CN100377331C - Semiconductor package loading stage and semiconductor package device handler including same - Google Patents
Semiconductor package loading stage and semiconductor package device handler including same Download PDFInfo
- Publication number
- CN100377331C CN100377331C CNB2005100687240A CN200510068724A CN100377331C CN 100377331 C CN100377331 C CN 100377331C CN B2005100687240 A CNB2005100687240 A CN B2005100687240A CN 200510068724 A CN200510068724 A CN 200510068724A CN 100377331 C CN100377331 C CN 100377331C
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- Prior art keywords
- loading
- semiconductor packages
- loading stage
- stage
- station
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- Expired - Lifetime
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
One kind of semiconductor package loading stage capable of setting the semiconductor package precisely to its notch and one kind of semiconductor package treating machine with the semiconductor package loading stage are disclosed. The semiconductor package loading stage includes a loading assembly for setting semiconductor packages on it. The loading assembly includes one first loading part and one second loading part separated from the first one by certain interval, and the first loading part and the second loading part form setting notches and non-setting gaps alternately so as to make the sides of the notches not contact directly.
Description
The application's application number that to be the applicant submit to March 29 calendar year 2001 is 01109514.8, name is called the dividing an application of patent application of " treatment system that is used for cutting semiconductor packing device ".
Technical field
The present invention relates generally to semiconductor packages loading stage and the semiconductor packages processor that comprises this semiconductor packages loading stage.The present invention be more particularly directed to comprise the semiconductor packages processor of carrying pick-up and the semiconductor packages loading stage of in settling groove, accurately laying the semiconductor packages of clean dried, wherein by using cutting machine, for example machine for sawing will cut into single semiconductor packages by the semiconductor chip that has encapsulated that complete semiconductor fabrication produces and make described each semiconductor packages.
Background technology
Usually, semiconductor packages is made in such a way by the semiconductor packages processor: will have the semiconductor chip of highly integrated circuit, and for example be formed on transistor on the semiconductor wafer and electric capacity etc., and be welded to the semiconductor chip of being made by silicon; Utilize resin that this semiconductor chip is sealed on this semiconductor chip; To be welded to the lower surface of this semiconductor chip as the ball grid array of wire holder, so that electric current is applied to this chip; And use cutting machine that this chip cutting is become single semiconductor packages.
Then, semiconductor packages is purified and dried, in cutting process, adhere to its surperficial foreign substance so that remove, and by using the semiconductor packages load units with its arrangement or be transported on the carriage (tray).
The semiconductor packages load units uses loading stage, loads semiconductor packages thereon, and comprises loading part, forms some arrangement grooves of corresponding semiconductor packages quantity thereon, so that semiconductor packages is settled thereon.
But, adjoin each other with matrix-style and lay owing to be formed on arrangement groove on the existing loading part, be difficult to accurately semiconductor packages is placed to these and settle groove.For addressing this problem, can be formed for thereon semiconductor packages accurately is directed to the encapsulation lead-in chamfered of settling groove, but, be difficult in and settle groove to form lead-in chamfered on every side because each settles the narrow gaps between the groove.
Summary of the invention
In order to address the above problem, the present invention is proposed, and an object of the present invention is to provide a kind of semiconductor packages loading stage, the semiconductor packages of clean dried accurately can be placed on the arrangement groove of this semiconductor packages loading stage, wherein, by using cutting machine, for example machine for sawing will cut into single semiconductor packages by the semiconductor chip that has encapsulated that complete semiconductor fabrication produces and make described each semiconductor packages; And provide a kind of semiconductor packages processor that comprises described semiconductor packages loading stage.
According to an aspect of the present invention, realize above-mentioned and other purpose by a kind of semiconductor packages loading stage is provided, described semiconductor packages loading stage comprises loading part, be used for loading a plurality of semiconductor packages thereon, wherein, described loading part alternately is formed with a plurality of non-arrangement space that is used to settle a plurality of arrangement grooves of described a plurality of semiconductor packages and does not lay described semiconductor packages, so that the side of a groove does not directly contact with the side of other grooves.
