CN100385654C - Wire rack packaging structure and manufacturing method thereof - Google Patents
Wire rack packaging structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN100385654C CN100385654C CNB2004100423820A CN200410042382A CN100385654C CN 100385654 C CN100385654 C CN 100385654C CN B2004100423820 A CNB2004100423820 A CN B2004100423820A CN 200410042382 A CN200410042382 A CN 200410042382A CN 100385654 C CN100385654 C CN 100385654C
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- China
- Prior art keywords
- lead frame
- junction surface
- encapsulation structure
- chip
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The present invention relates to a leading-wire rack encapsulation structure and a manufacturing method thereof. The leading-wire rack encapsulation structure at least comprises a carrier and more than one contact components, wherein the carrier at least comprises more than one chip and leading-wire rack, and the carrier is provided with more than one joint part. The contact components and the chip form electrical-property conduction, and encapsulation material is arranged on the leading-wire frame and the joint parts in a connection mode; the leading-wire frame is mutual joint with the encapsulation material through the joint parts to make the encapsulation material and the leading-wire frame attain the efficiency of no disengagement.
Description
Technical field
Relevant a kind of lead frame encapsulation structure of the present invention and manufacture method thereof relate generally to the encapsulation of lead frame, refer to structure and manufacture method thereof that encapsulating material and lead frame are connected mutually especially.
Background technology
General prior art chip-packaging structure, the high heat that chip is produced when often using because of finished product makes this encapsulating structure shrinkage heat rise, and causes encapsulating structure easily to produce following state:
(1) encapsulating material and lead frame partly break away from and make encapsulating material loosening;
(2) encapsulating material can't effectively engage with lead frame and make encapsulating material and lead frame separate.
See also Fig. 1, Fig. 2 and Fig. 3, schematic diagram for prior art conducting wire frame structure encapsulation procedure, as shown in the figure: it consists predominantly of carrier 11, more than one contact component 113 and encapsulating material 12, wherein this carrier 11 is made up of lead frame 111 and the chip 112 be located on this lead frame 111, an end and contact component 113 with lead 113a join, the other end of lead 113a then with cohere the pad 113b join, with with chip 112 electrically conduct in outside, be arranged on the lead frame 111 with encapsulating material 12 again, after encapsulating material 12 coolings, promptly as shown in Figure 3.
When this finished product uses; the Gao Re regular meeting that is produced by chip 112 easily rises by encapsulating material 12 because of local shrinkage heat effect; cause encapsulating material 12 and lead frame 111 partly to break away from; make that encapsulating material 12 is loosening; after the use of a period of time; even can cause encapsulating material 12 and lead frame 111 to be separated from each other, cause chip 112 to lose the protection of encapsulating material 12 and damage.
In sum, learn that by the problem that above-mentioned prior art encapsulation technology is produced the prior art encapsulation technology has following shortcoming:
(1) can't reach the effect that does not break away between encapsulating material and the lead frame, as long as this finished product is when using, under the effect of encapsulating material shrinkage heat being risen via the high heat of chip, promptly can produce loosening between this encapsulating material and the lead frame, after the use of a period of time, even can cause encapsulating material and lead frame to be separated from each other;
(2) often have the situation that can't effectively engage to produce between encapsulating material and the lead frame, just must encapsulate again this moment, thereby cause the increase of processing cost.
So,, just become considerable problem for solving the above problems to strengthen engaging between encapsulating material and the lead frame.
Summary of the invention
Main purpose of the present invention provides a kind of lead frame encapsulation structure, and this structure and lead frame can reach the effect that is difficult for disengaging after encapsulation, and relates to the manufacture method of this structure.
The present invention introduces a kind of lead frame encapsulation structure, it is characterized in that, this lead frame encapsulation structure comprises at least: carrier and more than one contact component, wherein this carrier comprises more than one chip and lead frame at least, this lead frame is established more than one junction surface in order to carries chips on carrier; Wherein aforementioned contact component and chip have the property of conducting, and are located on lead frame and the junction surface with encapsulating material, are bonded with each other via junction surface and encapsulating material, make this encapsulating material and lead frame reach the effect that does not break away from.
