CN100389355C - Method of manufacturing LCD panels - Google Patents
Method of manufacturing LCD panels Download PDFInfo
- Publication number
- CN100389355C CN100389355C CNB2004100227100A CN200410022710A CN100389355C CN 100389355 C CN100389355 C CN 100389355C CN B2004100227100 A CNB2004100227100 A CN B2004100227100A CN 200410022710 A CN200410022710 A CN 200410022710A CN 100389355 C CN100389355 C CN 100389355C
- Authority
- CN
- China
- Prior art keywords
- transparency carrier
- liquid crystal
- frame adhesive
- sealing
- crack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 39
- 238000007789 sealing Methods 0.000 claims abstract description 24
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000000741 silica gel Substances 0.000 claims abstract description 9
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 9
- 239000000853 adhesive Substances 0.000 claims description 34
- 230000001070 adhesive effect Effects 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 11
- 239000000565 sealant Substances 0.000 claims description 10
- 238000005260 corrosion Methods 0.000 abstract description 7
- 230000007797 corrosion Effects 0.000 abstract description 7
- 239000000428 dust Substances 0.000 abstract description 7
- 238000007688 edging Methods 0.000 abstract description 7
- 239000003292 glue Substances 0.000 abstract 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 21
- 238000010586 diagram Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- 230000010412 perfusion Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
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- Liquid Crystal (AREA)
Abstract
The present invention relates to a liquid crystal display panel which provides a manufacturing method of the liquid crystal display panel. The manufacturing method comprises the following steps: first sealing: a gap between a first transparent base board and a second transparent base board is sealed; liquid crystal pouring: a liquid crystal is injected into a cavity through a liquid crystal injecting opening, and the cavity is surrounded by the first and the second transparent base boards and side frame glue; sealing: the liquid crystal injecting opening is enclosed; edging: the edge of the liquid crystal display panel is ground. The present invention makes the gap between the transparent base boards sealed by silica gel before the liquid crystal is injected, and solves the problem that dust generated by edging, which is clamped in the gap of the liquid crystal, is difficult to clean. Finally, the present invention avoids electric corrosion of an ITO electrode because of dust.
Description
[technical field]
The present invention relates to LCD panel, relate in particular to a kind of manufacturing process flow of LCD panel.
[background technology]
ITO (tin indium oxide) transparency electrode is an important component part of LCD panel, the ITO electrode corrosion also is important problem during LCD panel is made, the ITO electrode corrosion not only can cause LCD panel or LCD (LCD) to scrap, and because of its passing meeting in time serious gradually, integrity problem takes place in the back in user's hand thereby may be sold at LCD, causes market to be complained.After having done macromethod, find that the ITO electrode corrosion is relevant with the manufacturing process flow of LCD panel.The manufacturing process flow of existing LCD panel is: liquid crystal filling---seals that---edging---clean---IC nation fixed---is beaten silica gel sealing.The problem of this technological process is: because liquid crystal filling is the principle that relies on siphonage, after two base plate glass are bonding by frame adhesive, leave a crack between two base plate glass He outside the frame adhesive, and shown in Fig. 1 label 5, label 2 expression frame adhesive.Liquid crystal will remain in the crack by siphonage during liquid crystal filling, the dust that produces behind the edging will be mixed in the liquid crystal that remains in the crack, be difficult to clean up, As time goes on electro-chemical reaction will take place in these dust, causes product that the ITO electrode corrosion takes place.
[summary of the invention]
Fundamental purpose of the present invention is exactly in order to solve the problem of existing technological process, a kind of manufacturing process flow of LCD panel to be provided, preventing that the dust that produces behind the edging from causing the ITO electrode corrosion.
For achieving the above object, the manufacture method of the LCD panel that the present invention proposes comprises first transparency carrier and second transparency carrier, engages fixing, wherein further comprising the steps of between described first transparency carrier and second transparency carrier by frame adhesive:
1) sealing for the first time: with between first transparency carrier, second transparency carrier and the crack sealing that surrounds along the second transparency carrier edge outside the frame adhesive;
2) liquid crystal filling: liquid crystal is filled in the cavity that first transparency carrier, second transparency carrier and frame adhesive surround by liquid crystal injecting port;
3) seal: the sealing liquid crystal injecting port.
The described sealing of step 1) is to seal between first transparency carrier, second transparency carrier and the crack that surrounds along the second transparency carrier edge outside the frame adhesive with sealant.
With silica gel as sealant.
The described crack of step 1) is meant that the ITO electrode extends between one side of frame adhesive or above on one side first transparency carrier, second transparency carrier and the crack that surrounds along the second transparency carrier edge outside the frame adhesive.
