CN100380401C - External memory device - Google Patents
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- CN100380401C CN100380401C CNB2004800001244A CN200480000124A CN100380401C CN 100380401 C CN100380401 C CN 100380401C CN B2004800001244 A CNB2004800001244 A CN B2004800001244A CN 200480000124 A CN200480000124 A CN 200480000124A CN 100380401 C CN100380401 C CN 100380401C
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Abstract
An external storage apparatus capable of preventing erroneous assembly of components for which the assembly position is decided and of suppressing the occurrence of variations in its quality is provided. An external storage apparatus including a main body 11, a memory substrate 12 having a connector 24, a substrate holder 13 for fixing the memory substrate 12 to the main body under the state that the connector 24 projects outward, a cap 14 to be attachable and detachable to and from the substrate holder 13 for protecting the connector 24, wherein erroneous assembly restricting means 38, 37, 40 and 32 are provided between the main body 11, the memory substrate 12 and the substrate holder 13.
Description
Technical field
The present invention relates to a kind of External memory equipment that can exchange or carry as external memory media.
Background technology
Usually memory device or the memory element inside that can write down and store different pieces of information or audio frequency/pictorial data etc. are installed in the apparatus casing of personal computer, or can at random be installed on the described apparatus casing and at random take off (or interchangeable) from it.
Under situation such as the external storage device that adopts the diskette unit that freely to take out etc. from described equipment, can realize connecting and taking off with an action, and with suitably corresponding to the mode of this purpose and object etc., can write down and store different data, this has the principal advantages that can arrange with direct mode.
Yet under the situation that adopts floppy disk, with respect to the record different pieces of information, not only lack reliability, the access time is also slow.And when the trend according to miniaturization, when equipment was made compactness, the surf zone of medium diminished inevitably, has reduced storage capacity, and this situation has limited the realization of the miniaturization of high power capacity.
On the other hand, when using semiconductor memory, have and to solve the existing advantage of floppy disk such as slow problem of record and storage different pieces of information reliability and access time as External memory equipment.
The Card Type equipment that Japanese patent application 2003-281490 is introduced is known as the External memory equipment of the semiconductor memory that uses association area.Yet, use described Card Type External memory equipment, the versatility of the driving arrangement that the data that store on this memory device are read and write is harmful to, and its availability is not convenient to the user.
The applicant once proposed a kind of External memory equipment (Japanese patent application 2003-281490) that uses by USB (USB (universal serial bus)) port etc. that inserts personal computer, because this External memory equipment does not require special-purpose driving arrangement, by inserting the USB port that typically is arranged on the personal computer simply, just can store and reading of data, very convenient.The structure of said external memory device is shown in Figure 58 to 60.
The External memory equipment 1 of association area is a kind of like this structure, wherein, substrate fixture 5 is used to hold the storage substrate 6 that semiconductor memory has been installed, by the synthetic resin manufacturing, and insert in the main body of making by synthetic resin 2, be exposed to the outside of main body 2 such as the external connection terminals 3 that is installed in the joint on storage substrate 6 one side.
In use, link to each other with the USB port of unshowned personal computer by external connection terminals 3, recording the information in the information that maybe will be recorded on this semiconductor memory on the semiconductor memory reads, when not in use, lid 4 by the synthetic resin manufacturing is contained on the main body 2, be used to shield dust and foul, guarantee to read exactly, record and canned data.
In addition, the applicant has applied for that also Japanese patent application puts down into 6-312593,11-354213 and 2001-160390.
The compatible External memory equipment 1 of above-mentioned USB comprises four elements, main body 2, lid 4, substrate fixture 5 and storage substrate 6, main body 2, substrate fixture 5 and storage substrate 6 are so that fixedly the all-in-one-piece mode is manufactured respectively, and lid 4 can be mounted freely on the substrate fixture 5 or from substrate fixture 5 and take off.
Existing problem is how to determine the attitude of main body 2, substrate fixture 5 and storage substrate 6 assemblings, if even when these elements assemblings in these elements the attitude of any element incorrect, all may bring deleterious effect to obtaining reliability of products.Specifically,, particularly in the type of She Ji viewpoint based on outward appearance,, be difficult to before and after the difference, in assembly manipulation, have the trend that element is installed improperly because the profile of front and back is symmetrical for such External memory equipment.
There are many different reasons to limit and shown in Figure 59, an example is that storage substrate 6 is positioned, thereby make its center line 2c deflection rear surface side with respect to main body 2 to the assembling attitude of element.Its reason provides a kind of design, makes the center line 2c height of the central axis of the external connection terminals 3 that is arranged on storage substrate 6 ends than main body 2.At this moment, when providing a kind of when preventing mechanism that storage substrate 6 and main body 2 and substrate fixture 5 rock, this mechanism is arranged on the deviation position corresponding to storage substrate 6.This makes the inner structure of main body 2 and substrate fixture 5 asymmetric along fore-and-aft direction.
Even the inner structure of element when asymmetric, still the situation that the workman can not distinguish that element is installed mistakenly may occur along fore-and-aft direction for above-mentioned reasons.When not recognizing that when finishing installation procedure element is assembled by mistake, may cause the problem relevant with product quality.For example compare with the element of correct assembling, function is incorrect, or life-span decline, causes product quality to change.
Particularly along with such External memory equipment becomes littler, it is remarkable that the problems referred to above become.
For example when this External memory equipment uses with the portable personal computer that is known as notebook type computers, the outstanding degree of USB port that is provided with from the side surface that is arranged on personal computer etc. is very big, this causes operational trouble to the user, and the situation that External memory equipment is littler is wished in existence.In the case, during each miniaturized element of assembling, the front and back of element are distinguished and are become more difficult, with the possibility increase of the opposite way round assembling.
Summary of the invention
The present invention is proposed in view of the above problems.The purpose of this invention is to provide and a kind ofly can prevent that those determine the External memory equipment that the element of assembling position is installed by mistake in the equipment, and suppress the fluctuation of its quality.
According to an aspect of the present invention, provide a kind of External memory equipment, it is characterized in that, comprising: main body; Storage substrate, semiconductor memory is installed on this storage substrate at least, splicing ear outside the one end has; The substrate fixture that has substrate insertion through hole on it, by described insertion through hole, described storage substrate is inserted into, be used to adopt following manner that described storage substrate is fixed in described main body, thereby make described outer splicing ear outwards outstanding from the opening on the end of described substrate insertion through hole, and described main body has the space, and described substrate fixture can insert in this space; The lid that can be installed on the described substrate fixture and can take off from described substrate fixture is used to protect described outer splicing ear; Wrong assembling wherein is set on described main body, described storage substrate and described substrate fixture prevents device, be used for when described storage substrate is incorrect with respect to the assembling attitude of described main body, when described storage substrate is incorrect with respect to the assembling attitude of described substrate fixture and described substrate fixture prevent assembling when incorrect with respect to the assembling attitude of described main body.