Wherein this lead frame is made of the material with preferable ductility, the material that has the material of preferable radiating effect and have preferable conductivity, for example copper alloy etc.
Wherein this contact component is to be connected with lead with chip.And wherein this lead is to be connected to cohere pad (the described pad that coheres can be metal gasket etc.) with chip.
Wherein said junction surface can be the L shaped plate of toppling over or can be the く shape plate of toppling over.
The present invention also introduces a kind of manufacture method of lead frame encapsulation structure, it is characterized in that comprising the steps:
(a) provide a lead frame, lead frame is processed, make and form the preliminary shape in more than one junction surface, for example rectangular cylinder on the lead frame with pressure setting;
(b) with the preliminary shape processing of shaped device, make and made more than one junction surface on the lead frame junction surface on the lead frame;
(c) on described lead frame, accept a chip, with lead described chip and at least one are positioned at the outer contact component of lead frame and are electrically connected;
(d) be located at lead frame and junction surface with encapsulating material again.
The present invention also introduces the manufacture method of another kind of lead frame encapsulation structure, it is characterized in that comprising the steps:
(a) provide a lead frame, lead frame is processed, make and form the preliminary shape in more than one junction surface, for example rectangular cylinder on the lead frame with punching and shearing device;
(b) with the preliminary shape processing of shaped device, make and made more than one junction surface on the lead frame junction surface on the lead frame;
(c) on described lead frame, accept a chip, with lead described chip and at least one are positioned at the outer contact component of lead frame and are electrically connected;
(d) be located at lead frame and junction surface with encapsulating material again.
Characteristic on above-mentioned purpose of the present invention and structure thereof and the function will be illustrated according to the preferred embodiment of appended accompanying drawing.
Description of drawings
Fig. 1 is the preceding schematic perspective view of prior art lead frame encapsulation structure encapsulation;
Fig. 2 is the schematic perspective view after the prior art lead frame encapsulation structure encapsulation;
Fig. 3 is the side-looking generalized section after the prior art lead frame encapsulation structure encapsulation;
Fig. 4 is the preceding schematic perspective view of the present invention's first preferred embodiment lead frame encapsulation structure encapsulation;
Fig. 5 is the schematic perspective view after the encapsulation of the present invention's first preferred embodiment lead frame encapsulation structure;
Fig. 6 is the side-looking generalized section after the encapsulation of the present invention's first preferred embodiment lead frame encapsulation structure;
Fig. 7 is the schematic perspective view of the present invention's second preferred embodiment lead frame;
Fig. 8 is the schematic perspective view of the present invention's the 3rd preferred embodiment lead frame;
Fig. 9 adds the side-looking generalized section in man-hour via pressure setting for the present invention's the 3rd preferred embodiment lead frame;
Figure 10 adds the side-looking generalized section in man-hour via shaped device for the present invention's the 3rd preferred embodiment lead frame;
Figure 11 is the side-looking generalized section after the processing of the present invention's the 3rd preferred embodiment lead frame;
Figure 12 is the schematic perspective view of the present invention's the 4th preferred embodiment lead frame;
Figure 13 adds the side-looking generalized section in man-hour via pressure setting for the present invention's the 4th preferred embodiment lead frame;
Figure 14 adds the side-looking generalized section in man-hour via shaped device for the present invention's the 4th preferred embodiment lead frame;
Figure 15 is the side-looking generalized section after the processing of the present invention's the 4th preferred embodiment lead frame;
Figure 16 is the schematic perspective view of the present invention's the 5th preferred embodiment lead frame;
Figure 17 adds the side-looking generalized section in man-hour via pressure setting for the present invention's the 5th preferred embodiment lead frame;
Figure 18 adds the side-looking generalized section in man-hour via shaped device for the present invention's the 5th preferred embodiment lead frame;
