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CN100378111C - Compound, synthetic method and application of organosilicon containing carbon-oxygen-ether linkage - Google Patents

Compound, synthetic method and application of organosilicon containing carbon-oxygen-ether linkage Download PDF

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CN100378111C
CN100378111C CNB200510027452XA CN200510027452A CN100378111C CN 100378111 C CN100378111 C CN 100378111C CN B200510027452X A CNB200510027452X A CN B200510027452XA CN 200510027452 A CN200510027452 A CN 200510027452A CN 100378111 C CN100378111 C CN 100378111C
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oxygen
organosilicon
ether bond
compound containing
carbon
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CN1727349A (en
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麻生明
杨青
肖丰收
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Shanghai Institute of Organic Chemistry of CAS
Jilin University
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Shanghai Institute of Organic Chemistry of CAS
Jilin University
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Abstract

The present invention relates to an organosilicon compound containing a carbon-oxygen-ether linkage, a synthetic method thereof and an application of the organosilicon compound containing the carbon-oxygen-ether linkage in the surface modification of mesoporous silicon materials. The structural formula of the compound is disclosed in the figure I; the compound can be used for synthesizing the following organosilicon materials containing the carbon-oxygen-ether linkage, (which is disclosed in the figure II.), wherein R is hydrocarbyl of C1 to C6, and R1, R2 and R3 are alkyl groups of C1 to C6; mesoporous materials whose mesoporous pore canals are 2.0 to 50 nm have a bidimensional cubic syngony, a bidimensional hexagonal syngony, a tridimensional cubic syngony or a tridimensional hexagonal syngony, which is disclosed in the figure III. The method has the advantages of simplicity, high efficiency, easy obtainment of material, simple operation, convenient post-treatment, high reaction yield, simple reaction device and easy industrial production.

Description

Organic silicon compound containing carbon-oxygen ether bond, synthetic method and application thereof
Technical Field
The invention relates to a novel organic silicon compound containing carbon-oxygen ether bond, a synthetic method and application thereof. The synthesis method of the compound is to generate an organic silicon compound through olefin hydrosilation reaction. Organosilicon containing different numbers and types of carbon-oxygen ether bonds can be synthesized through different alkene substrates; or grafted to the surface of the silicon material, thereby changing the properties of the silicon material. The modified silicon material can be applied to a supported catalyst for synthesizing a noble metal catalyst. The modified silicon material is also potentially applied to metal adsorption, hydrophilic and hydrophobic regulation of the surface of the material, and phase transfer catalysis, and provides wide prospects for industrial production thereof.
Background