Description of drawings
Fig. 1 is a plan view according to the External memory equipment of first embodiment of the invention;
Fig. 2 is the side view of Fig. 1;
Fig. 3 is the plan view of External memory equipment 10 when lid is removed;
Fig. 4 is the side view of Fig. 2;
Fig. 5 is a skeleton view, shows main body 11 1 sides of External memory equipment 10 and the lid 14 that separates;
Fig. 6 is the decomposition view of External memory equipment 10;
Fig. 7 is the skeleton view of the rear surface 13B side of substrate fixture 13;
Fig. 8 is the skeleton view that display substrate inserts the through hole 25 of substrate fixture 13;
Fig. 9 is the front view of main body 11;
Figure 10 shows the skeleton view that covers 14 inner structures;
Figure 11 is the side viewgraph of cross-section of the essential part of External memory equipment 10;
Figure 12 is the skeleton view that shows an embodiment of External memory equipment 10;
Figure 13 is the decomposition diagram according to the External memory equipment 60 of second embodiment of the invention;
Figure 14 is the skeleton view of the substrate fixture 13 of the External memory equipment 60 seen from a distolateral opening 39;
Figure 15 is the skeleton view of the substrate fixture 13 seen from other end side opening;
Figure 16 is the front view of the main body 11 of External memory equipment 60;
Figure 17 is the viewgraph of cross-section of the essential part of External memory equipment 60;
Figure 18 is the plan view according to the External memory equipment 110 of third embodiment of the invention;
Figure 19 is the skeleton view of External memory equipment 110 when lid is removed;
Figure 20 is the viewgraph of cross-section that supports the structure of storage substrate 112 with respect to first main body 121;
Figure 21 is the side viewgraph of cross-section of External memory equipment 110;
Figure 22 is the skeleton view of the substrate fixture 113 seen from the front side;
Figure 23 is the skeleton view of the substrate fixture 113 seen from rear side;
Figure 24 is the front view of first main body 121;
Figure 25 is the skeleton view of the essential part of first main body 121 seen from rear side;
Figure 26 is a skeleton view, shows storage substrate that is in confined state 112 and the substrate fixture 113 seen from the front side;
Figure 27 is a skeleton view, shows storage substrate that is in confined state 112 and the substrate fixture 113 seen from rear side;
Figure 28 is the skeleton view that a substrate fixture 113 separates with first main body 121;
Figure 29 is a skeleton view that part is cut open, shows to be in the substrate fixture 113 of confined state and the essential part of first main body 121;
Figure 30 is the skeleton view that first main body 121 is separated with storage substrate 112;
Figure 31 is the skeleton view of storage substrate 112 rear side essential part of first main body 121 when being fixed on first main body 121;
Figure 32 is a skeleton view, shows the operation that storage card 200 is inserted External memory equipment 110 and takes out storage card 200 from External memory equipment 110;
Figure 33 is the skeleton view of second main body 122 seen from the front side;
Figure 34 is a skeleton view according to the External memory equipment 210 of fourth embodiment of the invention;
Figure 35 is one and shows and to cover 214 the skeleton views of External memory equipment 210 when being removed;
Figure 36 is the plan view of External memory equipment 210;
Figure 37 is the side view of External memory equipment 210;
Figure 38 is the decomposition diagram of External memory equipment 210;
Figure 39 is the side view of substrate fixture 213;
Figure 40 is the skeleton view of the substrate fixture 213 seen from a distolateral opening 239;
Figure 41 is the skeleton view of the substrate fixture 213 seen from other end side opening;
Figure 42 is the skeleton view that the substrate of display substrate anchor clamps 213 inserts through hole 225 structures;
Figure 43 is the viewgraph of cross-section of substrate fixture 213 and storage substrate 212 assemblings;
Figure 44 is the skeleton view that shows the essential part of the mechanism that positions with respect to 213 pairs of storage substrates 212 of substrate fixture;
Figure 45 is the skeleton view that shows the inner structure of main body 211;
Figure 46 is the front view of main body 211;
Figure 47 is the skeleton view that shows the following main part 211L inner structure of main body 211;
Figure 48 shows the plan view of the inner structure of main part 211L down;
Figure 49 shows the skeleton view of the last main part 211U inner structure of main body 211;
Figure 50 is the plan view that shows the inner structure that goes up main part 211U;
Figure 51 is the decomposition diagram that shows the assembling process of main body 211 and substrate fixture 213;
Figure 52 shows the plan view that is in the substrate fixture 213 of confined state with respect to following main part 211L;
Figure 53 is the skeleton view that a demonstration will be gone up the operation on the following main part 211L that main part 211U is assembled into combined base anchor clamps 213;
Figure 54 is the side viewgraph of cross-section of an External memory equipment 210 (not having lid);
Figure 55 is a perspective cross-sectional view that shows the essential part of the holding state of storage substrate 212 in main body 211;
Figure 56 is display substrate anchor clamps 213 and the perspective cross-sectional view of covering the essential part of the structure of coupling part between 214;
Figure 57 A and 57B are the plan views that shows the improvement example structure of External memory equipment of the present invention;
Figure 58 is the side view of conventional External memory equipment 1;
Figure 59 shows the side view that covers the conventional External memory equipment 1 that is removed;
Figure 60 is the plan view of Figure 59;
Embodiment
Hereinafter in detail embodiments of the invention are described in conjunction with the accompanying drawings.
(first embodiment)
Fig. 1 to 12 has shown the External memory equipment 10 of first embodiment of the invention.
At this, Fig. 1 is the plan view (from front surface, identical hereinafter) of External memory equipment 10, and Fig. 2 is its side view; Fig. 3 is the plan view of the lid of External memory equipment 10 when being removed, Fig. 4 is its side view, Fig. 5 is a skeleton view, main body 11 1 sides and the lid 14 that show External memory equipment 10 are in released state, Fig. 6 is the decomposition view of External memory equipment 10, Fig. 7 is the skeleton view of the rear surface side of substrate fixture 13, Fig. 8 is the skeleton view that display substrate inserts through hole 25, Fig. 9 is the front view of main body 11, Figure 10 shows the skeleton view that covers 14 inner structures, Figure 11 is the side viewgraph of cross-section of the essential part of External memory equipment 10, and Figure 12 is the skeleton view that shows an embodiment of External memory equipment 10.
The External memory equipment 10 of this embodiment mainly comprises main body 11, storage substrate 12, substrate fixture 13 and covers 14 (Fig. 6)
In Fig. 9, constitute main body 11 symmetrically, and externally leave space 15 on the surface.According to the shape of cross section of substrate fixture 13 end regions 26 hereinafter described, the opening shape in space 15 forms symmetrically with respect to the central axis 11c of main body 11.A plurality of linear restriction rib 37,38a and 38b are set on the inner wall surface in space 15.And, the bent recess that the end 11a of main body 11 and 11b have curved surface shape (Fig. 2,4 and 6).
For example the structure of storage substrate 12 comprises: be installed in having printed circuit board (PCB) 23 such as the semiconductor memory 21 of short-access storage, be arranged on joint 24 (Fig. 6) on printed circuit board (PCB) 23 face side one end such as the electronic component 22 of crystal oscillator and light emitting diode etc. and as outer splicing ear on the both sides of glass epoxy resin substrate.In this embodiment, a side of installation semiconductor memory 21 is taken as the front surface of storer substrate 12.
Joint 24 is made by the metal of for example stainless steel etc., is used to connect computing machine and peripherals, and has a plurality of inner splicing ears that are provided with.In this embodiment, joint 24 is configured to conform to USB (USB (universal serial bus)).
(Fig. 6 to 8) forms the substrate that inserts storage substrate 12 and inserts through hole 25 in substrate fixture 13.The entire length of substrate fixture 13 is shorter than the entire length of storage substrate 12, and form that (Fig. 3 to 5, Figure 11) edge 42 of the printed circuit board (PCB) 23 of joint 24 and storage substrate 12 is outstanding from the opening that substrate inserts through hole 25 when passing substrate and inserting through hole 25 when storage substrate 12 is inserted into.
Specifically, as shown in Figure 8, the position of retainer 40,40 is set, makes its central axis 39C deflection rear surface 13B with respect to opening 39 Widths of substrate fixture 13.The degree of described deflection is corresponding to the distance between the axis centre of the axis centre of joint 24 and printed circuit board (PCB) 23.
When storage substrate 12 back to front is inserted into substrate when inserting in the through hole 25, the step portion 41 of storage substrate 12 contact with retainer 40 in substrate inserts through hole 25, and contacts with the interior bottom 25a of substrate insertion through hole 25.At this moment, because joint 24 surpasses scheduled volume basically from opening 39 outstanding degree, can recognize that the workman assembles in the mode of mistake.
In the opening 39 of substrate fixture 13, be provided with a plurality of be used to support be inserted into the support sections 18 that described substrate inserts the joint 24 of the storage substrate 12 in the through hole 25, by these support sections 18 inhibition by acting on external force effect lower sub 24 on joint 24 thickness directions with respect to the inclination of opening 39.
Side on the end regions 26 of the substrate fixture 13 that cooperates with the insertion space 15 of main body 11 is provided with a plurality of linear ribs 28,29a and 29b (Fig. 6,7 and Figure 11), is used for keeping equably when it inserts space 15 clearance G with the inner wall surface 30 in space 15.Along the direction of insertion of substrate fixture 13, linear rib 28,29a and 29b are set corresponding to space 15.
Certainly, linear rib 28 is arranged on the surperficial 13A of substrate fixture 13, and the rear surface 13B that linear rib 29a and 29b are arranged on substrate fixture 13 goes up (Fig. 6, Fig. 7).
Specifically, as shown in Figure 9, the position of the restriction rib 37 that forms on corresponding to wall surface at the linear rib 28 on the 13A of substrate fixture surface in the 11B inboard, rear surface in the space 15 of main body 11.As shown in Figure 9, at the linear rib 29a on the 13B of the rear surface of substrate fixture 13 and 29b corresponding to formation restriction rib 38a on the inner wall surface in the surperficial 11A side in the space 15 of main body 11 and the position of 38b.
In this embodiment, the height of linear rib 28,29a and 29b is identical with the height of restriction rib 37,38a and 38b, for example is set at 0.03 to 0.07 millimeter.
As shown in Figure 9, on the bottom in the space 15 of the main body 11 of the end regions 26 that will insert assembled base plate clamp 13, a plurality of welding muscle 31 are set.These welding muscle are arranged on 8 relative positions corresponding to face of weld 27 diffusedly, thereby contact (with reference to figure 7 and 8) with the face of weld 27 of the end regions 26 of substrate fixture 13.