Figure 19 is the side-looking generalized section after the processing of the present invention's the 5th preferred embodiment lead frame;
Figure 20 is the schematic perspective view of the present invention's the 6th preferred embodiment lead frame;
Figure 21 adds the side-looking generalized section in man-hour via pressure setting for the present invention's the 6th preferred embodiment lead frame;
Figure 22 adds the side-looking generalized section in man-hour via shaped device for the present invention's the 6th preferred embodiment lead frame;
Figure 23 is the side-looking generalized section after the processing of the present invention's the 6th preferred embodiment lead frame;
Figure 24 adds the schematic perspective view in man-hour via pressure setting for the present invention's the 7th preferred embodiment lead frame;
Figure 25 adds the schematic perspective view in man-hour via shaped device for the present invention's the 7th preferred embodiment lead frame;
Figure 26 is the schematic perspective view after the processing of the present invention's the 7th preferred embodiment lead frame;
Figure 27 adds the schematic perspective view in man-hour via pressure setting for the present invention's the 8th preferred embodiment lead frame;
Figure 28 adds the schematic perspective view in man-hour via shaped device for the present invention's the 8th preferred embodiment lead frame;
Figure 29 is the schematic perspective view after the processing of the present invention's the 8th preferred embodiment lead frame;
Figure 30 adds the schematic perspective view in man-hour via pressure setting for the present invention's the 9th preferred embodiment lead frame;
Figure 31 adds the schematic perspective view in man-hour via shaped device for the present invention's the 9th preferred embodiment lead frame;
Figure 32 is the schematic perspective view after the processing of the present invention's the 9th preferred embodiment lead frame;
Figure 33 adds the schematic perspective view in man-hour via pressure setting for the present invention's the tenth preferred embodiment lead frame;
Figure 34 adds the schematic perspective view in man-hour via shaped device for the present invention's the tenth preferred embodiment lead frame;
Figure 35 is the schematic perspective view after the processing of the present invention's the tenth preferred embodiment lead frame.
Drawing reference numeral explanation: 11 carriers; 111 lead frames; 112 chips; 113 contact components; The 113a lead; 113b coheres pad; 12 encapsulating materials; 21 carriers; 211 lead frames; The 211a junction surface; 212 chips; 213 contact components; The 213a lead; 213b coheres pad; 22 encapsulating materials; 311 lead frames; The 311a junction surface; 411 lead frames; The 411a junction surface; 413 punching and shearing devices; The 414a shaped device; The 414b shaped device; 511 lead frames; The 511a junction surface; 513 punching and shearing devices; The 514a shaped device; The 514b shaped device; 611 lead frames; The 611a junction surface; 613 punching and shearing devices; The 614a shaped device; The 614b shaped device; 711 lead frames; The 711a junction surface; 713 punching and shearing devices; The 714a shaped device; The 714b shaped device; 811 lead frames; The 811a junction surface; 911 lead frames; The 911a junction surface; 101 lead frames; The 101a junction surface; 102 lead frames; The 102a junction surface; The A bending place; The B bending place; The C bending place; The D bending place; The E bending place; The F bending place; The G bending place; The H bending place; The I bending place; The J bending place.
Embodiment
The invention provides a kind of lead frame encapsulation structure and manufacture method thereof, see also Fig. 4, Fig. 5 and Fig. 6, be first preferred embodiment of the present invention, as shown in the figure, it consists predominantly of carrier 21, more than one contact component 213 and encapsulating material 22, wherein this carrier 21 is made up of lead frame 211 and the chip 212 be located on this lead frame 211, and this lead frame 211 is by having preferable ductility, the material of preferable conductivity and preferable radiating effect constitutes, an end and contact component 213 with lead 213a connect, the other end of lead 213a then with cohere the pad 213b connect, with with chip 212 electrically conduct in outside, on this lead frame 211, establish more than one junction surface 211a, be arranged on the junction surface 211a of lead frame 211 and lead frame 211 with encapsulating material 22 again, affixed mutually via junction surface 211a and encapsulating material 22, so that this encapsulating material 22 reaches the effect that does not break away from lead frame 211.
