CN109830476B - Flexible filter system including integrated circuit module - Google Patents
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- CN109830476B CN109830476B CN201811603872.1A CN201811603872A CN109830476B CN 109830476 B CN109830476 B CN 109830476B CN 201811603872 A CN201811603872 A CN 201811603872A CN 109830476 B CN109830476 B CN 109830476B
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 179
- 239000002184 metal Substances 0.000 claims abstract description 179
- 229920000642 polymer Polymers 0.000 claims abstract description 156
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims description 17
- 238000005538 encapsulation Methods 0.000 claims description 16
- -1 silk Substances 0.000 claims description 12
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 10
- 239000004697 Polyetherimide Substances 0.000 claims description 8
- 239000004642 Polyimide Substances 0.000 claims description 8
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 8
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 8
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 8
- 229920000052 poly(p-xylylene) Polymers 0.000 claims description 8
- 229920001225 polyester resin Polymers 0.000 claims description 8
- 239000004645 polyester resin Substances 0.000 claims description 8
- 229920001601 polyetherimide Polymers 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 8
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 7
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 7
- 239000004811 fluoropolymer Substances 0.000 claims description 6
- 229920002313 fluoropolymer Polymers 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000004417 polycarbonate Substances 0.000 claims description 6
- 229920000515 polycarbonate Polymers 0.000 claims description 6
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 5
- 239000004695 Polyether sulfone Substances 0.000 claims description 4
- 239000011651 chromium Substances 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims description 4
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 4
- 229920006393 polyether sulfone Polymers 0.000 claims description 4
- 239000010453 quartz Substances 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 claims description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910052732 germanium Inorganic materials 0.000 claims description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 3
- 229910052741 iridium Inorganic materials 0.000 claims description 3
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 3
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims description 3
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- UKDIAJWKFXFVFG-UHFFFAOYSA-N potassium;oxido(dioxo)niobium Chemical compound [K+].[O-][Nb](=O)=O UKDIAJWKFXFVFG-UHFFFAOYSA-N 0.000 claims description 3
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 3
- 229910052707 ruthenium Inorganic materials 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 2
- 238000009459 flexible packaging Methods 0.000 abstract description 10
- 238000004806 packaging method and process Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- UYAHIZSMUZPPFV-UHFFFAOYSA-N erbium Chemical compound [Er] UYAHIZSMUZPPFV-UHFFFAOYSA-N 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
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- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The invention provides a flexible filter system comprising an integrated circuit module, which comprises a flexible substrate, a polymer total layer, the filter module, the integrated circuit module, a flexible packaging structure, a first metal layer, a first metal interconnection, a second metal layer and a second metal interconnection, wherein: the polymer overall layer is positioned on the flexible substrate, and the top surface of the polymer overall layer is provided with a cavity; the filter module is positioned above the cavity of the polymer aggregate layer and comprises a plurality of acoustic wave resonators, an input port and an output port which are connected with each other, and each acoustic wave resonator comprises a bottom electrode, a piezoelectric layer and a top electrode which are sequentially arranged from bottom to top; the integrated circuit module is positioned in the polymer aggregate layer and comprises a first electronic element and a second electronic element; the first metal layer and the first metal interconnection are used for connecting the first electronic element and the input port together; the second metal layer and the second metal interconnect are commonly used to connect the second electronic component and the output port.
Description
Technical Field
The present invention relates to the field of semiconductor technology, and in particular to a flexible filter system including an integrated circuit module.
Background
A smart phone is one of the most common application scenarios for electronic devices. The radio frequency communication part of the smart phone comprises an acoustic wave filter module and an integrated circuit module. Conventional smart phones are manufactured based on non-flexible silicon-based devices. With increasingly strong consumer demands such as wearability, integrated circuits with flexible electronic devices replacing traditional hard substrates have become an important development trend of future electronic technologies in recent years. However, how to arrange the integrated circuit module and the acoustic wave filter module connected to each other on the same flexible device at the same time becomes a problem in the prior art.
Disclosure of Invention
In view of this, the present invention provides a flexible filter system including an integrated circuit module, which can fill the gap in the prior art and realize device flexibility.