On position, be provided with the maintenance groove 32 (with reference to figure 9 and 11) of roughly V-arrangement of supporting the fringe region 42 of described storage substrate 12 by clamping in the face of another ora terminalis 42 of storage substrate 12 (edges on printed circuit board (PCB) 23 and joint 24 opposite sides).The open side end 43 that keeps groove 32 is by R operation (R-processing) processing.Guarantee this storage substrate 12 of easier propelling.
With respect to a pair of rib 44,44 that is formed on 15 bottoms, space, maintenance groove 32 forms mortar shape (mortar) as shown in figure 11, thereby extend at horizontal direction, to form the shape that diminishes gradually along the direction of propulsion gap of storage substrate 12 marginal portions 42 with the marginal portion 42 of storage substrate 12.Simultaneously, the face of weld 27 of substrate fixture 13 is fixed on the bottom in space 15 by welding muscle 31, in the bottom of described maintenance groove 32 and be clamped between storage substrate 12 marginal portions 42 that keep groove 32 and keep groove 32 bottoms and form predetermined gap D (Figure 11).
At this, carry out formation storage substrates 12 such as punch process by the working pressure machine, but because the wearing and tearing of drift and mould, shape of cross section gradually changes, poor dimensional precision, and in the present embodiment, storage substrate 12 size fluctuation on vertically roughly is ± 0.1 millimeter.And, welding muscle 31 on main body 11 sides with respect to the fluctuation of the depth of weld of the face of weld 27 of substrate fixture 13 roughly be ± 0.05 millimeter, and main body 11 and constitute fluctuation on substrate fixture 13 sizes of casting element and roughly be ± 0.05 millimeter, thereby total size fluctuation is ± 0.25 millimeter or bigger.
In the present embodiment, the maintenance groove 32 by said structure has absorbed size fluctuation.Thereby if the size of clearance D is set at for example 0.5 millimeter under the situation that size does not fluctuate, so the size fluctuation size changes between 0.25 to 0.75 millimeter.
With reference to Figure 11, exactly the gap size that produces in the bottom of the maintenance groove 32 that forms mortar shape form littler than the thickness t of storage substrate 12, thereby as shown in the figure, along with the clamping that keeps groove 32, storage substrate 12 is supported under state of plastic deformation.Even storage substrate 12 is subjected to the influence of size fluctuation with respect to keeping groove 32 to adopt shallow mode to advance, storage substrate 12 causes keeping groove 32 to stand plastic yield, thereby supported by clamping.
As shown in Figure 9, keep groove 32 to be formed on the position of being partial to rear surface 11B side with respect to the axis centre of main body 11.The deflection degree is corresponding to the distance between the axis centre of the printed circuit board (PCB) of the axis centre of joint 24 and storage substrate 12.
Therefore, when storage substrate 12 back to front inserted in the space 15 of main body 11, the marginal portion 42 of storage substrate 12 contacted with the top of rib 44.At this moment, because be held result's the propelling of storage substrate 12 in space 15 of groove 32 clampings as the marginal portion 42 of storage substrate 12 restricted, the workman can find loading error.
Even this wrong assembling is left in the basket, because storage substrate 12 can not advance in keeping groove 32, the face of weld 27 of substrate fixture 13 can not arrive the bottom in space 15.As a result, may cause the weld defects of main body 11 and substrate fixture 13, can not make the product of wrong assembling.
Hereinbefore, constituted " device is prevented in the mistake assembling " of the present invention, if storage substrate 12 is incorrect with respect to the assembling attitude of main body 11, described wrong assembling prevents device to prevent this assembling.
Hereinafter introduce and cover 14 structure, when not using External memory equipment 10, load onto described lid 14 and prevent that joint 24 from suffering damage and avoid it to be stained with dust.
The space 16 that in lid 14, is formed for holding substrate fixture 13.As shown in figure 11, corresponding to the shape of main body 11 outer surfaces, space 16 provides unlimited inward flange 17, and the hermetic unit of sealed body neighboring closely when being equipped with on being assembled to substrate fixture 13, thereby prevents the intrusion of dust and foul.
Though in Figure 10, only shown a side, thereby the guiding rib 19 that is used for the side at substrate fixture and partly provides smooth connection pilot cap 14 to install and take off is set at a left side and the right side in space 16.
And, intermeshing first and second engagement projections 35 and 36 are arranged on the inside surface of the surperficial 13A of substrate fixture and rear surface 13B and cover on 14 the surperficial 14A and rear surface 14B, so that be installed on the substrate fixture 13 and when taking off from it will covering 14, the sensation of snap is provided, and (Fig. 3 is to Fig. 6, Figure 10, Figure 11).In the present embodiment, first and second engagement projections 35 and 36 are separately positioned on two positions.
The through hole 45 that is used to belt is passed be formed on cover 14 end (Fig. 5, Fig. 6).Through hole 45 is formed by being formed on the groove 46 that covers 14 ends and the bridging part 47 of the described groove 46 of bridge joint.Use bridging part 47, can belt is fastening.
Hereinafter will the assembly method that adopt the External memory equipment of the present invention 10 that aforesaid way constitutes be described.
At first as shown in Figure 6, after facing with each other along the surface that makes storage substrate 12 and substrate fixture 13 on the equidirectional with correct assembling attitude, along direction shown in the arrow A, the substrate that storage substrate 12 is inserted substrate fixture 13 inserts in the through hole 25.When the joint 24 of storage substrate 12 passed substrate and inserts opening 39 1 scheduled volumes of through hole 25, the step portion 41 of storage substrate 12 contact with retainer 40 in substrate inserts through hole 25, thereby, limit storage substrate 12 forward above this point.
Then, the surperficial 11A that holds the surperficial 13A of substrate fixture 13 of storage substrate 12 and main body 11 be arranged in above the equidirectional that has correct assembling attitude right.Then, substrate fixture 13 is inserted in the space 15 of main body 11, use the supersonic welding connection technology, the face of weld 27 of welding substrate fixture 13 and the welding muscle 31 of 15 bottoms, space.Thereby substrate fixture 13 and main body 11 are fixed together and joint 24 is outwards outstanding from the opening 39 that substrate inserts through hole 25.
At this moment, substrate fixture is correct with respect to the assembling attitude of main body 11, does not contact between linear rib 28,29a and 29b and restriction rib 37,38a and the 38b, and the propelling of substrate fixture 13 in the space 15 of main body 11 is unrestricted.
At this moment, the marginal portion 42 of the other end of storage substrate 12 is kept clampingly by the maintenance groove 32 on 15 bottoms, space that are arranged on main body 11.Because described maintenance groove 32 roughly is a V-arrangement, even fluctuation (printed circuit board (PCB) self size fluctuation, ultrasonic soldering condition self fluctuation etc.) on the storage substrate advance distance, occurs, keep the plastic yield degree of groove 32 correspondingly to change, thereby, absorb described fluctuation.Thereby the substrate that storage substrate 12 can be positioned at substrate fixture 13 reliably inserts between the retainer 40 and the maintenance groove 32 in the main body 11 of through hole 25.
Therefore, when carrying (carrying) External memory equipment 10, prevented that storage substrate 12 from sending the sound of card card, and the user need not worry about or produces unhappiness to functional.And the connection material (solder flux) that can prevent the substrate installation elements that the vibration by when welding causes comes off, prevent injury such as precision electronic elements such as semiconductor memory 21 and crystal oscillators, can guarantee record/storage different types of data and/function of sound/image.
Make main body 11 then and face with each other with the integrated lid 14 of substrate fixture 13.At this moment, on both assembling attitudes without limits.Slip effect by between the side surface of guiding rib 19 and substrate fixture 13 then, substrate fixture 13 are contained in covers in 14 the space 16, is installed on the substrate fixture 13 so that will cover 14.
When lid 14 sliding lengths with respect to substrate fixture 13 reach scheduled volume, 35,36 engagements of first and second engagement projections.Just, first engagement projections 35 on substrate fixture 13 sides rides over second engagement projections, 36 tops, thereby, promote to cover 14 outside, so that it becomes more roomy, first and second engagement projections 35,36 are engaged with each other as illustrated in fig. 11.Thereby, finish lid 14 operations that are installed on the substrate fixture 13.
According to External memory equipment 10 of the present invention, assemble with wrong (incorrect) assembling attitude even attempt, just substrate fixture 13 adopts the wrong way assembling with respect to main body 11, restriction rib 38a and 38b on restriction rib 37 on linear rib 28 on substrate fixture 13 sides and main body 11 sides, the linear rib 29a on substrate fixture 13 sides and 29b and main body 11 sides contact with each other, and can prevent from substrate fixture 13 is installed on the main body 11.
And, even, can suppose that also the assembling attitude between substrate fixture 13 and the storage substrate 12 is incorrect when the assembling attitude between main body 11 and the substrate fixture 13 when being correct.At this moment, rib 44 that can usage space 15 bottoms is prevented the propelling of storage substrate 12 to main body 11, can avoid storage substrate 12 to be installed in mistakenly on the main body 11.
