CN109815891A

CN109815891A - For shielding the identification mould group and electronic equipment of lower optical finger print

Info

Publication number: CN109815891A
Application number: CN201910057107.2A
Authority: CN
Inventors: 焉逢运; 刘文涛; 谢詹奇; 孙云刚
Original assignee: Silead Inc
Current assignee: Silead Inc
Priority date: 2019-01-22
Filing date: 2019-01-22
Publication date: 2019-05-28
Anticipated expiration: 2039-01-22
Also published as: CN109815891B

Abstract

The present invention provides a kind of for shielding the identification mould group and electronic equipment of lower optical finger print, which includes: electrically-conductive backing plate；Recognizer component on electrically-conductive backing plate is set comprising: light sensation chip, at lower section of the recognizer component mould group in display screen for received from the reflected echo signal light of target organism above display screen；Light sensation chip includes at least metal layer；Guard assembly above light sensation chip, with transmission region, echo signal light reaches light sensation chip through transmission region；The protection chamber for guard metal layer is formed with below guard assembly；It is intracavitary that metal layer is housed in protection；Alternatively, light sensation chip constitutes the internal partial wall of protection chamber；Conductive path, one end and metal layer are conductively connected, and the other end is conductively connected by Reflow Soldering and electrically-conductive backing plate.The production of the identification mould group of the embodiment of the present invention and packaging efficiency are higher.

Description

A discernment module and electronic equipment for optical fingerprint under screen

Technical Field

The invention relates to the technical field of optical technology under a screen, in particular to an identification module for optical fingerprints under the screen and electronic equipment using or configured with the identification module.

Background

The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.

The technology of optical fingerprint recognition under screen is rapidly developed and applied because it does not occupy the surface space of electronic devices (e.g., smart phones).

At present, most procedures of identification components of fingerprint identification modules applied to optical screens under screens are finished in module factories. Specifically, at first, electronic components such as capacitors and resistors can be soldered to an FPC (flexible printed Circuit), the FPC is transferred to a clean workshop to be cleaned, and then a COB (chip on Board) process is used for packaging the fingerprint chip. The fingerprint chip is fixed on the FPC firstly, then the fingerprint chip and the FPC are connected through gold threads, and the FPC is fixed on the steel plate.

That is, the identification module in the existing known fingerprint identification module at least needs to perform two processes of reflow soldering and COB at the module factory. Conventionally, the efficiency of a module factory is much lower than that of a packaging factory by performing the same process. Therefore, the production efficiency of the existing identification component applied to the optical screen is very low. And then lead to the production and the packaging efficiency of the fingerprint identification module that is used for optics under the screen not high.

It should be noted that the above background description is only for the sake of clarity and complete description of the technical solutions of the present invention and for the understanding of those skilled in the art. Such solutions are not considered to be known to the person skilled in the art merely because they have been set forth in the background section of the invention.

Disclosure of Invention

Based on the foregoing defects in the prior art, embodiments of the present invention provide an identification module for optical fingerprints under a screen and an electronic device using or configured with the identification module, where the identification module has high production and assembly efficiency.

In order to achieve the above object, the present invention provides the following technical solutions.

The identification module is used for being arranged below a display screen; the identification module comprises:

a conductive substrate;

an identification component disposed on the conductive substrate, the identification component comprising:

the light sensing chip is used for receiving target signal light reflected by a target organism above the display screen when the identification module is arranged below the display screen; the light sensing chip at least comprises a metal layer;

the protective assembly is positioned above the light sensing chip and provided with a light transmitting area, and the target signal light can reach the light sensing chip through the light transmitting area; a protection cavity for protecting the metal layer is formed below the protection component; the metal layer is accommodated in the protection cavity; or the light sensing chip forms part of the inner wall of the protection cavity;

and one end of the conductive path is in conductive connection with the metal layer, and the other end of the conductive path is in conductive connection with the conductive substrate through reflow soldering.

Because the metal layer of the light sensing chip is protected by the protection cavity, conditions are provided for the recognition component of the embodiment of the invention to be packaged firstly and then to be connected with the conductive substrate in a conductive manner by adopting reflow soldering.

That is to say, the identification module of the embodiment of the invention can complete the packaging of the light sensing chip in the packaging factory and then realize the connection with the conductive substrate in the module factory. And the light sensing chip of the identification assembly can be in conductive connection with an external circuit through the conductive substrate.

Therefore, compared with the prior art, the assembly work of the identification module provided by the embodiment of the invention only needs to execute a reflow soldering process with low requirement on the cleanliness of the operating environment or atmosphere in a module factory with low efficiency, so that the production and assembly efficiency of the identification module is greatly improved.

Further, by disposing the first film unit including the first 1/4 wave plate and the first linear polarizer between the display panel and the light-sensing chip, the non-reflected noise light directly emitted from the display panel to the light-sensing chip is attenuated after passing through the first 1/4 wave plate and the first linear polarizer. Thus, the luminance of the non-reflected noise light can be reduced, and the imaging quality can be improved.

In addition, by configuring the second diaphragm unit including the second 1/4 wave plate and the second linear polarizer and adapting the direction and the difference between the first angle formed between the first 1/4 wave plate and the first linear polarizer and the second angle formed between the second 1/4 wave plate and the second linear polarizer, the target signal light is not attenuated or less attenuated while the non-reflected noise light is attenuated. Therefore, the signal-to-noise ratio of the light received by the light sensing chip is improved, and the imaging quality is greatly improved.

Specific embodiments of the present invention are disclosed in detail with reference to the following description and drawings, indicating the manner in which the principles of the invention may be employed. It should be understood that the embodiments of the invention are not so limited in scope. The embodiments of the invention include many variations, modifications and equivalents within the spirit and scope of the appended claims.

Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments, in combination with or instead of the features of the other embodiments.

It should be emphasized that the term "comprises/comprising" when used herein, is taken to specify the presence of stated features, integers, steps or components but does not preclude the presence or addition of one or more other features, integers, steps or components.

Drawings

The drawings described herein are for illustration purposes only and are not intended to limit the scope of the present disclosure in any way. In addition, the shapes, the proportional sizes, and the like of the respective members in the drawings are merely schematic for facilitating the understanding of the present invention, and do not specifically limit the shapes, the proportional sizes, and the like of the respective members of the present invention. Those skilled in the art, having the benefit of the teachings of this invention, may choose from the various possible shapes and proportional sizes to implement the invention as a matter of case. In the drawings:

FIG. 1 is a schematic structural diagram of an identification assembly for an optical fingerprint under a screen according to a first embodiment of the present invention;

FIG. 2 is a schematic structural diagram of an identification assembly for an optical fingerprint under a screen according to a second embodiment of the present invention;

FIG. 3 is a schematic structural diagram of an identification assembly for an optical fingerprint under a screen according to a third embodiment of the present invention;

FIG. 4 is a schematic structural diagram of an identification assembly for an optical fingerprint under a screen according to a fourth embodiment of the present invention;

FIG. 5 is a schematic structural diagram of an identification assembly for an optical fingerprint under a screen according to a fifth embodiment of the present invention;

FIG. 6 is a schematic structural diagram of an identification assembly for an optical fingerprint under a screen according to a sixth embodiment of the present invention;

FIG. 7 is a schematic structural diagram of an identification assembly for an optical fingerprint under a screen according to a seventh embodiment of the present invention;

FIG. 8 is a schematic structural diagram of an identification assembly for an optical fingerprint under a screen according to an eighth embodiment of the present invention;