MCM-4 mesoporous silica materials previously reported by scientists of Mobil corporation in 1992 were popular among scientists of (a) C.T.Kresge, M.E.Leonowicz, W.J.Roth, J.C.Vartuli, J.S.Beck, Nature, 1992, 359, 710 (b) J.S.Beck, J.C.Vartuli, W.J.Roth, M.E.Leonowicz, C.T.Kresge, K.D.Schmitt, C.T-W.Chu, D.H.Olson, E.W.Sheppard, S.B.McCullen, J.B.Higgins, J.L.Schlenker, J.Am.Chem.1992.1992, 114, 10834 mesoporous silica materials. The silicon material has many advantages, such as very high specific surface area (500-2The/g), adjustable uniform regular mesoporous channels, high chemical stability and hydrothermal stability. [ (a) d.zhao, j.feng, q.huo, n.melosh, g.h.fredrickson, b.f.chmelka, g.d.stucky, Science1998, 279, 548.(b) y.liu, w.zhang, t.j.pinnavaia, j.am.chem.soc.2000, 122, 8791.(c) y.liu, w.zhang, t.j.pinnaavaia, angew.chem.int.ed.2001, 40, 1255.(d) y.han, f.s.xiao, s.wu, j.phys.chem.b.2001, 105, 7963.(e) y.han, d.li, l.zhao, f.zhao, s.zhao, s.yhu, j.phys.chem.2001, 7963, e.han, d.li, l.zhao, s.zhao, s.yhao, s.ihtmao, si.e.e.e.2003, si-via-oh, si-h.e.e, si-h, si-g. 33, h, si-si. These organosilicon modified mesoporous materials can be used in catalysis, as [ (a) d.e.de Vos, m.das, b.f.sels, p.a.jacobs, chem.rev.2002, 102, 3615.(b) r.raja, j.m.thomas, m.d.jones, b.f.g Johnson, d.e.w Vaughan, j.am.chem.soc.2003, 125, 14982.(c) s.huh, h-t.n, j.w.wich en, m.pruski, v.s. -y.lin, j.am.soc.2004, 126, 1010.(d) c.h.christen, john.133schenen, i.midt, c.h.christen, am.soc.2004, 126, 1010.(d) c.h.christen, john.133yan, i.midt, c.h.christen, am.m.m.2002, molve.h.m.m.m.h.m.2002, levam.g.p.r.r.70, levam.r.r.r.r.r.t.r.r.r.t.m.r.m.g; 4,4297. (f) m.jia,; seifert,; thiel, chem. mater.2003, 15, 2174.(g) m.jia, a.seifert, m.berger, h.giegengack, s.schulze, w.r.thiel, chem. mater.2004,16,877.(h)M.V.Vasylyev,R.Neumann,J.Am.Chem.Soc.2004,126,884.(i)K.Mukhopadhyay,A.B.Mandale,R.V.Chaudhari,Chem.Mater.2003,15,1766.(j)V.S.-Y.Lin,D.R.Radu,M.-K.Han,W.Deng,S.Kuroki,B.H.Shanks,M.Pruski,J.Am.Chem.Soc.2002,124,9040.(k)A.Vinu,T.Krithiga,V.Murugesan,M.Hartmann,Adv.Mater.2004,16,1817.(1)R.Becker,H.Parala,F.Hipler,O.P.Tkachenko,K.V.Klementiev,W.Grünert,H.Wilmer,O.Hinrichsen,M.Muhler,A.Birkner,C.Wöll,S.Sch*fer,R.A.Fischer,Angew.Chem.Inter.Ed.2004,43,2839.(m)M.Chatterjee,F.Y.Zhao,Y.Ikushima,Adv.Syn.&Catal.2004,346,459.(n)D.S.Shephard,T.Maschmeyer,B.F.G.Johnson,J.M.Thomas,G.Sankar,D.Ozkaya,W.Zhou,R.D.Oldroyd,R.G.Bell,Angew.Chem.Inter.Ed.1997,36,2242.(o)P.Sreekanth,S.-W.Kim,T.Hyeon,B.M.Kim,Adv.Syn.& Catal.2003,345,936.(p)J.H.Clark,A.J.Butterworth,S.J.Tavener,A.J.Teasdale,S.J.Barlow,T.W.Bastock,K.Martin,J.Chem.T ech.Biotechnol.1997,68,367.(q)J.D.Bass,S.L.Anderson,A.Katz,Angew.Chem.Int.Ed.2003,42,5219.(r)P.Ferreira,I.S.Gonc,F.E.Kühn,A.D.Lopes,M.A.Martins,Ma.Pillinger,A.Pina,J.Rocha,C.C.
Figure C20051002745200051
santos, t.m.santos, a.a.valente.eur.j.inorg.chem.2000, 2263(s) k.mukhopadhyay, a.b.mandale, r.v.chaudhart, chem.mater.2003, 15, 1766. adsorption of metal ions,' (a) x.feng, g.e.fryxell, l.q.wang, a.y.kim, j.liu, k.m.mnner, Science, 1997, 276, 923.(b) l.mercier, t.j.pinnanvaia, adv.mater.1997, 9, 500.(C) j.liu, x.feng, g.e.frxe, l.q.wang.wang.m, a.y.wang.m, goarv.mater.161, gore.161, gore.15, chalce.r.t.j.j.j.n.p.neu, Science, r.r.r.t.m.wang.m.m.m.santos, gore.t.t.r.r.t.t.r.r.r.r.t.r.r.t.r.r.t.r.t.r.r.r.t.r.t.r.r.r.161, gore.e.e.e.15. e.r.Chem.Mater.2003,15,4181.(f)V.Antochshuk,Ok.Olkhovyk,Mi.Jaroniec,I.-S.ParkR.Ryoo, Langmuir, 2003, 19, 3031, for controlled release of drug or guest molecules, [ N.K.Mal, M.Fujiwara, Y.tanaka, Nature 2003, 421, 350 ] (b) N.K.Mal, M.Fujiwara, Y.tanaka, T.Taguchi, M.Matsukata, chem.Mater.2003, 15, 3385.(c) C.Y.Lai, B.G.Trewyn, D.M.Jettija, K.Jettiija, S.xu, S.Jettiijja, V.S.S.Lin, J.Am.C.Soc.125, 2003, 4451.