The invention has the beneficial effects as follows: 1) before the technological process of liquid crystal filling and edging with first transparency carrier, second transparency carrier between and the crack sealing that surrounds along the second transparency carrier edge outside the frame adhesive, liquid crystal remains in the crack by siphonage in the liquid crystal filling process to avoid, thereby the dust of avoiding producing behind the edging is mixed in the liquid crystal that remains in the crack, has finally avoided the ITO electrode because of dust electrocorrosion to take place.2) utilize silica gel to make sealant, easy to use, cost is low.3) only will there be the ITO electrode to extend between one side of frame adhesive or above first transparency carrier, second transparency carrier on one side and the crack sealing that surrounds along the second transparency carrier edge outside the frame adhesive, the ITO electrode on other limit does not extend outside the frame adhesive, thereby the obstruct of frame adhesive arranged, so unnecessary just sealing before liquid crystal filling was so not only increased work efficiency but also was reduced cost.
Feature of the present invention and advantage will be elaborated in conjunction with the accompanying drawings by embodiment.
[description of drawings]
Fig. 1 represents that LCD panel of the present invention seals the right side before for the first time and looks synoptic diagram;
Fig. 2 represents that LCD panel of the present invention seals Facad structure synoptic diagram afterwards for the first time;
Fig. 3 represents the process flow diagram of one embodiment of the present of invention;
Fig. 4 represents that the LCD panel of further embodiment of this invention seals Facad structure synoptic diagram afterwards for the first time;
Synoptic diagram is looked on the right side of Fig. 5 presentation graphs 4;
Fig. 6 represents that the LCD panel of another embodiment of the present invention seals the right side afterwards for the second time and looks synoptic diagram.
[embodiment]
Specific embodiment one, as shown in Figure 1, 2 forms voltage at the ito transparent electrode 10 that is manufactured with respectively on first transparency carrier 3 and second transparency carrier 4 on 10, two substrates of ito transparent electrode according to institute's plus signal, makes liquid crystal produce deflection under the voltage effect.First transparency carrier 3 and second transparency carrier 4 are isometric, but wide less than first transparency carrier 3 of second transparency carrier 4 wide, the edge of first transparency carrier 3 and second transparency carrier 4 is fixed together by frame adhesive 2, also has a circle crack 5 between the two substrates, outside the frame adhesive 2 along the edge of second transparency carrier 4, leave the liquid crystal injecting port 6 of perfusion liquid crystal on one side of two substrates, be the chamber 7 of perfusion liquid crystal in the middle of the two substrates, liquid crystal is entered in the chamber 7 by liquid crystal injecting port 6 by siphonage.For avoiding liquid crystal also to enter in the crack 5 by siphonage, present embodiment before liquid crystal filling technology earlier with between first transparency carrier 3, second transparency carrier 4 and crack 5 sealings that surround along second transparency carrier, 4 edges outside the frame adhesive 2, its technological process as shown in Figure 3:
1) sealing for the first time: with between first transparency carrier, second transparency carrier and the crack sealing that surrounds along the second transparency carrier edge outside the frame adhesive;
2) liquid crystal filling: liquid crystal is filled in the cavity that first transparency carrier, second transparency carrier and frame adhesive surround by liquid crystal injecting port;
3) seal: the sealing liquid crystal injecting port;
4) edging: the edge of polishing LCD panel.
5) clean;
6) IC nation is fixed: IC ground connection being fixed on that be electrically connected extended on the ITO electrode of frame adhesive;
7) sealing for the second time; To extend the IC sealing of the ITO electrode and the Bang Ding of frame adhesive with silica gel.
The described sealing of step 1) is meant and seals between first transparency carrier, second transparency carrier and the crack that surrounds along the second transparency carrier edge outside the frame adhesive with sealant.The preferred silica gel of sealant can also be other sealants.
Seal between first transparency carrier, second transparency carrier and the crack that surrounds along the second transparency carrier edge outside the frame adhesive can also adopt other modes, for example with sealing strip or sealing-plug.
Specific embodiment two, because the ITO electrode can only extend beyond the edge of frame adhesive to the first transparency carrier 3 to one side of first transparency carrier 3 (direction), the ITO electrode 10 of other direction is all in frame adhesive.So what present embodiment and specific embodiment one were different is: only carry out sealing first time there being ITO electrode 10 to extend on the direction of substrate edges, as shown in Figure 4, because wide less than first transparency carrier 3 of second transparency carrier 4 wide, the direction that ITO electrode 10 staggers from the two substrates edge extends to the edge of first transparency carrier 3, with silica gel or other sealants are beaten between second transparency carrier 4, first transparency carrier 3 and the crack that surrounds along second transparency carrier, 4 edges outside the frame adhesive in, form band 8.To extend the ITO electrode of frame adhesive and the IC of Bang Ding and carry out the sealing second time, form band 9, and make the ITO electrode 10 and the external world isolated fully.