Described loading part can comprise first loading station and with this first loading station second loading station of preset distance at interval, described arrangement groove alternately is formed on described first and second loading stations, so that the position of the described arrangement groove of described first loading station is not corresponding with the position of the described arrangement groove of described second loading station.
Each described arrangement groove can be formed with vacuum passage, and this vacuum passage is communicated with the vacuum source that is used for supplying suction force, so that each semiconductor packages is settled by vacuum force.
Described semiconductor packages loading stage can comprise: go up loading stage, have the described loading station that is formed on its upper surface; And following loading stage, be fixed to the described lower surface of going up loading stage, and be formed with the vacuum port that is communicated with described vacuum passage.
Each described arrangement groove can be formed with lead-in chamfered at the edge, be used for each described semiconductor packages is guided to described arrangement groove, and described lead-in chamfered has the gradient of 20～40 degree.
According to a further aspect in the invention, provide a kind of semiconductor packages processor that comprises described semiconductor packages loading stage.
Described semiconductor packages processor can comprise supply unit, is used for moving described loading stage.Especially, described supply unit comprises the described transfer unit of loading stage down that is used to support described semiconductor packages loading stage, and has: nut piece; Be coupled to the screw rod of this nut piece, rotate so that described transfer unit is moved to the precalculated position by CD-ROM drive motor; And the loading stage guiding piece, be used to guide described transfer unit moving along described screw rod.
Described semiconductor packages processor may further include semiconductor packages and carries pick-up, is used for that single semiconductor packages is transported to the described arrangement groove of described loading part and the vacuum draw by each semiconductor packages is placed to it with each semiconductor packages.
Described semiconductor packages carries pick-up described semiconductor packages to be placed on the described arrangement groove of described loading part selectively by optionally controlling suction force.Can adopt described semiconductor packages to carry pick-up, be applied to by release and be sucked up to half the suction force that described semiconductor packages is carried the described semiconductor packages of pick-up, with described semiconductor packages described half be arranged to described first loading station, and, by discharging described suction force fully, with described semiconductor packages other half be arranged to described second loading station
Description of drawings
The purpose and the characteristic of other that can be expressly understood more that the present invention is above-mentioned by detailed description below in conjunction with accompanying drawing.Accompanying drawing comprises:
Fig. 1 a is the plane graph that illustrates according to semiconductor packages processor structure of the present invention, and Fig. 1 b is the front view of semiconductor packages processor among Fig. 1 a;
Fig. 2 a is the plane graph that an embodiment of semiconductor packages loading stage of the present invention is shown, and Fig. 2 b is the plane graph of the semiconductor packages loading stage among Fig. 2 a;
Fig. 3 a is the plane graph that an embodiment of semiconductor packages loading stage among Fig. 2 a is shown, and Fig. 3 b is the sectional view of the semiconductor packages loading stage shown in Fig. 3 a, and Fig. 3 c illustrates down the loading stage plane graph;
Fig. 4 a and Fig. 4 b are respectively plane graph and the vertical cross-section diagrams of an embodiment that the loading part of the load units shown in Fig. 2 a is shown; And
Fig. 5 is the end view that semiconductor packages of the present invention is carried an embodiment of pick-up.
Embodiment
With reference now to accompanying drawing, describes preferred embodiment in detail.
Referring to Fig. 1 a and Fig. 1 b, the semiconductor packages processor comprises: cutter sweep 110 is used for semiconductor strip is cut into single semiconductor packages; Semiconductor packages is carried pick-up 300, is used for by using vacuum draw to carry semiconductor packages; Semiconductor packages load units 200 is used to load the semiconductor packages that is sucked up to semiconductor packages conveying pick-up 300; Semiconductor packages is selected pick-up 400, be used for aspirating selectively the semiconductor packages that is positioned at loading attachment 200, and semiconductor packages is transported to visual detector 140 and carriage 500, in order to the semiconductor packages of selecting pick-up 400 to divide into non-substandard products and substandard products by semiconductor packages is carried out different loadings.
In Fig. 2 a and Fig. 2 b, show a embodiment according to semiconductor packages load units of the present invention.