The invention provides a flexible filter system comprising an integrated circuit module, which comprises a flexible substrate, a polymer aggregate layer, a filter module, the integrated circuit module, a flexible packaging structure, a first metal layer, a first metal interconnection, a second metal layer and a second metal interconnection, wherein: the polymer overall layer is positioned on the flexible substrate, and the top surface of the polymer overall layer is provided with a cavity; the filter module is positioned above the cavity of the polymer aggregate layer, the filter module comprises a plurality of acoustic wave resonators, an input port and an output port which are connected with one another, and each acoustic wave resonator comprises a bottom electrode, a piezoelectric layer and a top electrode which are sequentially arranged from bottom to top; an integrated circuit module located within the polymer aggregate layer, the integrated circuit module including a first electronic component and a second electronic component; the first metal layer and the first metal interconnection are used together for connecting the first electronic element and the input port; the second metal layer and the second metal interconnect are commonly used to connect the second electronic component and the output port.
Optionally, the polymeric total layer comprises a plurality of polymeric layers.
Optionally, wherein: the polymer total layer comprises a first polymer layer, a second polymer layer and a third polymer layer which are arranged in sequence from bottom to top, and the cavity is positioned on the top surface of the third polymer layer; the first electronic component is located over the flexible substrate and covered by the first polymer layer, the first metal layer is located over the first polymer layer and covered by the second polymer layer, the second electronic component is located over the second polymer layer and covered by the third polymer layer, the second metal layer is located over the third polymer layer; a first end of the first metal layer is connected with the first electronic element through a metal hole, and a second end of the first metal layer reaches the top surface of the third polymer layer through the metal hole and then is connected with the input port through the first metal interconnection; a first end of the second metal layer is connected to the second electronic component via a metal via, and a second end of the second metal layer is connected to the output port directly through the second metal interconnect.
Optionally, wherein: the filter module further includes a top Bragg reflector layer located over the top electrode.
Optionally, wherein the filter module further comprises: a bottom Bragg reflector layer located below the bottom electrode; the first insulation structure and the second insulation structure are respectively located on two sides of the bottom Bragg reflection layer, the first insulation structure is used for isolating the bottom Bragg reflection layer from the first metal interconnection, and the second insulation structure is used for isolating the bottom Bragg reflection layer and the piezoelectric layer from the second metal interconnection.
Optionally, the method further comprises: the bottom Bragg reflection layer is positioned below the bottom electrode, and the top Bragg reflection layer is positioned above the top electrode; the first insulating structure and the second insulating structure are distributed on two sides of the bottom Bragg reflection layer, the first insulating structure is used for isolating the bottom Bragg reflection layer from the first metal interconnection, and the second insulating structure is used for isolating the bottom Bragg reflection layer and the piezoelectric layer from the second metal interconnection.
Optionally, wherein: the polymer total layer comprises a first polymer layer, a second polymer layer, a third polymer layer and a fourth polymer layer which are arranged in sequence from bottom to top, and the cavity is positioned on the top surface of the fourth polymer layer; the first electronic component is located over the flexible substrate and covered by the first polymer layer, the first metal layer is located over the first polymer layer and covered by the second polymer layer, the second electronic component is located over the second polymer layer and covered by the third polymer layer, the second metal layer is located over the third polymer layer and covered by the fourth polymer layer; the first end of the first metal layer is connected with the first electronic element through a metal hole, and the second end of the first metal layer is connected with the input port through a first metal interconnection after reaching the top surface of the fourth polymer layer through the metal hole; and the first end of the second metal layer is connected with the second electronic element through a metal hole, and the second end of the second metal layer is connected with the output port through a second metal interconnection after reaching the top surface of the fourth polymer layer through the metal hole.
Optionally, the flexible package structure includes a first package layer and a second package layer, the first package layer covers the filter module, and the second package layer covers the first package layer and the integrated circuit module.
Optionally, the input port, the output port, the bottom electrode, the top electrode, the first metal layer, the second metal layer, the first metal interconnect, and the second metal interconnect are made of materials including: gold, tungsten, molybdenum, platinum, ruthenium, iridium, germanium, copper, titanium tungsten, aluminum, chromium, or arsenic-doped gold.
Optionally, the material of the piezoelectric layer comprises: aluminum nitride, doped aluminum nitride, zinc oxide, lead zirconate titanate, lithium niobate, quartz, potassium niobate, or lithium tantalate, wherein the doped aluminum nitride contains at least one rare earth element.
Optionally, the material of the flexible substrate comprises: silicon, gallium arsenide, steel, paper, silk, plastic, polyimide, parylene, polycarbonate, polyester resin, polyethylene naphthalate, polyethersulfone, polyetherimide, polydimethylsiloxane, polyvinyl alcohol, or fluoropolymer.
