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CN109817611A - 具有集成无源电组件的半导体封装 - Google Patents

具有集成无源电组件的半导体封装 Download PDF

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Publication number
CN109817611A
CN109817611A CN201811364218.XA CN201811364218A CN109817611A CN 109817611 A CN109817611 A CN 109817611A CN 201811364218 A CN201811364218 A CN 201811364218A CN 109817611 A CN109817611 A CN 109817611A
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China
Prior art keywords
lead frame
semiconductor packages
semiconductor
bare chip
inductor
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乔伊斯·马里·马莱尼克斯
罗伯托·加姆皮耶尔·马索利尼
拉吉夫·D·乔希
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Texas Instruments Inc
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Texas Instruments Inc
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Abstract

本申请案涉及一种具有集成无源电组件的半导体封装。一种半导体封装(100)包含：引线框(104)，其包括可在所述半导体封装外部接近的输入/输出引脚；以及半导体裸片(102)，其电连接到所述引线框(104)。半导体封装(100)还包含安装在所述半导体裸片(102)的与所述引线框(104)相对的一侧上的无源电组件(120、116、110)。模制化合物(115)包封所述无源电组件(120、116、110)、半导体裸片(102)和引线框(104)，以形成所述半导体封装(110)。还公开相关方法。

Description

具有集成无源电组件的半导体封装
技术领域
本申请案涉及半导体技术领域，且更明确地说，涉及半导体封装及其方法。
背景技术
许多类型的集成电路(IC)具有输入/输出(I/O)引脚，其用以连接外部无源或有源组件。IC(还被称作半导体裸片)通常附接到引线框，且接着由模制化合物环绕以形成半导体封装。所述封装接着附接到印刷电路板(PCB)。电容器、电感器或其它类型的无源电组件可附接到同一PCB。通过PCB上的迹线，无源电组件电连接到引线框的一或多个I/O引脚，且通过所述引线框电连接到IC。半导体封装和外部无源组件占用相当大量的空间。空间在例如智能电话或其它类型的移动消费型电子装置等许多应用中是宝贵的。另外，因较长的互连通路而产生的互连寄生效应可不利地影响性能。
发明内容
在一个实例中，一种半导体封装包含：引线框，其包括可在半导体封装外部接近的输入/输出引脚；以及电连接到所述引线框的半导体裸片。所述半导体封装还包含无源电组件，其安装在半导体裸片的与引线框相对的一侧上，来将半导体裸片夹在无源电组件与引线框之间。模制化合物包封无源电组件、半导体裸片和引线框，以形成半导体封装。
另一实例是针对一种方法，其包含：在导电环的第一表面上形成第一磁性材料；以及在所述导电环的与所述第一表面相对的第二表面上形成第二磁性材料，以形成电感器。所述方法进一步包含：用焊料球将半导体裸片附接到引线框，并将所述电感器附接到所述引线框。半导体裸片夹在电感器与引线框之间。
在又另一实例中，一种半导体封装包含引线框，其包括可在半导体封装外部接近的输入/输出引脚。还包含半导体裸片，且其电连接到引线框。电感器包含夹在一对磁性元件之间的导电元件，且用焊料球附接到引线框，使得电感器在半导体裸片的与引线框相对的一侧上。模制化合物包封电感器、半导体裸片和引线框，以形成半导体封装。
附图说明
为了详细描述各种实例，现在将参考附图，其中：
图1A说明根据一实施例的半导体封装；
图1B示出半导体封装可用于的开关模式电压转换器的实例；
图2A到2D说明图1的半导体封装的组装过程；
图3示出根据一实施例的图1的半导体封装的透视图；
图4示出根据一实施例图1的半导体封装的侧视图；
图5说明根据另一实施例的半导体封装；
图6A到6D说明图5的半导体封装的组装过程；以及
图7说明图5的半导体封装的透视图。
具体实施方式
所公开的实施例是针对具有集成无源电装置的半导体封装。也就是说，无源电装置包含在封装内，但在半导体裸片外部。在一个实施例中，引线框、半导体裸片和无源电组件成堆叠排列，其中无源电组件安装在半导体裸片的与引线框相对的一侧上。因此，并非将无源电组件放置在半导体封装外部的PCB上，而是将无源电组件集成到相对于半导体裸片及其引线框垂直堆叠的半导体封装中。无源电组件可包括电感器、电容器、电阻器或其它类型的无源组件中的一或多者。本文中所描述的技术适用于任何半导体封装类型。此类封装的实例包含方形扁平无铅(QFN)封装、小外形集成电路(SOIC)封装、薄型小外形封装(TSOP)等。
所得产品具有比无源电组件已安置在半导体封装外部的情况小的占用面积(即，截面积)。另外，无源电组件较靠近半导体裸片，其在减少环电感、电阻等方面可具有有益的电特性。
图1A说明根据一实施例的半导体封装100的横截面侧视图。半导体封装包含安装到引线框104(例如铜)的半导体裸片102，以及也附接到所述引线框的无源电组件130。半导体裸片102例如使用铜柱106附接引线框。半导体裸片102含有任何类型的集成电路。在一个实例中，集成电路是电力电路，例如开关模式电压转换器。在所述实例中，集成电路可包含一或多个功率晶体管、较低功率晶体管开关、栅极驱动器、控制电路等。
图1A的实例中的无源电组件130包含导电元件116(例如铜)，其平行于引线框104横跨，且通过一或多个焊料球125电连接到引线框。在图1A中，焊料球的高度H1大于半导体裸片102的高度H2。无源电组件130的导电元件116夹在一对磁性元件110和120之间。导电元件116可具有非线性形状(例如弯曲、线圈等)。在图1的实例中，导电元件116与磁性元件110和120的组合形成包括电感器的无源电组件。
作为电感器，无源电组件具有两个电触点，其连接到单独的焊料球125，且通过焊料球125连接到引线框104上的触点。引线框104的导电部分提供焊料球125与半导体裸片102的I/O引脚之间的电连接性。因此，通过焊料球125和引线框104，无源电组件130连接到半导体裸片。如上所述，半导体裸片可包括电压转换器。在一个实例中，电压调节器可包括布克电压转换器，其包含一对或多对功率晶体管(例如每一对包括连接到供电电压节点的高侧晶体管和连接到接地节点的低侧晶体管)。每一对的功率晶体管在开关节点处连接在一起。作为电感器，无源电组件130连接到开关节点。电压转换器和无源电组件所占用的占用面积小于无源电组件位于半导体封装外部的情况将导致的占用面积。
图1B示出开关模式电压转换器的电示意图的实例，其中半导体封装100(以及下文所描述的封装200)可使用。在此实例中，电压转换器包含控制器和栅极驱动器103、高侧功率晶体管(HS)、低侧功率晶体管(LS)、电感器L和输出电容器Cout。控制器和栅极驱动器103断言栅极信号，以选择性地接通和断开功率晶体管HS和LS。电感器L连接到形成于HS的源极与LS的漏极之间的开关节点(SW)。输出电容器Cout连接到电感器L的相对端子，且提供来自转换器的输出电压Vout。电感器L包括无源电组件130。上文提到的半导体裸片102包含控制器和栅极驱动器103以及功率晶体管HS和LS。半导体封装100集成半导体裸片102和电感器L两者。
图2A到2D示出组装图1的半导体封装100的实例。图2A说明导电元件116。导电元件可由铜或其它合适的金属制成。导电元件116形成为适合形成电感器的非线性形状(例如环)。图2B说明形成于导电元件116的相对表面上的磁性元件110、120。在一个实施例中，所述磁性元件包括磁性模制化合物，其施加到导电元件116的相对表面。在另一实施例中，磁性元件包括磁性薄片，其借助于例如非导电环氧树脂粘附到导电元件。此类环氧树脂不应施加到导电元件116的焊料球接触到的区域。
图2C说明半导体裸片102经由铜柱106附接到引线框106，且放置在半导体裸片102上并借助于焊料球125电连接到引线框104的电感器(包括磁性元件110、120以及导电元件116)的放置。焊料球可经处理，并借助于回焊步骤附接到导电元件116和引线框104。在一些实施例中，下部磁性元件110可与半导体裸片102接触。在其它实施例中，电介质或其它类型的保护层可安置于磁性元件110与半导体裸片102之间。图2D说明用以包封所述组件来形成半导体封装的模制化合物115。图2A到2D的组件可在晶片上执行以创造多个此类集成结构。接着借助于激光或机械切割工艺来将所述晶片单分。
图3示出半导体封装100的透视图。在此实例中，将导电元件116示出为具有曲线形状以形成局部环。导电元件夹在磁性元件110和120之间。引线框104还示出为具有多个单独导电部件，以提供到半导体裸片102的外部可接近连接。图4示出半导体封装的另一侧视图。此视图还示出电感器的下部磁性元件110与半导体裸片102的顶部表面之间的层117。层117可包括保护层，例如模制化合物或非导电环氧树脂。
图5示出半导体封装200的另一实施例。如同图1的实施例，图2的半导体封装200包含借助于铜柱106安装到引线框104的半导体裸片102。导电元件216(例如铜合金)沿着大体上平行于引线框的平面延伸，且搁置在半导体裸片102上或附接到所述半导体裸片，且借助于一或多个焊料球125电连接到引线框。如上文中所述，焊料球125的高度大于半导体裸片102的高度。无源电组件220安装到导电元件216。焊料球125的数目可对应于无源电组件220的端子(未图示)的数目。在一些实施例中，无源组件包括电感器、电容器和电阻器中的至少一者。图5中所示的组件包封于模制化合物115中，以形成半导体封装。
图6A到6D示出组装图5的半导体封装200的实例。图6A说明导电元件116，其提供无源电组件220与焊料球125之间的连接。在图2B的局部组合件中，无源电组件220已安装到导电元件116。图2C示出半导体裸片102经由铜柱106附接到引线框106，以及将无源电组件和导电元件216放置在半导体裸片102上，且借助于焊料球125电连接到引线框104。在一些实施例中，导电元件216可与半导体裸片102接触。在其它实施例中，电介质或其它类型的保护层可安置于导电元件216与半导体裸片102之间。图6D说明用以包封所述组件来形成半导体封装200的模制化合物115。
图7示出具有引线框的堆叠排列的半导体封装200的透视图。在此实例中，示出较小引线框216，其通过焊料球125将无源电组件220电连接到较大的引线框104。无源电组件(例如电感器)安装在半导体裸片102的与夹层排列中的引线框相对的一侧上。引线框104还示出为具有多个单独导电部件，以提供到半导体裸片102的外部可接近连接。在此实例中，可形成引线框104，且例如半导体裸片等组件放置在引线框104之上，并借助于焊料附接到引线框。借着可回焊且接着包覆模制所述组件。焊料球125接着可附接到较大的引线框104。无源电组件220附接在其上的较小引线框216可附接到焊料球，从而形成堆叠排列(无源电组件220在半导体裸片102之上，半导体裸片在引线框104之上)。另一模制化合物包封无源电组件220、半导体裸片102和引线框104，以形成最终半导体封装。
在本说明书中，术语“耦合”表示间接或直接的有线或无线连接。因此，如果第一装置耦合到第二装置，那么所述连接可能是通过直接连接，或通过经由其它装置和连接的间接连接。
在所描述的实施例中可能进行修改，且其它实施例在权利要求的范围内为可能的。

Claims (20)

1.一种半导体封装，其包括：
引线框，其包括可在所述半导体封装外部接近的输入/输出引脚；
半导体裸片，其电连接到所述引线框；
无源电组件，其安装在所述半导体裸片的与所述引线框相对的一侧上，以将所述半导体裸片夹在所述无源电组件与所述引线框之间；以及
模制化合物，其包封所述无源电组件、半导体裸片和引线框，以形成所述半导体封装。
2.根据权利要求1所述的半导体封装，其中所述无源电组件包含导电元件，其平行于所述引线框横跨，且通过焊料球电连接到所述引线框。
3.根据权利要求2所述的半导体封装，其中所述引线框包含导电通路以将所述焊料球电连接到所述半导体裸片的触点。
4.根据权利要求2所述的半导体封装，其中所述焊料球的高度大于所述半导体裸片的高度。
5.根据权利要求1所述的半导体封装，其中所述无源电组件包括电感器、电容器和电阻器中的至少一者。
6.根据权利要求1所述的半导体封装，其中所述无源电组件包括夹在一对磁性元件之间的导电元件，且其中所述导电元件借助于多个焊球连接到所述引线框。
7.根据权利要求1所述的半导体封装，其中所述导电元件具有非线性形状。
8.根据权利要求1所述的半导体封装，其中所述半导体裸片包括开关模式电压转换器电路。
9.一种方法，其包括：
在导电环的第一表面上形成第一磁性材料；
在所述导电环的与所述第一表面相对的第二表面上形成第二磁性材料以形成电感器；
将半导体裸片附接到引线框；
用焊料球将所述电感器附接到所述引线框，其中所述半导体裸片夹在所述电感器与所述引线框之间。
10.根据权利要求9所述的方法，其中形成所述第一和第二磁性材料包括将磁性模制化合物施加到所述导电环的所述第一和第二表面。
11.根据权利要求9所述的方法，其中形成所述第一和第二磁性材料包括将磁性薄片附接到所述导电环的所述第一表面，且将另一磁性薄片附接到所述导电环的所述第二表面。
12.根据权利要求9所述的方法，其进一步包括将所述电感器和半导体裸片包封在模制化合物中。
13.一种半导体封装，其包括：
第一引线框，其包括可在所述半导体封装外部接近的输入/输出引脚；
半导体裸片，其电连接到所述第一引线框；
电感器，其包括夹在一对磁性元件之间的导电元件，其中所述电感器用焊料球电连接到所述第一引线框，使得所述电感器安装在所述半导体裸片的与所述第一引线框相对的一侧上；以及
模制化合物，其包封所述电感器、半导体裸片和第一引线框，以形成所述半导体封装。
14.根据权利要求13所述的半导体封装，其中每一焊料球的高度大于所述半导体裸片的高度。
15.根据权利要求13所述的半导体封装，其中所述引线框包含导电通路以将每一焊料球电连接到所述半导体裸片的触点。
16.根据权利要求13所述的半导体封装，其中所述导电元件具有非线性形状。
17.根据权利要求13所述的半导体封装，其中所述半导体裸片包括电压转换器电路。
18.根据权利要求13所述的半导体封装，其进一步包括所述电感器附接到的第二引线框。
19.根据权利要求18所述的半导体封装，其中所述第二引线框通过所述焊料球电连接到所述第一引线框。
20.根据权利要求13所述的半导体封装，其中所述模制化合物还包封所述第二引线框。
CN201811364218.XA 2017-11-22 2018-11-16 具有集成无源电组件的半导体封装 Pending CN109817611A (zh)

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