CN109971406B - Halogen-free flame-retardant high-temperature-resistant epoxy resin sealant - Google Patents
Halogen-free flame-retardant high-temperature-resistant epoxy resin sealant Download PDFInfo
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- CN109971406B CN109971406B CN201910332149.2A CN201910332149A CN109971406B CN 109971406 B CN109971406 B CN 109971406B CN 201910332149 A CN201910332149 A CN 201910332149A CN 109971406 B CN109971406 B CN 109971406B
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 75
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 75
- 239000003063 flame retardant Substances 0.000 title claims abstract description 57
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title claims abstract description 51
- 239000000565 sealant Substances 0.000 title claims abstract description 28
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 23
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229920000877 Melamine resin Polymers 0.000 claims abstract description 20
- 239000011159 matrix material Substances 0.000 claims abstract description 5
- 229920005989 resin Polymers 0.000 claims abstract description 4
- 239000011347 resin Substances 0.000 claims abstract description 4
- 239000012796 inorganic flame retardant Substances 0.000 claims description 40
- 238000001816 cooling Methods 0.000 claims description 32
- 238000002360 preparation method Methods 0.000 claims description 28
- 239000000203 mixture Substances 0.000 claims description 26
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 25
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 claims description 25
- 238000002156 mixing Methods 0.000 claims description 23
- 239000002250 absorbent Substances 0.000 claims description 18
- 230000002745 absorbent Effects 0.000 claims description 18
- 239000012745 toughening agent Substances 0.000 claims description 18
- 238000004898 kneading Methods 0.000 claims description 17
- 238000000227 grinding Methods 0.000 claims description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 15
- 238000001035 drying Methods 0.000 claims description 15
- 229910052710 silicon Inorganic materials 0.000 claims description 15
- 239000010703 silicon Substances 0.000 claims description 15
- KCAMLFCTSSYIFW-UHFFFAOYSA-N 2,4,6-tris(dimethylamino)phenol Chemical compound CN(C)C1=CC(N(C)C)=C(O)C(N(C)C)=C1 KCAMLFCTSSYIFW-UHFFFAOYSA-N 0.000 claims description 14
- 239000007822 coupling agent Substances 0.000 claims description 13
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 12
- LHPPDQUVECZQSW-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-ditert-butylphenol Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=CC=CC3=N2)=C1O LHPPDQUVECZQSW-UHFFFAOYSA-N 0.000 claims description 10
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical group OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 9
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 claims description 8
- 239000002518 antifoaming agent Substances 0.000 claims description 8
- 238000007599 discharging Methods 0.000 claims description 8
- -1 aliphatic glycidyl ethers Chemical class 0.000 claims description 7
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 7
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 7
- 239000000347 magnesium hydroxide Substances 0.000 claims description 7
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 7
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 6
- 239000003085 diluting agent Substances 0.000 claims description 6
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 6
- 238000004383 yellowing Methods 0.000 claims description 6
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims description 4
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 4
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 claims description 4
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 4
- 239000000395 magnesium oxide Substances 0.000 claims description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 4
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 4
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims description 4
- 150000007524 organic acids Chemical group 0.000 claims description 4
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims description 3
- OBETXYAYXDNJHR-UHFFFAOYSA-N 2-Ethylhexanoic acid Chemical class CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 claims description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims description 2
- QLBRROYTTDFLDX-UHFFFAOYSA-N [3-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCCC(CN)C1 QLBRROYTTDFLDX-UHFFFAOYSA-N 0.000 claims description 2
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 claims description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 claims description 2
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 claims description 2
- 238000012986 modification Methods 0.000 claims description 2
- 230000004048 modification Effects 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 150000003839 salts Chemical class 0.000 claims description 2