FIG. 9 is a schematic structural diagram of an identification assembly for an optical fingerprint under a screen according to a ninth embodiment of the present invention;

FIG. 10 is a schematic structural diagram of an identification assembly for an optical fingerprint under a screen according to a tenth embodiment of the present invention;

FIG. 11 is a schematic structural diagram of an identification assembly for an optical fingerprint under a screen according to an eleventh embodiment of the present invention;

FIG. 12 is a schematic structural diagram of an identification assembly for an optical fingerprint under a screen according to a twelfth embodiment of the present invention;

FIG. 13 is a schematic structural diagram of an identification assembly for an optical fingerprint under a screen according to a thirteenth embodiment of the present invention;

FIG. 14 is a schematic structural diagram of an identification component for an optical fingerprint under a screen according to a fourteenth embodiment of the invention;

fig. 15 is a schematic structural diagram of an identification assembly for an optical fingerprint under a screen according to a fifteenth embodiment of the present invention;

fig. 16 is a schematic structural diagram of an identification component for an optical fingerprint under a screen according to a sixteenth embodiment of the present invention;

FIG. 17 is a schematic structural diagram of an identification assembly for an underscreen optical fingerprint according to a seventeenth embodiment of the invention;

fig. 18 is a schematic structural diagram of an identification component for an optical fingerprint under a screen according to an eighteenth embodiment of the present invention;

fig. 19 is a schematic structural diagram of an identification component for an optical fingerprint under a screen according to a nineteenth embodiment of the present invention;

FIG. 20 is a schematic structural diagram of an identification component for an optical fingerprint under a screen according to a twentieth embodiment of the present invention;

fig. 21 is a schematic structural diagram of an identification component for an off-screen optical fingerprint according to a twenty-first embodiment of the present invention;

FIG. 22 is a schematic structural diagram of an identification assembly for an optical fingerprint under a screen according to a twenty-second embodiment of the present invention;

FIG. 23 is a schematic structural diagram of an identification assembly for an optical fingerprint under a screen according to a twenty-third embodiment of the present invention;

FIG. 24 is a schematic structural diagram of an identification assembly for an optical fingerprint under a screen in accordance with a twenty-fourth embodiment of the present invention;

fig. 25 is a schematic structural view of an identification module for an optical fingerprint under a screen according to an embodiment of the present invention, in which a bracket is disposed on a conductive substrate;

FIG. 25A is a schematic structural diagram of the identification module according to the first embodiment under the condition illustrated in FIG. 25;

FIG. 25B is a schematic structural diagram of an identification module according to the second embodiment under the condition illustrated in FIG. 25;

FIG. 25C is a schematic structural diagram of an identification module according to a third embodiment in the situation illustrated in FIG. 25;

FIG. 25D is a schematic structural diagram of an identification module according to a fourth embodiment in the situation illustrated in FIG. 25;

FIG. 25E is a schematic structural diagram of an identification module according to a fifth embodiment in the situation illustrated in FIG. 25;

FIG. 25F is a schematic structural diagram of an identification module according to a sixth embodiment in the situation illustrated in FIG. 25;

FIG. 25G is a schematic structural diagram of an identification module according to a seventh embodiment in the situation illustrated in FIG. 25;

fig. 26 is a schematic structural view of an identification module for an optical fingerprint under a screen according to an embodiment of the present invention, in a situation where a bracket is disposed on an identification component;

FIG. 26A is a schematic structural diagram of an identification module according to the first embodiment under the condition illustrated in FIG. 26;

FIG. 26B is a schematic structural diagram of an identification module according to the second embodiment under the condition illustrated in FIG. 26;

FIG. 26C is a schematic structural diagram of an identification module according to a third embodiment in the situation illustrated in FIG. 26;

FIG. 26D is a schematic structural diagram of an identification module according to a fourth embodiment in the situation illustrated in FIG. 26;

FIG. 26E is a schematic structural diagram of an identification module according to a fifth embodiment in the situation illustrated in FIG. 26;

FIG. 26F is a schematic structural diagram of an identification module according to a sixth embodiment in the situation illustrated in FIG. 26;

FIG. 26G is a schematic structural diagram of an identification module according to a seventh embodiment in the situation illustrated in FIG. 26;

FIG. 27A is a schematic diagram of an electronic device equipped with an identification module according to a first embodiment of the invention;

FIG. 27B is a schematic diagram of an electronic device equipped with an identification module according to a second embodiment of the invention;

FIG. 28A is a schematic diagram of the first 1/4 wave plate having an optical axis +45 ° ± 5 ° with respect to the polarization direction of the first linear polarizer;

FIG. 28B is the schematic diagram of the second 1/4 wave plate having an angle of-45 ° ± 5 ° between the optic axis and the polarization direction of the second linear polarizer;

FIG. 29A is a diagram of the first 1/4 wave plate showing an angle of-45 ° ± 5 ° between the optic axis and the polarization direction of the first linear polarizer;

FIG. 29B is the diagram illustrating the relationship between the optical axis of the second 1/4 wave plate and the polarization direction of the second linear polarizer by +45 ° ± 5 °;

fig. 30 is a schematic structural diagram of an off-screen biometric device according to a known embodiment of the prior art.

Detailed Description

In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, shall fall within the scope of protection of the present invention.

It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a single embodiment.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As can be seen from the above description, the existing known identification assembly for assembling to form a fingerprint identification module requires performing a reflow process and then performing a COB process. And both processes need to be completed at the module factory.

However, in the COB-packaged structure, it is difficult to reverse the execution sequence of the two processes. The main reasons are as follows:

as can be seen from the above description of the COB process, the fingerprint chip is exposed after being packaged by the COB process. In the reflow soldering process, hot air also plays a role in blowing impurities or dust while heating the FPC and the electronic components to be soldered. And if COB packaging is finished, the electronic components are welded on the FPC by adopting reflow soldering. Then, during the reflow process, impurities or dust blown by hot air may adhere to the exposed fingerprint chip. And impurities or dust can have serious and even fatal influence on the normal operation of the fingerprint chip.

Therefore, the existing known identification assembly for assembling and forming the fingerprint identification module can only be executed in a module factory due to the relative fixation of the execution sequence of the reflow soldering process and the COB process in the preparation process, and the COB process cannot be transferred to a packaging factory to be completed. Thereby the production efficiency greatly reduced of discernment subassembly, and then the production and the packaging efficiency that lead to the fingerprint identification module are not high.

In view of the above, the embodiments of the present invention provide an identification component for optical fingerprint under a screen, and the preparation of the entire identification component can be completed in a packaging factory. The identification component can be assembled in a module factory to form the identification module, so that the production efficiency is greatly improved.

In this specification, the direction pointing or facing the user in the normal use state of the identification component and the identification module according to the embodiment of the present invention is defined as "up", and the opposite direction, or the direction facing away from the user is defined as "down".

More specifically, an upward direction illustrated in fig. 1 to 26 is defined as "up", and a downward direction illustrated in fig. 1 to 26 is defined as "down".

It should be noted that the definitions of the directions in the present specification are only for convenience of describing the technical solution of the present invention, and do not limit the directions of the identification component or module according to the embodiments of the present invention in other scenarios, including but not limited to use, test, transportation, and manufacturing, which may cause the orientation of the identification component or module to be reversed or the position of the identification component or module to be changed.

The identification module provided by the embodiment of the invention can be applied to scenes including but not limited to unlocking fingerprint under a screen, user identity verification, permission acquisition and the like.

