CN109852843A - Indium tin silver copper alloy and preparation method and application thereof - Google Patents
Indium tin silver copper alloy and preparation method and application thereof Download PDFInfo
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- CN109852843A CN109852843A CN201910259665.7A CN201910259665A CN109852843A CN 109852843 A CN109852843 A CN 109852843A CN 201910259665 A CN201910259665 A CN 201910259665A CN 109852843 A CN109852843 A CN 109852843A
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- Prior art keywords
- silver
- tin
- indium
- copper
- copper alloy
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- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 39
- 239000000956 alloy Substances 0.000 title claims abstract description 39
- SQIBVKXUIBVITQ-UHFFFAOYSA-N [Ag].[Sn].[In].[Cu] Chemical compound [Ag].[Sn].[In].[Cu] SQIBVKXUIBVITQ-UHFFFAOYSA-N 0.000 title claims abstract description 30
- 238000002360 preparation method Methods 0.000 title claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910052802 copper Inorganic materials 0.000 claims abstract description 34
- 239000010949 copper Substances 0.000 claims abstract description 34
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 29
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052738 indium Inorganic materials 0.000 claims abstract description 21
- 229910052718 tin Inorganic materials 0.000 claims abstract description 19
- 229910052709 silver Inorganic materials 0.000 claims abstract description 18
- 239000004332 silver Substances 0.000 claims abstract description 18
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 239000000843 powder Substances 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 239000000243 solution Substances 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 5
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 claims description 3
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 2
- 239000011135 tin Substances 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 abstract description 6
- 229910000969 tin-silver-copper Inorganic materials 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 238000005452 bending Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910001074 Lay pewter Inorganic materials 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003181 co-melting Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Adornments (AREA)
Abstract
The invention discloses an indium tin silver copper alloy, which comprises 20-90% of indium, 5-80% of tin, 1-10% of silver and 0.3-2% of copper by mass ratio, and has the following beneficial effects: the indium tin silver copper alloy provided by the invention has very good plasticity on the basis of inheriting the excellent quality of the tin silver copper alloy, can be used in electronic products, can greatly improve the plasticity, and still cannot influence the smooth circuit of the electronic products after being bent for many times.
Description
Technical field
The invention belongs to metal alloy fields, and in particular to a kind of indium Tin Silver Copper Alloy and its preparation method and application.
Background technique
Initial stage nineties conditional electronic industry weld production alloy be mainly leypewter, later because environmental protection requirement,
It is gradually replaced with silver-bearing copper, uses Xi Yin or tin silver copper or gun-metal instead, this kind of alloy use is in terms of PCB manufacturing industry trusts effect
It is done well.But as the update of product upgrades, Xi Yin or tin silver copper or the not strong defect of gun-metal plasticity are produced in part
It is gradually protruded on product, therefore causes product more bad.Modern, the pursuit to electronic product, does not require nothing more than beauty, Er Qieyao
Ask durable, in public understanding, plastic definition is are as follows: still not broken by repeatedly bending.But it is made as electronic product
, in use, the fold for needing to be tossed about, if the material before continuing to use, plasticity compared with
Difference, service life can all reduce very much.
Summary of the invention
To solve the above-mentioned problems, the present invention provides a kind of indium Tin Silver Copper Alloy and its preparation method and application, specifically
Technical solution is as follows:
A kind of indium Tin Silver Copper Alloy, including indium metal, metallic tin, mass ratio, in metallic silver and metallic copper, the mass fraction of indium is
20%-90%, the mass fraction of tin are 5%-80%, and silver-colored mass fraction is 1-10%, and the mass fraction of copper is 0.3%-2%.
As a further improvement, it is characterised in that: the indium, tin, silver, copper mass fraction be respectively 65%, 30%,
4.5% and 0.5%.
A kind of preparation method of above-mentioned indium Tin Silver Copper Alloy, the specific steps are that:
Step 1: by metallic silver, copper rinse in aqueous solution respectively, then drying is pounded silver powder and copper powders；
Step 2: metallic tin is melted, and temperature is promoted to 350-400 DEG C, is added described in step 1 in soldering tin
Silver powder and copper powders, and constantly stir evenly；
Step 3: being processed into powder for indium metal, is added in the heat fusing tin liquor in step 2, is stirred mixing about 1-3
Minute；
Step 4: the metal mixed liquid in step 3 is poured into corresponding template and is cooled down, indium Tin Silver Copper Alloy is frozen into.