Optionally, the materials of the flexible encapsulation structure and the polymer include: polyimide, parylene, polycarbonate, polyester resin, polyethylene naphthalate, polyethersulfone, polyetherimide, polydimethylsiloxane, polyvinyl alcohol, or fluoropolymer.
Optionally, the integrated circuit module includes one or more of the following: power amplifier, low noise amplifier, radio frequency antenna, radio frequency switch, modem, digital-to-analog converter
According to the technical scheme of the invention, the filter module and the integrated circuit module are respectively embedded in the polymer aggregate layer and the flexible packaging structure, and the first metal layer and the second metal layer for connecting the filter module and the integrated circuit module have good flexibility because the substrate at the bottom, the polymer aggregate layer in the middle and the flexible packaging structure at the top are all flexible structures and the first metal layer and the second metal layer for connecting the filter module and the integrated circuit module also have malleability.
Drawings
The drawings are included to provide a better understanding of the invention and are not to be construed as unduly limiting the invention. Wherein:
FIG. 1 is a schematic diagram of a filter of a Ladder structure;
fig. 2 is a cross-sectional view of a flexible filter system including an integrated circuit module according to a first embodiment of the invention;
fig. 3 is a cross-sectional view of a flexible filter system including an integrated circuit module according to a second embodiment of the invention;
fig. 4 is a cross-sectional view of a flexible filter system including an integrated circuit module according to a third embodiment of the invention;
fig. 5 is a cross-sectional view of a flexible filter system including an integrated circuit module according to a fourth embodiment of the present invention;
fig. 6 is a cross-sectional view of a flexible filter system including an integrated circuit module according to a fifth embodiment of the invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The flexible filter system including an integrated circuit module of an embodiment of the present invention includes a flexible substrate, a polymer aggregate layer, a filter module, an integrated circuit module, a flexible package structure, a first metal layer, and a second metal layer. Wherein: the polymer aggregate layer is positioned on the flexible substrate, and the top surface of the polymer aggregate layer is provided with a cavity. The filter module is located over the cavity of the polymer aggregate layer. The filter module comprises a plurality of sound wave resonators, an input port and an output port which are connected with one another, and each sound wave resonator comprises a bottom electrode, a piezoelectric layer and a top electrode which are sequentially arranged from bottom to top. An integrated circuit module is located within the polymer build-up layer, the integrated circuit module including a first electronic component and a second electronic component. The first metal layer is used for connecting the first electronic element and the input port; the second metal layer is used for connecting the second electronic element and the output port.
It should be noted that: the input port and the output port of the filter module are positioned on different resonators, can be led out from the bottom electrodes of the corresponding resonators and can also be led out from the top electrodes, and the specific conditions are flexibly set.
As can be seen from the above, in the flexible filter system including the integrated circuit module according to the embodiment of the present invention, the filter module and the integrated circuit module are respectively embedded in the polymer aggregate layer and the flexible packaging structure, since the bottom substrate, the middle polymer aggregate layer, and the top flexible packaging structure are all flexible structures, and the first metal layer and the second metal layer for connecting the filter module and the integrated circuit module are also malleable, the whole system has an advantage of good flexibility.
Alternatively, the polymeric master layer may comprise multiple polymeric layers.
Optionally, the flexible encapsulation structure comprises a first encapsulation layer and a second encapsulation layer. The first encapsulation layer covers the filter module, and the second encapsulation layer covers the first encapsulation layer and the integrated circuit module. The packaging effect of the device with the double flexible packaging structure is better.
It should be noted that the materials of the input port, the output port, the bottom electrode, the top electrode, the first metal layer, the second metal layer, the first metal interconnection, and the second metal interconnection include: gold (Au), tungsten (W), molybdenum (Mo), platinum (Pt), ruthenium (Ru), iridium (Ir), germanium (Ge), copper (Cu), titanium (Ti), titanium Tungsten (TiW), aluminum (Al), chromium (Cr), or arsenic (As) doped with gold, and the like.
The piezoelectric layer can be made of aluminum nitride (AlN), doped aluminum nitride (doped AlN), zinc oxide (ZnO), lead zirconate titanate (PZT), or lithium niobate (LiNbO) 3 ) Quartz (Quartz), potassium niobate (KNbO) 3 ) Or lithium tantalate (LiTaO) 3 ) And the material is a piezoelectric film, and the thickness of the material is less than 10 micrometers. The aluminum nitride film is polycrystalline or monocrystalline, and the growth method is sputtering or Metal Organic Chemical Vapor Deposition (MOCVD). The doped AlN contains at least one rare earth element, such as scandium (Sc), yttrium (Y), lanthanum (La), erbium (Er) and ytterbium (Yb).
