CN109991705A - A kind of high-speed parallel two-way transmission optical module - Google Patents
A kind of high-speed parallel two-way transmission optical module Download PDFInfo
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- CN109991705A CN109991705A CN201910234609.8A CN201910234609A CN109991705A CN 109991705 A CN109991705 A CN 109991705A CN 201910234609 A CN201910234609 A CN 201910234609A CN 109991705 A CN109991705 A CN 109991705A
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- way transmission
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- 230000003287 optical effect Effects 0.000 title claims abstract description 121
- 230000005540 biological transmission Effects 0.000 title claims abstract description 34
- 239000013307 optical fiber Substances 0.000 claims abstract description 23
- 239000000835 fiber Substances 0.000 claims abstract description 18
- 238000012544 monitoring process Methods 0.000 claims description 22
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000012858 packaging process Methods 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- 238000012913 prioritisation Methods 0.000 description 4
- 101100084627 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) pcb-4 gene Proteins 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 210000004209 hair Anatomy 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000011514 reflex Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4272—Cooling with mounting substrates of high thermal conductivity
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The present invention relates to optical module technical fields, provide a kind of high-speed parallel two-way transmission optical module, including heat sink carrier, it further include two transmitting units for receiving the two of optical signal receiving units and for emitting optical signal, the upper surface of the heat sink carrier is recessed inwardly to form two the first grooves, two first grooves are arranged side by side, and two transmitting units are respectively arranged in two first grooves；The heat sink carrier side is equipped with PCB, and two receiving units pass through two the first flexible circuit boards respectively and are electrically connected with the PCB.The present invention saves transmission fiber resource, realize back and forth that two paths of signals transmits in a piece single mode optical fiber, corresponding high-speed parallel two-way transmission optical module, by the way that the encapsulation of optical module is divided into several units, each unit is set into position according to the set of locations of groove again, is conducive to the quality and cost control of optical package.
Description
Technical field
The present invention relates to optical module technical field, specially a kind of high-speed parallel two-way transmission optical module.
Background technique
Along with digitized process, the processing of data stores and transmits to have obtained development at full speed.Big data quantity is searched
The swift and violent growth of rope service and video traffic has greatly driven the hair of the data center based on supercomputer and storage
Exhibition.The design philosophy of data center's optical module is to provide higher access density, most by smaller volume and lower cost
User's access capacity is improved eventually.
High-speed parallel transmits major product of the optical module as short-range data center interconnecting application, there is wide market
Application prospect.High-speed parallel transmits optical module, and light intercommunication is realized by parallel optical module and optical fiber ribbon cable.Under normal conditions,
Optical interface uses the MPO/MTP optical cable of standard, the transmitting of 4 tunnels and 4 tunnel receiving channels.Parallel emission and reception module is due to can be smaller
The lower energy consumption in space can provide bigger transmission bandwidth under occupying, and corresponding research and development starts increasingly to accelerate.
High-speed parallel transmitted in both directions multichannel optical module can receive and dispatch two sides in every optical fiber of optical cable with simultaneous transmission
To optical signal, the optical signal of positive and negative both direction do not interfere with each other.And conventional transmitted in both directions multichannel optical module, in optical cable
Unidirectional optical signal is only transmitted in every optical fiber, to realize that two-way communication just needs two optical fiber in this way.Compare and
Speech, single fiber bi-directional technology only uses an optical fiber and just completes the work that original two optical fiber could be completed, by existing fiber
Transmission quantity is doubled, so that fiber resource be greatly saved.Single fiber bi-directional technology is in the two-way biography of data center's high-speed parallel
In defeated multichannel optical module, under the optical cable (optical fiber) of identical quantity, transmission capacity is put and is twice, data center is agreed with very much
The design philosophy of optical module.
But high-speed parallel transmitted in both directions multichannel optical module optical package element is very more.The difficult point of light module package is again
Be due to will in the limited package dimension shell of protocol requirement integrated multipath chip and multiplex optical component, this is just to envelope
Dress technology proposes higher challenge.
Summary of the invention
The purpose of the present invention is to provide a kind of high-speed parallel two-way transmission optical module, transmission fiber resource is saved, one
Realize that back and forth two paths of signals transmits in single mode optical fiber, corresponding high-speed parallel two-way transmission optical module, by by the envelope of optical module
Dress is divided into several units, then each unit is set position according to the set of locations of groove, is conducive to the quality and cost of optical package
Control.