In the metal each component, the fusing point of tin is relatively low, silver-bearing copper will be firstly added after tin melting, co-melting stirring is one
It rises, indium powder is then added, stirring constitutes mixed liquor, is subsequently poured into cooling medium and begins to cool to form alloy, there is indium, can have
There is good plasticity, after being made into electronic product, even if the electronic product turns down repeatedly nor affects on its performance, is applicable in model
It encloses extensively, product quality is higher.
It is further to improve, it is characterised in that: in the aqueous solution of the step 1 plus number acid carries out rinse.
A kind of application method of above-mentioned indium Tin Silver Copper Alloy, for manufacturing earphone.
In use, there are many bending for earphone, are to prevent welding disconnected by glue covering product in traditional manufacture
It splits, but in practical application, is still easier the bad reason of route occur, be mainly exactly because traditional volume Tin Silver Copper Alloy can
Poor effect is moulded, and having used indium Tin Silver Copper Alloy then can make earphone still not broken by repeatedly bending, nor affect on electricity
Sub-line road.
Beneficial effects of the present invention: indium Tin Silver Copper Alloy provided by the invention is inheriting Tin Silver Copper Alloy fine quality
On the basis of there are also very good plasticity, for its plasticity can be greatly improved in electronic product, by multiple curved
The route that folding still will not influence electronic product is unobstructed.
Specific embodiment
In order to deepen the understanding of the present invention, below in conjunction with embodiment, the invention will be described in further detail, the reality
It applies example for explaining only the invention, protection scope is not constituted and limited.
Embodiment 1
A kind of indium Tin Silver Copper Alloy, including indium metal, metallic tin, mass ratio, in metallic silver and metallic copper, the mass fraction of indium is
20%, the mass fraction of tin is 75%, and silver-colored mass fraction is 4%, and the mass fraction of copper is 1%.
A kind of preparation method of above-mentioned indium Tin Silver Copper Alloy, the specific steps are that:
Step 1: by the rinse in hydrochloric acid solution respectively of metallic silver, copper, then drying is pounded silver powder and copper powders；The process
In, the oxide on silver-bearing copper surface or other impurities can be removed, be further ensured that the purity of silver-bearing copper.
Step 2: metallic tin is melted, and temperature is promoted to 400 DEG C, is added described in step 1 in soldering tin
Silver powder and copper powders, and constantly stir evenly；In the step, it can be filtered to remove first by tin after 231 DEG C of fusing point meltings
Solid impurity is then heated to 400 DEG C, and silver powder and copper powders are added while then stirring, is uniformly mixed.
Step 3: being processed into powder for indium metal, is added in the heat fusing tin liquor in step 2, is stirred mixing about
1 minute；Indium metal is as rare earth metal, after joining, stirs evenly, and constitutes the solution of tin of uniform indium, silver, copper.
Step 4: the metal mixed liquid in step 3 is poured into corresponding template and is cooled down, indium tin silver copper is frozen into
Alloy.In cooling procedure, the problem of in order to guarantee stress in alloy formation process, when can slowly cool to 200 DEG C, then suitably
Cooling progress is improved, and then guarantees to form alloy within the faster time, improves yield.
The indium Tin Silver Copper Alloy inherited Tin Silver Copper Alloy it is excellent on the basis of, can have better plasticity,
The production and manufacture of more electronic products are met, and improves its service life.
A kind of application method of above-mentioned indium Tin Silver Copper Alloy, for manufacturing earphone.When the metal material of manufacture earphone
When being substituted with above-mentioned indium Tin Silver Copper Alloy, the earphone produced can use the several years, after experienced a large amount of fold,
It still can guarantee the unobstructed of route.
Embodiment 2
A kind of indium Tin Silver Copper Alloy, including indium metal, metallic tin, mass ratio, in metallic silver and metallic copper, the mass fraction of indium is
65%, the mass fraction of tin is 30%, and silver-colored mass fraction is 4.5%, and the mass fraction of copper is 0.5%.
A kind of preparation method of above-mentioned indium Tin Silver Copper Alloy, the specific steps are that:
Step 1: by the rinse in aqueous hydrochloric acid solution respectively of metallic silver, copper, then drying is pounded silver powder and copper powders；
Step 2: metallic tin is melted, and temperature is promoted to 400 DEG C, and silver powder described in step 1 is added in soldering tin
End and copper powders, and constantly stir evenly；
Step 3: being processed into powder for indium metal, is added in the heat fusing tin liquor in step 2, is stirred about 2 points of mixing
Clock；
Step 4: the metal mixed liquid in step 3 is poured into corresponding template and is cooled down, indium Tin Silver Copper Alloy is frozen into.