Certainly,, extend to the edge of both direction, just need in the crack of this both direction, stamp silica gel or other sealants if ITO electrode 10 has both direction to exceed outside the frame adhesive.
Embodiment two compares with embodiment one, has improved work efficiency, has reduced cost.
In a word, the present invention has reduced the probability of ITO electrode corrosion on the basis that does not increase too big cost.
Claims (4)
1. the manufacture method of LCD panel comprises first transparency carrier and second transparency carrier, and is fixing by the frame adhesive joint between described first transparency carrier and second transparency carrier, it is characterized in that further comprising the steps of:
1) sealing for the first time: with between first transparency carrier, second transparency carrier and the crack sealing that surrounds along the second transparency carrier edge outside the frame adhesive;
2) liquid crystal filling: liquid crystal is filled in the cavity that first transparency carrier, second transparency carrier and frame adhesive surround by liquid crystal injecting port;
3) seal: the sealing liquid crystal injecting port.
2. the manufacture method of LCD panel as claimed in claim 1, it is characterized in that: the described sealing of step 1) is to seal between first transparency carrier, second transparency carrier and the crack that surrounds along the second transparency carrier edge outside the frame adhesive with sealant.
3. the manufacture method of LCD panel as claimed in claim 2 is characterized in that: with silica gel as sealant.
4. as the manufacture method of each described LCD panel in the claim 1 to 3, it is characterized in that: the described crack of step 1) is meant that the ITO electrode extends between one side of frame adhesive or above on one side first transparency carrier, second transparency carrier and the crack that surrounds along the second transparency carrier edge outside the frame adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100227100A CN100389355C (en) | 2004-05-31 | 2004-05-31 | Method of manufacturing LCD panels |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100227100A CN100389355C (en) | 2004-05-31 | 2004-05-31 | Method of manufacturing LCD panels |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1704801A CN1704801A (en) | 2005-12-07 |
| CN100389355C true CN100389355C (en) | 2008-05-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100227100A Expired - Fee Related CN100389355C (en) | 2004-05-31 | 2004-05-31 | Method of manufacturing LCD panels |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100389355C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101344722B (en) * | 2007-07-09 | 2012-01-04 | 中华映管股份有限公司 | Manufacturing method of color filter substrate |
| TWI642044B (en) * | 2018-01-09 | 2018-11-21 | 友達光電股份有限公司 | Electronic device and manufacturing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0836187A (en) * | 1994-07-25 | 1996-02-06 | Sony Corp | Production of liquid crystal panel |
| CN1128567A (en) * | 1994-05-12 | 1996-08-07 | 三星电子株式会社 | Finely sealed liquid crystal display panel and manufacturing method thereof |
| US5684555A (en) * | 1994-12-19 | 1997-11-04 | Kabushiki Kaisha Toshiba | Liquid crystal display panel |
| JP2000066232A (en) * | 1998-08-20 | 2000-03-03 | Matsushita Electric Ind Co Ltd | Liquid crystal display device |
| US6496240B1 (en) * | 1997-09-02 | 2002-12-17 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display apparatus containing image sensor and process for producing the same |
-
2004
- 2004-05-31 CN CNB2004100227100A patent/CN100389355C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1128567A (en) * | 1994-05-12 | 1996-08-07 | 三星电子株式会社 | Finely sealed liquid crystal display panel and manufacturing method thereof |
| JPH0836187A (en) * | 1994-07-25 | 1996-02-06 | Sony Corp | Production of liquid crystal panel |
| US5684555A (en) * | 1994-12-19 | 1997-11-04 | Kabushiki Kaisha Toshiba | Liquid crystal display panel |
| US6496240B1 (en) * | 1997-09-02 | 2002-12-17 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display apparatus containing image sensor and process for producing the same |
| JP2000066232A (en) * | 1998-08-20 | 2000-03-03 | Matsushita Electric Ind Co Ltd | Liquid crystal display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1704801A (en) | 2005-12-07 |
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Owner name: SHENZHEN BYD ELECTRONIC COMPONENT CO., LTD. Free format text: FORMER OWNER: BIYADI CO., LTD. Effective date: 20150901 |
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Effective date of registration: 20150901 Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee after: SHENZHEN BYD ELECTRONIC COMPONENT Co.,Ltd. Address before: Kwai Chung town Yanan Road, BYD Industrial Park in Longgang District of Shenzhen City, Guangdong province 518119 Patentee before: BYD Co.,Ltd. |
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Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee after: Shenzhen helitai photoelectric Co.,Ltd. Address before: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee before: SHENZHEN BYD ELECTRONIC COMPONENT Co.,Ltd. |
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