To achieve the above object, the embodiment of the present invention provides the following technical solutions: a kind of high-speed parallel transmitted in both directions optical mode
Block, including heat sink carrier further include two hairs for receiving the two of optical signal receiving units and for emitting optical signal
Unit is penetrated, the upper surface of the heat sink carrier is recessed inwardly to form two the first grooves, and two first grooves are arranged side by side,
Two transmitting units are respectively arranged in two first grooves；The heat sink carrier side is equipped with PCB, described in two
Receiving unit passes through two the first flexible circuit boards respectively and is electrically connected with the PCB.
Further, each transmitting unit includes the LD chip being set in turn in corresponding first groove
Group, the optoisolator for being used to be isolated reflected light, is used for light the first optical lens group for diverging light to be shaped to directional light
The Amici prism that signal light splitting exports and the second optical lens group for coupling optical signal, the light that the LD chipset issues
Signal sequentially passes through first optical lens group, the optoisolator, the Amici prism and second optical lens
Group.
Further, each LD chipset includes four LD chips arranged side by side.
Further, each first optical lens group and each second optical lens group include arranged side by side
Four lens, four LD chips and four lens are corresponded and are configured.
Further, the optical signal across second optical lens group is coupled in fiber array, the fiber array packet
Four single mode optical fibers arranged side by side are included, four single mode optical fibers and four LD chips are corresponded and configured, Mei Yisuo
It states the corresponding single mode optical fiber of LD chip and forms optical path, the input light of four optical paths is λ1, output light is
λ2。
Further, the distance between two neighboring single mode optical fiber is not less than 750 μm.
Further, each receiving unit includes for converting four road optical signals of four LD chip emissions
For four PD chips of electric signal, four PD chips are arranged side by side and correspond with four LD chips and configure, and four
A PD chip is respectively connected with trans-impedance amplifier.
Further, the lower surface of the heat sink carrier is recessed inwardly to form two the second grooves, each second groove
Inside be mounted with backlight monitoring unit, two backlight monitoring units pass through respectively two the second flexible circuit boards with it is described
PCB electrical connection；Two backlight monitoring units and two transmitting units are corresponded and are configured.
Further, two first grooves and two second grooves correspond, and the heat sink carrier, which has, to be passed through
Lead to the first through hole of one of them described first groove and corresponding second groove, the heat sink carrier, which also has, to be passed through
Lead to second through-hole of another described first groove and corresponding second groove；One of them described transmitting unit hair
The light penetrated is reflexed to by the first through hole part in the corresponding backlight monitoring unit, another described transmitting is single
The light of member transmitting is reflexed to by second throughhole portions in the corresponding backlight monitoring unit.
Further, each backlight monitoring unit includes four MPD chips arranged side by side, each MPD chip
It is encapsulated on second flexible circuit board by semiconductor packaging process.
Compared with prior art, it the beneficial effects of the present invention are: saving transmission fiber resource, is realized in a single mode optical fiber
Two paths of signals transmits back and forth, corresponding high-speed parallel two-way transmission optical module, by the way that the encapsulation of optical module is divided into several lists
Member, then each unit is set into position according to the set of locations of groove, be conducive to the quality and cost control of optical package.
