virtual valve in microinjector to eject fluid |
-
2004
- 2004-08-11 CN CNB2004100564852A patent/CN100446977C/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59199256A (en) * | 1983-04-28 | 1984-11-12 | Canon Inc | Liquid jet recording method |
| JPS62169657A (en) * | 1986-01-22 | 1987-07-25 | Canon Inc | Liquid jet recording head |
| JPS62225364A (en) * | 1986-03-27 | 1987-10-03 | Nec Corp | Printing head for ink jet printer |
| US5757391A (en) * | 1994-07-20 | 1998-05-26 | Spectra, Inc. | High-frequency drop-on-demand ink jet system |
| US5751317A (en) * | 1996-04-15 | 1998-05-12 | Xerox Corporation | Thermal ink-jet printhead with an optimized fluid flow channel in each ejector |
| US6102530A (en) * | 1998-01-23 | 2000-08-15 | Kim; Chang-Jin | Apparatus and method for using bubble as virtual valve in microinjector to eject fluid |
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| CN1733481A (en) | 2006-02-15 |
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