(d) D.R.Radu, C.Lattinji, Largi.S.S.S.Lin, J.2004, J.S.S.S.Lin, J.S.S.S.S.S.Lin, J.S.S.S.S.S.S.S.S.D.D.D.D.D.D.D.R.D.D.R.D.R.D.E.E.E.D.E.E.E.S.S.S.S.S.S.S.S.S.S.S.S.S.S.J.S.S.S.S.S.J.S.S.S.S.S.S.S.S.S.S.S.S.S.J.S.S.S.S.S.S.S.S.S.J.S.S.S.S. [ (a) E.W.Hagaman, H.Zhu, S.H.Overbury, S.Dai, Langmir, 2004, 20, 9577 ] although documents [ (a) M.E.Havill, I.Joffe, H.W.post, J.org.Chem.1948, 2, 282.(b) A.Behr, F.Naendrup, D.Obst, adv.Sunth.Catal, 2002, 344, 1142 ] have reported the formation of organosilicon compounds by olefin hydrosilation using chloroplatinic acid as a catalyst, this novel carbon-bond-containing organosilicon has not been reported. Because the organosilicon has a structure similar to crown ether, the mesoporous material modified by the organosilicon has strong complexing ability to metal and hydrophilicity and lipophilicity. Here, the palladium catalyst supported by the mesoporous material modified by the organic silicon is reported for the first time. The catalyst shows extremely high catalytic activity in the reaction, is stable in air, is environment-friendly, and can be recycled and uses water as a solvent.
Disclosure of Invention
The invention aims to provide a novel compound, namely an organic silicon compound containing a carbon-oxygen-ether bond.
The invention also aims to provide a synthetic method of the organic silicon compound containing the carbon-oxygen ether bond.
The invention also provides the use of the organosilicon compounds described above, i.e. for the surface modification of silicon materials.
The organosilicon compound containing carbon-oxygen-ether bond is added with the following structural formula:
wherein n is 1 to 20, R1、R2、R3Is C1~6R is C1~6Of hydrocarbon radicals, e.g. C1~6Alkyl or phenyl of
The synthetic method of the organic silicon compound containing the carbon-oxygen ether bond can be synthesized by the following method, and the typical reaction formula is as follows:
Figure C20051002745200062
the method comprises the following steps: neutralizing in an organic solvent at a temperature of-78-70 DEG C
Figure C20051002745200071
Figure C20051002745200072
And reacting with a catalyst for 0.5-48 hours to obtain the carbon-oxygen ether bond organic silicon compound. Wherein,
Figure C20051002745200073
the molar ratio of the catalyst to the catalyst is 1: 2-100: 0.001-10.0. The recommended molar ratio is 1: 2.2-30: 0.20-0.001.
The catalysts used may be: chloroplatinic acid (H)2PtCl6) Or rhodium acetylacetonate (Rh (acac)3) And the like. The reaction solvent is a conventional organic solvent such as N-hexane, cyclohexane, toluene, tetrahydrofuran, dichloromethane, dimethyl sulfoxide, N-dimethylformamide, 1, 4-dioxane, acetone, diethyl ether or acetonitrile.
The organic silicon compound containing the carbon-oxygen-ether bond can be used for synthesizing modified silicon materials, and the organic silicon material containing the carbon-oxygen-ether bond has the following structural formula;
Figure C20051002745200074
wherein n is 1-20, R is C1~6Of hydrocarbon radicals, e.g. C1~6The alkyl group or the phenyl group of (a),
Figure C20051002745200075
the mesoporous material can be a mesoporous pore channel of 2.0-50 nm, and the crystal system of the mesoporous material can be a two-dimensional cube, a two-dimensional hexagon, a three-dimensional cube or a three-dimensional hexagon. Preferred is a mesoporous silica material satisfying the above conditions.