Wherein the junction surface 211a of this lead frame 211 is in this preferred embodiment, be to make one in integrated mode, in detail, after promptly lead frame 211 being carried out initial processing with pressure setting, make lead frame 211 form a cylinder that probably is rectangle, and this rectangle cylinder is the preliminary shape of junction surface 211a, process at last with the junction surface 211a of shaped device again, the preliminary warpage of junction surface 211a is become have the L shaped cylinder of toppling over of bending place A lead frame 211.
And this has the junction surface 211a of bending place A, be arranged on the junction surface 211a of lead frame 211 and lead frame 211 at encapsulating material 22 and after the cooling, under the effect of the shape and structure of the junction surface of lead frame 211 211a own, not only can make this encapsulating material 22 reach the effect that does not break away from lead frame 211, and more can make encapsulating material 22 and lead frame 211 reach tight effect, especially when being provided with a plurality of junction surface 211a on this lead frame 211 simultaneously, the effect that it reached is better, so, this junction surface 211a can be not limited to two groups shown in preferred embodiment graphic, in other words, can set up to a plurality of or many groups.
Please continue to consult Fig. 7, as shown in the figure, schematic perspective view for the present invention's second preferred embodiment lead frame 311 courses of processing, its overall structure is roughly identical with first preferred embodiment, promptly repeat no more at this, and it does not exist together and is the junction surface 311a on the lead frame 311, this junction surface 311a will suppress than the 311 thick mother metals of the lead frame shown in Fig. 7 via pressure setting, make form the preliminary shape of junction surface 311a on the lead frame 311 after, again by shaped device be made for have a bending place B topple over く shape cylinder, so this preferred embodiment described junction surface 311a, be to constitute by the bending forming of the punch forming of pressure setting and shaped device.
Please continue to consult Fig. 8, Fig. 9, Figure 10 and Figure 11, as shown in the figure, schematic perspective view for the present invention's the 3rd preferred embodiment lead frame 411 courses of processing, its overall structure is roughly identical with first preferred embodiment, promptly repeat no more at this, and it does not exist together and is the junction surface 411a on the lead frame 411, after this junction surface 411a goes out the preliminary shape of junction surface 411a via punching and shearing device 413 with the 411 inner appropriate location punchings of the lead frame shown in the 9th figure, again by shaped device (414a, 414b) be made for and have the L shaped cylinder of toppling over of bending place C, so the described junction surface 411a of this preferred embodiment is punching moulding and the shaped device (414a by punching and shearing device 413, bending forming 414b) and constituting.
Please continue to consult Figure 12, Figure 13, Figure 14 and Figure 15, as shown in the figure, schematic perspective view for the present invention's the 4th preferred embodiment lead frame 511 courses of processing, its overall structure is roughly identical with first preferred embodiment, promptly repeat no more at this, and it does not exist together and is the junction surface 511a on the lead frame 511, after this junction surface 511a goes out the preliminary shape of junction surface 511a via punching and shearing device 513 with the 511 inner appropriate location punchings of the lead frame shown in Figure 13, again by shaped device (514a, 514b) be made for have a bending place D topple over く shape cylinder, so the described junction surface 511a of this preferred embodiment is punching moulding and the shaped device (514a by punching and shearing device 513, bending forming 514b) and constituting.
Please continue to consult Figure 16, Figure 17, Figure 18 and Figure 19, as shown in the figure, schematic perspective view for the present invention's the 5th preferred embodiment lead frame 611 courses of processing, its overall structure is roughly identical with first preferred embodiment, promptly repeat no more at this, and it does not exist together and is the junction surface 611a on the lead frame 611, after this junction surface 611a goes out the preliminary shape of junction surface 611a via punching and shearing device 613 with the 611 proximal edge place punchings of the lead frame shown in Figure 17, again by shaped device (614a, 614b) be made for and have the L shaped cylinder of toppling over of bending place E, so the described junction surface 611a of this preferred embodiment is punching moulding and the shaped device (614a by punching and shearing device 613, bending forming 614b) and constituting.
