CN109987831A - Substrate segmenting device - Google Patents
Substrate segmenting device Download PDFInfo
- Publication number
- CN109987831A CN109987831A CN201811627060.0A CN201811627060A CN109987831A CN 109987831 A CN109987831 A CN 109987831A CN 201811627060 A CN201811627060 A CN 201811627060A CN 109987831 A CN109987831 A CN 109987831A
- Authority
- CN
- China
- Prior art keywords
- substrate
- score line
- backing plate
- conveying device
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
- C03B33/074—Glass products comprising an outer layer or surface coating of non-glass material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
Substrate segmenting device (1) has lace conveying device (3), the first cutting bar (11), backing plate (21).Lace conveying device conveys the substrate (100) that end score line (S1, S2) is formed between main body (106a, 106b) and end material (107a, 107b).First cutting bar is configured at the top of lace conveying device, impacts substrate by decline to divide end score line.Backing plate is in the lower surface for the upside delivery section (3a) that position corresponding with the end material of substrate abuts or closely configured in lace conveying device, to ensure gap (29) below substrate.It is formed with notch corresponding with score line (S3, S4) is intersected by the end face (25a) of the main body side of the substrate in backing plate, the backing plate when segmentation intersects score line is avoided to buffer with the second cutting bar (11).It is accurately proceed the segmentation of the end material of the substrate on belt conveyor.
Description
Technical field
The present invention relates to substrate segmenting devices, in particular to the substrate being split the end material of substrate from main body point
Cut device.
Background technique
Usually in the manufacturing process of liquid crystal display panel, manufacture will become multiple unit display panel (units of manufacturing cell
Substrate) glass adhering substrate (mother substrate) of large area that has patterned, then divided by each unit display panel.Tool
For body, mother substrate is delineated simultaneously on two sides from up and down direction using upper and lower a pair of of break bar, then by same on two sides
Shi Jinhang separation, to be split by each unit display panel.It is provided between unit display panel additional
Part, these become end material after singulation.
Processing as end material, it is known to end material be grasped using chuck (chuck) component, and make card
Disk is mobile to make the method (example for falling on the end material collection vessel being arranged below under end material to isolated direction
Such as, referring to patent document 1).
Existing technical literature
Patent document
Patent document 1: International Publication No. 2002/057192.
Subject to be solved by the invention
In recent years, prevailing to divide substrate on belt conveyor.But if bar impact is cut off when dividing end material
To substrate, then cause substrate to be bent together with band, it can be considered that end score line (substrate main body (unit substrate) with
The score line formed between end material) segmentation precision reduce.
However, in the prior art without proposing the technology for solving such problems.
Summary of the invention
It is an object of the invention to the segmentations of the end material for the substrate being accurately proceed on belt conveyor.
Solution for solving the problem
Hereinafter, being illustrated as the means used to solve the problem to various ways.These modes can as needed into
Row arbitrarily combines.
The substrate segmenting device that a viewpoint of the invention is related to has lace conveying device, the first cutting bar and pad
Plate.
Lace conveying device between main body and end material to being formed with end score line and be formed with and the end
The substrate for the intersection score line that score line is intersected is conveyed.
First cutting bar is configured at the top of the lace conveying device, by applying impact force to the substrate come to institute
End score line is stated to be split.
Backing plate is at position corresponding with the end material of the substrate, along end score line abutting or closely
The lower surface for the upside delivery section configured in the lace conveying device, to ensure gap below the substrate.Pass through
It is formed with notch corresponding with score line is intersected in the end face of the main body side of the substrate of backing plate, avoids carrying out to intersection score line
Backing plate is buffered with the first cutting bar when segmentation.
In the apparatus, due to ensuring gap below the upside delivery section of lace conveying device by backing plate, so
When the first cutting bar applies impact force to the substrate configured on lace conveying device, in end, the periphery of score line generates big
Stress, as a result, end score line is accurately divided.
In the apparatus, it is possible to have the second cutting bar for being split to intersection score line.In addition it is also possible to
So that the first cutting bar rotates in the horizontal plane, also play a role as the second cutting bar.In the apparatus, due to intersection
The second cutting bar is connected to the position corresponding with the notch of backing plate of substrate when score line is split, backing plate configuration with base
The corresponding position of the end material of plate, so the undesirable feelings of segmentation that can be avoided the buffering due to cutting bar and backing plate and generate
Condition.
In addition, if be different from the present invention, without backing plate, even if then the first cutting bar declines and depresses end material,
End score line periphery will not generate sufficiently big bending stress, and it is therefore possible to will not accurately divide end delineation
Line.In addition, if there is no notch on backing plate, then slow to the second score line and backing plate generation when score line is split is intersected
It rushes without along the sufficiently big bending stress of score line generation is intersected, it is therefore possible to will not accurately divide to intersect delineation
Line.