The typical reaction formula of the organic silicon compound containing the carbon-oxygen ether bond for synthesizing the organic silicon material containing the carbon-oxygen ether bond is as follows:
Figure C20051002745200076
wherein n can be between 1 and 20, R is C1~6The hydrocarbon group of (2) may be an alkyl group such as a methyl group, an ethyl group, a propyl group, or a hexyl group, or a phenyl group, and the organosilicon compound containing a carbon-oxygen-ether bond is as described above. The mesoporous material can be a silicon material with a mesoporous pore channel of 2.0-50 nm, and the crystal system of the mesoporous material can be a two-dimensional cube, a two-dimensional hexagon, a three-dimensional cube or a three-dimensional hexagon. Preferred is a mesoporous silica material satisfying the above conditions.
The synthesis method of the organosilicon material containing carbon-oxygen-ether bond comprises the following steps: the mesoporous material and the organic silicon compound are reacted for 2-48 hours at the temperature of 20-200 ℃ in an organic solvent to obtain the silicon material modified by the organic silicon compound with carbon-oxygen ether bond. The molar ratio of silicon elements of the mesoporous material and the carbon-oxygen ether bond organic silicon compound is 10-10000: 1. The recommended molar ratio is 10-300: 1.
The reaction solvent used is a conventional organic solvent such as N-hexane, cyclohexane, toluene, tetrahydrofuran, dichloromethane, dimethyl sulfoxide, N-dimethylformamide, 1, 4-dioxane, acetone, diethyl ether, acetonitrile, etc.
The organosilicon material containing the carbon-oxygen-ether bond is expected to be capable of synthesizing a supported metal catalyst.
The invention generates organosilicon compounds by the hydrosilylation reaction of olefins. Silicones containing different numbers and types of carbon-oxygen bonds can be synthesized by different olefinic substrates. The method is simple and is a convenient and effective method. (1) The raw materials are convenient and easy to obtain, the operation is simple, and the post-treatment is convenient. (2) The reaction yield is high. (3) The reaction equipment is simple and easy for industrial production.
The organic silicon compound can be grafted on the surface of the silicon material, so that the property of the silicon material is changed. The modified silicon material is hopeful to be used for supporting the metal palladium catalyst.
Detailed Description
The following examples are helpful in understanding the present invention, but are not intended to limit the invention:
example 1
(1) Preparation of organosilicon Compound 1:
Figure C20051002745200081
the operation is as follows: chloroplatinic acid (0.5 mol%) was dried under vacuum at 180 ℃ for 2 hours, and ethyl-allyl-tetraethyleneglycol ether (0.1mol) and triethoxysilylhydride (0.3mol) were added and stirred at room temperature for 1 day. Steaming to remove excessive triethoxysilicanhydride, vacuum pumping, and steaming at 178 deg.CA colored liquid to give 27.5g of product.1H NMR(300MHz,CDCl3):δ3.79(q,J=7.2Hz,6H),3.64-3.43(m,18H),3.39(t,J=6.9Hz,2H),1.71-1.61(m,2H),1.19-1.14(m,12H),0.59(t,J=8.4Hz,2H)。13C NMR(75MHz,CDCl3):δ73.4,70.9,70.6,70.1,63.0,51.3,17.9,15.5,14.7,8.0;MS m/z(%)337(100),427(M+35.45); calculated value of elemental analysis, C19H42O8Si: c, 53.49; h, 9.92; measured value: c, 53.65; h, 9.70.
Example 2
(2) Preparation of organosilicon Compound 2:
Figure C20051002745200091
the operation is as follows: the operation is as follows: chloroplatinic acid (0.5 mol%) was dried under vacuum at 180 ℃ for 2 hours, and methyl-allyl-tetraethyleneglycol ether (0.1mol) and triethoxysilylhydride (0.3mol) were added and stirred at room temperature for 1 day. Excess triethoxysilicane hydrogen was distilled off, the vacuum pump was used for pressure reduction, and colorless liquid was distilled off at 178 ℃ to obtain 27.3g of product.1H NMR(300MHz,CDCl3):δ3.78(q,J=7.2Hz,6H),3.64-3.43(m,18H),3.39(t,J=6.9Hz,2H),3.25(t,J=8.4Hz,3H),1.71-1.61(m,2H),1.23(t,J=8.2Hz,9H),0.59(t,J=8.4Hz,2H)。13C NMR(75MHz,CDCl3):δ70.9,70.6,70.1,63.0,53.9,51.3,17.9,15.5,8.0;MS m/z(%)323(100),413(M+22.23); calculated value of elemental analysis, C18H40O8Si: c, 52.40; h, 9.77; measured value: c, 52.62; h, 9.65.