Thereby, prevented the mistake assembling of element, prevented to descend and the product quality fluctuation owing to the product quality that wrong assembling causes.Utilize this structure, significant especially result is that External memory equipment 10 sizes of this embodiment its little (Figure 23) than the External memory equipment 1 of correlation technique can prevent small by element and mistake assembling that cause, the increase reliability of products reliably.
Along with diminishing of element, there is a kind of trend that makes lid become difficult from the charge and discharge operations on the main body (substrate fixture).But, according to present embodiment, owing on end 11a and 11b about main body 11, form the flexure plane of depression, and on the preceding and rear surface 14A of lid 14 and 14B, waveform finger grip 34A and 34B are set, can suppress to cover the decline of 14 loading and unloading simplicity.
And, because elements small is worried owing to the minimizing that has reduced the face of weld zone between main body and the substrate fixture causes the strength of joint deficiency.Yet, according to present embodiment.Not only between the face of weld 27 of substrate fixture 13 and the welding muscle 31 in the main body 11, weld, and constitute among linear rib 28,29a and the 29b at least a portion among restriction rib 37,38a and the 38b of " restricted part " of the present invention or substrate fixture 13 sides at least a portion can be as the welding muscle, thereby prevent the decline of strength of joint.
And, the linear rib 28 on substrate fixture 13 sides, 29a and 29 be formed one on the surperficial 13A of substrate fixture 13 and two on the 13B of rear surface.The quantity of formed linear rib can be by the visual affirmation front and back that are used for.When the surperficial 13A of substrate fixture 13 and rear surface 13B spray paint with different paints or print, before and after can distinguishing effectively, improve operability.
Figure 12 has shown that the External memory equipment 10 with said structure is applied in an example on the auxiliary clamp 50 that is equipped with the USB cable expanded function, and described anchor clamps are known as " carriage (cradle) ".
By using this auxiliary clamp 50, externally do not provide between memory device 10 and the personal computer under the direct-connected prerequisite, use External memory equipment 10 and personal computer.
(second embodiment)
Figure 13 to 17 has shown second embodiment of the invention.In the accompanying drawings, represent with identical Reference numeral, and omission is to its description corresponding to the position of above-mentioned first embodiment.
The same with the External memory equipment 10 of above-mentioned first embodiment, the External memory equipment 60 of this embodiment comprises main body 11, storage substrate 12, substrate fixture 13 and covers 14.Storage substrate 12 is made up of the printed circuit board (PCB) that semiconductor memory 21 grades are installed, and joint 24 is as external connector terminal (Figure 13).
Especially, in this embodiment, printed circuit board (PCB) 23 width of comparing formation with above-mentioned first embodiment are wideer.
On the other hand, the substrate at substrate fixture 13 inserts on the left side and right lateral surface of through hole 25 formation and the left side of the printed circuit board (PCB) 23 of storage substrate 12 and the targeting part 61,61 (Figure 14 and 15) of right hand edge engagement.Targeting part 61,61 is formed the linear groove that forms on the position with respect to the described reverse side 13B of the central axis 39C (Figure 15) on substrate fixture 13 1 end openings 39 Widths deflection.The deflection degree is corresponding to the distance between the axial centre of the axis centre of joint 24 and printed circuit board (PCB) 23.
Under storage substrate 12 with respect to the assembling attitude of substrate fixture 13 was correct situation, targeting part 61,61 had the function that guiding storage substrate 12 advances to substrate fixture 13.Therefore, even storage substrate back to front inserts substrate when inserting in the through hole 25, because storage substrate 12 can not mesh with targeting part 61,61, the workman can distinguish loading error.
Widely form the openend of targeting part 61,61 relatively, and guarantee that storage substrate 12 assembles easily.On the other hand, targeting part 61,61 formed width narrow down gradually, and the step portion 41 (Figure 13) of printed circuit board (PCB) 23 contacts with blind end 62, thereby prevent storage substrate 12 to continue to advance.Thereby joint 24 is restricted from the projecting degree of the opening 39 of substrate fixture 13 1 ends.
In this embodiment, by pressing joint 24 is assembled on the opening 39, for example, the size of employed pressing pressure is for for example being guaranteed to finish the pressure of this assembling by workman's manual operations.Thereby when adopting correct mode to be assembled in storage substrate 12 on the substrate fixture 13, owing to the stitching operation of joint 24 with respect to opening 39, storage substrate 12 and substrate fixture 13 become one.
At a plurality of positions of opening 39 inward flanges, be formed for the support section 18 (in this embodiment, on top and bottom three) of the outer surface of supported joint 24, tilt with respect to opening 39 with limiting joint 24.These support sections 18 are formed linear (draft angle 0), thereby closely cooperate the outer surface of joint 24.
On the other hand, the marginal portion 42 on the other end side of storage substrate 12 is formed on the bottom in the space 15 of main body 11, thereby is advanced to the groove 64,64 (Figure 16 and 17) of the rib 44 that constitutes " device is prevented in the mistake assembling " of the present invention.The step portion 63 (Figure 13) that is formed on 42 corners, marginal portion constitutes " breach ", prevents to conflict with the step portion 65 of the bottom in the space 15 that is formed on main body 11 and the position that forms between the surface of welding muscle 31.
Identical with the maintenance groove 32 that has among above-mentioned first embodiment, be provided with described groove 64,64 to such an extent that more move to rear surface 11B one lateral deviation than the axis centre of main body 11, and constitute the V-arrangement that has roughly, but do not support the marginal portion 42 of storage substrate 12 by clamping.
As shown in figure 17, equally form the groove width T of groove 32 bottoms with the thickness of printed circuit board (PCB) 23.After substrate fixture 13 and main body 11 are soldered, between the bottom of the marginal portion 42 of storage substrate 12 and groove 32, form fixed interval (FI) (spacing) D1.Do not limit the size of D1 especially, but be roughly 0.1 millimeter in this embodiment.
Thereby, can allow storage substrate 12 length since being heated in use to a certain degree changing, thereby guarantee to alleviate the stress of storage substrate 12.And, because by pressing, joint 24 is supported by the opening 39 of substrate fixture 13 1 ends, not vibration of storage substrate 12.When external force acts on the joint 24,, can alleviate the stress of storage substrate 12 owing in the well width of the targeting part 61,61 of substrate fixture 13, allow the curved transition of storage substrate 12.Can prevent from the infringement that is installed in the substrate on the element and the destruction of coupling part are realized being recorded the protection of information.
When on the USB port that joint 24 is connected to computing machine etc., storage substrate 12 can to-and-fro movement in clearance D 1 scope, yet clearance D 1 is very little, and roughly 0.1 millimeter, because the pressing of joint 24 and opening 39 and realize above-mentioned to-and-fro movement by slip.Factitious sensation between the vibration of storage substrate 12 and dismounting and installation period can not passed to the user during operation.
(the 3rd embodiment)
Figure 18 to 33 has shown the External memory equipment of third embodiment of the invention.
Figure 18 is the plan view of External memory equipment 110; Figure 19 shows the skeleton view of External memory equipment 110 when lid 114 is removed; Figure 20 shows the viewgraph of cross-section that supports the structure of storage substrate 112 with respect to first main body 121; Figure 21 is the side viewgraph of cross-section of External memory equipment 110; Figure 22 is the skeleton view of the substrate fixture 113 seen from the front side; Figure 23 is the skeleton view of the substrate fixture 113 seen from rear side, and Figure 24 is the front view of first main body 121; Figure 25 is the skeleton view of the essential part of first main body 121 seen from rear side; Figure 26 is a skeleton view, shows storage substrate that is in confined state 112 and the substrate fixture 113 seen from the front side; Figure 27 is a skeleton view, shows storage substrate that is in confined state 112 and the substrate fixture 113 seen from rear side; Figure 28 is the skeleton view that display substrate anchor clamps 113 separate with first main body 121; Figure 29 is a skeleton view that part is cut open, shows to be in the substrate fixture 113 of confined state and the essential part of first main body 121; Figure 30 is a skeleton view that shows that first main body 121 is separated with storage substrate 112; Figure 31 is the skeleton view of the rear side essential part of one first main body 121, and wherein, storage substrate 112 is fixed on first main body 121; Figure 32 is a skeleton view, shows the operation that storage card 200 is inserted External memory equipment 110 and dismantles storage cards 200 from External memory equipment 110; Figure 33 is the skeleton view of second main body 122 seen from the front side of a demonstration.
The External memory equipment 110 of this embodiment is mainly by main body 111, storage substrate 112, substrate fixture 113 with cover 114 and form, and main body 111 is formed (Figure 18 to 21) by first main body 121 and second main body 122.
And, around the periphery formation flange 127 (Figure 20,22, Figure 23, Figure 26 to 29) in substrate fixture 113 centres.With flange 127 constitute by ultrasonic soldering with the open end 117 of first main body 121 become one the welding muscle (Figure 20, Figure 29).