Specifically, when the identification module of the embodiment of the present invention is configured in the electronic device, the electronic device may obtain the fingerprint feature information of the user based on the identification module, so as to match the fingerprint feature information with the stored fingerprint information, so as to implement identity verification on the current user, and thus determine whether the current user has a corresponding right to perform a related operation on the electronic device.

It should be noted that the fingerprint information obtained as described above is only one common example of the user's biometric features. Those skilled in the art can extend the technical solution of the embodiments of the present invention to any suitable biometric authentication scenario within the scope that can be envisioned. For example, the scenario of verifying by acquiring biometric information, that is, the iris of the user, is not limited in the embodiment of the present invention.

The following is set forth in a scenario in which user fingerprint information is obtained as a main description. It will nevertheless be understood that no limitation of the scope of the embodiments of the invention is thereby intended, as illustrated in the accompanying drawings.

The identification module for the optical fingerprint under the screen of the embodiment of the invention can be applied to electronic equipment including but not limited to mobile smart phones, tablet electronic equipment, computers, GPS navigators, personal digital assistants, intelligent wearable equipment and the like.

The electronic device in the embodiment of the present invention may further include other necessary modules or components in order to realize the basic functions of the electronic device. Taking a mobile smart phone as an example, it may further include a communication module, a battery, and the like.

It should be noted that any other necessary modules or components included in the electronic device may be used in any suitable existing configuration. For clearly and briefly explaining the technical scheme provided by the invention, the parts are not described again, and the drawings in the specification are correspondingly simplified. It will nevertheless be understood that no limitation of the scope of the invention is thereby intended.

As shown in fig. 27A and 27B, the electronic apparatus may be configured with a display screen 200. The display panel 200 may be a self-luminous display panel using self-luminous units as display pixels, such as an OLED display panel or an LED display panel. Of course, the display 200 may also be an LCD display or other passive light emitting display, which is not limited in the embodiment of the present invention.

The identification module 1000 according to the embodiment of the present invention is disposed below the display screen 200. Specifically, the electronic device may be provided with a middle frame, and the identification module 1000 is installed below the display screen 200 through the middle frame and fixed. And, relative and interval setting between identification module 1000 and the display screen 200.

The identification module 1000 and the identification assembly 100 according to the embodiment of the present invention will be explained and explained with reference to fig. 1 to 26. It should be noted that, for convenience of description, like reference numerals denote like parts in the embodiments of the present invention. And for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments, and the descriptions of the same components may be mutually referred to and cited.

As shown in fig. 1 to 24, the identification device 100 includes a light sensing chip 1 for converting a light signal into an electrical signal. The light sensing chip 1 is configured to receive a target signal light reflected from a target organism (e.g., a user's finger) above the display screen 200 when the identification module 1000 is disposed below the display screen 200. And, the target signal light may be converted into an electrical signal to generate a fingerprint image. The light sensing chip 1 can further send the fingerprint image to an image processor connected with the signal, the image processor performs image processing to obtain a fingerprint signal, and fingerprint identification is performed on the fingerprint signal through an algorithm.

The photo sensor chip 1 at least includes a metal layer 1 a. Since the metal layer 1a is used for wiring or routing, the metal layer 1a needs to be protected. The photo chip 1 may further include a silicon layer 1b, and the silicon layer 1b is laminated with the metal layer 1 a. And the relative positions of the two can be changed and adjusted according to different conditions.

Above the light sensing chip 1, a light condensing member may be disposed, and specifically, the light condensing member may be located in the protection cavity 2 mentioned below. And, the spotlight component is located between light sense chip 1 and display screen 200 when identification component 100 sets up the below of display screen 200, and it is used for assembling signal light to can realize assembling comparatively dispersed signal light in the wide angle range to light sense chip 1 on, in order to promote imaging quality.

In the present embodiment, the light condensing member may be constituted by a plurality of microlenses 13. The plurality of microlenses 13 can be disposed on the light-sensing chip 1, so that the light-sensing chip 1 can provide a disposing position and a support for the plurality of microlenses 13.

Of course, the plurality of microlenses 13 may be spaced apart from the light-sensing chip 1. Specifically, a light-transmitting plate or a light-transmitting sheet for disposing the plurality of microlenses 13 may be disposed above the light-sensing chip 1, thereby achieving the spaced disposition of the plurality of microlenses 13 and the light-sensing chip 1.

In order not to affect the imaging quality of the light-sensing chip 1, the distance between the plurality of microlenses 13 and the light-sensing chip 1 is equal to or close to the focal length of the microlenses 13. Specifically, the difference between the spacing distances between the microlenses 13 and the light-sensing chip 1 is within a predetermined range [0, Φ ], i.e., the spacing distances between the microlenses 13 and the light-sensing chip 1 are considered to be equal to or close to the focal length of the microlenses 13.

The upper limit value Φ of the predetermined range may be set according to actual conditions, which is not limited in the embodiment of the present invention.

The protection component 5 is arranged above the light sensing chip 1, the protection component 5 is provided with a light transmitting area, and target signal light can reach the light sensing chip 1 through the light transmitting area.

The light-transmitting region may occupy the entire light-facing surface (e.g., the upper surface) of the shield member 5. In this case, the whole of the protection component 5 may be made of a light-transmitting material, and there is no region on the light-facing surface through which light cannot pass.

Alternatively, the light-transmitting region may occupy only a part of the light-facing surface of the shield member 5. For example, the protective member 5 is made of a light-transmitting material and a light-impermeable material in different regions; the area occupied by the light transmissive material forms a light transmissive area.

Or, the whole of the protection component 5 is made of a light-transmitting material, and an area covered by a light-tight material can exist or be distributed on the light-facing surface; the areas not covered by the opaque material form the transparent areas.

The shield member 5 may be disposed at any position along a propagation path in a direction in which the target signal light reaches the optical sensor chip 1. In other words, the projection of the shielding member 5 along the propagation direction of the target signal light at least partially covers the light-sensing chip 1.

For example, if the target signal light propagates in a direction perpendicular to the light-facing surface of the light-sensing chip 1, the protection member 5 may be located right above the light-sensing chip 1. If the target information light propagates obliquely to the light-facing surface of the light-sensing chip 1, the protection component 5 may be correspondingly located obliquely above the light-sensing chip 1. Thus, the target information light can penetrate through the light-transmitting area of the protective component 5 as much as possible to reach the light-sensing chip 1.

Furthermore, the resistant temperature of the protective component 5 is higher than 150 ℃. I.e. the protective component 5 does not change its physical form (e.g. soften, deform, melt) at temperatures above 150 ℃. Therefore, when the identification component 100 of the embodiment of the invention is connected with the conductive substrate 300 by reflow soldering, even if the temperature of the protective component 5 is raised, the protective component is not deformed or damaged, so that the adjacent or connected components can keep the original shape.

The temperature rises in a stepwise manner during reflow soldering. Thus, 150 ℃ may be the temperature that the shield assembly 5 can withstand at the beginning of reflow soldering. In order to adapt to the stepped temperature rise of the solder reflow, the withstand temperature of the protective component 5 can be further increased. For example, the maximum temperature point during reflow soldering may be 260 ℃, and the tolerance temperature of the shield assembly 5 is accordingly greater than 260 ℃, for example, 280 ℃ or 300 ℃.