In the apparatus, when cutting off bar pressure end material, bending stress acts on score line.
It the end face of backing plate can also be parallel with the end score line of substrate.
In the apparatus, when cutting off bar pressure end material, bending stress uniformly acts on entire end score line.
The end face can also be left from the end score line and be formed with above-mentioned gap.
In the apparatus, big stress is generated on score line periphery.
Substrate may be the adhesive substrates being made of two plate bases.It can also be in the end score line of the substrate to downside
When being split, is become by end face and configure backing plate in a manner of in the outer part than end score line, it can also be in the substrate to upside
When end score line is split, is become by end face and configure backing plate in a manner of in the inner part than score line.
In the apparatus, the end material of two substrates of adhesive substrates can accurately be divided.
Invention effect
In substrate segmenting device of the present invention, the end of the substrate on belt conveyor can be accurately proceed
The segmentation (dividing along end score line) of material and the segmentation along intersection score line.
Detailed description of the invention
Fig. 1 is the perspective view for the substrate segmenting device that first embodiment is related to.
Fig. 2 is the partial top view of the lace conveying device of substrate segmenting device.
Fig. 3 is the partial perspective view of the lace conveying device of substrate segmenting device.
Fig. 4 is the perspective view of backing plate.
Fig. 5 is the schematic sectional view for indicating substrate segmentation work.
Fig. 6 is the diagrammatic top view of substrate.
Specific embodiment
1. first embodiment
(1) substrate segmenting device
It is illustrated using substrate segmenting device 1 of the Fig. 1 to first embodiment.Fig. 1 is what first embodiment was related to
The perspective view of substrate segmenting device.In addition, in the various figures, arrow X is first level direction, arrow Y is the second horizontal direction.
Substrate segmenting device 1 is following device: by that will be formed with score line (grooving) in front-end-of-line (comprising end
Score line S1, S2 and intersect score line S3, S4) substrate 100 (Fig. 5, Fig. 6) (and intersect from end score line S1, S2
Score line S3, S4) opposite side face pressing and be bent substrate, thus along end score line S1, S2 (and intersect delineate
Line S3, S4) divide substrate 100.
Substrate segmenting device 1 has lace conveying device 3.Lace conveying device 3 can convey in the second horizontal direction
Substrate 100.Lace conveying device 3 has the upside delivery section 3a for loading substrate 100.
Substrate segmenting device 1 has the beam (crossbeam) 9 extended in first level direction (X-direction).Beam 9 is configured at than band
The position upside delivery section 3a of formula conveying device 3 against the top, can be by sliding drive mechanism (not shown) along track 15
It is moved in the second horizontal direction.
Substrate segmenting device 1 has the first cutting bar 11.First cutting bar 11 is maintained at beam 9, such as along the second level
Direction extends very long.First cutting bar 11 is configured at the top of lace conveying device 3, is applied by decline to substrate 100 and is impacted
Power and end score line S1, S2 being upwardly formed in first level side is split.Specifically, first cutting bar 11 with
It is static at the position of the surface contact of substrate 100, so that the hammer (not shown) as impact structure is fallen to first in this state
Bar 11 is cut off, is cut off substrate 100 along end score line S1, S2 by its impact.In addition it is also possible to using by cutting bar 11
The pressing of itself and the impact force that generates and substrate 100 is cut off along end score line S1, S2.First cutting 11 energy of bar
It is enough to rotate in the horizontal plane, the state extended along the second horizontal direction can be become, to what is formed in the second horizontal direction
Intersect score line S3, S4 to be split.In addition it is also possible to different from the first cutting bar 11 extended along the second horizontal direction
Ground has the second cutting bar extended along first level direction, cuts off bar to being formed in the second horizontal direction with second
Intersect score line S3, S4 to be split.
As shown in figure 5, substrate 100 is the fitting glass being made of first substrate 101 and the second substrate 102.Such as Fig. 6 institute
Show, be formed with end score line S1, S2 in substrate 100 and intersect score line S3, S4.In first substrate 101, pass through end
Score line S1 divides main body 106a and end material 107a, and is formed with and intersects score line with what end score line S1 intersected
S3.In the second substrate 102, main body 106b and end 107b are divided by end score line S2, and is formed with and is carved with end
The intersection score line S4 that the S2 that crosses intersects.End score line S1 and end score line S2 and intersection score line S3 and intersection are carved
The S4 that crosses is consistent when looking down.