Example 3
(3) Preparation of organosilicon Compound 3:
the operation is as follows: chloroplatinic acid (0.5 mol%) was dried under vacuum at 180 ℃ for 2 hours, and phenyl-allyl-tetraethyleneglycol ether (0.1mol) and triethoxysilylhydride (0.3mol) were added and stirred at room temperature for 1 day. Excess triethoxysilicane hydrogen was distilled off, the vacuum pump was used for pressure reduction, and colorless liquid was distilled off at 178 ℃ to obtain 32.8g of product.1H NMR(300MHz,CDCl3):δ6.90-6.76(m,5H),4.20(t,J=6.9Hz,2H),3.79(q,J=7.2Hz,6H),3.64-3.43(m,16H),1.70-1.64(m,2H),1.19-1.14((t,J=7.2Hz,9H),0.69(t,J=8.4Hz,2H)。13C NMR(75MHz,CDCl3):δ158.8,129.1,120.1,114.2,73.4,70.9,70.6,70.5,51.3,17.9,15.5,14.7,8.0;MS m/z(%)385(100),475(M+22.54); calculated value of elemental analysis, C23H42O8Si: c, 58.20; h, 8.92; measured value: c, 58.45; h, 8.70.
Example 4
(4) Preparation of organosilicon Compound 4:
Figure C20051002745200101
the operation is as follows: chloroplatinic acid (0.5 mol%) was dried under vacuum at 180 ℃ for 2 hours, and ethyl-allyl-triethylene glycol ether (0.1mol) and trimethoxysilylhydride (0.3mol) were added and stirred at room temperature for 1 day. Excess trimethoxysilylhydride was distilled off, the pressure was reduced by means of a vacuum pump, and a colorless liquid was distilled off at 169 ℃ to give 28.6g of a product.1H NMR(300MHz,CDCl3):δ3.74(q,J=7.2Hz,6H),3.64-3.43(m,14H),3.38(t,J=6.9Hz,2H),1.70-1.56(m,2H),1.17-1.10(m,12H),0.58(t,J=8.4Hz,2H)。13C NMR(75MHz,CDCl3):δ73.4,70.9,70.6,70.1,63.0,51.3,17.9,15.5,14.7,8.0;MS m/z(%)293(100),383(M+53.21); elemental analysisCalculated value, C19H42O8Si: c, 53.37; h, 10.01; measured value: c, 53.55; h, 9.73.
Example 5
(5) Preparation of organosilicon Compound 5:
Figure C20051002745200102
the operation is as follows: chloroplatinic acid (0.5 mol%) was dried under vacuum at 180 ℃ for 2 hours, and phenyl-allyl-triethylene glycol ether (0.1mol) and triethoxysilylhydride (0.3mol) were added and stirred at room temperature for 1 day. Excess triethoxysilicane hydrogen was distilled off, the vacuum pump was used for pressure reduction, and colorless liquid was distilled off at 178 ℃ to obtain 32.8g of product.1H NMR(300MHz,CDCl3):δ6.90-6.76(m,5H),4.20(t,J=6.9Hz,2H),3.79(q,J=7.2Hz,6H),3.64-3.43(m,12H),1.70-1.64(m,2H),1.19-1.14((t,J=7.2Hz,9H),0.69(t,J=8.4Hz,2H)。13C NMR(75MHz,CDCl3):δ158.8,129.1,120.1,114.2,73.4,70.9,70.6,70.5,51.3,17.9,15.5,14.7,8.0;MS m/z(%)341(100),431(M+32.22); calculated value of elemental analysis, C23H42O8Si: c, 58.58; h, 8.89; measured value: c, 58.29; h, 8.92.
Example 6
(6) Preparing the mesoporous silicon material modified by the organic silicon 1:
the operation is as follows: 13.0g of the mesoporous material (SBA-15) treated with ethanol reflux was placed in a 100ml three-necked flask and vacuum-dried at 120 ℃ for 3 hours. After cooling, toluene (60ml) and silicone 1(9.6g) were added and refluxed at 110 ℃ for 6 hours. The solvent was spin dried and then dried under vacuum at 150 ℃ for 12 hours to give a white powder. Washing with ethanol for 3 times, and airing in the air to obtain the surface modified mesoporous material. Elemental analysis showed that C content was 15.42% and organosilicon content was 1.0 mmol/g.