The protective component 5 may specifically comprise at least one of a light-transmissive carrier 5a and a filter 5 b. For example, the protective member may be constituted by any one of the light-transmitting carrier 5a and the optical filter 5b, for example, only the light-transmitting carrier 5a constitutes the protective member 5, or only the optical filter 5b constitutes the protective member 5. Of course, the protective component may also be formed by combining the light-transmitting carrier 5a and the filter 5 b.

When the protective member 5 is formed specifically as at least one configuration of the light-transmitting carrier 5a and the optical filter 5b, the entire light-facing surface of the protective member 5 may form a light-transmitting region.

The light-transmitting support 5a may provide a location for the optical filter 5b and function to support the optical filter 5 b. Thereby, the relative position between the light-transmitting support 5a and the filter 5b can be made relatively free.

Specifically, the optical filter 5b may be disposed on the upper surface or the lower surface of the light-transmitting carrier 5a in a pasted manner. So that the surface of the filter 5b is bonded to the surface of the light-transmitting support 5 a.

In this embodiment, the filter 5b may be attached to the surface of the light-transmitting carrier 5a in the form of a film. The filters 5b may be provided on both the upper and lower surfaces of the light-transmitting support 5 a.

Alternatively, the optical filter 5b may be embedded in the light transmissive carrier 5 a. That is, the filter 5b is integrated with the light-transmitting carrier 5a, and the light-transmitting carrier 5a in this case has a function of filtering noise light.

In this embodiment, the light-transmitting support 5a may be a single-layer member, and the optical filter 5b may be formed in the light-transmitting support 5a in the form of an optical filter coating. Also, the optical filter coating may be distributed discretely or continuously in the light-transmissive carrier 5 a.

Further, the light-transmitting support 5a may be plural. The optical filter 5b may be attached between two adjacent light-transmitting carriers 5a in the form of a film, or may be formed in one or some of the light-transmitting carriers 5a in the form of an optical filter coating.

In one embodiment, the light transmissive carrier 5a may be a cover glass or a sapphire cover.

The protection member 5 is spaced from the light sensing chip 1. Therefore, the light sensing chip 1 can be prevented from being damaged due to the contact between the protection component 5 and the light sensing chip 1.

The optical filter 5b is used for at least partially filtering out noise light mixed in the target signal light so as to improve the sensing of the light sensing chip 1 on the received light and improve the imaging quality.

When the light sources are energized differently, the noise light also changes accordingly. The excitation light source is used for emitting excitation light to the finger of the user, the excitation light is reflected by the finger of the user, and the reflected light is target signal light carrying fingerprint information.

In some scenarios, when the display 200 is a self-luminous display, the self-luminous display can be an excitation light source. The excitation light emitted by the excitation light source is generally visible light, and similarly, the target signal light is also visible light. Then, in such a scenario, the noise light may be invisible light in the ambient light, such as infrared light, near-infrared light, or the like. Then, at this time, the filter 5b may be specifically an infrared filter.

In this scenario, the filter 5b may allow light emitted from the self-luminous display screen to pass therethrough, while filtering noise light (including invisible light such as infrared light, near-infrared light, and the like) in ambient light (e.g., sunlight). The light emitted from the self-luminous display screen includes non-target signal light which directly faces the optical filter 5b and does not include fingerprint information, and also includes target signal light which is reflected by a finger of a user and carries fingerprint information.

Therefore, when the electronic device equipped with the identification component 100 of the embodiment of the present invention is used outdoors, the filter 5b can effectively filter the noise light in the external environment light, thereby improving the signal-to-noise ratio of the light reaching the light-sensing chip 1.

In some cases, the excitation light source may be an invisible light source, such as an infrared light source, additionally disposed under the display screen 200, and both the excitation light emitted by the excitation light source and the target signal light are invisible light. In this scenario, the noise light is then visible light in the ambient light, e.g. white light. In this case, the filter 5b may be a visible light filter.

In this scenario, the filter 5b may allow invisible excitation light emitted from the excitation light source to pass through, while filtering noise light (including visible light such as white light) in ambient light.

Typically, when the excitation light source is an additionally configured invisible light source, it may enable directional emission of light, i.e. towards a specific area on the display screen 200, typically the pressing area of a user's finger. Therefore, most of invisible excitation light emitted by the excitation light source forms target signal light carrying fingerprint information after being reflected by fingers, and cannot be directly transmitted to the light sensing chip 1.

Therefore, when the electronic device equipped with the identification assembly 100 of the embodiment of the present invention is used outdoors, the filter 5b can also effectively filter the noise light in the external environment light. Moreover, since the identification component 100 according to the embodiment of the present invention is disposed below the display screen 200, the optical filter 5b can also filter out visible light in the light emitted downward from the display screen 200, so as to improve the signal-to-noise ratio of the light reaching the light sensing chip 1.

A protection cavity 2 for protecting the metal layer 1a is formed below the protection component 5. The protection function of the protection cavity 2 on the metal layer 1a at least comprises impurity or dust separation, and further comprises anti-oxidation protection.

In addition, the main forms of protection of the metal layer 1a by the protection cavity 2 may include: the metal layer 1a is accommodated in the protective cavity 2. Alternatively, the photo chip 1 forms part of the inner wall of the protection cavity 2.

Further, the identification component 100 of embodiments of the present invention is also configured with conductive pathways. One end (inner end) of the conductive path is conductively connected to the metal layer 1a, and the other end (outer end) is used for connection to the conductive substrate 300.

Since the metal layer 1a of the light-sensing chip 1 is protected by the protection cavity 2, conditions are provided for the recognition component 100 of the embodiment of the present invention to be packaged first and then to be electrically connected to the conductive substrate 300 by reflow soldering.

That is, the identification device 100 of the embodiment of the invention can complete the packaging of the photo sensor chip 1 in the packaging factory, and then connect with the conductive substrate 300 in the module factory. Thus, compared with the prior art, the identification component 100 of the embodiment of the invention only needs to perform a reflow soldering process in a module factory, so that the production efficiency is greatly improved.

It should be noted that although the prior art is in the field of optical fingerprint recognition technology under a screen, there are known embodiments of an enclosed space in which a fingerprint chip is housed. However, in these known embodiments, the identification component has been assembled with other associated structures for implementing the off-screen optical fingerprint recognition, forming a corresponding identification module. And the enclosed space is formed by the identification component and other related structures. That is, the closed space for housing the fingerprint chip therein exists in the identification module, but cannot exist in the identification module.

At this point, the resulting identification module is assembled and the reflow process has completed. When the identification module or the identification component is connected with an external circuit, reflow soldering is not generally adopted for realizing the connection. And practice proves that the method is difficult to realize even by a reflow soldering process.

Specifically, for example, the publication number CN208027382U provides an off-screen biometric recognition apparatus and an electronic device. In which an off-screen biometric identification device is described as one known embodiment.

As shown in fig. 30, in this known embodiment, an FPC270 is fixed to a steel plate, and an imaging chip 250 (i.e., the above-mentioned fingerprint chip) is fixed to an upper surface of the FPC270 by pad bonding. The upper surface of the FPC270 is fixedly connected to the lower surface of the bracket 230 at the edge area of the imaging chip 250. And, a closed space is formed between the bracket 230 and the FPC 270. Thus, the closed space accommodates the imaging chip 250 therein.

In essence, in this known embodiment, the structure including the steel plate, the FPC270, and the imaging chip 250 is identical to the identification assembly 100 of the embodiment of the present invention (for simplicity and distinction from the present invention, it is named as an identification structure). And the bracket 230 configured with the lens 210 and the lens barrel 220 is a related structure matched with the same. Thus, the identification structure is assembled with the associated structure to form an underscreen biometric identification device.