On the preceding and rear surface of first main body 121 and lid 114 formation cut open part 121s and 114s with the surface portion of substrate fixture 113 be exposed to the outside, can be thereby form from window (Figure 18, Figure 19, Figure 24 of visual observation storage substrate 112, Figure 28, Figure 30).First engagement projections 130 (Figure 19, Figure 22, Figure 23, Figure 26 to 29) is set on a plurality of positions on substrate fixture 113 outside surfaces.The second engagement projections (not shown) corresponding with first engagement projections 130 is set on lid 114 inside surface.When mounted substrate anchor clamps 113 and lid 114, first and second engagement projections are engaged with each other.
The mechanism that is used for respect to first main body, 121 location storage substrates 112 is described below.
Along direction shown in the arrow E among Figure 20 the substrate that storage substrate 112 inserts substrate fixture 113 is inserted through hole 125.At this moment, on the direction of insertion of storage substrate 112, be positioned at the opening 135 outstanding scheduled volumes (Figure 20, Figure 26 and 27) of the joint 124 of front end from substrate fixture 113 1 ends.The step portion 137 that on the periphery of storage substrate 112, is provided with, by its with the contacting of flange 127 of substrate fixture 113 limiting joint 124 with respect to opening 135 projecting degrees (Figure 20, Figure 27).
Go up in the rear surface (in the face of the surface on step portion 137 1 sides of storage substrate 112) of the flange 127 of substrate fixture 113 and to form protuberate 131.Protuberate 131 is formed on such position, thereby, if storage substrate 112 during with respect to the assembly direction of substrate fixture 113 correct (Figure 27), then contacts with step portion 137, when if assembly direction is incorrect (fore-and-aft direction is put upside down), then do not contact with step portion 137.
On the other hand, thus be arranged on the inside surface of first main body 121 (Figure 24 and Figure 30) with gathering sill 119,119 that the periphery sliding contact guiding storage substrate 112 that is contained in the storage substrate 112 in the substrate fixture 113 advances.On near the rib the open end 117 that is formed at first main body 121 144,144, form gathering sill 119, and its be formed on from the central axis 121C of first main body 121 to rear surface 121B one lateral deviation from the position on, departure degree is corresponding to the axis centre of joint 124 and the distance between printed circuit board (PCB) 123 axis centre.
When storage substrate 112 back to front is installed on first main body 121, another ora terminalis of storage substrate 112 (with the end on the joint 124 1 side opposition sides) 142 contacts with rib 144, thereby, the propelling of storage substrate 112 in first main body 121 is restricted, so the workman can distinguish setup error.
As mentioned above, if constituted " device is prevented in the mistake assembling " of the present invention of preventing described assembling when storage substrate 112 is incorrect with respect to the assembling attitude of first main body 121.
And in this embodiment, asymmetric by the mating surface that makes the substrate fixture 113 and first main body 121 respectively, substrate fixture 113 is restricted with respect to the assembly direction of first main body 121.
More particularly, in the paired rib 144 of first main body 121 at least one rib, on the initiating terminal of this gathering sill 119, form mating part (gap) 129 (Figure 24, Figure 29), only make on the side of flange 127 rear surfaces of substrate fixture 113 outstanding and the projection that forms 128 cooperate with it.The well width (for example about 0.5 millimeter) of the initiating terminal by widening a gathering sill 119 forms mating part 129.Thereby, as shown in figure 28, when first main body 121 that the surperficial 113A that makes substrate fixture 113 up makes progress with respect to surperficial 121A, can insert connection, and when surperficial 113A is downward, can not insert connection.
In this embodiment, the rib 144 that is not provided with on mating part 129 1 sides has constituted " restricted part " of the present invention.
When storage substrate 121 is under the correct attitude assembling storage substrate 112 with respect to first main body 121, obtain guide function by above-mentioned gathering sill 119, thereby storage substrate 112 and substrate fixture 113 are inserted in the space 115 of first main body 121 to storage substrate 121.By before the cutting part 121s open and be formed on substrate fixture 113 of first main body 121 and the slip effect between the ridge part 113s on the rear surface, obtained the guiding mechanism (Figure 28) of substrate fixture 113 with respect to first main body 121.
Be used to keep first retaining part 132 of storage substrate 112 marginal portions 142 to be arranged on the rear end (Figure 25,31) of gathering sill 119.First retaining part 132 for example is made up of the groove that is roughly V-arrangement, has identical structure with the described maintenance groove 32 of above-mentioned first embodiment.When between the open end 117 of the flange 1 27 of substrate fixture 113 and first main body 121, carrying out ultrasonic soldering, along with the propelling of storage substrate 112, clamping (Figure 31) is carried out in first retaining part 132 marginal portion 142 to storage substrate 112 under the state of plastic yield.Thereby, absorb the size fluctuation on first main body, 121 length directions.Specifically, in this embodiment, the side of storage substrate 112 contacts with gathering sill 119, thereby the whole periphery of storage substrate 112 is supported on first main body 121 and the substrate fixture 113.
When the welding substrate fixture 113 and first main body 121, the opening 136 (Figure 21,24) on second retained part, 133, the 133 clamping substrate fixture other ends that cutting open of first main body 121 forms on part 121s, the 121s end.
Hereinafter introduce the structure of second main body 122.
Second main body 122 is assembled with respect to first main body 121, thus the opening 118 on the covering rear end (Figure 24, Figure 25, Figure 31).On second main body 122, be formed for the groove 150 of the storage card 200 that inserts and take off, simultaneously at the contiguous stayed surface 151 that is provided for supporting the lower face side of storage card 200 of described groove 150.
As the result with this storage card 200, the information recording capacity of the External memory equipment 110 of this embodiment can increase significantly.In addition, although on the one hand such storage card 200 requires special-purpose driving arrangement, External memory equipment 110 can be by linking to each other with standard USB port on the personal computer and used simply, so it has very high dirigibility.Even therefore computing machine is not used in the special purpose driver of storage card 200, also can use storage card 200 by External memory equipment 110, enlarged the range of application of External memory equipment 110.
Have the External memory equipment 110 of the above-mentioned primary structure that this embodiment adopts, the main body of being made up of first main body 121 and second main body 122 111 is difficult to by once mold formed.Therefore they form as individual component, and then link together.Usually when connecting the synthetic resin injection molded article, use ultrasonic soldering, can obtain the solid connection of high reliability with low cost.But, but can not adopt in this example owing to following reason.
As shown in the figure, the outer surface of second main body 122 is curved surfaces, for this reason, must make wave welding head of ultrasonic wave separately.And, if manufacturing corresponding to the soldering tip of second main body, 122 profiles, is difficult to implement uniform ultrasonic vibration on whole second main body, 122 pressed surfaces, and cause applying a large amount of local vibration strength.At this moment, for example, the outside surface of second main body 122 stands matt the processing, owing to adopt inhomogeneous mode to apply ultrasonic vibration, the gloss that is known as " gloss (sheen) " partly appears on the outside surface of product, impairs presentation quality.
In the present embodiment, use to embed to connect, finish being connected of first main body 121 and second main body 122.Can under the prerequisite of not damaging presentation quality, second main body 122 be connected on first main body 121 like this.
Specifically, as shown in figure 33,, form engaged claw 152A, 152A, 152B, 152B, 152S, 152S at surperficial 122A, rear surface 122B and on groove 150 left side and right side on every side of second main body, 122 inside.It is more side-prominent to first main body 121 that these pawls compare the mating surface 153 that forms corresponding to the open end 118 of first main body 121.
Specifically, mate 162S, 162S are arranged on from the axis 121C vertical with the central axis of first main body 121 on the position that surperficial 121A one lateral deviation is moved (Figure 24), and are formed on the position corresponding with engaged claw 152S, 152S.
When being that identical correct assembling attitude is when assembling second main body 122 at fore-and-aft direction with respect to first main body 121, each and mate 162A, 162B, 162S engagement among engaged claw 152A, 152B, the 152S, thereby the connection status that keeps the mating surface 153 of second main body 122 to contact with the open end 118 of first main body 121.
On the other hand, when with respect to first main body 121 for when the incorrect assembling attitude of face is assembled second main body 122, engaged claw 152S, 152S contact with the open end 118 of first main body 121, the propelling in first main body 121 is prevented.Thereby, prevent that second main body 122 is installed on first main body 121 mistakenly, can guarantee correct installment state, realize the groove 150 of second main body 122 and for the face-to-face relation between the clamping in first main body, used 120.
In this example, open end 118 constitutes " obstacle part (wall section) " of the present invention.
According to this embodiment, as above-mentioned first embodiment, can prevent storage substrate 112 with respect to main body 111 mistake installations, can prevent because quality decline that wrong installation causes and the quality fluctuation between the product.