Detailed description of the invention
Fig. 1 is a kind of the first viewing angle constructions signal of high-speed parallel two-way transmission optical module provided in an embodiment of the present invention
Figure；
Fig. 2 is a kind of the second viewing angle constructions signal of high-speed parallel two-way transmission optical module provided in an embodiment of the present invention
Figure；
Fig. 3 is that a kind of heat sink carrier of high-speed parallel two-way transmission optical module provided in an embodiment of the present invention is connected with PCB
The first viewing angle constructions schematic diagram；
Fig. 4 is a kind of second visual angle of the heat sink carrier of high-speed parallel two-way transmission optical module provided in an embodiment of the present invention
Structural schematic diagram；
Fig. 5 is a kind of partial structural diagram of high-speed parallel two-way transmission optical module provided in an embodiment of the present invention；
Fig. 6 is a kind of structural representation of the fiber array of high-speed parallel two-way transmission optical module provided in an embodiment of the present invention
Figure；
Fig. 7 is the row of optical path in a kind of first groove of high-speed parallel two-way transmission optical module provided in an embodiment of the present invention
Walk direction schematic diagram；
In appended drawing reference: 1- receiving unit；2- transmitting unit；20-LD chipset；The first optical lens group of 21-；22- light
Isolator；23- Amici prism；The second optical lens group of 24-；3- is heat sink carrier；The first groove of 30-；The second groove of 31-；32-
One through-hole；The second through-hole of 33-；4-PCB；The first flexible circuit board of 5-；6- fiber array；7- backlight monitoring unit；8- second is soft
Property circuit board.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts all other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1-7 is please referred to, the embodiment of the present invention provides a kind of high-speed parallel two-way transmission optical module, including heat sink carrier 3,
For receiving two receiving units 1 of optical signal, and two transmitting units 2 for emitting optical signal, the heat sink carrier 3
Upper surface be recessed inwardly to form two the first grooves 30, two first grooves 30 are arranged side by side, and two transmittings are singly
Member 2 is respectively arranged in two first grooves 30；3 side of heat sink carrier is equipped with PCB4, two receiving units 1
It is electrically connected respectively by two the first flexible circuit boards 5 with the PCB4.In the present embodiment, saving transmission fiber resource, one
It realizes that back and forth two paths of signals transmits in root single mode optical fiber, and each section in the optical module of the prior art is divided and formed several
A subelement, i.e. two receiving units 1 and two transmitting units 2, it is more if it exists to receive list certainly with the raising of rate
Member 1 and transmitting unit 2, can also be laid out according to this form.The first groove 30 and the second groove 31 side by side is that strip is recessed
Slot, they can be positioned in order to the assembling of transmitting unit 2, and then improve the efficiency of encapsulation, be conducive to mass large-scale production.
The following are specific embodiments:
Optimize above scheme, please refer to Fig. 5 and Fig. 7, each transmitting unit 2 includes being set in turn in corresponding institute
State the LD chipset 20 in the first groove 30, the first optical lens group 21 for diverging light to be shaped to directional light, be used for every
Optoisolator 22 from reflected light, for by the Amici prism 23 of optical signal light splitting output and being used to couple the second of optical signal
Optical lens group 24, the optical signal that LD (transmitting) chipset issues sequentially pass through first optical lens group 21, described
Optoisolator 22, the Amici prism 23 and second optical lens group 24.Preferably, each LD chipset 20 is equal
Including four LD chips arranged side by side.In the present embodiment, LD chipset 20 issues optical signal, after the first optical lens
It is shaped as directional light, then transmits optoisolator 22, which can prevent the light in optical path to be reflected back LD chip, connect
Optical signal transmit honourable prism again, the optical signal with multiple wavelength is decomposed into the multi-path parallel light with single wavelength simultaneously
Optical signal is focused the single-mode optics being coupled in four core FA by output to the first optical lens group 21, first optical lens group 21
It is fine.Preferably, LD chip is specially electric absorption semiconductor laser chip (EML).
Advanced optimize above scheme, each first optical lens group 21 and each second optical lens group 24
It include four lens arranged side by side, four LD chips and four lens are corresponded and configured.In the present embodiment
In, four lens can decompose tetra- road optical signal of Hou to Amici prism 23 respectively and carry out convergence coupling.
As the prioritization scheme of the embodiment of the present invention, referring to Fig. 7, passing through the optical signal of second optical lens group 24
Be coupled in fiber array 6, the fiber array 6 includes four single mode optical fibers arranged side by side, four single mode optical fibers with
Four LD chips, which correspond, to be configured, the corresponding single mode optical fiber formation optical path of each LD chip, and four
The input light of the optical path is λ1, output light is λ2.In the present embodiment, fiber array 6 is four-core fiber array, such as Fig. 7
Shown, arrow is the direction of optical signal, and the optical signal of output is after 24 shaping of the second optical lens group, by certain angle of divergence
Diverging light is changed into directional light, and four beam directional lights are arrived separately at by the whole reflections of Amici prism 23 and connect after Amici prism 23
Receive unit 1.Preferably, the distance between two neighboring single mode optical fiber is not less than 750 μm.Preferably, the input light of four optical paths
It is 1270nm, output light is 1330nm.
As the prioritization scheme of the embodiment of the present invention, each receiving unit 1 includes for by four LD cores
Four road optical signals of piece transmitting are converted to four PD chips of electric signal, and four PD (receptions) chips are arranged side by side and with four
A LD chip corresponds configuration, and four PD chips are respectively connected with trans-impedance amplifier.In the present embodiment, four PD
Chip can convert four road optical signals to electric signal output, and be amplified by trans-impedance amplifier.