The material of the flexible substrate may be ultra-thin silicon, gallium arsenide, ultra-thin steel sheet, paper, silk, plastic, polyimide (PI), parylene (Parylene), polycarbonate (PC), polyester resin (PET), polyethylene naphthalate (PEN), polyethersulfone (PES), polyetherimide (PEI), polydimethylsiloxane (PDMS), polyvinyl alcohol (PVA), various Fluoropolymers (FEP), and the like.
The material of the flexible package and the polymer may be Polyimide (PI), parylene (Parylene), polycarbonate (PC), polyester resin (PET), polyethylene naphthalate (PEN), polyethersulfone (PES), polyetherimide (PEI), polydimethylsiloxane (PDMS), polyvinyl alcohol (PVA), and various Fluoropolymers (FEP).
It should be noted that: the integrated circuit module may include: power amplifier, low noise amplifier, radio frequency antenna, radio frequency switch, modem, digital-to-analog converter, etc.
For a better understanding of those skilled in the art, reference is made to the following detailed description taken in conjunction with the accompanying drawings. It should be noted that, a filter device may be constructed by connecting the film bulk acoustic resonators according to a certain topological structure, where the most common resonator link topological structure constituting the filter is a Ladder structure, as shown in fig. 1, the input and output ports of the filter are located on different resonators, and may be led out from the bottom electrodes of the corresponding resonators or from the top electrodes. In the following, only a single resonator is drawn in the filter module to represent the whole filter, the resonator comprising a bottom electrode, a piezoelectric layer and a top electrode arranged in this order from bottom to top. In the embodiments herein, the bottom electrode can be used as the input port, and the top electrode can be used as the output port, but the application of the present invention is not limited thereto. In addition, the filter module also has a ground port.
Example 1
Fig. 2 is a cross-sectional view of a flexible filter system including an integrated circuit module according to a first embodiment of the invention. As shown in fig. 2, the system mainly includes: the flexible substrate 100, the polymer aggregate layer (including the first polymer layer 201, the second polymer layer 202, and the third polymer layer 203, which are sequentially arranged from bottom to top), the filter module 300 (including the bottom electrode 301, the piezoelectric layer 302, and the top electrode 303, which are sequentially arranged from bottom to top, where the bottom electrode 301 is an input port and the top electrode 303 is an output port), the integrated circuit module 400 (including the first electronic element 401 and the second electronic element 402), the flexible package structure (including the first package layer 501 and the second package layer 502), the first metal layer 601, the first metal interconnection 602, the second metal layer 701, and the second metal interconnection 702.
Wherein the first polymer layer 201 is located on the flexible substrate 100, the second polymer layer 202 is located on the first polymer layer 201, the third polymer layer 203 is located on the second polymer layer 202, and the top surface of the third polymer layer 203 has a cavity 210. The filter module 300 is located above the cavity 210. The first electronic component 401 is located on the flexible substrate 100 and covered by the first polymer layer 201, the first metal layer 601 is located on the first polymer layer 201 and covered by the second polymer layer 202, the second electronic component 402 is located on the second polymer layer 202 and covered by the third polymer layer 203, and the second metal layer 701 is located on the third polymer layer 203. A first end of the first metal layer 601 is connected to the first electronic component 401 through a metal via, and a second end of the first metal layer 601 reaches the top surface of the third polymer layer through a metal via and is connected to the bottom electrode 301 through a first metal interconnect 602. A first end of the second metal layer 701 is connected to the second electronic element 402 via a metal hole, and a second end of the second metal layer 701 is connected to the top electrode 303 directly through a second metal interconnect 702. A first encapsulation layer 501 in the flexible encapsulation structure covers the filter module 300 and a second encapsulation layer 502 covers the first encapsulation layer 501 and the integrated circuit module 400. The first package layer 501 has a cavity structure for providing a sound reflection condition on the upper surface of the resonator, thereby ensuring the normal operation of the filter, and the second package layer 502 is filled with a material easy to dissipate heat, thereby ensuring the mechanical strength of the whole system and improving the heat dissipation capability.