Please continue to consult Figure 20, Figure 21, Figure 22 and Figure 23, as shown in the figure, schematic perspective view for the present invention's the 6th preferred embodiment lead frame 711 courses of processing, its overall structure is roughly identical with first preferred embodiment, promptly repeat no more at this, and it does not exist together and is the junction surface 711a on the lead frame 711, after this junction surface 711a goes out the preliminary shape of junction surface 711a via punching and shearing device 713 with the 711 proximal edge place punchings of the lead frame shown in Figure 21, again by shaped device (714a, 714b) be made for have a bending place F topple over く shape cylinder, so the described junction surface 711a of this preferred embodiment is punching moulding and the shaped device (714a by punching and shearing device 713, bending forming 714b) and constituting.
Please continue to consult Figure 24, Figure 25 and Figure 26, as shown in the figure, schematic perspective view for the present invention's the 7th preferred embodiment lead frame 811 courses of processing, its overall structure is roughly identical with first preferred embodiment, promptly repeat no more at this, and it does not exist together and is the junction surface 811a on the lead frame 811, after this junction surface 811a goes out the preliminary shape (as Figure 25) of junction surface 811a via punching and shearing device with the 811 proximal edge place punchings of the lead frame shown in Figure 24, be made for by shaped device again and have the L shaped cylinder of toppling over of bending place G (as Figure 26).
Please continue to consult Figure 27, Figure 28 and Figure 29, as shown in the figure, schematic perspective view for the present invention's the 8th preferred embodiment lead frame 911 courses of processing, its overall structure is roughly identical with first preferred embodiment, promptly repeat no more at this, and it does not exist together and is the junction surface 911a on the lead frame 911, after this junction surface 911a goes out the preliminary shape (as Figure 28) of junction surface 911a via punching and shearing device with the 911 proximal edge place punchings of the lead frame shown in Figure 27, be made for by shaped device again and have the L shaped cylinder of toppling over of bending place H (as Figure 29).
Please continue to consult Figure 30, Figure 31 and Figure 32, as shown in the figure, schematic perspective view for the present invention's the 9th preferred embodiment lead frame 101 courses of processing, its overall structure is roughly identical with first preferred embodiment, promptly repeat no more at this, and it does not exist together and is the junction surface 101a on the lead frame 101, after this junction surface 101a goes out the preliminary shape (as Figure 31) of junction surface 101a via punching and shearing device with the 101 proximal edge place punchings of the lead frame shown in Figure 30, be made for by shaped device again and have the L shaped cylinder of toppling over of bending place I (as Figure 32).
Please continue to consult Figure 33, Figure 34 and Figure 35, as shown in the figure, schematic perspective view for the present invention's the tenth preferred embodiment lead frame 102 courses of processing, its overall structure is roughly identical with first preferred embodiment, promptly repeat no more at this, and it does not exist together and is the junction surface 102a on the lead frame 102, after this junction surface 102a goes out the preliminary shape (as Figure 34) of junction surface 102a via punching and shearing device with the 102 proximal edge place punchings of the lead frame shown in Figure 33, again by shaped device be made for have a bending place J topple over く shape cylinder (as Figure 35).
The above only is preferable feasible embodiment of the present invention, and the variation that utilizes the above-mentioned method of the present invention, shape, structure, device to do such as all should be contained in the interest field of this case.
Claims (10)
1. lead frame encapsulation structure, it is characterized in that this lead frame encapsulation structure comprises at least: carrier and more than one contact component, wherein this carrier comprises more than one chip and lead frame at least, this lead frame is established more than one junction surface in order to carries chips on carrier; Wherein aforementioned contact component and chip have the property of conducting, and are located on lead frame and the junction surface with encapsulating material, are bonded with each other via junction surface and encapsulating material, make this encapsulating material and lead frame reach the effect that does not break away from.