As the prioritization scheme of the embodiment of the present invention, please refer to Fig. 2, Fig. 3 and Fig. 4, the following table of the heat sink carrier 3 towards
Sunken inside forms two the second grooves 31, is mounted with backlight monitoring unit 7, two back in each second groove 31
Light monitoring unit 7 is electrically connected by two the second flexible circuit boards 8 with the PCB4 respectively；Two backlight monitoring units 7
It corresponds and configures with two transmitting units 2.In the present embodiment, if this backlight monitoring unit 7 can be to LD chip
Transmitting light optical power is monitored, and two the second grooves 31 are also strip groove, and on the one hand they can be convenient positioning, another party
Face can also install FPC (flexible circuit board) in them.
Above scheme is advanced optimized, please refers to Fig. 2, Fig. 3 and Fig. 4, two first grooves 30 and two described
Two grooves 31 correspond, and the heat sink carrier 3, which has, penetrates through one of them described first groove 30 and corresponding described
The first through hole 32 of second groove 31, the heat sink carrier 3, which also has, penetrates through another described first groove 30 and corresponding
Second groove 31 the second through-hole 33；The light that one of them described transmitting unit 2 emits passes through the first through hole 32
Part reflexes in the corresponding backlight monitoring unit 7, and the light that another described transmitting unit 2 emits passes through described the
Two through-holes, 33 part reflexes in the corresponding backlight monitoring unit 7.In the present embodiment, in the upper of heat sink carrier 3
The first groove 30 and the second groove 31 on lower surface are penetrated through by through-hole, and the first through hole 32 and the second through-hole 33 are rectangular logical
Hole, the incident optical signal in optical path is reflexed to receiving unit 1 by above-mentioned prism, while LD chip emission light fraction being reflected
To backlight monitoring unit 7, the optical signal emitted at this time i.e. from through-hole by into backlight monitoring unit 7.
As the prioritization scheme of the embodiment of the present invention, referring to Fig. 2, each backlight monitoring unit 7 includes side by side
Four MPD chips being arranged, each MPD chip are encapsulated on second flexible circuit board 8 by semiconductor packaging process.
In the present embodiment, above-mentioned backlight monitoring unit is monitored using MPD (back light detector) chip, it is preferred that MPD chip and
TIA chip passes through the Die Bonding technique of semiconductor packages and FPC is realized and fixed, and the electrical connection of PD chip and FPC are logical
The Wire Bonding for crossing semiconductor packaging process is realized.Preferably, there is a stiffening plate at the back side FPC, stiffening plate be sheet metal or
Ceramic substrate.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (10)
1. a kind of high-speed parallel two-way transmission optical module, including heat sink carrier, it is characterised in that: including for receiving optical signal
Two receiving units and two transmitting units for emitting optical signal, the upper surface of the heat sink carrier is recessed inwardly to be formed
Two the first grooves, two first grooves are arranged side by side, two transmitting units be respectively arranged on two it is described first recessed
In slot；The heat sink carrier side is equipped with PCB, and two receiving units pass through two the first flexible circuit boards and institute respectively
State PCB electrical connection.
2. a kind of high-speed parallel two-way transmission optical module as described in claim 1, it is characterised in that: each transmitting unit
It include the LD chipset being set in turn in corresponding first groove, for diverging light to be shaped to the first of directional light
Optical lens group, the optoisolator for reflected light to be isolated, for by optical signal light splitting output Amici prism and be used for coupling
Second optical lens group of light combination signal, the optical signal that the LD chipset issues sequentially pass through first optical lens group,
The optoisolator, the Amici prism and second optical lens group.
3. a kind of high-speed parallel two-way transmission optical module as claimed in claim 2, it is characterised in that: each LD chipset
It include four LD chips arranged side by side.
4. a kind of high-speed parallel two-way transmission optical module as claimed in claim 3, it is characterised in that: each first optics
Lens group and each second optical lens group include four lens arranged side by side, four LD chips and four institutes
It states lens and corresponds configuration.