Although this known embodiment does not mention the implementation of the connection of the identification structure to an external circuit. However, it should be noted that the connection between the identification structure and the external circuit cannot be achieved by reflow soldering due to the limitations of its own structure and the consideration of product yield. The main reason is that the lens 210 cannot be over-reflowed, i.e., the temperature atmosphere in which reflow is performed may damage the lens 210. The method comprises the following specific steps:

the temperature resistance of the lens 210 is poor (at present, the lens applied in the field of optical devices under a screen is mostly made of plastic materials, the heat-resistant temperature is low, generally about 60 ℃), and the temperature atmosphere in the reflow soldering process will cause the deformation of the lens 210.

Further, in the known embodiment, the lens 210 is fixed in the lens barrel 220, and the lens barrel 220 is connected to the holder 230 by means of a screw connection. Similarly, the stent 230 is typically less resistant to temperature (typically around 100 ℃). The temperature atmosphere during reflow will cause the carrier 230 to soften and compress the lens 210.

Since the lens 210 is a precision device, it is scrapped due to slight damage or deformation.

Therefore, the known embodiment employs the COB process to obtain the identification structure, and the identification device assembled using the identification structure has difficulty in connection with the external circuit by reflow soldering.

Thus, the formation of the enclosed space in the identification device in which the fingerprint chip is housed is due to the structure that must be formed when the identification assembly is assembled with the associated structure. However, when the identification device is formed by assembling the identification component and then reflow soldering is performed to connect the identification component to an external circuit, the fragile and delicate components of the identification device may be damaged. Thus, reflow soldering cannot be performed, or forced reflow soldering results in product scrap.

However, if the above-described embodiment is used without forming a closed space (i.e., when the identification structure is not assembled with the holder 230 having the lens 210 and the lens barrel 220, there is no precision component such as the lens 210), the identification structure is connected to an external circuit by reflow soldering, although the lens 210 is not damaged. However, in the recognition structure at this time, the imaging chip 250 is exposed, and impurities or dust blown by hot air during reflow soldering may adhere to the surface of the imaging chip 250, thereby damaging the imaging chip 250.

It follows that in this known embodiment, neither at the stage of the identification structure, nor at the stage after assembly of the identification device using the identification structure, it is possible to achieve an electrically conductive connection of the identification structure to an external circuit by means of a process such as reflow soldering.

In the embodiment of the present invention, the protection cavity 2 for protecting the light-sensing chip 1 is formed in the identification component 100, and since the identification component 100 does not include a precise and poor temperature-resistant device such as the lens 210 in the above-mentioned known embodiment, it is possible to connect the identification component 100 to the conductive substrate 300 by reflow soldering. And reduces the cost of consumables that are added by damage to these expensive precision components.

Further, the identification device 100 according to the embodiment of the present invention can be completed in a packaging factory, that is, the package including the optical sensor chip 1 and the protection cavity 2 are formed, and in a module factory, only a reflow soldering process is required to connect the identification device 100 to the outside. Therefore, as many processes as possible can be completed in a packaging plant with higher production efficiency, and the overall production efficiency is greatly improved. In addition, the requirement of the reflow soldering on the cleanliness of the operating environment or atmosphere is not high, and the production efficiency can be further improved.

Thus, the identification component 100 of the embodiment of the present invention may be connected to the conductive substrate 300 by reflow soldering. Specifically, the identification device 100 of the embodiment of the present invention is provided with a conductive via having one end electrically connected to the metal layer 1a of the photo sensor chip 1, and the other end of the conductive via can be electrically connected to the conductive substrate 300 by reflow soldering. Thereby, the conductive communication of the identification component 100 of the present embodiment with the external circuit is achieved through the conductive substrate 300.

In addition, the other end of the conductive path may be connected to the conductive substrate 300 by reflow soldering, and the other end of the conductive path may be connected to an FPC by a connector or a connection plug, which is connected to other peripheral circuits or electronic components by insertion and removal.

Further, in order to facilitate connection of the other end of the conductive path to the conductive substrate 300 by reflow soldering, the other end of the conductive path may be in an exposed state. And in particular the other end of the conductive path is not obstructed by the wall of the identification assembly 100. For example, when the other end of the conductive path is located within the wall of the identification component 100, the exposure may be achieved by providing an opening or through-hole in the wall of the identification component 100 that communicates the other end of the conductive path with the outside.

Alternatively, the other end of the conductive path may expose or protrude from the outer surface of the identification component 100. For example, the other end of the conductive path may be flush with the outer surface of the identification component 100 or may extend outside the outer surface of the identification component 100. Thereby, the other end of the conductive path is exposed and extends to be outside the protection cavity 2.

The other end of the conductive path may be formed with a solder ball 15 through a ball-attachment process. The solder ball 15 has better solderability, such as solder ball, so as to conveniently realize the connection between the solder ball 15 and the conductive substrate 300 by reflow soldering.

The light-sensing chip 1 included in the identification assembly 100 according to the embodiment of the invention can be packaged by using the same COB process as that of the above-described embodiment. Of course, other packaging processes may be used.

For example, in one possible embodiment, the light sensing Chip 1 may be packaged by a Chip Scale Package (CSP) process. The thickness and volume of the packaged product can be reduced due to the CSP process. Therefore, the embodiment of the invention adopts the CSP process to realize the packaging of the light sensing chip 1, so that the thickness and the volume of the identification assembly 100 are smaller, and the requirements of electronic equipment on the thinness and the smallness of the identification assembly 100 of the optical fingerprint under the screen can be met.

By adopting the CSP process, the area ratio of the photosensitive chip 1 to the packaging part is larger than 1:1.14 and is close to 1:1.

Since the light-sensing chip 1 needs to be supported by a supporting carrier, i.e. a carrier, during the packaging process using the CSP process. Therefore, after the package is completed, the carrier can be removed, or the carrier can be kept in a combined state with the optical sensor chip 1.

That is, in one case, the photo die 1 is combined with the carrier by the CSP process. After the light sensing chip 1 is packaged, the carrier and the light sensing chip 1 are continuously kept in the combined state. I.e., the carrier is contained within the final identification assembly 100.

In another case, the carrier only supports the photo-sensing chip 1 during the packaging process of the photo-sensing chip 1 through the CSP process. After the package is completed, the carrier is peeled off and separated from the photo sensor chip 1. I.e., the carrier is not included in the final identification assembly 100.

As shown in fig. 1 to 18, the optical sensor chip 1 is packaged and the carrier is continuously bonded to the optical sensor chip.

In this case, the photo chip 1 includes a metal layer 1a and a silicon layer 1 b. In order to protect the metal layer 1a, the metal layer 1a may be housed in the protection cavity 2; alternatively, the photo chip 1 forms part of the inner wall of the protection cavity 2. Thus, during the reflow soldering, impurities or dust can be blocked outside the protective chamber 2. And further, the metal layer 1a may also be protected from oxidation.

Further, the silicon layer 1b may also be housed in the protective cavity 2. That is, the entire photo sensor chip 1 is accommodated in the protection cavity 2.

As shown in fig. 1 to 8, the metal layer 1a is accommodated in the protection cavity 2, and the silicon layer 1b is also accommodated therein. In these embodiments, the carrier may be a Substrate 3 (SUB). The substrate 3 can provide electrical connection, protection, support, heat dissipation, assembly, and the like for the light sensing chip 1.