Example 2
Fig. 3 is a cross-sectional view of a flexible filter system including an integrated circuit module according to a second embodiment of the invention. As shown in fig. 3, the system mainly includes: the flexible substrate 100, the polymer aggregate layer (including a first polymer layer 201, a second polymer layer 202, a third polymer layer 203, and a fourth polymer layer 204 arranged in sequence from bottom to top), the filter module 300 (including a bottom electrode 301, a piezoelectric layer 302, and a top electrode 303 arranged in sequence from bottom to top, where the bottom electrode 301 is used as an input port and the top electrode 303 is used as an output port), the integrated circuit module 400 (including a first electronic element 401 and a second electronic element 402), the flexible package structure 500, the first metal layer 601, the first metal interconnection 602, the second metal layer 701, and the second metal interconnection 702.
Wherein the first electronic element 401 is located over the flexible substrate 100 and covered by the first polymer layer 201, the first metal layer 601 is located over the first polymer layer 201 and covered by the second polymer layer 202, the second electronic element 402 is located over the second polymer layer 202 and covered by the third polymer layer 203, and the second metal layer 701 is located over the third polymer layer 203 and covered by the fourth polymer layer 204; cavity 210 is located at a top surface of fourth polymer layer 204. A first end of the first metal layer 601 is connected to the first electronic component 401 through a metal hole, and a second end of the first metal layer 601 reaches the top surface of the fourth polymer layer 204 through a metal hole and is connected to the bottom electrode 301 through a first metal interconnect 602. A first end of the second metal layer 701 is connected to the second electronic component 402 through a metal hole, and a second end of the second metal layer 701 reaches the top surface of the fourth polymer layer 204 through a metal hole and is connected to the top electrode 303 through a second metal interconnect 702. The flexible package structure 500 is in a unitary form and has a cavity structure.
As can be seen from fig. 3, in the flexible filter system including the integrated circuit module according to this embodiment, the filter module and the integrated circuit module may be stacked in the vertical direction, which can further reduce the device area.
Example 3
Fig. 4 is a cross-sectional view of a flexible filter system including an integrated circuit module according to a third embodiment of the invention. As shown in fig. 4, the system mainly includes: the flexible printed circuit board comprises a flexible substrate 100, a polymer aggregate layer (comprising a first polymer layer 201, a second polymer layer 202 and a third polymer layer 203 which are sequentially arranged from bottom to top), a filter module 300 (comprising a bottom electrode 301, a piezoelectric layer 302, a top electrode 303 and a top bragg reflection layer 304 which are sequentially arranged from bottom to top, wherein the bottom electrode 301 is used as an input port, and the top electrode 303 is used as an output port), an integrated circuit module 400 (comprising a first electronic element 401 and a second electronic element 402), a flexible packaging structure 500, a first metal layer 601, a first metal interconnection 602, a second metal layer 701 and a second metal interconnection 702.
Wherein the first polymer layer 201 is located on the flexible substrate 100, the second polymer layer 202 is located on the first polymer layer 201, the third polymer layer 203 is located on the second polymer layer 202, and the top surface of the third polymer layer 203 has a cavity 210. The filter module 300 is located above the cavity 210. The first electronic component 401 is located on the flexible substrate 100 and covered by the first polymer layer 201, the first metal layer 601 is located on the first polymer layer 201 and covered by the second polymer layer 202, the second electronic component 402 is located on the second polymer layer 202 and covered by the third polymer layer 203, and the second metal layer 701 is located on the third polymer layer 203. A first end of the first metal layer 601 is connected to the first electronic component 401 through a metal via, and a second end of the first metal layer 601 reaches the top surface of the third polymer layer through a metal via and is connected to the bottom electrode 301 through a first metal interconnect 602. A first end of the second metal layer 701 is connected to the second electronic element 402 via a metal hole, and a second end of the second metal layer 701 is connected to the top electrode 303 directly through a second metal interconnect 702. A top bragg reflector layer 304 is located above the top electrode 303. Since the bragg reflector instead of the cavity structure provides the acoustic reflection condition of the upper surface of the resonator, in this embodiment, only the integral flexible package structure 500 is required, wherein the integral flexible package structure 500 is filled with the heat-dissipating material for ensuring the mechanical strength of the whole system and improving the heat-dissipating capability.
In addition, referring to embodiment 2, a layer of polymer can be added to realize vertical stacking of the filter module and the integrated circuit module, thereby further reducing the overall area.