Substrate segmenting device 1 has backing plate 21.Backing plate 21 is for that will not carve to the intersection with the substrate in conveying device
The segmentation precision of scribing line causes adverse effect and the component that improves the segmentation precision of end score line.In lace conveying device 3
Upside delivery section 3a lower section, backing plate 21 is configured on the upper surface of mounting table 27.Backing plate 21 has end face 25a.With
At the corresponding position end material 107a, 107b of one substrate 101, end face 25a is abutted or is closely configured and fills in belt conveying
Set the lower surface of 3 upside delivery section 3a.In end face, 25a is formed with notch 26 corresponding with score line S3, S4 is intersected.
Illustrate backing plate 21 in further detail using Fig. 2~Fig. 4.Fig. 2 is the lace conveying device of substrate segmenting device
Partial top view.Fig. 3 is the partial perspective view of the lace conveying device of substrate segmenting device.Fig. 4 is the perspective view of backing plate.
Backing plate 21 is a pair of of the component configured in the first level direction two sides of lace conveying device 3.Backing plate 21 is to be used for
The component that the end material of the one or both sides in the first level direction of substrate is split.In mounting table 27, each backing plate
21 configure the arbitrary position on first level direction in prescribed limit relative to mounting table 27.Mounting table 27 is in the second level
There is defined width on direction, have and upwardly extend very long upper surface in first level side.The upper surface of mounting table 27 is
Plane is closely configured in the lower section of the upside delivery section 3a of lace conveying device 3.
The second part that backing plate 21 has first part 23 and formed on the inside of the first level direction of first part 23
25.Second part 25 has above-mentioned end face 25a.End face 25a opposite toward each other side (inside in first level direction).
End face 25a linearly extends in the second horizontal direction.In end face 25a (end face of the main body side of the substrate) formation of backing plate 21
There is the notch (corresponding to the notch for intersecting score line) 26 extended from the 25a of end face along first level direction.Second part 25 is also
With a pair of thin extension 25b extended in the second horizontal direction two sides.That is, the second level side of end face 25a
Become the shape of board member incision on the outside of to the first level direction of two side portions.Therefore, 21 lightweight of backing plate can be made, into
And it can reduce fee of material.
In turn, second part 25 has bending part 25c on the top of extension 25b.Bending part 25c is pushed up from extension 25b
End extends downward.Bending part 25c is abutted or close to the second horizontal direction end face of mounting table 27.Backing plate 21 is opposite as a result,
It is limited in the movement of mounting table 27 towards the second horizontal direction.
Substrate segmenting device 1 also can have the moving machine for moving backing plate 21 between the position and other positions of Fig. 1
Structure.
(2) substrate divides work
Illustrate that the substrate being split to the end score line of the substrate of downside divides work using Fig. 5.Fig. 5 is to indicate
The schematic sectional view of substrate segmentation work.
In Fig. 5, in substrate 100, end score line S1, S2 extends in second direction, that is to say, that end material
107a and 107b is configured on the outside of first level direction.Moreover, first substrate 101 is configured at downside.
The end face 25a of backing plate 21 is configured in a manner of corresponding with end material 107a, 107b, more specifically than end
Mode of the score line S1 on the outside of first level direction configures.In other words, end face 25a is from the score line S1 of end to first
It is configured with leaving on the outside of horizontal direction.Above result is to ensure gap 29 below the delivery section 3a of upside.It is specific and
Speech, gap 29 is formed in a part of the lower section of main body 106a, 106b and the lower section of end material 107a, 107b.
As shown in figure 5, when near end material 107a, 107b of the first cutting pressure substrate 100 of bar 11 or its, bending
Stress is in end score line S1.Therefore, end score line S1 can accurately be divided.In addition, the first cutting bar 11 presses
Position can be consistent with end score line S1, S2, can also rise and be upwardly deviated from first level side from there.
Particularly, since end face 25a is parallel with the score line S1 of substrate 100, so when the first cutting bar 11 depresses end
When material 107a, 107b, bending stress is uniformly applied to entire end score line S1.
In addition, illustrating the embodiment being split to the end score line of the substrate of upside below.
In substrate 100, end score line S1, S2 extends in the second horizontal direction, that is to say, that end material 107a and
107b is configured on the outside of first level direction.Moreover, first substrate 101 is configured at downside.
The end face 25a of backing plate 21 can be to configure than mode of the end score line S2 on the inside of first level direction.It changes
Sentence is talked about, and end face 25a is configured from the score line S2 of end to first level direction inside with leaving.Above result is, upper
Gap 29 is ensured below the delivery section 3a of side.Specifically, gap 29 is formed in a part and the end of main body 106a, 106b
The lower section of portion material 107a, 107b.
