CN100446210C - 具有ccd传感器的硅片传输系统及传输方法 - Google Patents
具有ccd传感器的硅片传输系统及传输方法 Download PDFInfo
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- CN100446210C CN100446210C CNB2005101264385A CN200510126438A CN100446210C CN 100446210 C CN100446210 C CN 100446210C CN B2005101264385 A CNB2005101264385 A CN B2005101264385A CN 200510126438 A CN200510126438 A CN 200510126438A CN 100446210 C CN100446210 C CN 100446210C
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CNB2005101264385A CN100446210C (zh) | 2005-12-09 | 2005-12-09 | 具有ccd传感器的硅片传输系统及传输方法 |
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CNB2005101264385A CN100446210C (zh) | 2005-12-09 | 2005-12-09 | 具有ccd传感器的硅片传输系统及传输方法 |
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CN1848399A CN1848399A (zh) | 2006-10-18 |
CN100446210C true CN100446210C (zh) | 2008-12-24 |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101383311B (zh) * | 2007-09-04 | 2010-12-08 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 晶片传输系统 |
TWI534937B (zh) * | 2013-09-09 | 2016-05-21 | 政美應用股份有限公司 | 對位晶圓的總成及方法 |
WO2015101220A1 (zh) | 2013-12-31 | 2015-07-09 | 上海微电子装备有限公司 | 一种硅片预对准装置及其方法 |
CN105336654B (zh) * | 2014-07-29 | 2017-12-29 | 上海微电子装备(集团)股份有限公司 | 一种适应多种工艺类型硅片的预对准装置 |
CN103715123B (zh) * | 2013-12-31 | 2018-05-01 | 上海集成电路研发中心有限公司 | 用于半导体制造工艺中的硅片定位系统 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07193112A (ja) * | 1993-12-27 | 1995-07-28 | Hitachi Ltd | マルチ式ウエ−ハ処理装置 |
JPH07263518A (ja) * | 1994-03-18 | 1995-10-13 | Fujitsu Ltd | 半導体ウェハの搬送装置及び搬送方法並びに半導体ウェハ処理装置 |
JPH10270533A (ja) * | 1997-03-26 | 1998-10-09 | Enya Syst:Kk | ウエ−ハセンタリング装置及びそれを用いたウエ−ハ貼付装置 |
US5982492A (en) * | 1998-04-07 | 1999-11-09 | Lam Research Corporation | Method of and apparatus for determining the center of a generally circular workpiece relative to a rotation axis of the workpiece |
US6516244B1 (en) * | 2000-08-25 | 2003-02-04 | Wafermasters, Inc. | Wafer alignment system and method |
US6690986B1 (en) * | 1999-04-19 | 2004-02-10 | Applied Materials, Inc. | Method of detecting the position of a wafer |
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2005
- 2005-12-09 CN CNB2005101264385A patent/CN100446210C/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07193112A (ja) * | 1993-12-27 | 1995-07-28 | Hitachi Ltd | マルチ式ウエ−ハ処理装置 |
JPH07263518A (ja) * | 1994-03-18 | 1995-10-13 | Fujitsu Ltd | 半導体ウェハの搬送装置及び搬送方法並びに半導体ウェハ処理装置 |
JPH10270533A (ja) * | 1997-03-26 | 1998-10-09 | Enya Syst:Kk | ウエ−ハセンタリング装置及びそれを用いたウエ−ハ貼付装置 |
US5982492A (en) * | 1998-04-07 | 1999-11-09 | Lam Research Corporation | Method of and apparatus for determining the center of a generally circular workpiece relative to a rotation axis of the workpiece |
US6690986B1 (en) * | 1999-04-19 | 2004-02-10 | Applied Materials, Inc. | Method of detecting the position of a wafer |
US6516244B1 (en) * | 2000-08-25 | 2003-02-04 | Wafermasters, Inc. | Wafer alignment system and method |
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CN1848399A (zh) | 2006-10-18 |
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Address after: 100176 8 Wenchang Avenue, Beijing economic and Technological Development Zone, Beijing Patentee after: Beijing North China microelectronics equipment Co Ltd Address before: 100015 Jiuxianqiao East Road, Chaoyang District, Chaoyang District, Beijing Patentee before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |