CN109900394A - A kind of bionic array sensing element and preparation method thereof - Google Patents
A kind of bionic array sensing element and preparation method thereof Download PDFInfo
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- CN109900394A CN109900394A CN201910175777.4A CN201910175777A CN109900394A CN 109900394 A CN109900394 A CN 109900394A CN 201910175777 A CN201910175777 A CN 201910175777A CN 109900394 A CN109900394 A CN 109900394A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
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Abstract
The invention discloses a kind of bionic array sensing elements and preparation method thereof, shown bionic array sensing element includes: flexible substrates, crackle array is provided in the flexible substrates, several conductive units being arranged on the crackle array and the deposition route for connecting several conductive units；Each conductive unit is connected in parallel by the deposition route.Since each conductive unit has crack structtire, thus form an independent sensing unit.Each conductive unit is connected using deposition connection, and using parallel way.Each sensing unit can independently perceive the stimulation that it is corresponded in induction region and solve the problems, such as that single sensing unit accuracy is not high to obtain the exact position of stimulation.
Description
Technical field
The present invention relates to sensor fields more particularly to a kind of bionic array sensing element and preparation method thereof.
Background technique
Currently, the strain/stress sensor based on piezoresistive effect can be divided into two class of structural type and material type.Structural type is answered
Becoming the principle that sensor utilizes is that micro-nano structure perceives strain after stress deformation.Material type strain transducer application principle be
The scale effect of all kinds of novel nano-materials.Mechanical structure type transducer experienced the John A. of Illinois university, the U.S.
Rogers teaches the sinuous serpentine configuration of team, and John A. Rogers teaches fold-type (bulking) strain sensing of team
Kahp Yang Suh of device South Korea Seoul national university et al., the chiasma type strain of the micrometer fibers structure that intersects of manufacture
After the development of sensor, occur producing various templates using photoetching technique in recent years again to manufacture pyramid, nano-pillar
Type sensing element.The development of material type strain transducer is mainly based upon using by various Chemical self-assemblies, the nanometer of polymerization
Material.Currently, the nanocomposite for sensor includes nano metal particles (Nps), carbon nanotubes (CNTs) or its two
Person's is compound, and there are also nano metal line (NWs)；Graphene (Graphene) and its derivative type.The strain of nano-functional material type
The strain mechanism of perception of sensor is when straining, and the spacing for being embedded into nanoparticle or nanometer sheet in flexible substrates changes
Become, the state that contacts with each other also changes, and thus caused electrical characteristic variation is measured for straining perception.
In the prior art, sensor is usually to prepare in single form, and the durability of single sensor is poor, and accuracy is not
It is enough.
Therefore, the existing technology needs to be improved and developed.
Summary of the invention
The technical problem to be solved in the present invention is that in view of the above drawbacks of the prior art, providing a kind of bionic array biography
Sensing unit and preparation method thereof, it is intended to solve in the prior art seam sensing unit can not large area use, zonule can only be directed to
The problem of small range uses.
The technical proposal for solving the technical problem of the invention is as follows:
A kind of bionic array sensing element, wherein include: flexible substrates, crackle array is provided in the flexible substrates, be arranged
Several conductive units on the crackle array and the deposition route for connecting several conductive units；The deposition
Each conductive unit is connected in parallel by route.
The bionic array sensing element, wherein the deposition route includes: positioned at the first of the crackle array centre
Route, positioned at the first line two sides and connect with the first line the second route, be separately positioned on conductive unit two
The tertiary circuit of side and the 4th route；The two of crackle where the tertiary circuit and the 4th route are located at the conductive unit
Side, the tertiary circuit and second connection.
The bionic array sensing element, wherein the flexible substrates are made of following material: epoxy resin, thermoplastic
Property polyurethane, polyacrylate, Kynoar, polystyrene, polyamide, polyimides, polyethylene terephthalate,
Styrene-Butadiene-Styrene Block Copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-
Butylene-styrene block copolymer, styrene ethylene-propylene-styrene type block copolymer, natural rubber, butadiene-styrene rubber,
Butadiene rubber, isoprene rubber, silicon rubber, neoprene, butyl rubber, nitrile rubber, EP rubbers, fluorubber, poly dimethyl
Siloxanes, styrene analog thermoplastic elastomer, olefin hydrocarbons thermoplasticity elastic body, diene analog thermoplastic elastomer, polyvinyl chloride-base heat
One of thermoplastic elastic, polyamide-type thermoplastic elastomer or thermoplastic vulcanizates are a variety of.
State bionic array sensing element, wherein the depth of crackle is 60-1000nm in the crackle array, and width is
800-1200nm。
The bionic array sensing element, wherein the conductive unit with a thickness of 40-60nm.
The bionic array sensing element, wherein the conductive unit is made of following material: carbon nano-particles, gold
Nanoparticle, nano platinum particle, Nano silver grain, copper nano-particle, aluminum-boron alloy, aluminum chromium, ferromanganese, aluminium chromium yttrium close
One of gold, silver copper palldium alloy is a variety of.
The bionic array sensing element, wherein the flexible substrates with a thickness of 200-600 μm.
A kind of preparation method of the bionic array sensing element as described in above-mentioned any one, which is characterized in that including with
Lower step:
Preparation has the flexible substrates of crackle array；
Conductive unit is plated on crackle array；
The deposition route of deposition connection conductive unit on a flexible substrate.
The preparation method of the bionic array sensing element, wherein the flexible substrates of the preparation with crackle array walk
Suddenly it specifically includes:
It is heated after quantitative alcohol is added in polystyrene culture dish with cover, forms crackle array on lid on culture dish and split
Line array mould plate；
Antistructure template is prepared with crackle array mould plate；
Deaeration processing and heat treatment are carried out after spin coating flexible material in antistructure template, and remove antistructure template obtain it is soft
Property substrate.
The preparation method of the bionic array sensing element, wherein described that conductive element steps tool is plated on crackle array
Body includes:
Conductive unit is plated after covering flexible substrates using the first mask plate；
The deposition course step of the connection conductive unit of deposition on a flexible substrate specifically includes:
Plated deposition route after the second mask plate covering flexible substrates is used after removing the first mask plate.
The utility model has the advantages that since each conductive unit has crack structtire, thus form an independent sensing unit.Respectively lead
Electric unit is connected using deposition connection, and using parallel way.Each sensing unit can independently perceive it and correspond to induction
Stimulation in region solves the problems, such as that single sensing unit accuracy is not high to obtain the exact position of stimulation.
Detailed description of the invention
Fig. 1 is the first structure diagram of bionic array sensing element in the present invention.
Fig. 2 is the SEM figure of bionical crack structtire in flexible substrates in the present invention.
Fig. 3 is the AFM figure of bionical crack structtire in flexible substrates in the present invention.
Fig. 4 is the structural schematic diagram of the first template.
Fig. 5 is the structural schematic diagram of the second template.
Fig. 6 is the second structural schematic diagram of bionic array sensing element in the present invention.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention clearer and more explicit, right as follows in conjunction with drawings and embodiments
The present invention is further described.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and do not have to
It is of the invention in limiting.
Please refer to Fig. 1-Fig. 6, the present invention provides a kind of some embodiments of bionic array sensing element.
Scorpion class passes through very long evolution in 1 years, and there is no significant changes for morphosis.Its body surface has evolved quick
The sensor of sharp crack form can perceive very small vibration signal, thus food and hide natural enemy to hunt.Cause
This, is had a very important significance by simulation scorpion fissured structure to prepare sensor.
As depicted in figs. 1 and 2, a kind of bionic array sensing element of the invention, comprising: flexible substrates 10, the flexibility
It is provided with crackle array 11 in substrate 10, several conductive units 20 on the crackle array 11 are set and connection is several
The deposition route 30 of a conductive unit 20；Each conductive unit 20 is connected in parallel by the deposition route 30.
For every Crack in crackle array 11, conductive unit 20, each conductive unit is arranged in the length direction along crackle
20 have crack structtire, thus form an independent sensing unit.Several each conductive units 20 form conductive unit array, then
Each conductive unit 20 is connected using deposition route 30, each conductive unit 20 is connected using parallel way.Each sensing unit can
The stimulation in induction region is corresponded to independently to perceive it, to obtain the exact position of stimulation, solves single sensing unit essence
The not high problem of true property.Certainly, each conductive unit can also combine perceptible stimulus, due to each conductive unit perception stimulation it is big
Small different, the power of the electric signal of output is not identical, can obtain the whole size distribution figure of stimulation.
Flexible substrates 10 with crackle array 11 are prepared using following steps:
Step S110, it is added after quantitative alcohol to heating, is training in laboratory commonly polystyrene (PS) culture dish with cover
Crackle array, which is formed, on lid on feeding ware obtains crackle array mould plate.
Specifically, ethyl alcohol heating temperature is 80 DEG C, heating time 8-16h, due to solvent-induced method and polystyrene line
Property strand characteristic, polystyrene upper lid surface occur rule crackle array structure, then use its table of ultrasonic cleaning
Face.
Step S120, antistructure template is prepared with crackle array mould plate.
Specifically, antistructure template is prepared using epoxy resin AB glue in the present invention, by epoxy resin AB glue with the matter of 3:1
It measures ratio after mixing, is put into polystyrene upper cover, and vacuum defoamation, inclined heated plate 2h are carried out by vacuum tank.So
Afterwards, it is put into baking oven and is solidified, solidification temperature is 50 DEG C, curing time 7-9h.After epoxide resin AB adhesive curing, it can adopt
Mechanically the film (i.e. antistructure template) that epoxide resin AB adhesive curing is formed is separated with crackle array mould plate, antistructure mould
Plate has the V-type protrusion cooperated with crackle array 11.
Step S130, deaeration processing and heat treatment are carried out after spin coating flexible material in antistructure template, and is removed anti-
Stay in place form obtains flexible substrates 10.
Specifically, the flexible material is epoxy resin, thermoplastic polyurethane, polyacrylate, Kynoar, polyphenyl
Ethylene, polyamide, polyimides, polyethylene terephthalate, Styrene-Butadiene-Styrene Block Copolymer, benzene second
Alkene-isoprene-styrene block copolymer, styrene-ethylene-butylene-styrene block copolymer, styrene-ethylene-the third
Alkene-styrene type block copolymer, natural rubber, butadiene-styrene rubber, butadiene rubber, isoprene rubber, silicon rubber, neoprene, fourth
Base rubber, nitrile rubber, EP rubbers, fluorubber, dimethyl silicone polymer, styrene analog thermoplastic elastomer, olefines heat
Thermoplastic elastic, diene analog thermoplastic elastomer, polyvinyl chloride-base thermoplastic elastomer, polyamide-type thermoplastic elastomer or thermoplastic
One of property vulcanized rubber is a variety of.
In order to accelerate the solidification of flexible material, curing agent is added in flexible material, flexible material and curing agent are with quality
After ratio mixing than 8-12:1, it is spin-coated in antistructure template by spin coater, being specifically spin-coated in antistructure template has V
The one side of type protrusion.Then deaeration processing and heat treatment are carried out, uses vacuum defoamation here, heating temperature is 70-90 DEG C, is added
The hot time is 3-5h.Antistructure template is finally removed using mechanical system, due to there is V-type raised in antistructure template, then soft
Property substrate 10 have and the consistent crackle array structure of crackle array mould plate.By controlling the additional amount of flexible material, can obtain
To the flexible substrates 10 of different-thickness, in the present embodiment, flexible substrates 10 with a thickness of 200-600 μm.As shown in figure 3, crackle
The depth of crackle is 60-1000nm, width 800-1200nm in array 11.
In the present invention in a preferred embodiment, the deposition route 30 includes: positioned at 11 center of crackle array
First line 31, positioned at 31 two sides of first line and connect with the first line 31 the second route 32, respectively set
Set the tertiary circuit 33 and the 4th route 34 in 20 two sides of conductive unit；The tertiary circuit 33 and the 4th route 34 are located at
The two sides of the 20 place crackle of conductive unit, the tertiary circuit 33 are connect with second route 32.That is, respectively leading
Electric unit one end converges to the center of sensing element with the output of first line 31, and the other end diffuses to sensing element edge, with reality
Now each conductive unit 20 is connected in parallel.The space for being conducive to save sensing element in this way, reduces the arrangement of deposition route 30, prevents
Conducting only occurs between each conductive unit 20 and destroys parallel.
In specific embodiment, as depicted in figs. 1 and 2, there are several crackles, the spacing between two crackles in crackle array
About 50 microns, at least one crackle of each conductive unit, naturally it is also possible to cover a plurality of crackle, conductive unit in the present embodiment
It is arranged and is arranged using 4 rows 4.First line 31 only has one, and the second route 32 has two, is respectively communicated with leading for 31 two sides of first line
Electric unit, tertiary circuit 33 and the 4th route 34 respectively have 16 articles, that is to say, that first line 31 and the second route 32 form bus
Branch corresponds respectively to 16 conductive units, that is to say, that the tertiary circuit 33 of each conductive unit and the formation of the 4th route 34
One branch.As shown in fig. 6, first line 31 and the 4th route 34 are respectively connected with conducting wire 60.
Conductive unit 20 and deposition route 30 are made in flexible substrates 10 using following steps in the present invention:
Step S200, conductive unit 20 is plated on crackle array 11.
Specifically, conductive unit 20 is plated after covering flexible substrates 10 using the first mask plate 40.The system of first mask plate 40
It is as follows to make method: as shown in figure 4, determining the position of each sensing unit in template, first through hole being set in corresponding position
41, the length and width of first through hole 41 are respectively 8mm and 4mm.Divide 4 rows 4 column 16 first through hole 41 of arrangement.Adjacent rows first through hole
Longitudinal pitch between 41 is between 10mm, first row and secondary series, the cross of each first through hole 41 between third column and the 4th column
To spacing between 3mm.First row and the 4th column sensing unit array with away from a distance from the parallel two sides of substrate between 10mm.
The spacing of secondary series and third column sensing unit array is between 7mm.
It first passes through the first mask plate 40 and carries out sensing unit array sputter coating, template placement direction will be put down substantially with crack
Row guarantees so that crackle is parallel with the short side of first through hole 41 in each first through hole 41.
Specifically, the conductive unit 20 is made of following material: carbon nano-particles, gold nanoparticle, platinum nanoparticle
Son, Nano silver grain, copper nano-particle, aluminum-boron alloy, aluminum chromium, ferromanganese, aluminium chromium yittrium alloy, in silver-bearing copper palldium alloy
It is one or more.The conductive unit 20 with a thickness of 40-60nm, considered according to economy and select silver as target, sprayed about
For the silver particles film of 50nm thickness.Certainly deposition route 30 can be made of the conductive material as conductive unit 20.
Step S300, the deposition route 30 of deposition connection conductive unit 20 in flexible substrates 10.
Specifically, plated deposition route after the second mask plate 50 covering flexible substrates 10 is used after removing the first mask plate 40
30.Second mask plate 50 the production method is as follows: as shown in figure 5, determine deposition route 30 width be 1mm.And deposited adjacent line
Spacing between road 30 is not less than 1mm.Arrange that 16 branches and a bus branch, the position of each branch guarantee in total
Reach seamless connection with the sensing unit of first time mask plate.Setting and deposition route 30 consistent the on the second mask plate 50
Two through-holes 51.
After the completion of the sputtering of conductive unit 20, the first mask plate 40 is carefully removed with tweezers, then the second mask plate 50 is small
The heart is attached in flexible substrates 10.Nanogold (or nano silver) particle granules for coating 50nm thickness are sprayed twice.Certainly,
In order to ensure the 30 smooth energization of energy of deposition route, conductive material can be sprayed, deposition is thicker, such as with a thickness of 60-80nm more.
The preparation method for the bionic array sensing element that the present invention provides a kind of as described in above-mentioned any embodiment is some
Embodiment.
The preparation method comprises the following steps:
Step S100, preparation has the flexible substrates of crackle array, as detailed above.
Step S110, it heats after quantitative alcohol is added in polystyrene culture dish with cover, is formed on lid on culture dish
Crackle array obtains crackle array mould plate, as detailed above.
Step S120, antistructure template is prepared with crackle array mould plate, as detailed above.
Step S130, deaeration processing and heat treatment are carried out after spin coating flexible material in antistructure template, and is removed anti-
Stay in place form obtains flexible substrates, as detailed above.
Step S200, conductive unit is plated on crackle array, as detailed above.
Step S210, conductive unit is plated after covering flexible substrates using the first mask plate, as detailed above.
Step S300, the deposition route of connection conductive unit is deposited on a flexible substrate, as detailed above.
Step S310, plated deposition route after the second mask plate covering flexible substrates is used after removing the first mask plate, specifically
As described above.
In conclusion a kind of bionic array sensing element provided by the present invention and preparation method thereof, shown bionic array
Sensing element includes: flexible substrates, and crackle array is provided in the flexible substrates, is arranged in several on the crackle array
A conductive unit and the deposition route for connecting several conductive units；The deposition route connects each conductive unit parallel connection
It connects.Since each conductive unit has crack structtire, thus form an independent sensing unit.Each conductive unit is using deposition
Connection, and connected using parallel way.Each sensing unit can independently perceive it and correspond to the stimulation in induction region, from
And the exact position of stimulation is obtained, solve the problems, such as that single sensing unit accuracy is not high.
It should be understood that the application of the present invention is not limited to the above for those of ordinary skills can
With improvement or transformation based on the above description, all these modifications and variations all should belong to the guarantor of appended claims of the present invention
Protect range.
Claims (10)
1. a kind of bionic array sensing element characterized by comprising flexible substrates are provided with crackle in the flexible substrates
Array, several conductive units being arranged on the crackle array and the cement line for connecting several conductive units
Road；Each conductive unit is connected in parallel by the deposition route.