Embodiment 3
A kind of indium Tin Silver Copper Alloy, it is characterised in that: including indium metal, metallic tin, mass ratio in metallic silver and metallic copper, indium
Mass fraction is 90%, and the mass fraction of tin is 5%, and silver-colored mass fraction is 4%, and the mass fraction of copper is 1%.
A kind of preparation method of above-mentioned indium Tin Silver Copper Alloy, the specific steps are that:
Step 1: by the rinse in aqueous hydrochloric acid solution respectively of metallic silver, copper, then drying is pounded silver powder and copper powders；
Step 2: metallic tin is melted, and temperature is promoted to 350 DEG C, and silver powder described in step 1 is added in soldering tin
End and copper powders, and constantly stir evenly；
Step 3: being processed into powder for indium metal, is added in the heat fusing tin liquor in step 2, is stirred about 3 points of mixing
Clock；
Step 4: the metal mixed liquid in step 3 is poured into corresponding template and is cooled down, indium Tin Silver Copper Alloy is frozen into.
In integrated embodiment 1-3, each component is slightly different, and feature has difference slightly, can be directed to subtle difference
It is not applied to different electronic field products, which can not only influence the circuit in electronic product as solder, but also i.e.
Make product fold repeatedly, will not influence to connect, compared with traditional glue, fold is easy to fall off several times, and then influences to produce
Product use.
Claims (5)
1. a kind of indium Tin Silver Copper Alloy, it is characterised in that: including indium metal, metallic tin, mass ratio in metallic silver and metallic copper, indium
Mass fraction be 20%-90%, the mass fraction of tin is 5%-80%, and silver-colored mass fraction is 1-10%, and the mass fraction of copper is
0.3%-2%。
2. a kind of indium Tin Silver Copper Alloy according to claim 1, it is characterised in that: the quality point of the indium, tin, silver, copper
Number is respectively 65%, 30%, 4.5% and 0.5%.
3. a kind of preparation method of above-mentioned indium Tin Silver Copper Alloy, the specific steps are that:
Step 1: by metallic silver, copper rinse in aqueous solution respectively, then drying is pounded silver powder and copper powders；
Step 2: metallic tin is melted, and temperature is promoted to 350-400 DEG C, is added described in step 1 in soldering tin
Silver powder and copper powders, and constantly stir evenly；
Step 3: being processed into powder for indium metal, is added in the heat fusing tin liquor in step 2, is stirred mixing about 1-3
Minute；
Step 4: the metal mixed liquid in step 3 is poured into corresponding template and is cooled down, indium Tin Silver Copper Alloy is frozen into.
4. a kind of preparation method of indium Tin Silver Copper Alloy according to claim 3, it is characterised in that: the water of the step 1
In solution plus number acid carries out rinse.
5. a kind of application method of above-mentioned indium Tin Silver Copper Alloy, it is characterised in that: for manufacturing earphone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910259665.7A CN109852843A (en) | 2019-04-02 | 2019-04-02 | Indium tin silver copper alloy and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910259665.7A CN109852843A (en) | 2019-04-02 | 2019-04-02 | Indium tin silver copper alloy and preparation method and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109852843A true CN109852843A (en) | 2019-06-07 |
Family
ID=66902990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910259665.7A Pending CN109852843A (en) | 2019-04-02 | 2019-04-02 | Indium tin silver copper alloy and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109852843A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000058051A1 (en) * | 1999-03-29 | 2000-10-05 | Antaya Technologies Corporation | Low temperature solder |
| CN106350701A (en) * | 2016-08-22 | 2017-01-25 | 吴雅萍 | Copper alloy |
| CN107635717A (en) * | 2015-05-15 | 2018-01-26 | 安塔亚技术公司 | Lead-free solder based on indium tin silver |
-
2019
- 2019-04-02 CN CN201910259665.7A patent/CN109852843A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000058051A1 (en) * | 1999-03-29 | 2000-10-05 | Antaya Technologies Corporation | Low temperature solder |
| CN107635717A (en) * | 2015-05-15 | 2018-01-26 | 安塔亚技术公司 | Lead-free solder based on indium tin silver |
| CN106350701A (en) * | 2016-08-22 | 2017-01-25 | 吴雅萍 | Copper alloy |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190607 |
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| RJ01 | Rejection of invention patent application after publication |