5. a kind of high-speed parallel two-way transmission optical module as claimed in claim 3, it is characterised in that: pass through second optics
The optical signal of lens group is coupled in fiber array, and the fiber array includes four single mode optical fibers arranged side by side, four institutes
It states single mode optical fiber and four LD chips is corresponded and configured, the corresponding single mode optical fiber shape of each LD chip
At optical path, the input light of four optical paths is λ1, output light is λ2。
6. a kind of high-speed parallel two-way transmission optical module as claimed in claim 5, it is characterised in that: two neighboring single mode optical fiber
The distance between be not less than 750 μm.
7. a kind of high-speed parallel two-way transmission optical module as claimed in claim 3, it is characterised in that: each receiving unit
It include four PD chips for four road optical signals of four LD chip emissions to be converted to electric signal, four PD
Chip is arranged side by side and corresponds with four LD chips and configures, and four PD chips are respectively connected with trans-impedance amplifier.
8. a kind of high-speed parallel two-way transmission optical module as described in claim 1, it is characterised in that: under the heat sink carrier
Surface is recessed inwardly to form two the second grooves, backlight monitoring unit is mounted in each second groove, described in two
Backlight monitoring unit passes through two the second flexible circuit boards respectively and is electrically connected with the PCB；Two backlight monitoring units with
Two transmitting units correspond configuration.
9. a kind of high-speed parallel two-way transmission optical module as claimed in claim 8, it is characterised in that: two first grooves
It is corresponded with two second grooves, the heat sink carrier, which has, penetrates through one of them described first groove and corresponding
Second groove first through hole, the heat sink carrier, which also has, penetrates through another described first groove and corresponding
Second through-hole of second groove；The light of one of them transmitting unit transmitting is reflexed to by the first through hole part
In the corresponding backlight monitoring unit, the light of another transmitting unit transmitting is anti-by second throughhole portions
It is incident upon in the corresponding backlight monitoring unit.
10. a kind of high-speed parallel two-way transmission optical module as claimed in claim 8, it is characterised in that: each backlight prison
Control unit includes four MPD chips arranged side by side, and each MPD chip is encapsulated in described the by semiconductor packaging process
On two flexible circuit boards.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910234609.8A CN109991705B (en) | 2019-03-26 | 2019-03-26 | High-speed parallel bidirectional transmission optical module |
| PCT/CN2019/083930 WO2020191844A1 (en) | 2019-03-26 | 2019-04-23 | High-speed parallel two-way transmission optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910234609.8A CN109991705B (en) | 2019-03-26 | 2019-03-26 | High-speed parallel bidirectional transmission optical module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109991705A true CN109991705A (en) | 2019-07-09 |
| CN109991705B CN109991705B (en) | 2024-05-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910234609.8A Active CN109991705B (en) | 2019-03-26 | 2019-03-26 | High-speed parallel bidirectional transmission optical module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109991705B (en) |
| WO (1) | WO2020191844A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110376688A (en) * | 2019-07-16 | 2019-10-25 | 武汉光迅科技股份有限公司 | A kind of optical module |
| CN112799182A (en) * | 2020-12-31 | 2021-05-14 | 重庆霓扬科技有限责任公司 | Method for manufacturing multi-channel integrated assembly |
| WO2021212868A1 (en) * | 2020-04-22 | 2021-10-28 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2022142171A1 (en) * | 2020-12-31 | 2022-07-07 | 武汉联特科技股份有限公司 | Mlg2.0 protocol-based single-mode optical module |
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| CN109061811A (en) * | 2018-08-10 | 2018-12-21 | 武汉联特科技有限公司 | Double hairs are double to receive optical module |
| CN109491027A (en) * | 2019-01-08 | 2019-03-19 | 中航海信光电技术有限公司 | A kind of parallel optical module |
| CN209525489U (en) * | 2019-03-26 | 2019-10-22 | 武汉联特科技有限公司 | A kind of high-speed parallel two-way transmission optical module |
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| CN110376688A (en) * | 2019-07-16 | 2019-10-25 | 武汉光迅科技股份有限公司 | A kind of optical module |
| WO2021212868A1 (en) * | 2020-04-22 | 2021-10-28 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN112799182A (en) * | 2020-12-31 | 2021-05-14 | 重庆霓扬科技有限责任公司 | Method for manufacturing multi-channel integrated assembly |
| WO2022142171A1 (en) * | 2020-12-31 | 2022-07-07 | 武汉联特科技股份有限公司 | Mlg2.0 protocol-based single-mode optical module |
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| CN109991705B (en) | 2024-05-03 |
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