2. bionic array sensing element according to claim 1, which is characterized in that the deposition route includes: positioned at described
The first line of crackle array centre, positioned at the first line two sides and connect with the first line the second route, point
The tertiary circuit and the 4th route of conductive unit two sides are not set；The tertiary circuit and the 4th route are located at described lead
The two sides of crackle, the tertiary circuit and second connection where electric unit.
3. bionic array sensing element according to claim 1, which is characterized in that the flexible substrates use following material system
At: epoxy resin, thermoplastic polyurethane, polyacrylate, Kynoar, polystyrene, polyamide, polyimides, poly- pair
Ethylene terephthalate, Styrene-Butadiene-Styrene Block Copolymer, styrene-isoprene-phenylethene block are total
Polymers, styrene-ethylene-butylene-styrene block copolymer, styrene ethylene-propylene-styrene type block copolymer, day
Right rubber, butadiene-styrene rubber, butadiene rubber, isoprene rubber, silicon rubber, neoprene, butyl rubber, nitrile rubber, EP rubbers,
Fluorubber, dimethyl silicone polymer, styrene analog thermoplastic elastomer, olefin hydrocarbons thermoplasticity elastic body, dienes thermoplastic elastomehc
One of property body, polyvinyl chloride-base thermoplastic elastomer, polyamide-type thermoplastic elastomer or thermoplastic vulcanizates are a variety of.
4. bionic array sensing element according to claim 1, which is characterized in that the depth of crackle is in the crackle array
60-1000nm, width 800-1200nm.
5. bionic array sensing element according to claim 1, which is characterized in that the conductive unit with a thickness of 40-
60nm。
6. bionic array sensing element according to claim 1, which is characterized in that the conductive unit uses following material system
At: carbon nano-particles, gold nanoparticle, nano platinum particle, Nano silver grain, copper nano-particle, aluminum-boron alloy, aluminum chromium,
One of ferromanganese, aluminium chromium yittrium alloy, silver-bearing copper palldium alloy are a variety of.
7. bionic array sensing element according to claim 1, which is characterized in that the flexible substrates with a thickness of 200-
600μm。
8. a kind of preparation method of the bionic array sensing element as described in claim 1-7 any one, which is characterized in that packet
Include following steps:
Preparation has the flexible substrates of crackle array；
Conductive unit is plated on crackle array；
The deposition route of deposition connection conductive unit on a flexible substrate.
9. the preparation method of bionic array sensing element according to claim 8, which is characterized in that the preparation has crackle
The flexible substrates step of array specifically includes:
It is heated after quantitative alcohol is added in polystyrene culture dish with cover, forms crackle array on lid on culture dish and split
Line array mould plate；
Antistructure template is prepared with crackle array mould plate；
Deaeration processing and heat treatment are carried out after spin coating flexible material in antistructure template, and remove antistructure template obtain it is soft
Property substrate.
10. the preparation method of bionic array sensing element according to claim 8, which is characterized in that described in crackle array
Upper plating conductive element steps specifically include:
Conductive unit is plated after covering flexible substrates using the first mask plate；
The deposition course step of the connection conductive unit of deposition on a flexible substrate specifically includes:
Plated deposition route after the second mask plate covering flexible substrates is used after removing the first mask plate.
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| CN201910175777.4A CN109900394A (en) | 2019-03-08 | 2019-03-08 | A kind of bionic array sensing element and preparation method thereof |
| PCT/CN2019/113681 WO2020181781A1 (en) | 2019-03-08 | 2019-10-28 | Bionic array sensing element and preparation method thereof |
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| WO2020181781A1 (en) * | 2019-03-08 | 2020-09-17 | 吉林大学 | Bionic array sensing element and preparation method thereof |
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| CN111521305A (en) * | 2020-04-03 | 2020-08-11 | 吉林大学 | Bionic sensor for measuring mechanical signal and manufacturing method thereof |
| CN111521305B (en) * | 2020-04-03 | 2021-12-14 | 吉林大学 | Bionic sensor for measuring mechanical signal and manufacturing method thereof |
| CN112432589A (en) * | 2020-11-30 | 2021-03-02 | 中南大学 | Parallel flexible strain sensor and preparation method thereof |
| CN112432589B (en) * | 2020-11-30 | 2022-06-24 | 中南大学 | Parallel flexible strain sensor and preparation method thereof |
| WO2022247018A1 (en) * | 2021-05-26 | 2022-12-01 | 苏州大学 | Microcrack strain sensing element, preparation method therefor and application thereof |
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Application publication date: 20190618 |