Under the situation of using dissimilar recording mediums, need different special purpose interfaces usually.Yet, for example on an independent terminal, the polytype interface is set and has the restriction that makes equipment can become excessive.And there is a restriction of the high recording capacity of recording medium of fixed measure.
The External memory equipment 110 of present embodiment is equipped with such as a plurality of different codes and standards of USB port joint 124 with the joint 120 that is used for storage card 200 uses, thereby provides compatible to connected recording medium.Therefore need not provide than the necessary more interface of terminal, can increase the adaptability of recording medium, improve usability.
And the joint 120 that is used to the card use is installed in public storage substrate 112, can reduce number of elements, makes the entire equipment profile littler, helps microminiaturization.
Storage card is installed in the direction that direction and the direction of taking off from it on the joint 120 that card uses load onto and take off with joint 124 on USB port identical.When using External memory equipment 110, can alleviate the relevant operation burden of loading onto or taking off storage card 200 that is positioned on the position that is used for jointing 124 and USB port.Face in an opposite direction owing to be used for the connection opening of the joint 120 of joint 124 and card use, can improve operation.
(the 4th embodiment)
Figure 34 has shown the External memory equipment 210 of fourth embodiment of the invention to Figure 57 A and 57B.
Figure 34 is the overall perspective of an External memory equipment 210; Figure 35 is one and shows the skeleton view cover 214 External memory equipments 210 when being removed; Figure 36 is the plan view of External memory equipment 210; Figure 37 is the side view of External memory equipment 210; Figure 38 is the decomposition diagram of External memory equipment 210;
Figure 39 is the side view of substrate fixture 213; Figure 40 is the skeleton view of seeing from substrate fixture 213 1 distolateral openings 239; Figure 41 is the skeleton view of seeing from substrate fixture 213 other end side openings 239; Figure 42 is the skeleton view that the substrate of display substrate anchor clamps 213 inserts the structure of through hole 225; Figure 43 is the side viewgraph of cross-section of substrate fixture 213 and storage substrate 212 assemblings; Figure 44 is the perspective cross-sectional view of the essential part of the mechanism that positions with respect to 213 pairs of storage substrates of substrate fixture.
Figure 45 is the skeleton view that shows the inner structure of main body 211; Figure 46 is the front view of main body 211; Figure 47 is the skeleton view that shows the following main part 211L inner structure of main body 211; Figure 48 shows the plan view of the inner structure of main part 211L down; Figure 49 shows the skeleton view of the last main part 211U inner structure of main body 211; Figure 50 is the plan view that shows the inner structure that goes up main part 211U.
Figure 51 is the decomposition diagram that shows the assembling process of main body 211 and substrate fixture 213; Figure 52 is the plan view that shows with respect to the substrate fixture 213 of following main part 211L confined state; Figure 53 is that a demonstration will be gone up the skeleton view that main part 211U is assembled to down the last operation of main part 211L, and this moment, substrate fixture 213 was combined in down on the main part 211L; Figure 54 is the side viewgraph of cross-section (not lid) of an External memory equipment 210; Figure 55 is a perspective cross-sectional view that is illustrated in the support modes of first main body, 211 stored substrates 212; And Figure 56 is a substrate fixture 213 of expression and the perspective cross-sectional view of covering the essential part of the structure of coupling part between 214.
The External memory equipment 210 of this embodiment is mainly by housing 211, storage substrate 212, substrate fixture 213 with cover 214 and form (Figure 34 to 38).Main body 211 and lid 214 are made up of (preceding and back) about being divided into two parts.
On the other hand, substrate fixture 213 for example utilizes injection molding to be formed by the colourful transparent polycarbonate resin.In this embodiment, substrate fixture 213 is in the roughly symmetrical shape of the formation in appearance of fore-and-aft direction (top is to the bottom).Form circular projection 226A and 226B highlightedly from the preceding of substrate fixture 213 and approximate centre position, rear surface.The outside surface of circular projection 226A and 226B is the curved surface of recessed shape, and has the window of guaranteeing to see from the outside inside of storage substrate 212.On each open end of main body 211 and lid 214, form circular arc otch 211s, 214s (Figure 34 to 36) respectively with circular projection 226A and the engagement of 226B outer surface.
Near circular projection 226A and 226B on the preceding and rear surface of substrate fixture 213, form engagement projections 227A and 227B, when mounting cover 214, its be formed on cover 214 openings up and down the engagement recessed portion 217 on the inward flange mesh (Figure 56).
Substrate forms and inserts through hole 225 (Figure 38, Figure 40 is to Figure 43) in substrate fixture 213, inserts through hole 225 by substrate, inserts storage substrate 212.The entire length of substrate fixture 213 is shorter than the entire length of the storage substrate 212 that comprises joint 224, and form when storage substrate 212 and be inserted into substrate when inserting in the through hole 225, make the rear end of the printed circuit board (PCB) 223 of joint 224 and storage substrate 212 give prominence to (Figure 43) from the opening that substrate inserts through hole 225 respectively.
Insert at substrate and to form targeting part 228,228 on the left side of through hole 225 and the right lateral surface surface (Figure 41, Figure 42), the left side of the printed circuit board (PCB) 223 of storage substrate 212 and right hand edge mesh with described targeting part 228,228.Targeting part 228,228 forms linear groove, and described groove forms the position of deflection rear surface side with respect to the central axis 230C (Figure 42) on open end 230 Widths of substrate fixture 213 substrate inserting sides.Described deflection degree is corresponding to the distance between the axis centre of the axis centre of joint 224 and printed circuit board (PCB) 223.
When storage substrate 212 with respect to substrate fixture 213 was correct installation attitude, targeting part 228 had the function to substrate fixture 213 guiding storage substrates 212.Therefore, insert in the through hole 225 if back to front storage substrate 212 is inserted substrate, because storage substrate 212 and targeting part 228 can not mesh or be difficult to engagement, the workman can find loading error.
Widely form the open end of targeting part 228,228 relatively, and be easy to guarantee the assembling of storage substrate 212.On the other hand, inserting towards substrate on through hole 225 1 end openings 239 1 sides, on width, form targeting part 228,228 gradually with narrowing down, make the step portion 240 (Figure 38) of printed circuit board (PCB) 223 contact (Figure 42) with blind end 229, thereby, prevent storage substrate 212 further to advance (Figure 44).Thereby joint 224 is restricted from substrate fixture 213 1 end openings 230 outstanding degree.
In this embodiment, to opening 239, the selected pressure that is used for pressing for example, can be the amount of being guaranteed by workman's manual operation to assemble to joint 224 by press fit arrangement.Thereby after the correct mode of employing was assembled into storage substrate 212 on the substrate fixture 213, owing to the stitching operation of joint 224 with respect to opening 239, storage substrate 212 and substrate fixture 213 became one.
Be formed for the ribs 218 (in this embodiment, three in top and bottom) of the outer surface of supported joint 224 (Figure 40, Figure 42), thereby limiting joint 224 tilts with respect to opening 239 at a plurality of positions of opening 239 inward flanges.These ribs 218 form straight shape (draft angle 0), thereby closely cooperate (Figure 43) with the outer surface of joint 224.
In Figure 39, forming the projection 226A of substrate fixture 213 and the right side area at 226B position is the installation region 231 that is used to install main body 211.This installation region 231 is clamped between the last main body 211U and following main body 211L that constitutes main body 211, and is welded on the inside surface of main body 211U and following main body 211L (Figure 54).
As mentioned above, main body 211 is formed (Figure 45) by last main body 211U and following main body 211L.The space 215 of main body 211 is by the clamping retaining part 232 of the mounting portion 231 that is used for clamping substrate fixture 213 and be used for clamping and form from the chip holding part 233 of the outstanding storage substrate 212 of substrate fixture 213.
On clamping retaining part 232, have the recessed portion 235U and the 235L that are meshed with the connection rib 234 (Figure 39 is to Figure 42) in 231 bights, mounting portion that are formed on substrate fixture 213; The first positioning rib 241U, the 241L that are used for the 231 front end 231a positions, mounting portion of definite substrate fixture 213; Be used for determining 231b position, 231 rear end, mounting portion the second positioning rib 242U, (Figure 47 is to Figure 50, Figure 52) for 242L.In recessed portion 235U and 235L, form a plurality of pyramidal projections 235p that are used for ultrasonic soldering.
Preceding and the rear surface of the mounting portion 231 of substrate fixture 213 is the surface 243 (Figure 39 is to Figure 41) of part embossing (coarse), thereby, can make these surfaces and the inner surface additional of last main body 211U that faces with it and following main body 211L put forth effort higher.If facing the last main body 211U of embossed surface 243 and the inside surface of following main body 211L is same embossed surface, can further strengthen described adhesion.