Example 4
Fig. 5 is a cross-sectional view of a flexible filter system including an integrated circuit module according to a fourth embodiment of the invention. As shown in fig. 5, the system mainly includes: the flexible printed circuit board comprises a flexible substrate 100, a polymer total layer (comprising a first polymer layer 201, a second polymer layer 202 and a third polymer layer 203 which are sequentially arranged from bottom to top), a filter module 300 (comprising a bottom bragg reflection layer 305, a bottom electrode 301, a piezoelectric layer 302 and a top electrode 303 which are sequentially arranged from bottom to top, wherein the bottom electrode 301 is used as an input port, and the top electrode 303 is used as an output port), an integrated circuit module 400 (comprising a first electronic element 401 and a second electronic element 402), a flexible packaging structure (comprising a first packaging layer 501 and a second packaging layer 502), a first metal layer 601, a first metal interconnection 602, a second metal layer 701, a second metal interconnection 702, a first insulating structure 801 and a second insulating structure 802.
Wherein the first polymer layer 201 is located on the flexible substrate 100, the second polymer layer 202 is located on the first polymer layer 201, and the third polymer layer 203 is located on the second polymer layer 202. The first electronic component 401 is located on the flexible substrate 100 and covered by the first polymer layer 201, the first metal layer 601 is located on the first polymer layer 201 and covered by the second polymer layer 202, the second electronic component 402 is located on the second polymer layer 202 and covered by the third polymer layer 203, and the second metal layer 701 is located on the third polymer layer 203. A first end of the first metal layer 601 is connected to the first electronic component 401 through a metal via, and a second end of the first metal layer 601 reaches the top surface of the third polymer layer through a metal via and is connected to the bottom electrode 301 through a first metal interconnect 602. A first end of the second metal layer 701 is connected to the second electronic component 402 via a metal hole, and a second end of the second metal layer 701 is directly connected to the top electrode 303 via a second metal interconnect 702. The first insulating structure 801 and the second insulating structure 802 are distributed on both sides of the bottom bragg reflector layer 305. The first insulating structure 801 is used to isolate the bottom bragg reflective layer 305 from the first metal interconnect 602, and the second insulating structure 802 is used to isolate the bottom bragg reflective layer 305 and the piezoelectric layer 302 from the second metal interconnect 702. A first encapsulation layer 501 in the flexible encapsulation structure covers the filter module 300 and a second encapsulation layer 502 covers the first encapsulation layer 501 and the integrated circuit module 400. The first package layer 501 has a cavity structure for providing a sound reflection condition on the upper surface of the resonator, thereby ensuring the normal operation of the filter, and the second package layer 502 is filled with a material easy to dissipate heat, thereby ensuring the mechanical strength of the whole system and improving the heat dissipation capability. Because the Bragg reflection layer is adopted to replace a cavity structure, the acoustic reflection condition of the lower surface of the resonator is provided, so that the lower surface of the resonator does not need a cavity in the embodiment, and the difficulty in processing the cavity on the flexible substrate is reduced.
In addition, referring to embodiment 2, the vertical stacking of the filter module and the integrated circuit module can be realized without adding an additional polymer layer, thereby further reducing the overall area.
Example 5
Fig. 6 is a cross-sectional view of a flexible filter system including an integrated circuit module according to a fifth embodiment of the invention. As shown in fig. 6, the system mainly includes: the flexible substrate 100, the polymer aggregate layer (including the first polymer layer 201, the second polymer layer 202, and the third polymer layer 203, which are sequentially arranged from bottom to top), the filter module 300 (including the bottom bragg reflector 305, the bottom electrode 301, the piezoelectric layer 302, the top electrode 303, and the top bragg reflector 304, which are sequentially arranged from bottom to top, where the bottom electrode 301 serves as an input port and the top electrode 303 serves as an output port), the integrated circuit module 400 (including the first electronic component 401 and the second electronic component 402), the flexible package structure 500, the first metal layer 601, the first metal interconnect 602, the second metal layer 701, the second metal interconnect 702, the first insulating structure 801, and the second insulating structure 802.