2. lead frame encapsulation structure as claimed in claim 1, wherein this lead frame is made of the material with preferable ductility.
3. lead frame encapsulation structure as claimed in claim 1, wherein this lead frame is made of the material with preferable conductivity.
4. lead frame encapsulation structure as claimed in claim 1, wherein this lead frame is made of the material with preferable radiating effect.
5. lead frame encapsulation structure as claimed in claim 1, wherein this contact component is to be connected with lead with chip.
6. lead frame encapsulation structure as claimed in claim 5, wherein this lead is to be connected to cohere pad with chip.
7. lead frame encapsulation structure as claimed in claim 1, wherein this junction surface can be the L shaped plate of toppling over.
8. lead frame encapsulation structure as claimed in claim 1, wherein this junction surface can be the ㄑ shape plate of toppling over.
9. the manufacture method of a lead frame encapsulation structure is characterized in that, comprising:
(a) provide a lead frame, lead frame is processed, make and form the preliminary shape in more than one junction surface on the lead frame with pressure setting;
(b) with the preliminary shape processing of shaped device, make and made more than one junction surface on the lead frame junction surface on the lead frame;
(c) on described lead frame, accept a chip, with lead described chip and at least one are positioned at the outer contact component of lead frame and are electrically connected;
(d) be located at lead frame and junction surface with encapsulating material again.
10. the manufacture method of a lead frame encapsulation structure is characterized in that, comprising:
(a) provide a lead frame, lead frame is processed, make and form the preliminary shape in more than one junction surface on the lead frame with punching and shearing device;
(b) with the preliminary shape processing of shaped device, make and made more than one junction surface on the lead frame junction surface on the lead frame;
(c) on described lead frame, accept a chip, with lead described chip and at least one are positioned at the outer contact component of lead frame and are electrically connected;
(d) be located at lead frame and junction surface with encapsulating material again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100423820A CN100385654C (en) | 2004-05-28 | 2004-05-28 | Wire rack packaging structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100423820A CN100385654C (en) | 2004-05-28 | 2004-05-28 | Wire rack packaging structure and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN1705115A CN1705115A (en) | 2005-12-07 |
| CN100385654C true CN100385654C (en) | 2008-04-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100423820A Expired - Fee Related CN100385654C (en) | 2004-05-28 | 2004-05-28 | Wire rack packaging structure and manufacturing method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2376078Y (en) * | 1999-01-22 | 2000-04-26 | 太宇科技股份有限公司 | Semiconductor encaspulated element |
| CN2437045Y (en) * | 2000-07-26 | 2001-06-27 | 胜开科技股份有限公司 | Integrated circuit package structure |
| US20020146864A1 (en) * | 2001-04-04 | 2002-10-10 | Yoshinori Miyaki | Semiconductor device and method of manufacturing the same |
| US6580160B2 (en) * | 1999-08-17 | 2003-06-17 | Micron Technology, Inc. | Coupling spaced bond pads to a contact |
-
2004
- 2004-05-28 CN CNB2004100423820A patent/CN100385654C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2376078Y (en) * | 1999-01-22 | 2000-04-26 | 太宇科技股份有限公司 | Semiconductor encaspulated element |
| US6580160B2 (en) * | 1999-08-17 | 2003-06-17 | Micron Technology, Inc. | Coupling spaced bond pads to a contact |
| CN2437045Y (en) * | 2000-07-26 | 2001-06-27 | 胜开科技股份有限公司 | Integrated circuit package structure |
| US20020146864A1 (en) * | 2001-04-04 | 2002-10-10 | Yoshinori Miyaki | Semiconductor device and method of manufacturing the same |
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| Publication number | Publication date |
|---|---|
| CN1705115A (en) | 2005-12-07 |
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