On the other hand, (Figure 56), it has recess 244a for Figure 49, Figure 52 to form the flange 244 on a plurality of lower peripheral edge surfaces that are used to receive storage substrate 212 in chip holding part 233 on following main body 211L side.On last main body 211U, on corresponding to the position that forms flange 244, form a plurality of have butt joint edge 245 in the face of the projection 245a of storage substrate edge surface 212 last week (Figure 47, Figure 55, Figure 56).Storage substrate 212 is clamped between flange 244 and the butt joint edge 245, but also can interband unoccupied place installation slightly between these edge.
A plurality of xsects roughly are that leg-of-mutton welding muscle 246 is arranged on the inner periphery of main body 211U (Figure 47,48), thereby be welded on down on the face of weld 247 of main body 211L (Figure 49, Figure 50).
In addition, in this embodiment, guiding rib 248,248 is arranged on two inner surfaces of chip holding part 232, and on 231 both side surface of the mounting portion of substrate fixture 213, be provided with can with the engaging groove 249,249 of guiding rib 248,248 engagements.Engaging groove 249,249 only is formed on the rear surface side of substrate fixture 213, makes that substrate fixture 213 can not be assembled with following main body 211L when mounted substrate anchor clamps 213 back to front.
Shown in Figure 52, when assembled base plate clamp 213 and main body 211, the clamping that the first installation part 231 of substrate fixture 213 is assembled to down main body 211L comprises in the part 232.At this moment, if mounted substrate anchor clamps 213 back to front, the first installation part 231 can not with guiding rib 248 engagements, thereby, prevented to the assembling that clamping comprises on the part 232.The workman can find wrong installation.Thereby, prevented that by substrate fixture 213 storage substrate 212 is assembled on the main body 211 improperly.
When the clamping that is assembled to down main body 211L when substrate fixture 213 comprises in the part 232, because front end 231 contacts with the first positioning rib 241U, 241L, rear end 231b contacts with the second positioning rib 242U, 242L, and the mounting portion 231 of substrate fixture 213 is positioned on reciprocating direction.
Support described combination to enter the storer substrate 212 of described substrate fixture 213 by a plurality of flanges 244 at described chip holding part 233 places of main body 211L down.At this moment, because step portion 250 contacts with the second positioning rib 242U, 242L, the rear end contacts (Figure 52) with flange 244 on the bottom part body side, and storage substrate 212 is positioned on reciprocating direction.
Below, shown in Figure 54, last main body 211U is assemblied in down on the main body 211L, and substrate fixture 213 (with storage substrate 212) is combined in wherein.Then, on face of weld 247, use ultrasonic soldering, main body 211U and following main body 211L are linked together.
At this moment, the connection rib 234 of the mounting portion 231 of substrate fixture 213 is soldered on recessed portion 235U, the 235L by projection 235p, and embossed surface 243 is soldered on the inside surface of main body 211U and following main body 211L.Thereby last main body 211U and following main body 211L link together, and simultaneously, substrate fixture 213 is connected with them securely by welding.
And, be installed at storage substrate 212 between the flange 244 and butt joint edge 245 of the chip holding part 233 of organizing main bodys 211 more, thus the vibration of containment storage substrate 212 in main body.In addition, by between rib 244,245 and substrate, some gaps being set, allow storage substrate 212 thermal deformation to a certain degree, reduce substrate stress, can prevent such as the infringement of the electronic component of semiconductor memory 211A and 211B and to the infringement of element coupling part.
According to this embodiment, identical with above-mentioned each embodiment, can prevent the mistake installation of storage substrate 212 with respect to main body 211, can prevent because quality decline that wrong installation causes and the quality fluctuation between product.
And the External memory equipment 210 of this embodiment is different with the External memory equipment of the foregoing description, has adopted the integrated morphology of substrate fixture 213 by main body 211 clampings that are divided into top and bottom two-part structure.
For example when in order to write down when increasing recording capacity and on storage substrate a plurality of semiconductor memory being installed, the length of storage substrate becomes (becoming longer) greatly.At this moment, main body that holding the storage substrate that more lives forever is also elongated, when carrying out injection molding when integrally forming main body, because the relation between the mold releasability angle etc., becomes big with wall thickness on the open section opposition side.Internal volume becomes and is not enough to hold described substrate, the problem of (sink) may occur being recessed into.
On the other hand, when the length of length that makes the substrate fixture that holds storage substrate and main body extends, on length direction between substrate fixture end face and the main body (direction of loading onto and taking off of joint), become difficult as the welding operation among above-mentioned each embodiment, and may cause welding insufficient.And, when the length lengthening of the length of main body and substrate fixture, when the equipment of use, product becomes big from the outstanding degree of its side surface, the influence of the external force (bending force, torsion etc.) that causes by main body, the stress that being welded to connect part causes increases, under the most abominable situation, this coupling part may be compromised the degree that main body and substrate fixture separate.
At this, in the present embodiment, main body 211 is divided into two parts, just go up main body 211U and following main body 211L, from fore-and-aft direction clamping substrate fixture 213, by ultrasonic soldering, last main body 211U, following main body 211L and substrate fixture 213 are combined into a single main body.
By will substrate fixture 213 being welded to surface on the main body 211, can obtain to have the welding region of high surface area in the face of each the preceding and rear surface of inside surface of last main body 211U and following main body 211L ought act on.
The inner space 215 of main body 211 comprises that the clamping that is used for clamping substrate fixture 213 comprises part 232 and is used to support from the chip holding part 233 of the outstanding storage substrate 212 of substrate fixture 213.
(242U 242L), brings the function that keeps described substrate fixture 213 for 241U, 241L to comprise the mechanism that is provided on the part 232 along reciprocating direction (length direction) positions substrate fixture 213 in clamping.
Thereby on chip holding part 233, be provided for supporting storage substrate 212 peripheries from the mechanism (244,245) of the described storage substrate 212 of clamping up and down, so that prevent the vibration of storage substrate in main body effectively.By being provided for preventing substrate to-and-fro movement in main body in the mechanism (242U, 242L, 244,245) that storage substrate 212 reciprocating directions (length direction) position.
Utilize said structure, because main body 211 and substrate fixture 213, can be guaranteed the intensity of welding by welding securely simultaneously, being used for the equipment of assembly operation and device for ultrasonic welding etc. can miniaturization, has avoided the increase cost.And, on the other hand,,, can prevent from reliably to separate by the maintaining body of substrate fixture 213 even the strength of joint between main body 211 and the substrate fixture 213 is influenced by external force and descends, guarantee life of product.And, owing to can in main body, stably support the edge of storage substrate, can prevent that substrate and electronic component are subjected to the infringement owing to the stress of tension force and bending, and can prevent that the coupling part of element from suffering damage.Thereby, can carry out the record of recorded information for a long time reliably and read.
Above introduced embodiments of the invention, but the present invention is not limited to these embodiment.According to technological concept of the present invention, can carry out various improvement.
For example in above-mentioned first embodiment, form linear rib, so that prevent the mistake assembling of main body 11 and substrate fixture 13, but the quantity of formed rib is not limited to the foregoing description, can increase the quantity of rib, thereby under the situation of welding, strength of joint and reliability can greatly increase.
In addition, in above-mentioned the 3rd embodiment, only the position of engagement of engaged claw 152S and mate 162S is arranged on respect on the asymmetric position, front and back, assemble mistakenly so that prevent first main body 121 and second main body 122, but other engaged claw and the position of engagement are arranged on respect on the asymmetric position, front and back.
And, with respect to the assembling of storage substrate 112 and substrate fixture 113, be printed on the surperficial 113A of substrate fixture and rear surface 113B go up the difference of pattern and substrate fixture 113 projection 128 towards the fore-and-aft direction that can be used for judging substrate fixture.For example, can form the gap of the employed anchor clamps of exerting pressure in the printing process of substrate fixture 113, only when the surperficial 113A of substrate fixture upwards towards the time, projection 128 just can be assembled in this gap, thereby, guarantee when the rear surface of substrate fixture 113 113B upwards towards the time, substrate fixture 113 can not be installed on the installation site.
On the other hand, to be subject to the situation of the USB port etc. of computing machine be general to the outer splicing ear (joint) of External memory equipment of the present invention.In other words, when External memory equipment is installed on the USB port with incorrect direction, worry that the outer splicing ear of USB port and External memory equipment may suffer damage.
For example, shown in Figure 57 A and 57B, incorrect link externally is set on the memory device 70 prevents rib 71, be used to represent the closure of joint 24 with respect to USB port.Therefore, prevent that with incorrect link the profiled surface of rib 71 from being benchmark, can determine the closure of joint 24.
For example, in structure such as the electronic equipment of the computing machine that is equipped with USB port, USB port is contained in its shell, this housing is provided with the connecting hole that is used to connect USB port, in this connecting hole, form the recess that prevents rib 71 corresponding to incorrect link, thereby, guarantee to prevent the insertion of joint with incorrect direction.
According to the structure of External memory equipment 70,, can guarantee the correct assembly manipulation of surperficial 11A and 13A between main body 11 and the substrate fixture 13 by forming the recess that prevents rib 71 corresponding to the incorrect link of main body 11.