Shown in Fig. 2 a and Fig. 2 b, loading attachment 200 comprises semiconductor packages loading stage 201, it has: first and second loading stations 211 and 212, be formed on the upper surface of this loading stage 201, carry a plurality of semiconductor packages of pick-up 300 alternately to be arranged to first and second loading stations so that be sucked into semiconductor packages; And a plurality of vacuum tubes 230, be connected to the lower surface of semiconductor packages loading stage 201, it is applied high suction force.
To Fig. 3 c, semiconductor packages loading stage 201 comprises referring to Fig. 3 a: go up loading stage 210, be formed with first and second loading stations 211 and 212 on it; And following loading stage 220, be fixed to the lower surface of loading stage 210 by a plurality of securing members as bolt 216 and so on, wherein, each loading station 211 and 212 alternately is formed with the non-arrangement space 213a that is used for settling a plurality of arrangement grooves 213 of a plurality of semiconductor packages thereon and does not lay semiconductor packages, so that one is settled the side of groove directly not contact with the side of other grooves.The upper surface of following loading stage 220 is formed with the vacuum groove that is communicated with following vacuum passage 214, is coupled to a plurality of vacuum ports 222 simultaneously, in order to the suction force of conduction from vacuum tube 230.
Simultaneously, shown in Fig. 2 a and Fig. 2 b, encapsulation load units 200 is suitable for moving by supply unit.This supply unit comprises the transfer unit 205 of the following loading stage 220 that is used to support this semiconductor packages loading stage, and has: nut piece 206; Be coupled to the screw rod 203 of this nut piece, rotate so that described transfer unit 205 is moved horizontally to the precalculated position by CD-ROM drive motor 69; And loading stage guiding piece 202, be used to guide described transfer unit 205 moving along described screw rod 203.
Shown in Fig. 4 a and Fig. 4 b, first and second loading stations 211 and 212 each settle groove 213 to have formation vacuum passage 214 in the central, and settling the lead-in chamfered 215 that forms of groove 213 on every side, in order to being guided to, semiconductor packages settles groove 213.The contact surface that reference number 217 expression and semiconductor packages directly contact.
Simultaneously, lead-in chamfered 215 forms along four limits of settling groove 213, and preferably, each lead-in chamfered 215 has the gradient of 20～40 degree, so that the guiding semiconductor packages.
Although present embodiment is described as by fastening bolt 216 fixing loading stages 210 and 220 up and down, common trip bolt also can replace fastening bolt 216.
In Fig. 5, show according to semiconductor packages of the present invention and carry pick-up.
As shown in Figure 5, semiconductor packages carries pick-up 300 to comprise: pick-up head 330 is used to aspirate each semiconductor packages through cutting; Vertically supply unit 320 is used for vertical mobile pick-up head 330; Horizontal feed unit 310 is used to move horizontally pick-up head 330.The lower surface of pick-up head 330 is formed with vaccum-suction attachement pad 333, and vaccum-suction attachement pad 333 has a plurality of vacuum passages 332 that are connected to the vacuum source (not shown), so that semiconductor packages directly is drawn into vaccum-suction attachement pad 333.
The following describes operation according to the semiconductor packages processor of the embodiment of the invention.
Shown in Fig. 1 a and Fig. 1 b, by the semiconductor packages of cutter sweep 110 cutting, after cleaning unit 120 purifies by drier 130 dryings.
After the dried of finishing above-mentioned semiconductor packages, semiconductor packages carries pick-up 300 to aspirate the semiconductor packages that is placed on the drier 130, and they are shifted to semiconductor packages load units 200.At this time, carry out the suction of semiconductor packages in such a manner: will be sent to the upper surface of semiconductor packages by vacuum passage 332 from the suction force of external vacuum source, and make semiconductor packages be sucked up to vaccum-suction attachement pad 333.