As shown in figure 5, when at or near end material 107a, 107b that the first cutting bar 11 depresses substrate 100, it is curved
Transverse stress acts on end score line S2.Therefore, end score line S2 can accurately be divided.In addition, the first cutting bar 11 is pressed
The position of pressure is preferably end material 107a, 107b on the outside of first level direction than end score line S1, S2.
Particularly, since end face 25a is parallel with the end score line S2 of substrate 100, so when the first cutting bar 11 is depressed
When end material 107a, 107b, bending stress is uniformly applied to entire end score line S2.
2. other embodiment
More than, multiple embodiments of the invention are illustrated, but the present invention is not limited to above-mentioned embodiment party
Formula is able to carry out various changes without departing from the spirit and scope of the invention.Particularly, multiple realities described in this specification
Applying mode and variation can arbitrarily combine as needed.
(1) variation of backing plate
Flat shape, cross sectional shape, thickness of backing plate etc. are not limited to first embodiment.
Backing plate can also be configured by such a way that first level side upwardly extends, for removing in the second level side of substrate
To unilateral or two sides end material.
(2) variation of substrate
For the fitting brittle material substrate for being bonded two brittle material substrates, the liquid comprising being bonded glass substrate
The flat display board of crystal panel, plasma display panel, OLED panel etc. and silicon substrate, sapphire substrate etc. are fitted in
The semiconductor substrate of glass substrate.
The type of substrate is not particularly limited.Substrate includes glass, semiconductor wafer, the ceramic substrate of veneer.
(3) variation of score line
The shape of score line does not limit.Score line is straight line in said embodiment, but can also be local or complete
Portion has curve.
Industrial availability
The present invention can be widely applied for the substrate segmenting device for dividing the end material of substrate from main body.
Description of symbols
1: substrate segmenting device；
3: lace conveying device；
3a: upside delivery section；
11: the first cutting bars；
21: backing plate；
23: first part；
25: second part；
25a: end face；
25b: extension；
25c: bending part；
26: notch；
27: mounting table；
29: gap；
100: substrate；
101: first substrate；
102: the second substrate；
106a: main body；
106b: main body；
107a: end material；
107b: end material；
S1: end score line；
S2: end score line.
Claims (5)
1. a kind of substrate segmenting device, comprising:
Lace conveying device, to being formed with end score line between main body and end material and be formed with and the end
The substrate for the intersection score line that score line is intersected is conveyed；
First cutting bar, is configured at the top of the lace conveying device, for by applying impact force pair to the substrate
The end score line is split；And
Backing plate, at position corresponding with the end material of the substrate, along end score line abutting or closely
The lower surface for the upside delivery section configured in the lace conveying device, thus ensure gap below the substrate,
It is formed in the end face of the main body side of the backing plate and intersects the corresponding notch of score line with described.
2. substrate segmenting device according to claim 1, wherein
With the second cutting bar, the second cutting bar is configured at the top of the lace conveying device, for by described
Substrate applies impact force to be split to the intersection score line.
3. substrate segmenting device according to claim 1 or 2, wherein
The end face of the backing plate is parallel with the end score line of the substrate.
4. substrate segmenting device according to claim 1, wherein
It is left from the end score line and is formed with the gap in the end face.
5. substrate segmenting device according to claim 1, wherein
The substrate is the adhesive substrates being made of two substrates,
When the end score line of the substrate to downside is split, become in the outer part than the end score line with the end face
Mode configure the backing plate,
When the end score line of the substrate to upside is split, become in the inner part than the end score line with the end face
Mode configure the backing plate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-255114 | 2017-12-29 | ||
| JP2017255114A JP2019119642A (en) | 2017-12-29 | 2017-12-29 | Substrate parting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109987831A true CN109987831A (en) | 2019-07-09 |
Family
ID=67129649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811627060.0A Pending CN109987831A (en) | 2017-12-29 | 2018-12-28 | Substrate segmenting device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2019119642A (en) |
| KR (1) | KR20190082088A (en) |
| CN (1) | CN109987831A (en) |
| TW (1) | TW201930038A (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1486285B (en) | 2001-01-17 | 2013-01-16 | 三星宝石工业株式会社 | Scribing and breaking apparatus, system therefor |
-
2017
- 2017-12-29 JP JP2017255114A patent/JP2019119642A/en active Pending
-
2018
- 2018-11-27 TW TW107142153A patent/TW201930038A/en unknown
- 2018-12-05 KR KR1020180155301A patent/KR20190082088A/en unknown
- 2018-12-28 CN CN201811627060.0A patent/CN109987831A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190082088A (en) | 2019-07-09 |
| TW201930038A (en) | 2019-08-01 |
| JP2019119642A (en) | 2019-07-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190709 |
|
| WD01 | Invention patent application deemed withdrawn after publication |