Industrial applicability
As mentioned above, according to External memory equipment of the present invention, can prevent reliably the storage substrate mistake Be installed on the main body. Can avoid because product quality fluctuation and product that wrong assembling causes can Lean on the decline of property.
Claims (24)
1. an External memory equipment is characterized in that, comprising:
Main body;
Storage substrate, semiconductor memory is installed on this storage substrate at least, splicing ear outside the one end has;
The substrate fixture that has substrate insertion through hole on it, by described insertion through hole, described storage substrate is inserted into, thereby being used for that described storage substrate is fixed in described main body makes described outer splicing ear outwards outstanding from the opening on the end of described substrate insertion through hole, and described main body has the space, and described substrate fixture can insert in this space;
The lid that can be installed on the described substrate fixture and can take off from described substrate fixture is used to protect described outer splicing ear;
Wrong assembling wherein is set on described main body, described storage substrate and described substrate fixture prevents device, be used for when described storage substrate is incorrect with respect to the assembling attitude of described main body, when described storage substrate is incorrect with respect to the assembling attitude of described substrate fixture and described substrate fixture prevent assembling when incorrect with respect to the assembling attitude of described main body.
2. External memory equipment according to claim 1, it is characterized in that: the rib that described wrong assembling prevents device to extend for the direction that intersects along the other end with described storage substrate, if described storage substrate is incorrect with respect to the assembling attitude of described main body, prevent described storage substrate to be advanced in the described main body by contacting with the other end of described storage substrate.
3. as External memory equipment as described in the claim 2, it is characterized in that: form on described rib and keep groove, if described storage substrate is correct with respect to the assembling attitude of described main body, this maintenance groove is used to keep the other end of described storage substrate.
4. as External memory equipment as described in the claim 3, it is characterized in that: by the propelling of described storage substrate, described maintenance groove is accompanied by plastic yield and keeps described storage substrate.
5. as External memory equipment as described in the claim 2, it is characterized in that: form gathering sill on described rib, if described storage substrate is correct with respect to the assembling attitude of described main body, this gathering sill guides described storage substrate to be advanced in the described main body.
6. as External memory equipment as described in the claim 5, it is characterized in that: the bottom in described main body is provided with retaining part, the other end of the described storage substrate after being used to keep advancing.
7. as External memory equipment as described in the claim 6, it is characterized in that: by the propelling of described storage substrate, described retaining part follows plastic yield to keep described storage substrate.
8. External memory equipment according to claim 1, it is characterized in that: on the inside surface in described space, restricted part is set, if described substrate fixture is incorrect with respect to the assembling attitude of described main body, contact with described substrate fixture by this restricted part, prevent described substrate fixture to be advanced in the described space.
9. as External memory equipment as described in the claim 8, it is characterized in that: along the direction of insertion in the described relatively space of described substrate fixture, insert at described substrate fixture on the outside surface of end regions of that side of described space a plurality of linear ribs are set,
Described a plurality of linear rib is separately positioned on such position, if described substrate fixture is correct with respect to the assembling attitude of described main body, described rib does not contact with described restricted part, if described substrate fixture is incorrect with respect to the assembling attitude of described main body, described rib contacts with described restricted part.
10. as External memory equipment as described in the claim 9, it is characterized in that: during ultrasonic soldering, at least some ribs in described a plurality of ribs play the welding muscle effect between described main body and described substrate fixture.
11. External memory equipment according to claim 1, it is characterized in that: described main body roughly forms cylindricality, on the outer surface of described main body, offer the space that described substrate fixture can insert, when assembling, the end of the described main body side of described lid and merging of described body junction and described lid is shaped corresponding to the outer surface of described main body.
12., it is characterized in that: form roughly that each end of the main body of cylindricality has aduncate shape, the waveform portion of anti-sliding stop is set on the preceding and rear surface of described lid as External memory equipment as described in the claim 11.
13. External memory equipment according to claim 1 is characterized in that: described storage substrate is arranged on the position with respect to the shaft position biasing of described main center.
14. External memory equipment according to claim 1 is characterized in that described main body comprises:
First main body, substrate fixture is from inserting described first main body along a side of the described first modal length direction;
Second main body, described second main body forms end regions along the described first modal length direction on an opposite side of a side of inserting with described substrate fixture;
On described second main body, groove is set, is used for the clip type semconductor memory devices is connected on the described storage substrate or from described storage substrate and takes off described clip type semconductor memory devices.
15. as External memory equipment as described in the claim 14, it is characterized in that: embed by a plurality of engaged claws and to connect, described second main body links to each other with described first main body.
16. as External memory equipment as described in the claim 15, it is characterized in that: the part of placing obstacles on described first main body if the assembling attitude is incorrect, is used to prevent at least some described engaged claws to enter in described first main body.
17. External memory equipment according to claim 1 is characterized in that: between the other end of the inner wall surface of described main body and described storage substrate, form the gap, and described outer splicing ear is pressed to described substrate and inserts in the opening of through hole one end.
18. External memory equipment according to claim 1, it is characterized in that: in described substrate inserts through hole, form targeting part, if described storage substrate is correct with respect to the assembling attitude of described substrate fixture, this targeting part guides described storage substrate to be advanced in the described substrate fixture.
19. External memory equipment according to claim 1, it is characterized in that: described main body has the two-part structure in the top of being divided into and bottom, and described substrate fixture is kept by the main body of described two-part structure.
20., it is characterized in that: the mechanism that in described main body, is provided for determining described substrate fixture position on the length direction of described substrate fixture as External memory equipment as described in the claim 19.
21., it is characterized in that: if at least one of the main body of described two-part structure, be formed for described substrate fixture when correct and the mate of the outer surface engagement of described substrate fixture with respect to the attitude of described main body as External memory equipment as described in the claim 19.
22. as External memory equipment as described in the claim 19, it is characterized in that: the part of the outer surface of described at least substrate fixture is soldered on the surface, inside of described main body.
23., it is characterized in that: the retaining part that on the inside surface of described main body, forms described substrate fixture as External memory equipment as described in the claim 19.
24., it is characterized in that as External memory equipment as described in the claim 19: a kind of mechanism is set in described main body, is used to support described storage substrate from the outstanding edge of described substrate fixture, thereby from carrying out clamping up and down.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP002675/2003 | 2003-01-08 | ||
| JP2003002675 | 2003-01-08 | ||
| JP156072/2003 | 2003-05-30 | ||
| JP400876/2003 | 2003-11-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1698064A CN1698064A (en) | 2005-11-16 |
| CN100380401C true CN100380401C (en) | 2008-04-09 |
Family
ID=35350179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004800001244A Expired - Fee Related CN100380401C (en) | 2003-01-08 | 2004-01-07 | External memory device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100380401C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103268995B (en) * | 2013-04-19 | 2016-06-29 | 华为终端有限公司 | USB device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10250275A (en) * | 1997-03-18 | 1998-09-22 | Hitachi Ltd | Memory card and its manufacture |
| JPH1199779A (en) * | 1997-09-26 | 1999-04-13 | Oki Electric Ind Co Ltd | Pc card |
| JP2002007974A (en) * | 2000-06-26 | 2002-01-11 | Sony Corp | Recording and/or reproducing device for ic card |
| JP3086525U (en) * | 2001-12-07 | 2002-06-28 | 宣得股▲ふん▼有限公司 | Portable storage device that can be extended and retracted |
| JP3086524U (en) * | 2001-12-07 | 2002-06-28 | 宣得股▲ふん▼有限公司 | Combination structure of portable storage device |
| CN2517012Y (en) * | 2002-01-23 | 2002-10-16 | 台均实业有限公司 | The USB mobile memory that can be upgraded and expanded to replace the storage medium at will |
-
2004
- 2004-01-07 CN CNB2004800001244A patent/CN100380401C/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10250275A (en) * | 1997-03-18 | 1998-09-22 | Hitachi Ltd | Memory card and its manufacture |
| JPH1199779A (en) * | 1997-09-26 | 1999-04-13 | Oki Electric Ind Co Ltd | Pc card |
| JP2002007974A (en) * | 2000-06-26 | 2002-01-11 | Sony Corp | Recording and/or reproducing device for ic card |
| JP3086525U (en) * | 2001-12-07 | 2002-06-28 | 宣得股▲ふん▼有限公司 | Portable storage device that can be extended and retracted |
| JP3086524U (en) * | 2001-12-07 | 2002-06-28 | 宣得股▲ふん▼有限公司 | Combination structure of portable storage device |
| CN2517012Y (en) * | 2002-01-23 | 2002-10-16 | 台均实业有限公司 | The USB mobile memory that can be upgraded and expanded to replace the storage medium at will |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1698064A (en) | 2005-11-16 |
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Granted publication date: 20080409 Termination date: 20140107 |