The substrate 3 may take any suitable existing configuration. Specifically, the substrate 3 may be a flexible substrate made of a flexible material (e.g., a plastic film) on which a plurality of layers of metal wirings are formed. Alternatively, the substrate 3 may be a hard substrate made of a multilayer wiring ceramic or a multilayer wiring laminated resin plate. Alternatively, the substrate 3 may be a lead frame.

In addition, a supporting wall 4 is disposed on the substrate 3, and a lower end of the supporting wall 4 may be adhered to the substrate 3 by an adhesive 304. And, the shielding assembly 5 is braced against the upper end of the supporting wall 4. Similarly, the shielding member 5 may be fixed to the upper end of the supporting wall 4 by adhesive. In this way, the base plate 3, the support wall 4 and the shield assembly 5 define between them a protection chamber 2.

In the embodiment of the invention, the adhesive for bonding the adjacent parts adopts thermosetting glue. Therefore, when reflow soldering is subsequently performed, the connection among all the parts cannot be damaged by the high-temperature atmosphere, the curing effect of glue can be enhanced, and the connection among all the parts is firmer.

In this embodiment, the protection chamber 2 may be a sealed chamber or a non-sealed chamber.

The protection chamber 2 may be a closed chamber formed by arranging the support wall 4 to be circumferentially continuous. The support wall 4 may be circumferentially continuous in such a way that it defines an inner space which is not in communication with the outer space in the radial direction.

Specifically, for example, the support wall 4 may be a cylindrical body, and the wall of the cylindrical body is not provided with any through structure, such as a through hole, an opening, and the like, which can communicate the internal space and the external space. In addition, the cross section of the cylindrical body may be circular, polygonal, different and any other feasible shapes, which is not limited by the embodiment of the present invention.

The protection chamber 2 is an unsealed chamber which can be realized by configuring the supporting wall 4 to be circumferentially discontinuous. Likewise, the supporting wall 4 may be circumferentially continuous in such a way that its defined inner space is not in communication with the outer space in the radial direction.

Specifically, for example, the support wall 4 may be a cylindrical body having a wall provided with a through structure, such as a through hole or an opening, for communicating the internal space and the external space.

Alternatively, the support wall 4 has a casing structure that is not closed in the circumferential direction, and may have an arc-like or C-like cross-sectional shape in plan view, for example.

Or, the supporting wall 4 may be a plurality of columns, and the upper and lower ends of the plurality of columns are respectively connected to the lower surface of the protection component 5 and the upper surface of the substrate 3, so that the plurality of columns are erected between the protection component 5 and the substrate 3. In addition, a plurality of columns may be circumferentially spaced to form a fence-like structure.

The above are only some possible implementations in which the supporting wall 4 is circumferentially discontinuous to achieve non-tightness of the protection cavity 2, and the embodiments of the present invention are not limited thereto.

Further, the support wall 4 needs to be configured to have the capability of being over-reflowed. Thus, as described above, the temperature resistance of the supporting wall 4 is at least greater than 150 ℃, and further may be greater than 260 ℃. Accordingly, the support wall 4 may be made of any suitable material that does not undergo a change in physical form at temperatures above 150 ℃ or even 260 ℃, such as metal (preferably light metal, e.g. aluminium or aluminium alloy), ceramic, etc.

The upper surface of the substrate 3 may be provided with upper pins 301 and the lower surface of the substrate 3 is provided with lower pins 302 in conductive communication with the upper pins 301. Specifically, the metal posts 303 are embedded in the substrate 3, and the upper ends and the lower ends of the metal posts 303 are respectively connected to the upper surface and the lower surface of the substrate 3 to form the upper pins 301 and the lower pins 302, respectively.

The upper lead 301 and the lower lead 302 of the substrate 3 constitute a part of the conductive path. The upper lead 301 is used for electrically connecting with the metal layer 1a of the optical sensor chip 1, and the upper lead 301 is electrically connected with the lower lead 302, so that the optical sensor chip 1 is also electrically connected with the lower lead 302.

The lower pin 302 is located outside the protection cavity 2 and forms the other end of the conductive path for connecting with the conductive substrate 300. As described above, the lower lead 302 may have the solder ball 15 formed thereon.

The upper lead 301 is in conductive communication with the metal layer 1a of the optical sensor chip 1 as follows:

in the embodiment illustrated in fig. 1 to 2, the photo sensor chip 1 is adhered to the substrate 3 by the adhesive 103. Further, a pad 101 is formed on the photo chip 1. Specifically, the surface of the metal layer 1a of the photo chip 1 may form a pad 101.

The pad 101 is electrically connected to the upper lead 301 through a lead 6. The lead 6 may be a conductive metal Wire such as a gold Wire or a copper Wire, and may be connected to the pad 101 and the upper lead 301 through a Wire Bonding (WB) process. Thus, the pad 101, the lead 6, the upper lead 301, and the lower lead 302 form a conductive path.

In the embodiment illustrated in fig. 3 to 4, the light sensing chip 1 is embedded with the conductive posts 7 connected to the lower surface thereof. The conductive pillar 7 may be a metal pillar, such as a copper pillar, which may be formed in the light sensing chip 1 by a Through Silicon Via (TSV) technology.

The conductive column 7 is electrically connected with the upper pin 301. Specifically, the conductive post 7 may be fixed to the upper pin 301 by an adhesive bonding welding process. Thus, the conductive post 7, the upper pin 301, and the lower pin 302 form a conductive path.

In fact, in this embodiment, the photo sensor Chip 1 can be electrically connected to the substrate 3 by FC (Flip Chip) process.

Further, the lower end of the conductive pillar 7 may also be formed with a solder ball 701 by a ball-mounting process. And, the solder ball 701 touches the upper pin 301. Thereby, the conductive connection between the conductive column 7 and the upper pin 301 is preferably realized.

In the embodiment illustrated in fig. 5 to 6, the pad 101 is formed on the light sensing chip 1, the conductive pillar 7 is disposed on the outer side of the light sensing chip 1, and the pad 101 can be electrically connected to the conductive pillar 7 through the conductive layer 8. In particular, the conductive layer 8 may be in conductive communication with the pad 101 and the conductive post 7 through physical contact. Wherein, the upper end of the conductive column 7 is connected with the conductive layer 8.

Further, the conductive posts 7 are electrically connected with the upper pins 301 of the substrate 3 by an adhesive bonding welding process. Thus, the pad 101, the conductive layer 8, the conductive pillar 7, the upper pin 301, and the lower pin 302 form a conductive path.

Further, a support layer 9 may be provided between the photo chip 1 and the support wall 4, and the conductive pillars 7 may be provided in the support layer 9. Therefore, by providing the supporting layer 9, a setting position can be provided for the conductive post 7 to fix the conductive post 7, which plays a role of maintaining the stability of the conductive post 7, so that the conductive post 7 can be electrically connected with the conductive layer 8 and the upper pin 301.

The support layer 9 may be made of any suitable existing material. For example, the support layer 9 may be the same material as the substrate 3. The conductive layer 8 may be formed on the surface of or inside the support layer 9 through a redistribution layer (RDL) process.

Of course, the support layer 9 may not be limited to the above material, but may be EMC (Epoxy Molding Compound) so that the side of the photo sensor chip 1 may be coated by a packaging process. Thereby, the side surface of the photo chip 1, especially the side surface of the metal layer 1a, can be protected from oxidation.