Next, semiconductor packages carries pick-up 300 to move above the loading stage 210 at semiconductor packages load units 200 in the suction semiconductor packages, and discharge selectively by vacuum passage 332 and to be applied to the suction force that semiconductor package is loaded onto, therefore make semiconductor packages be placed in proper order on the arrangement groove 213 of formation on first and second loading stations 211 and 212 of loading stage 210.More particularly, be applied to half suction force of these semiconductor packages by release, half of semiconductor packages that is sucked up to vaccum-suction attachement pad 333 is positioned in first loading station 211, and by discharging suction force fully, remaining semiconductor packages is positioned in second loading station 212.During this time, can move smoothly when settling groove 213 in order to guarantee that semiconductor package is contained in to be arranged to, vacuum passage below the arrangement groove 213 that is formed on first and second loading stations 211 and 212 214 applies suction force to it.That is, be sent to semiconductor packages by vacuum tube 230, vacuum port 222, groove 221 and vacuum passage 214, therefore make semiconductor packages be sucked into loading part from the suction force of external vacuum source supply.
Here, when semiconductor packages was positioned on the arrangement groove 213, they were by lead-in chamfered 215 guiding.Like this, even semiconductor packages departs from a little at the correct installation position of settling on the groove 213, they also can be moved to the correct installation position of settling on the groove 213.And, according to the present invention, owing to alternately arrange to settle groove 213 and non-arrangement space 213a at first and second loading stations,, produced like this and made the maximized effect of the width of respectively settling groove so that the side of a groove does not directly contact with the side of other grooves.Therefore, can prevent the mutual interference of arranged adjacent groove phase, and accurately form lead-in chamfered 215.According to the present invention, this can make semiconductor packages alternately settle thereon owing to first and second loading stations 211 and 212.
And, encapsulate for the BGA N-type semiconductor N, when being positioned in, semiconductor packages settles groove 213, under the ledge and contact surface 217 state of contact of settling groove 213, bear the effect of suction force from the lower surface of outstanding solder bump 2 (solder ball) of semiconductor packages and semiconductor packages, therefore improved suction force.
Like this, when semiconductor packages is arranged to first and second loading stations 211 and 212 fully, the cooperation of the screw rod 203 that rotates by nut piece 206 with by CD-ROM drive motor 69, semiconductor packages load units 200 is moved toward visual detector 140 along loading stage guiding piece 202.Then, semiconductor packages selects pick-up 400 to aspirate the semiconductor packages that is positioned on the loading attachment 200 selectively, and they are moved to visual detector 140.According to the check result of visual detector, each semiconductor is packaged with selectively is loaded on the carriage 500.
By top explanation, obviously, according to the present invention, on each of described first and second loading stations, alternately arrange to settle groove 213 and non-arrangement space, so that the side of a groove does not directly contact with the side of other grooves, therefore maximize the width that each settles groove, like this, can prevent adjacent groove phase mutual interference, and on groove 213, accurately form lead-in chamfered 215.
And, settle groove 213 when semiconductor packages is placed in, they are guided by lead-in chamfered, like this, even semiconductor packages departs from a little at the correct installation position of settling on the groove 213, they also can be moved to the correct installation position of settling on the groove 213.
Therefore, the substandard products that the present invention has reduced semiconductor packages are presented and are carried, thereby have significantly improved treatment effeciency.
Should be appreciated that illustrated embodiment and accompanying drawing are for illustrative purposes, the present invention is only limited by claims.In addition, those of ordinary skill in the art can understand, and under the prerequisite that does not break away from the described scope and spirit of the present invention of claims, can make various modifications, interpolation and replacement.
Claims (12)
1. semiconductor packages loading stage, it comprises: loading part, be used for loading a plurality of semiconductor packages thereon, wherein, described loading part alternately is formed with a plurality of non-arrangement space that is used to settle a plurality of arrangement grooves of described each semiconductor packages and does not lay semiconductor packages, so that the side of a groove does not directly contact with the side of other grooves.
2. loading stage as claimed in claim 1, wherein said loading part comprise first loading station and with this first loading station second loading station of preset distance at interval, described arrangement groove alternately is formed on described first and second loading stations, so that the position of the described arrangement groove of described first loading station is not corresponding with the position of the described arrangement groove of described second loading station.