Example 7
(7) Preparing the mesoporous silicon material modified by the organic silicon 2:
the operation is as follows: 10.0g of the mesoporous material (SBA-15) treated with ethanol reflux was placed in a 100ml three-necked flask and vacuum-dried at 120 ℃ for 3 hours. After cooling, toluene (60ml) and silicone 1(8.0g) were added and refluxed at 110 ℃ for 6 hours. The solvent was spin dried and then dried under vacuum at 150 ℃ for 12 hours to give a white powder. Washing with ethanol for 3 times, and airing in the air to obtain the surface modified mesoporous material. Elemental analysis showed C content 14.93% and organosilicon content 1.0 mmol/g.
Example 8
(8) Preparing the mesoporous silicon material modified by the organic silicon 2:
the operation is as follows: 13.0g of the mesoporous material (SBA-15) treated with ethanol reflux was placed in a 100ml three-necked flask and vacuum-dried at 120 ℃ for 3 hours. After cooling, toluene (60ml) and silicone 5(9.0g) were added and refluxed at 110 ℃ for 6 hours. The solvent was spin dried and then dried under vacuum at 150 ℃ for 12 hours to give a white powder. Washing with ethanol for 3 times, and airing in the air to obtain the surface modified mesoporous material. Element analysis shows that the C content is 16.23 percent and the organic silicon content is 0.9 mmol/g.

Claims (8)

1. An organosilicon compound containing a carbon-oxygen-ether bond, which has the following structural formula:
Figure C2005100274520002C1
wherein R is C1~6A hydrocarbon group of R1、R2And R3=C1~6N is 1 to 20.
2. A process as claimed in claim 1The synthesis method of the organic silicon compound containing the carbon-oxygen-ether bond is characterized by comprising the following steps: neutralizing in an organic solvent at a temperature of-78-70 DEG C
Figure C2005100274520002C2
HSiOR1OR2OR3Reacting with a catalyst for 0.5-48 hours to obtain a compound with a structural formula
Figure C2005100274520002C3
The organosilicon compound containing a carbon-oxygen-ether bond of (a), wherein,
Figure C2005100274520002C4
HSiOR1OR2OR3the molar ratio of the catalyst to the catalyst is 1: 2-100: 0.001-10.0; the catalyst is chloroplatinic acid or acetylacetonatorhodium.
3. A process for synthesizing an organosilicon compound containing a carbon-oxygen-ether bond, as claimed in claim 2, wherein
In the method described
Figure C2005100274520002C5
HSiOR1OR2OR3The molar ratio of the catalyst to the catalyst is 1: 2.2-30: 0.001-0.20.
4. The application of the organosilicon compound containing carbon-oxygen ether bond as claimed in claim 1, wherein the organosilicon material is modified by grafting the organosilicon compound containing carbon-oxygen ether bond on the surface of the organosilicon material, wherein the organosilicon material is a mesoporous material with mesoporous pore channel of 2.0-50 nm and mesoporous material crystal system of two-dimensional cubic, two-dimensional hexagonal, three-dimensional cubic or three-dimensional hexagonal.
5. The use of organosilicon compounds containing carbon-oxygen ether linkages as claimed in claim 4, wherein the mesoporous material is a mesoporous silica material.
6. The application of the organosilicon compound containing carbon-oxygen ether bond as claimed in claim 4, wherein the grafting of the organosilicon compound containing carbon-oxygen ether bond to the surface of the organosilicon material is carried out by reacting the mesoporous material with the organosilicon compound containing carbon-oxygen ether bond at 20-200 ℃ for 2-48 hours in an organic solvent to obtain the organosilicon modified silicon material containing carbon-oxygen ether bond, wherein the mesoporous material is as claimed in claim 4, and the organosilicon compound containing carbon-oxygen ether bond is as claimed in claim 1.
7. The use of the organosilicon compound containing carbon-oxygen ether bond as claimed in claim 6, wherein the molar ratio of silicon element between the mesoporous material and the organosilicon compound containing carbon-oxygen ether bond is 10-300: 1.
8. The use of organosilicon compounds containing carbo-thioether bonds as claimed in claim 6, wherein the organic solvent is N-hexane, cyclohexane, toluene, tetrahydrofuran, dichloromethane, dimethyl sulfoxide, N-dimethylformamide, 1, 4-dioxane, acetone, diethyl ether or acetonitrile.
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