Further, the conductive layer 8 may not be limited to the above embodiment. In other possible embodiments, for example, the conductive layer 8 may be implemented as a metal conductive sheet, and the like, and the conductive connection pad 101 and the conductive pillar 7 are all included in the protection scope of the present invention.

Further, the support layer 9 may be spaced apart from the inner wall of the support wall 4. In this way, a space is formed between the support layer 9 and the support wall 4, providing a suitable operating space for performing the adhesion of the support wall 4 to the substrate 3.

In the embodiment illustrated in fig. 7 to 8, the lower surface of the optical sensor chip 1 is provided with the conductive bump 10, and the conductive bump 10 may be fixed to the upper lead 301 of the substrate 3 by adhesive bonding. Thus, the conductive bump 10, the upper lead 301, and the lower lead 302 form a conductive path.

Also, in this embodiment, the light sensing chip 1 may be electrically connected to the substrate 3 by the FC process.

Furthermore, the lower end of the conductive bump 10 may also be formed with a solder ball 1001 through a ball mounting process, and the solder ball 1001 is connected to the upper lead 301 through a soldering process. Thereby, the conductive connection between the conductive bump 10 and the upper lead 301 is preferably realized.

The above is an embodiment in which the substrate 3 is used as a carrier. In other possible embodiments, the carrier body can also be formed by using a material for encapsulating the photo sensor chip 1.

As shown in fig. 9-18, which is an embodiment using a carrier formed by a packaging layer 11. In these embodiments, the photo sensor chip 1 may be combined with the packaging layer 11 through the CSP packaging process as well.

Also, the encapsulation layer 11 may be any one or a combination of EMC, SMF, or underfill, which may be combined with the light-sensing chip 1 through the CSP process.

It should be noted that, in the embodiment of the carrier formed by the encapsulation layer 11, the same or repeated structures as those in the embodiment of the carrier formed by the substrate 3, such as the supporting wall 4, the shielding element 5, the conductive pillar 7, the conductive layer 8, the supporting layer 9, etc., can be referred to the above description, and are not repeated herein.

As can be seen from the above description, at least the metal layer 1a of the photo chip 1 needs to be protected. Therefore, when the metal layer 1a is located above the silicon layer 1b, only the metal layer 1a of the photo chip 1 may be protected by encapsulation.

Based on this, when the metal layer 1a is located below the silicon layer 1b (as in the embodiments illustrated in fig. 11 to 12), the package layer 11 needs to cover the bottom surface and the side surface of the photo chip 1.

When the metal layer 1a is located above the silicon layer 1b (as shown in fig. 9-10 and fig. 13-18), the package layer 11 may only cover the side surface of the light sensing chip 1, or further cover the bottom surface of the light sensing chip 1.

Therefore, the package layer 11 includes at least a peripheral portion 11b surrounding the side surface of the optical sensor chip 1, and further may include a substrate portion 11a covering the bottom surface of the optical sensor chip 1.

The substrate portion 11a is integrally configured with the peripheral portion 11 b. Therefore, the package layer 11 can be a shell with an open top, and the optical sensor chip 1 is embedded or wrapped in the package layer 11.

The peripheral portion 11b surrounds the side surface of the light-sensing chip 1, and the peripheral portion 11b may be in direct contact with the side surface of the light-sensing chip 1. Such as the embodiments of fig. 9-12, and 15-18. At this time, the peripheral portion 11b covers the side surface of the photo chip 1.

Alternatively, the peripheral portion 11b surrounds the side surface of the photo chip 1, and the peripheral portion 11b may surround the outside of the photo chip 1 with a space therebetween, and the support layer 9 for fixing the conductive post 7 may be provided therebetween. As in the embodiment of fig. 13-14. The support layer 9 is bonded to the outer surface of the photo sensor chip 1 and the inner wall of the peripheral portion 1 b. At this time, the side surface of the photo chip 1 is protected by the support layer 9.

Therefore, the protection cavity 2 is formed in a different manner depending on the contact relationship between the peripheral portion 11b and the side surface of the photo chip 1.

For example, as in the embodiments illustrated in fig. 9 to 12, the peripheral portion 11b covers the side surface of the photo chip 1. In this embodiment, the upper end of the peripheral portion 11b is provided with a support wall 4, and the upper end of the support wall 4 supports the shield assembly 5. Thus, the protection chamber 2 is defined by the light sensing chip 1, the support wall 4 and the shield member 5.

In the embodiment illustrated in fig. 13 to 14, unlike the embodiment illustrated in fig. 9 to 12, the peripheral portion 11b is disposed around the outer side of the photo chip 1 with a space therebetween, and the side surface of the photo chip 1 and the inner wall of the peripheral portion 11b are filled with the supporting layer 9. In this embodiment, the protection cavity 2 is defined by the photo chip 1, the support layer 9, the support wall 4 and the protection member 5.

In the embodiments illustrated in fig. 9 to 14, the conductive path may be formed by the conductive pillar 7 or the conductive bump 10 connected to the optical sensor chip 1. The specific mode is as follows:

in the embodiment illustrated in fig. 9 to 10, the conductive pillar 7 is embedded in the photo sensing chip 1, and the lower end thereof extends to the outside of the protection cavity 2 to form the other end of the conductive path for connecting with the conductive substrate 300. Likewise, the lower end of the conductive post 7 may be formed with a solder ball 15.

Furthermore, in embodiments where the encapsulation layer 11 includes a substrate portion 11a, the lower surface of the substrate portion 11a forms the outer surface of the identification component 100. The lower end of the conductive post 7 may extend through the thickness of the substrate portion 11 a.

And the lower end of the conductive post 7 may be flush with the lower surface of the substrate portion 11a, i.e. the other end of the conductive path is exposed and flush with the outer surface of the identification component 100. Alternatively, the lower end of the conductive post 7 may protrude beyond the lower surface of the substrate portion 11a, i.e., the other end of the conductive path extends outside of the outer surface of the identification component 100.

In the embodiment illustrated in fig. 11 to 12, the conductive bump 10 is formed on the lower surface of the optical sensor chip 1, and the lower end thereof extends to the outside of the protection cavity 2 to form the other end of the conductive path for connecting with the conductive substrate 300. Also, the lower end of the conductive bump 10 may be formed with a solder ball 15.

Likewise, in embodiments where the encapsulation layer 11 includes a substrate portion 11a, the lower end of the conductive bump 10 may extend through the thickness of the substrate portion 11 a.

And the lower end of the conductive bump 10 may be flush with the lower surface of the substrate portion 11 a; alternatively, the lower end of the conductive bump 10 may protrude from the lower surface of the substrate portion 11 a.

In the embodiment illustrated in fig. 13 to 14, the light sensing chip 1 is formed with a pad 101, the outer side of the light sensing chip 1 is provided with the conductive pillar 7, and the pad 101 is electrically connected to the conductive pillar 7 through the conductive layer 8. And the lower end of the conductive column 7 extends out of the protection cavity 2. Thus, the pad 101, the conductive layer 8, and the conductive post 7 form a conductive path.

Wherein the lower end of the conductive post 7 forms the other end of the conductive path for connection with the conductive substrate 300.

Likewise, the lower ends of the conductive posts 7 may penetrate the support layer 9. The lower ends of the conductive posts 7 can be flush with the lower surface of the supporting layer 9; alternatively, the lower ends of the conductive posts 7 may protrude from the lower surface of the support layer 9.