3. loading stage as claimed in claim 2, wherein said first and second loading stations are formed on the same surface of described loading stage.
4. loading stage as claimed in claim 1, wherein each described arrangement groove is formed with vacuum passage, and this vacuum passage is communicated with the vacuum source that is used for supplying suction force, so that settle each semiconductor packages by vacuum draw.
5. loading stage as claimed in claim 4, wherein said semiconductor packages loading stage comprises: go up loading stage, have the described loading station that is formed on its upper surface; And following loading stage, be fixed to the described lower surface of going up loading stage, and be formed with the vacuum port that is communicated with described vacuum passage.
6. loading stage as claimed in claim 1, wherein each described arrangement groove is formed with lead-in chamfered at the edge, is used for each described semiconductor packages is guided to described arrangement groove.
7. loading stage as claimed in claim 6, wherein said lead-in chamfered have the gradient of 20～40 degree.
8. a semiconductor packages processor comprises according to any one described semiconductor packages loading stage in the claim 2 to 7.
9. processor as claimed in claim 8 also comprises supply unit, is used for moving described semiconductor packages loading stage.
10. processor as claimed in claim 9, wherein said supply unit comprise the described transfer unit of loading stage down that is used to support described semiconductor packages loading stage, and have: nut piece; Be coupled to the screw rod of this nut piece, rotate so that described transfer unit is moved to the precalculated position by CD-ROM drive motor; And the loading stage guiding piece, be used to guide described transfer unit moving along described screw rod.
11. processor as claimed in claim 8, also comprise semiconductor packages conveying pick-up, each semiconductor packages is transported to the described arrangement groove of described loading part and settles described each semiconductor packages therein, described semiconductor packages is carried pick-up to be applied to by release and is sucked up to half the suction force that described semiconductor packages is carried the described semiconductor packages of pick-up, half of described semiconductor packages is arranged to described first loading station, and, by discharging described suction force fully, with described semiconductor packages other half be arranged to described second loading station.
12. a semiconductor packages loading stage comprises:
Last loading stage is formed with loading part, is used to settle each semiconductor packages;
Following loading stage is fixed to the described loading stage of going up, and is formed with the vacuum port that is connected to the vacuum source that is used to supply suction force,
Wherein, described loading part comprise first loading station and with this first loading station second loading station of preset distance at interval, described first and second loading stations all have thereon a plurality of arrangement grooves that alternately form, so that the position of the described arrangement groove of described first loading station is not corresponding with the position of the described arrangement groove of described second loading station.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2000-0079282A KR100385876B1 (en) | 2000-12-20 | 2000-12-20 | Handler System For Cutting The Semiconductor Device |
| KR79282/2000 | 2000-12-20 | ||
| KR79284/2000 | 2000-12-20 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011095148A Division CN1208824C (en) | 2000-12-20 | 2001-03-29 | Processing system for cutting semiconductor packing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1822344A CN1822344A (en) | 2006-08-23 |
| CN100377331C true CN100377331C (en) | 2008-03-26 |
Family
ID=36923536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100687240A Expired - Lifetime CN100377331C (en) | 2000-12-20 | 2001-03-29 | Semiconductor package loading stage and semiconductor package device handler including same |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100385876B1 (en) |