Wherein the bottom bragg reflector layer 305 is located below the bottom electrode 301 and the top bragg reflector layer 304 is located above the top electrode 303. A first end of the first metal layer 601 is connected to the first electronic component 401 through a metal via, and a second end of the first metal layer 601 reaches the top surface of the third polymer layer through a metal via and is connected to the bottom electrode 301 through a first metal interconnect 602. A first end of the second metal layer 701 is connected to the second electronic component 402 via a metal hole, and a second end of the second metal layer 701 is directly connected to the top electrode 303 via a second metal interconnect 702. The first insulating structure 801 and the second insulating structure 802 are distributed on both sides of the bottom bragg reflector layer 305. The first insulating structure 801 is used to isolate the bottom bragg reflective layer 305 from the first metal interconnect 602, and the second insulating structure 802 is used to isolate the bottom bragg reflective layer 305 and the piezoelectric layer 302 from the second metal interconnect 702. The flexible packaging structure 500 is in a unitary form. Wherein 500 is filled with a material easy to dissipate heat, so as to ensure the mechanical strength of the whole system and improve the heat dissipation capability. Because the Bragg reflection layer is adopted to replace a cavity structure, the acoustic reflection conditions of the upper surface and the lower surface of the resonator are provided, so that the upper surface and the lower surface of the resonator do not need cavities in the embodiment, and the difficulty of a bottom cavity and packaging is reduced.
In addition, referring to embodiment 2, the vertical stacking of the filter module and the integrated circuit module can be realized without adding an additional polymer layer, thereby further reducing the overall area.
The above-described embodiments should not be construed as limiting the scope of the invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions can occur, depending on design requirements and other factors. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (13)
1. A flexible filter system comprising an integrated circuit module, comprising a flexible substrate, a polymer aggregate layer, a filter module, an integrated circuit module, a flexible package structure, a first metal layer, a first metal interconnect, a second metal layer, and a second metal interconnect, wherein:
the polymer overall layer is positioned on the flexible substrate, and the top surface of the polymer overall layer is provided with a cavity;
the filter module is positioned above the cavity of the polymer aggregate layer, the filter module comprises a plurality of acoustic wave resonators, an input port and an output port which are connected with one another, each acoustic wave resonator comprises a bottom electrode, a piezoelectric layer and a top electrode which are sequentially arranged from bottom to top, and the input port and the output port of the filter module are positioned on different resonators and are led out from the bottom electrodes or the top electrodes of the corresponding resonators;
an integrated circuit module located within the polymer aggregate layer, the integrated circuit module including a first electronic component and a second electronic component;
the first metal layer and the first metal interconnection are used for connecting the first electronic element and the input port together;
the second metal layer and the second metal interconnect are commonly used to connect the second electronic component and the output port.
2. The flexible filter system including an integrated circuit module of claim 1, wherein the polymer aggregate layer comprises a plurality of polymer layers.
3. The flexible filter system including an integrated circuit module of claim 1, wherein:
the polymer total layer comprises a first polymer layer, a second polymer layer and a third polymer layer which are arranged in sequence from bottom to top, and the cavity is positioned on the top surface of the third polymer layer;
the first electronic component is located over the flexible substrate and covered by the first polymer layer, the first metal layer is located over the first polymer layer and covered by the second polymer layer, the second electronic component is located over the second polymer layer and covered by the third polymer layer, the second metal layer is located over the third polymer layer;
a first end of the first metal layer is connected with the first electronic element through a metal hole, and a second end of the first metal layer reaches the top surface of the third polymer layer through the metal hole and then is connected with the input port through the first metal interconnection;
a first end of the second metal layer is connected to the second electronic component via a metal via, and a second end of the second metal layer is connected to the output port directly through the second metal interconnect.
4. The flexible filter system including an integrated circuit module of claim 3, wherein:
the filter module further includes a top Bragg reflector layer located over the top electrode.
5. The flexible filter system including an integrated circuit module of claim 3, wherein the filter module further comprises:
a bottom Bragg reflector layer located below the bottom electrode;
the first insulation structure and the second insulation structure are respectively located on two sides of the bottom Bragg reflection layer, the first insulation structure is used for isolating the bottom Bragg reflection layer from the first metal interconnection, and the second insulation structure is used for isolating the bottom Bragg reflection layer and the piezoelectric layer from the second metal interconnection.
6. The flexible filter system including an integrated circuit module of claim 3, further comprising:
the bottom Bragg reflection layer is positioned below the bottom electrode, and the top Bragg reflection layer is positioned above the top electrode;
the first insulating structure and the second insulating structure are distributed on two sides of the bottom Bragg reflection layer, the first insulating structure is used for isolating the bottom Bragg reflection layer from the first metal interconnection, and the second insulating structure is used for isolating the bottom Bragg reflection layer and the piezoelectric layer from the second metal interconnection.