- 150000005846 sugar alcohols Polymers 0.000 claims description 2
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 abstract description 2
- 239000003292 glue Substances 0.000 description 30
- 239000013530 defoamer Substances 0.000 description 12
- 125000001931 aliphatic group Chemical group 0.000 description 8
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 8
- LEHOTFFKMJEONL-UHFFFAOYSA-N Uric Acid Chemical compound N1C(=O)NC(=O)C2=C1NC(=O)N2 LEHOTFFKMJEONL-UHFFFAOYSA-N 0.000 description 7
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 4
- 238000009472 formulation Methods 0.000 description 4
- XFZRQAZGUOTJCS-UHFFFAOYSA-N phosphoric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OP(O)(O)=O.NC1=NC(N)=NC(N)=N1 XFZRQAZGUOTJCS-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 150000007974 melamines Chemical class 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000779 smoke Substances 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- 241000217776 Holocentridae Species 0.000 description 1
- GANNOFFDYMSBSZ-UHFFFAOYSA-N [AlH3].[Mg] Chemical class [AlH3].[Mg] GANNOFFDYMSBSZ-UHFFFAOYSA-N 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000004585 electronic sealant Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000012433 hydrogen halide Substances 0.000 description 1
- 229910000039 hydrogen halide Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- JIYNFFGKZCOPKN-UHFFFAOYSA-N sbb061129 Chemical compound O=C1OC(=O)C2C1C1C=C(C)C2C1 JIYNFFGKZCOPKN-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/22—Halogen free composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to a halogen-free flame-retardant epoxy resin sealant which mainly comprises A, B components, wherein the A component is a resin matrix, and the B component is a curing agent system. The method is mainly characterized in that melamine flame retardant is used for modifying the epoxy resin in the adhesive A to form a flame-retardant epoxy resin matrix. The resin matrix fully exerts the flame retardant property, the curing property and the rigid structure of the melamine flame retardant, and obviously improves the flame retardant property, the mechanical property and the high temperature resistance of the sealant. The sealant can be used for sealing LED light sources.
Description
Technical Field
The invention belongs to the technical field of electronic sealants, and particularly relates to a halogen-free flame-retardant high-temperature-resistant epoxy resin sealant for LED packaging.
Background
LED encapsulation refers to the encapsulation of a light-emitting chip, and is greatly different from the encapsulation of an integrated circuit, and the encapsulation of the LED not only requires that a lamp wick can be protected, but also needs to have certain light transmittance and flame retardant property. The flame retardant mainly comprises halogen-free flame retardant and halogen-containing flame retardant, wherein the halogen-containing flame retardant generates a large amount of smoke and toxic corrosive hydrogen halide gas in the case of fire, thereby causing secondary harm. The halogen-free flame retardant has less smoke generation during combustion and does not generate toxic corrosive gas, thereby being an important direction for the research of flame retardant materials.
At present, the fire retardant adopted by the LED pouring sealant is mainly an inorganic fire retardant. The halogen-free flame retardant used in patent CN2015104863160 is mainly one of aluminum hydroxide, magnesium hydroxide or zinc borate with average particle size of 2-10 μm which is surface treated by coupling agent. The flame retardant property is controlled mainly by adjusting the particle size of the inorganic flame retardant. For another example, CN2016103731188 uses a nano-modified magnesium-aluminum composite flame retardant. However, as the addition amount of the inorganic flame retardant increases, both the mechanical properties and the light transmittance thereof are significantly reduced. Meanwhile, the organic epoxy resin system still has combustibility, so that the flame retardant effect of independently adding the inorganic flame retardant is not obvious.
Disclosure of Invention
In order to solve the defects of the prior art, the invention provides a novel halogen-free flame-retardant high-temperature-resistant epoxy resin sealant, which has flame-retardant property by modifying epoxy resin, and further improves the flame-retardant property of the sealant, and the specific scheme is as follows:
a halogen-free flame-retardant high-temperature-resistant epoxy resin sealant comprises A, B components, wherein the A component is a resin matrix, the B component is a curing agent system, and the halogen-free flame-retardant high-temperature-resistant epoxy resin sealant comprises the following components in percentage by weight:
the component A comprises: 100 parts of epoxy resin, 2-15 parts of melamine series flame retardant, 2-10 parts of inorganic flame retardant, 5-20 parts of diluent, 0.2-5 parts of anti-yellowing agent, 0.1-2 parts of defoaming agent and 2-12 parts of coupling agent;
the epoxy resin comprises bisphenol A type epoxy resin and hydrogenated bisphenol A type epoxy resin, and the epoxy value of the epoxy resin is between 0.02 and 0.56;
the melamine series flame retardant comprises one or more of melamine, melamine urate or melamine phosphate;
the inorganic flame retardant comprises one or a mixture of more of magnesium hydroxide, aluminum hydroxide, silicon micropowder, zinc borate, magnesium oxide and aluminum oxide;
the diluent comprises trimethylolpropane triglycidyl ether or C12-14One or a mixture of two of aliphatic glycidyl ethers;
the anti-yellowing agent is an ultraviolet absorbent and comprises one or a mixture of UV-40, UV-531, UV-9, UV-P, UV-329, UV-326, UV-320, UV-234 and UV-0;
the defoaming agent is an organic silicon defoaming agent;
the coupling agent is a silane coupling agent and comprises one or a mixture of more of methyltrimethoxysilane, dimethyldimethoxysilane, vinyl trimethoxysilane, vinyl triethoxysilane and tetraethoxysilane;
and B component: 100 parts of curing agent, 0.5-8 parts of curing accelerator, 0.2-5 parts of toughening agent and 3-15 parts of coupling agent;
the curing agent comprises organic acid anhydride curing agent or alicyclic amine curing agent, wherein the organic acid anhydride curing agent is selected from methyl hexahydrophthalic anhydride, phthalic anhydride, maleic anhydride and methyl nadic anhydrideOne or more mixtures; the alicyclic amine curing agent comprises
One or more of alkyl diamine, N-aminoethyl piperazine, isophorone diamine and 1, 3-bis (aminomethyl) cyclohexane;
the curing accelerator is one or a mixture of 2,4, 6-tri (dimethylamino) phenol (TAP), tri (2-ethylhexanoate) salt of 2,4, 6-tri (dimethylamino methyl) phenol and trioleate salt of 2,4, 6-tri (dimethylamino methyl) phenol;
the toughening agent is polyhydric alcohol, and the specific trade marks comprise JA-782 and JA-783;
the coupling agent is a silane coupling agent and comprises one or a mixture of more of methyltrimethoxysilane, dimethyldimethoxysilane, vinyl trimethoxysilane, vinyl triethoxysilane and tetraethoxysilane;
the epoxy group in the epoxy resin and the amino group of the melamine series flame retardant can form a uniform modified epoxy resin complex by utilizing the hydrogen bonding force between molecules at low temperature in the using process of the sealing colloid system. Furthermore, the complex can also generate ring-opening polymerization of epoxy groups at high temperature to form a flame-retardant epoxy resin network system, so that the flame-retardant effect of the epoxy resin is improved. Meanwhile, as a rigid melamine structure is introduced into the epoxy group, the polymerized network system also has higher high-temperature resistance.
The invention also provides a preparation method of the related sealant, and the specific scheme is as follows:
preparation of glue A: the preparation method mainly comprises the following steps of (1) fully mixing epoxy resin and melamine flame retardant in a stirring kettle at the mixing temperature of 70-90 ℃ for 20-60min, and then cooling to obtain flame-retardant modified epoxy resin; (2) grinding and mixing the flame retardant and the silane coupling agent in a grinding machine for 20min, then putting the inorganic flame retardant with fully wetted surface into an oven at 80-120 ℃ for drying, fully bonding the coupling agent to the surface of the inorganic flame retardant, and then cooling to obtain the modified inorganic flame retardant; (3) sequentially adding the modified epoxy resin, the modified inorganic flame retardant, the diluent, the anti-yellowing agent and the defoaming agent into a kneading machine, fully kneading at 60-80 ℃ until the mixture is uniformly mixed, and cooling to room temperature to obtain glue A;
b, preparation of glue B: and (3) sequentially adding the curing agent, the curing accelerator, the toughening agent and the coupling agent into a kneader, fully kneading for 30-60min at 50-80 ℃, cooling and discharging to obtain the B glue.
When in use, the A glue and the B glue are mixed in vacuum according to the mass ratio of 1-5:1, poured onto the surface of a device to be packaged, and then cured and molded at the temperature of 120-170 ℃ to obtain a packaged device product.
The packaging adhesive prepared by the method has the characteristics of good flame retardant effect, high light transmittance, good heat resistance and excellent mechanical property, and can be widely used for a packaging system of an LED light source.
Detailed Description
The principles and features of this invention are described below in conjunction with examples which are set forth to illustrate, but are not to be construed to limit the scope of the invention. The following formulations are all by weight:
example 1.
A halogen-free flame-retardant high-temperature-resistant epoxy resin sealant comprises A, B components, wherein the A component comprises 100 components of bisphenol A type epoxy resin (E44), 8 components of melamine, 3 components of aluminum hydroxide, 6 components of trimethylolpropane triglycidyl ether, 0.5 component of UV-40 type ultraviolet absorbent, 0.2 component of organic silicon defoamer and 3 components of methyltrimethoxysilane; the component B comprises 100 parts of methylhexahydrophthalic anhydride, 1 part of 2,4, 6-tri (dimethylamino) phenol, 3 parts of JA-782 type toughening agent and 4 parts of methyltrimethoxysilane;
the preparation method of the epoxy resin sealant comprises the following steps:
preparation of glue A: (1) firstly, sufficiently mixing bisphenol A type epoxy resin (E44) and melamine in a stirring kettle at the mixing temperature of 75 ℃ for 30min, and then cooling to obtain flame-retardant modified epoxy resin; (2) grinding and mixing aluminum hydroxide and methyltrimethoxysilane in a grinding machine for 20min, then putting the inorganic flame retardant with fully wetted surface into a drying oven at 100 ℃ for drying, fully bonding the methyltrimethoxysilane to the surface of the inorganic flame retardant, and then cooling to obtain the modified inorganic flame retardant; (3) sequentially adding the modified epoxy resin, the modified inorganic flame retardant, the trimethylolpropane triglycidyl ether, the UV-40 type ultraviolet absorbent and the organic silicon defoamer into a kneader, fully kneading at 70 ℃ until the mixture is uniformly mixed, and cooling to room temperature to obtain glue A;
b, preparation of glue B: sequentially adding methyl hexahydrophthalic anhydride, 2,4, 6-tri (dimethylamino) phenol, JA-782 type toughening agent and methyltrimethoxysilane into a kneader, fully kneading for 40min at 60 ℃, cooling and discharging to obtain the B glue.
Example 2.
A halogen-free flame-retardant high-temperature-resistant epoxy resin sealant comprises A, B components, wherein the A component comprises 100 components of bisphenol A type epoxy resin (E51), 8 components of melamine urate, 3 components of aluminum hydroxide, 6 components of trimethylolpropane triglycidyl ether, 0.5 component of UV-40 type ultraviolet absorbent, 0.3 component of organic silicon defoamer and 8 components of methyltrimethoxysilane; the component B comprises 100 parts of maleic anhydride, 6 parts of 2,4, 6-tri (dimethylamino) phenol, 4 parts of JA-782 type toughening agent and 8 parts of methyltrimethoxysilane;
the preparation method of the epoxy resin sealant comprises the following steps:
preparation of glue A: (1) firstly, sufficiently mixing bisphenol A type epoxy resin (E51) and melamine urate in a stirring kettle at 75 ℃ for 30min, and then cooling to obtain flame-retardant modified epoxy resin; (2) grinding and mixing aluminum hydroxide and methyltrimethoxysilane in a grinding machine for 20min, then putting the inorganic flame retardant with fully wetted surface into a drying oven at 100 ℃ for drying, fully bonding the methyltrimethoxysilane to the surface of the inorganic flame retardant, and then cooling to obtain the modified inorganic flame retardant; (3) sequentially adding the modified epoxy resin, the modified inorganic flame retardant, the trimethylolpropane triglycidyl ether, the UV-40 type ultraviolet absorbent and the organic silicon defoamer into a kneader, fully kneading at 70 ℃ until the mixture is uniformly mixed, and cooling to room temperature to obtain glue A;
b, preparation of glue B: sequentially adding maleic anhydride, 2,4, 6-tri (dimethylamino) phenol, JA-782 type toughening agent and methyltrimethoxysilane into a kneader, kneading fully for 40min at 60 ℃, cooling and discharging to obtain the B glue.
Example 3.
A halogen-free flame-retardant high-temperature-resistant epoxy resin sealant comprises A, B components, wherein the A component comprises 100 components of bisphenol A epoxy resin (E51), 8 components of melamine urate, 3 components of magnesium hydroxide and C12-147 parts of aliphatic glycidyl ether, 1 part of UV-320 type ultraviolet absorbent, 0.3 part of organic silicon defoamer and 8 parts of methyltrimethoxysilane; the component B comprises 100 parts of maleic anhydride, 6 parts of 2,4, 6-tri (dimethylamino) phenol, 4 parts of JA-782 type toughening agent and 8 parts of methyltrimethoxysilane;
the preparation method of the epoxy resin sealant comprises the following steps:
preparation of glue A: (1) firstly, sufficiently mixing bisphenol A type epoxy resin (E51) and melamine urate in a stirring kettle at 75 ℃ for 30min, and then cooling to obtain flame-retardant modified epoxy resin; (2) grinding and mixing magnesium hydroxide and methyltrimethoxysilane in a grinding machine for 20min, then putting the inorganic flame retardant with fully wetted surface into a drying oven at 100 ℃ for drying, fully bonding the methyltrimethoxysilane to the surface of the inorganic flame retardant, and then cooling to obtain the modified inorganic flame retardant; (3) modified epoxy resin, modified inorganic flame retardant and C12-14Sequentially adding aliphatic glycidyl ether, UV-320 type ultraviolet absorbent and organic silicon defoamer into a kneader, fully kneading at 65 ℃ until the mixture is uniformly mixed, and cooling to room temperature to obtain glue A;
b, preparation of glue B: sequentially adding maleic anhydride, 2,4, 6-tri (dimethylamino) phenol, JA-782 type toughening agent and methyltrimethoxysilane into a kneader, kneading fully for 40min at 60 ℃, cooling and discharging to obtain the B glue.
Example 4.
A halogen-free flame-retardant high-temperature-resistant epoxy resin sealant comprises A, B components, wherein the A component comprises 100 components of bisphenol A epoxy resin (E51), 8 components of melamine urate, 3 components of magnesium hydroxide and C12-147 parts of aliphatic glycidyl ether, 1 part of UV-320 type ultraviolet absorbent, 0.3 part of organic silicon defoamer, and vinyl triethoxy silicon12 parts of an alkane; the component B comprises 100 parts of isophorone diamine, 3 parts of 2,4, 6-tri (dimethylamino) phenol, 4 parts of JA-783 type toughening agent and 8 parts of methyltrimethoxysilane;
the preparation method of the epoxy resin sealant comprises the following steps:
preparation of glue A: (1) firstly, sufficiently mixing bisphenol A type epoxy resin (E51) and melamine urate in a stirring kettle at 75 ℃ for 30min, and then cooling to obtain flame-retardant modified epoxy resin; (2) grinding and mixing magnesium hydroxide and vinyltriethoxysilane in a grinding machine for 30min, then putting the inorganic flame retardant with fully wetted surface into a drying oven at 105 ℃ for drying, fully bonding the vinyltriethoxysilane to the surface of the inorganic flame retardant, and then cooling to obtain the modified inorganic flame retardant; (3) modified epoxy resin, modified inorganic flame retardant and C12-14Sequentially adding aliphatic glycidyl ether, UV-320 type ultraviolet absorbent and organic silicon defoamer into a kneader, fully kneading at 65 ℃ until the mixture is uniformly mixed, and cooling to room temperature to obtain glue A;
b, preparation of glue B: adding isophorone diamine, 2,4, 6-tri (dimethylamino) phenol, JA-783 type toughening agent and methyl trimethoxy silane into a kneader in sequence, fully kneading for 30min at 50 ℃, cooling and discharging to obtain the B glue.
Example 5.
A halogen-free flame-retardant high-temperature-resistant epoxy resin sealant comprises A, B components, wherein the A component comprises 100 components of bisphenol A epoxy resin (E51), 8 components of melamine phosphate, 3 components of silica powder and C component12-144 parts of aliphatic glycidyl ether, 3 parts of trimethylolpropane triglycidyl ether, 0.5 part of UV-9 type ultraviolet absorbent, 0.5 part of UV-320 type ultraviolet absorbent, 0.3 part of organosilicon defoamer and 12 parts of vinyl triethoxysilane; the component B comprises 100 parts of isophorone diamine, 3 parts of 2,4, 6-tri (dimethylamino) phenol, 4 parts of JA-783 type toughening agent and 8 parts of methyltrimethoxysilane;
the preparation method of the epoxy resin sealant comprises the following steps:
preparation of glue A: (1) firstly, bisphenol A type epoxy resin (E51) and melamine phosphate are fully mixed in a stirring kettle and mixedThe mixing temperature is 75 ℃, the mixing time is 30min, and then the temperature is reduced to obtain the flame-retardant modified epoxy resin; (2) grinding and mixing the silicon micropowder and the vinyltriethoxysilane in a grinding machine for 30min, then putting the inorganic flame retardant with fully wetted surface into a drying oven at 105 ℃ for drying, fully bonding the vinyltriethoxysilane to the surface of the inorganic flame retardant, and then cooling to obtain the modified inorganic flame retardant; (3) modified epoxy resin, modified inorganic flame retardant and C12-14Sequentially adding aliphatic glycidyl ether, trimethylolpropane triglycidyl ether, UV-320 type ultraviolet absorbent, UV-9 type ultraviolet absorbent and organic silicon defoamer into a kneader, fully kneading at 80 ℃ until the mixture is uniformly mixed, and cooling to room temperature to obtain glue A;
b, preparation of glue B: adding isophorone diamine, 2,4, 6-tri (dimethylamino) phenol, JA-783 type toughening agent and methyl trimethoxy silane into a kneader in sequence, fully kneading for 30min at 50 ℃, cooling and discharging to obtain the B glue.
Example 6.
A halogen-free flame-retardant high-temperature-resistant epoxy resin sealant comprises A, B components, wherein the A component comprises 100 components of hydrogenated bisphenol A epoxy resin, 5 components of melamine, 3 components of magnesium oxide and C component12-144 parts of aliphatic glycidyl ether, 3 parts of trimethylolpropane triglycidyl ether, 0.5 part of UV-9 type ultraviolet absorbent, 0.5 part of UV-320 type ultraviolet absorbent, 0.3 part of organosilicon defoamer and 12 parts of vinyl triethoxysilane; the component B comprises 100 parts of isophorone diamine, 3 parts of 2,4, 6-tri (dimethylamino) phenol, 4 parts of JA-783 type toughening agent and 8 parts of methyltrimethoxysilane;
the preparation method of the epoxy resin sealant comprises the following steps:
preparation of glue A: (1) fully mixing hydrogenated bisphenol A epoxy resin and melamine in a stirring kettle at the mixing temperature of 80 ℃ for 45min, and then cooling to obtain flame-retardant modified epoxy resin; (2) grinding and mixing magnesium oxide and vinyltriethoxysilane in a grinding machine for 30min, then drying the inorganic flame retardant with fully wetted surface in a drying oven at 95 ℃ to fully bond the vinyltriethoxysilane to the surface of the inorganic flame retardant, and then cooling to obtain the flame retardantModified inorganic flame retardant; (3) modified epoxy resin, modified inorganic flame retardant and C12-14Sequentially adding aliphatic glycidyl ether, trimethylolpropane triglycidyl ether, UV-320 type ultraviolet absorbent, UV-9 type ultraviolet absorbent and organic silicon defoamer into a kneader, fully kneading at 80 ℃ until the mixture is uniformly mixed, and cooling to room temperature to obtain glue A;
b, preparation of glue B: adding isophorone diamine, 2,4, 6-tri (dimethylamino) phenol, JA-783 type toughening agent and methyl trimethoxy silane into a kneader in sequence, fully kneading for 30min at 50 ℃, cooling and discharging to obtain the B glue.
Comparative example 1.
The formulation used is similar to that of example 1, the main difference being that it does not contain a melamine flame retardant, nor does it modify the epoxy resin, as do the other preparation processes.
Comparative example 2.
The formulation used is similar to that of example 3, the main difference being that it does not contain melamine cyanurate flame retardant, nor does it modify the epoxy resin, as do the other preparation processes.
Comparative example 3.
The formulation used is similar to that of example 5, the main difference being that it does not contain melamine phosphate flame retardant, nor does it modify the epoxy resin, as do the other preparation processes.
To evaluate the performance characteristics of the above examples and comparative examples, the prepared A, B rubber was made into rubber sheets according to different ratios, and the tensile property, glass transition temperature, and light transmittance data were measured, and the related results are as follows:
as can be seen from the analysis of the above examples and comparative examples, the mechanical property and flame retardant property of the cured product of the sealant prepared by the invention are both obviously improved, and the temperature resistance of the sealant is also improved without affecting the light transmittance of the product.
The epoxy resin comprises bisphenol A type epoxy resin and hydrogenated bisphenol A type epoxy resin, and the epoxy value of the epoxy resin is between 0.02 and 0.56;
the above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (2)
1. A halogen-free flame-retardant high-temperature-resistant epoxy resin sealant comprises A, B components, wherein the A component is a resin matrix, and the B component is a curing agent system; the concrete components by weight are as follows:
the component A comprises: 100 parts of epoxy resin, 2-15 parts of melamine, 2-10 parts of inorganic flame retardant, 5-20 parts of diluent, 0.2-5 parts of anti-yellowing agent, 0.1-2 parts of defoaming agent and 2-12 parts of coupling agent; and B component: 100 parts of curing agent, 0.5-8 parts of curing accelerator, 0.2-5 parts of toughening agent and 3-15 parts of coupling agent;
the epoxy resin firstly reacts with melamine to generate flame-retardant modified epoxy resin, and the specific modification steps are as follows: fully mixing the epoxy resin and the melamine in a stirring kettle at the mixing temperature of 70-90 ℃ for 20-60min, and then cooling to obtain the flame-retardant modified epoxy resin;
the epoxy resin is bisphenol A type epoxy resin or hydrogenated bisphenol A type epoxy resin, and the epoxy value of the epoxy resin is between 0.02 and 0.56;
the inorganic flame retardant is one or a mixture of more of magnesium hydroxide, aluminum hydroxide, silicon micropowder, zinc borate, magnesium oxide and aluminum oxide;
the diluent is trimethylolpropane triglycidyl ether or C12-14One or a mixture of two of aliphatic glycidyl ethers;
the anti-yellowing agent is an ultraviolet absorbent and comprises one or a mixture of UV-40, UV-531, UV-9, UV-P, UV-329, UV-326, UV-320, UV-234 and UV-0;
the defoaming agent is an organic silicon defoaming agent;
the coupling agent in the component A is a silane coupling agent and comprises one or a mixture of more of methyltrimethoxysilane, dimethyldimethoxysilane, vinyl trimethoxysilane, vinyl triethoxysilane and ethyl orthosilicate;
the curing agent is an organic acid anhydride curing agent or an alicyclic amine curing agent, wherein the organic acid anhydride curing agent is one or a mixture of more of methylhexahydrophthalic anhydride, phthalic anhydride, maleic anhydride and methylnadic anhydride; the alicyclic amine curing agent comprisesone or more of alkyldiamine, N-aminoethyl piperazine, isophorone diamine and 1, 3-bis (aminomethyl) cyclohexane;
the curing accelerator is one or a mixture of 2,4, 6-tri (dimethylamino) phenol (TAP), tri (2-ethylhexanoate) salt of 2,4, 6-tri (dimethylamino methyl) phenol and trioleate salt of 2,4, 6-tri (dimethylamino methyl) phenol;
the toughening agent is polyhydric alcohol, and the specific trade marks comprise JA-782 and JA-783;
the coupling agent in the component B is a silane coupling agent and comprises one or a mixture of more of methyltrimethoxysilane, dimethyldimethoxysilane, vinyl trimethoxysilane, vinyl triethoxysilane and ethyl orthosilicate.
2. The preparation method of the halogen-free flame retardant high temperature resistant epoxy resin sealant as claimed in claim 1, characterized by comprising the following steps:
preparation of component A: (1) firstly, fully mixing epoxy resin and melamine in a stirring kettle at the mixing temperature of 70-90 ℃ for 20-60min, and then cooling to obtain flame-retardant modified epoxy resin; (2) grinding and mixing the inorganic flame retardant and a silane coupling agent in a grinding machine for 20min, then putting the inorganic flame retardant with fully wetted surface into a drying oven at 80-120 ℃ for drying, fully bonding the coupling agent to the surface of the inorganic flame retardant, and then cooling to obtain the modified inorganic flame retardant; (3) sequentially adding the modified epoxy resin, the modified inorganic flame retardant, the diluent, the anti-yellowing agent and the defoaming agent into a kneader, fully kneading at 60-80 ℃ until the mixture is uniformly mixed, and cooling to room temperature to obtain a component A;
preparation of the component B: and (3) sequentially adding the curing agent, the curing accelerator, the toughening agent and the coupling agent into a kneader, fully kneading for 30-60min at 50-80 ℃, cooling and discharging to obtain the component B.
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| CN102838959A (en) * | 2011-06-22 | 2012-12-26 | 费金华 | Modified flame-retarding epoxy resin adhesive |
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