| CN (1) | CN100377331C (en) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040044225A (en) * | 2002-11-19 | 2004-05-28 | 세크론 주식회사 | Apparatus for Picking and Transferring Semiconductor package |
| KR100501403B1 (en) * | 2002-11-19 | 2005-07-18 | 세크론 주식회사 | Apparatus for carrier's film cutting |
| KR100574584B1 (en) * | 2003-05-31 | 2006-04-27 | 한미반도체 주식회사 | sawing and handler system for manufacturing semiconductor package |
| CN101969038B (en) | 2004-08-23 | 2012-02-15 | 洛克系统有限公司 | Supporting arrangement for a group of integrated circuit units |
| KR101303103B1 (en) * | 2006-03-29 | 2013-09-06 | 한미반도체 주식회사 | Strip location system and method for semiconductor production |
| KR100833283B1 (en) * | 2006-08-28 | 2008-05-28 | 세크론 주식회사 | Reversing Device for Sawing Sorter System |
| US8011058B2 (en) | 2006-10-31 | 2011-09-06 | Asm Assembly Automation Ltd | Singulation handler system for electronic packages |
| JP5285217B2 (en) * | 2006-11-27 | 2013-09-11 | Ｔｏｗａ株式会社 | Electronic component manufacturing apparatus and manufacturing method |
| KR101305346B1 (en) | 2007-02-09 | 2013-09-06 | 한미반도체 주식회사 | Sawing and Handling Apparatus for Semiconductor Package |
| KR100862638B1 (en) * | 2007-03-13 | 2008-10-09 | (주) 인텍플러스 | Apparatus for inspection of semiconductor device having the cleaning means and method for inspection by the same |
| KR100873670B1 (en) * | 2007-05-23 | 2008-12-12 | (주) 인텍플러스 | System for inspection of semiconductor package |
| KR100886403B1 (en) * | 2007-07-18 | 2009-03-04 | 김일환 | A handler system for cutting semiconductor pakage device |
| KR100917025B1 (en) * | 2007-09-20 | 2009-09-10 | 세크론 주식회사 | Sawing/sorting system and method of sorting a semiconductor package using the same |
| KR101373393B1 (en) * | 2012-07-31 | 2014-03-13 | 세메스 주식회사 | Rotatable rail for transferring a substrate |
| KR101411053B1 (en) * | 2012-10-30 | 2014-06-30 | 세메스 주식회사 | Apparatus for singulating a strip into packages |
| KR101414690B1 (en) * | 2013-04-22 | 2014-07-08 | 한미반도체 주식회사 | Semiconductor Strip Sawing Apparatus |
| KR101534107B1 (en) * | 2014-06-10 | 2015-07-09 | 순천향대학교 산학협력단 | Inspection and changing device of packing semiconductor |
| KR102041957B1 (en) * | 2015-08-27 | 2019-11-08 | 한미반도체 주식회사 | Apparatus of Sawing and Array for Semiconductor Strip and Method thereof |
| JP7154195B2 (en) * | 2019-07-26 | 2022-10-17 | Ｔｏｗａ株式会社 | CUTTING DEVICE AND CUTTING PRODUCT MANUFACTURING METHOD |
| KR102159467B1 (en) | 2020-03-26 | 2020-09-23 | (주)네온테크 | Semiconductor Package Drying Apparatus And Mehtod For The Same |
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| US6139243A (en) * | 1997-07-09 | 2000-10-31 | Systemation Engineering | Method and system for flipping a tray of parts |
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| JPS5943524B2 (en) * | 1981-04-23 | 1984-10-23 | 新日本製鐵株式会社 | Blast furnace furnace wall hot repair equipment |
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| KR100342179B1 (en) * | 2000-07-18 | 2002-07-02 | 윤성석 | A handler for cutting a semiconductor chip's package |
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- 2000-12-20 KR KR10-2000-0079282A patent/KR100385876B1/en not_active IP Right Cessation
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- 2001-03-29 CN CNB2005100687240A patent/CN100377331C/en not_active Expired - Lifetime
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| JPH0542980A (en) * | 1991-07-31 | 1993-02-23 | Mitsubishi Electric Corp | Ic package transporting device |
| US5792304A (en) * | 1993-09-16 | 1998-08-11 | Hitachi, Ltd. | Method of holding substrate and substrate holding system |
| CN1192825A (en) * | 1995-07-10 | 1998-09-09 | Pcd公司 | Top loading socket for ball grid arrays |
| US5725347A (en) * | 1996-05-17 | 1998-03-10 | International Business Machines Corporation | Carousel pin stacker |
| US6139243A (en) * | 1997-07-09 | 2000-10-31 | Systemation Engineering | Method and system for flipping a tray of parts |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100385876B1 (en) | 2003-06-02 |
| KR20020049954A (en) | 2002-06-26 |
| CN1822344A (en) | 2006-08-23 |
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