7. The flexible filter system including an integrated circuit module of claim 1, wherein:
the polymer total layer comprises a first polymer layer, a second polymer layer, a third polymer layer and a fourth polymer layer which are arranged from bottom to top in sequence, and the cavity is positioned on the top surface of the fourth polymer layer;
the first electronic component is located over the flexible substrate and covered by the first polymer layer, the first metal layer is located over the first polymer layer and covered by the second polymer layer, the second electronic component is located over the second polymer layer and covered by the third polymer layer, the second metal layer is located over the third polymer layer and covered by the fourth polymer layer;
a first end of the first metal layer is connected with the first electronic element through a metal hole, and a second end of the first metal layer reaches the top surface of the fourth polymer layer through a metal hole and then is connected with the input port through a first metal interconnection;
and the first end of the second metal layer is connected with the second electronic element through a metal hole, and the second end of the second metal layer is connected with the output port through a second metal interconnection after reaching the top surface of the fourth polymer layer through the metal hole.
8. The flexible filter system including an integrated circuit module according to any of claims 1 to 7, wherein the flexible package structure comprises a first package layer and a second package layer, the first package layer covering the filter module and the second package layer covering the first package layer and the integrated circuit module.
9. The flexible filter system including an integrated circuit module according to any of claims 1 to 7, wherein the materials of the input port, the output port, the bottom electrode, the top electrode, the first metal layer, the second metal layer, the first metal interconnect, and the second metal interconnect comprise: gold, tungsten, molybdenum, platinum, ruthenium, iridium, germanium, copper, titanium tungsten, aluminum, chromium, or arsenic-doped gold.
10. A flexible filter system including an integrated circuit module according to any of claims 1 to 7, wherein the material of the piezoelectric layer comprises: aluminum nitride, doped aluminum nitride, zinc oxide, lead zirconate titanate, lithium niobate, quartz, potassium niobate, or lithium tantalate, wherein the doped aluminum nitride contains at least one rare earth element.
11. The flexible filter system including an integrated circuit module according to any one of claims 1 to 7, wherein the material of the flexible substrate comprises: silicon, gallium arsenide, steel, paper, silk, plastic, polyimide, parylene, polycarbonate, polyester resin, polyethylene naphthalate, polyethersulfone, polyetherimide, polydimethylsiloxane, polyvinyl alcohol, or fluoropolymer.
12. The flexible filter system including an integrated circuit module according to any of claims 1 to 7, wherein the materials of the flexible encapsulation structure and the polymer comprise: polyimide, parylene, polycarbonate, polyester resin, polyethylene naphthalate, polyethersulfone, polyetherimide, polydimethylsiloxane, polyvinyl alcohol, or fluoropolymer.
13. A flexible filter system comprising an integrated circuit module according to any of claims 1 to 7, wherein the integrated circuit module comprises one or more of: power amplifier, low noise amplifier, radio frequency antenna, radio frequency switch, modem, digital-to-analog converter.
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| US4757553A (en) * | 1984-05-15 | 1988-07-12 | Crimmins James W | Communication system with portable unit |
| CN108092639A (en) * | 2017-12-21 | 2018-05-29 | 华南理工大学 | A kind of micro-nano column flexible array film bulk acoustic resonator subfilter and its preparation |
| CN108288959A (en) * | 2013-05-08 | 2018-07-17 | 天津大学 | Piezoelectric acoustic wave resonator and filter |
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| US7030472B2 (en) * | 2004-04-01 | 2006-04-18 | Agere Systems Inc. | Integrated circuit device having flexible leadframe |
| US9370736B2 (en) * | 2012-01-17 | 2016-06-21 | The Penn State Research Foundation | Flexible filter device for capturing of particles or cells in a fluid |
| US9824995B2 (en) * | 2014-09-29 | 2017-11-21 | Nxp Usa, Inc. | Flexible circuit leads in packaging for radio frequency devices |
| US20180170093A1 (en) * | 2015-06-30 | 2018-06-21 | Spectral Devices Inc. | Flexible pixelated fabry-perot filter |
| JP6517643B2 (en) * | 2015-09-16 | 2019-05-22 | 株式会社ジャパンディスプレイ | Display device manufacturing method and display device |
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| US4757553A (en) * | 1984-05-15 | 1988-07-12 | Crimmins James W | Communication system with portable unit |
| CN108288959A (en) * | 2013-05-08 | 2018-07-17 | 天津大学 | Piezoelectric acoustic wave resonator and filter |
| CN108092639A (en) * | 2017-12-21 | 2018-05-29 | 华南理工大学 | A kind of micro-nano column flexible array film bulk acoustic resonator subfilter and its preparation |
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