It should be noted that, in the embodiments illustrated in fig. 9 to 14, when the package layer 11 only includes the peripheral portion 11b and does not include the substrate portion 11a (i.e., the embodiments illustrated in fig. 9 and 11 to 13), the lower ends of the conductive pillars 7 or the conductive bumps 10 may directly form the other end of the conductive path.

At this time, the lower end of the conductive pillar 7 or the conductive bump 10 may be flush with the lower surface of the light sensing chip 1 (specifically, the lower surface of the silicon layer 1 b), or may protrude or exceed the lower surface of the light sensing chip 1.

In another case where the carrier is formed by a package layer 11 configuration, as shown in fig. 15 to 18, the upper end of the peripheral portion 11b supports the wiring board 12, and the wiring board 12 may be provided with an opening through which the target signal light passes so that the target signal light may reach the photo-sensing chip 1 through the opening.

The shield assembly 5 may be embedded in the opening (as in the embodiment illustrated in fig. 15-16). And, the outer wall of protection component 5 and the inner wall of opening are sealed laminating. In particular, a sealant can be arranged between the two.

Alternatively, the shield assembly 5 may be disposed on the wiring board 12 and cover the opening (as in the embodiment illustrated in fig. 17-18). Also, the shield member 5 may be fixed to the circuit board 12 by an adhesive 14 and seal the edge of the opening.

In this embodiment, the protection component 5 may be disposed on the upper surface of the circuit board 12, or may be disposed on the lower surface of the circuit board 12, which is not limited in this embodiment of the present invention.

Thus, a protection cavity 2 is defined among the light sensing chip 1, the circuit board 12 and the protection component 5.

In the embodiments illustrated in fig. 15 to 18, the conductive path may be formed by the conductive pillar 7 connected to the optical sensor chip 1 through the peripheral portion 11b of the package layer 11. The specific mode is as follows:

specifically, a pad 101 is formed on the photo sensor chip 1, the conductive post 7 is embedded in the peripheral portion 11b, the circuit board 12 is provided with a conductive layer 8 electrically connected to the conductive post 7, and the conductive layer 8 is electrically connected to the pad 101 through the conductive bump 16. Thus, the pad 101, the conductive bump 16, the conductive layer 8, and the conductive pillar 7 form a conductive path.

In this embodiment, the conductive bumps 16 may be formed on the lower surface of the circuit board 12 by electroplating, and solder balls may be formed on the lower end thereof. So that the conductive bumps 16 can be fixed to the lower surface of the wiring board 12 by soldering.

Of course, the conductive bumps 16 are also formed on the upper surface of the photo chip 1.

Alternatively, the conductive bump 16 may be any conductor, and the upper and lower ends of the conductor respectively contact the conductive layer 8 and the pad 101 of the photo chip 1.

The lower end of the conductive post 7 extends out of the protection cavity 2 to form the other end of the conductive path for connecting with the conductive substrate 300. Likewise, the lower end of the conductive post 7 passes through the peripheral portion 11b and extends outside the protection chamber 2.

The conductive post 7 penetrates the peripheral portion 11b, and the lower end thereof may be flush with the lower surface of the peripheral portion 11b or may protrude from the lower surface of the peripheral portion 11 b.

In all the embodiments related to or including the bonding pad 101 as illustrated in fig. 1 to 2, 5 to 6, and 13 to 18, the bonding pad 101 is only required to be in conductive communication with the metal layer 1a of the photo chip 1. Thus, the pad 101 may not be limited to be formed on the upper surface of the photo chip 1 illustrated in the above-described drawings.

In all the embodiments relating to or including the conductive pillars 7 as illustrated in fig. 3 to 6, 9 to 10, 13 to 18, and the like, the conductive pillars 7 may be formed in the photo-sensing chip 1, the peripheral portion 11b, or the supporting layer 9 by a TSV process. The conductive posts 7 penetrate through the thickness of the photo chip 1, the peripheral portion 11b, or the support layer 9. Thus, the upper end of the conductive post 7 can be connected to the layer above the photo sensor chip 1.

In these embodiments, the lower end of the conductive pillar 7 may directly form the outer end of the conductive via (as in the embodiments illustrated in fig. 9 to 10 and 13 to 18), or be connected to the upper pin 301 (as in the embodiments illustrated in fig. 3 to 6). Therefore, the upper end of the conductive pillar 7 is connected to the metal layer 1a of the photo chip 1.

Thus, in these embodiments, the metal layer 1a is located above the silicon layer 1b, i.e., the metal layer 1a is located above.

Accordingly, in all embodiments related to or including the conductive bump 10 as illustrated in fig. 7 to 8, 11 to 12, etc., the conductive bump 10 may be formed on the lower surface of the photo chip 1 by a plating process. As described above, the conductive bump 10 is connected to the metal layer 1a of the photo sensor chip 1.

Thus, in these embodiments, the metal layer 1a is located below the silicon layer 1b, i.e., the metal layer 1a is located below.

This is the situation that the carrier keeps being combined with the optical sensor chip 1 after the optical sensor chip is packaged. In this case, the specific manufacturing process or flow of the identification component 100 generally includes first implementing the packaging of the light-sensing chip 1 and the carrier by the CSP process, and then attaching or assembling other corresponding components.

In the recognition module 100 as illustrated in fig. 1 to 8, the substrate 3 is used as a carrier. Taking the identification assembly 100 as illustrated in fig. 1 to 2 as an example, the preparation process is substantially as follows:

1. obtaining single light sensing chips 1 by cutting the wafer;

2. adhering the obtained light sensing chip 1 monomer on the upper surface of the substrate 3 through the adhesive 103;

3. a WB process is executed to realize the conductive connection between the photosensitive chip 1 and the substrate 3;

4. the supporting wall 4 is pasted on the substrate 3 through the adhesive 304;

5. the shielding member 5 is attached to the upper end of the supporting wall 4.

The manufacturing process of the identification device 100 illustrated in fig. 3 to 4 and fig. 7 to 8 is different from the above process in that the photo sensor chip 1 and the substrate 3 are electrically connected by FC process. The other flows are substantially the same.

The manufacturing process of the identification device 100 illustrated in fig. 5 to 6 is different from the above process in that the light-sensing chip 1 and the substrate 3 are electrically connected through the conductive pillar 7 and the conductive layer 8. Wherein, the conductive pillars 7 are embedded in the supporting layer 9, the supporting layer 9 and the substrate 3 may be made of the same material, so that the conductive layer 8 may be formed or implanted in the supporting layer 9 by an RDL process. The supporting layer 9 and the substrate 3 can be adhered and fixed.

In the identification module 100 as illustrated in fig. 9 to 18, the encapsulation layer 11 is used as a carrier. Taking the identification assembly 100 as illustrated in fig. 9 to 10 as an example, the preparation process is substantially as follows:

1. obtaining single light sensing chips 1 by cutting a wafer, wherein the light sensing chips 1 are embedded with conductive columns 7;

2. packaging the obtained single light sensing chip 1 to form a packaging layer 11 for coating the lower surface and/or the side surface of the single light sensing chip, and exposing the lower end of the conductive column 7;

3. the supporting wall 4 is pasted on the substrate 3 through the adhesive 304;

4. the shielding member 5 is attached to the upper end of the supporting wall 4.

The difference between the manufacturing process of the identification device 100 illustrated in fig. 11 to 12 and the above-mentioned process is that the conductive bumps 10 are formed on the lower surface of the photo chip 1. The other flows are substantially the same.

The identification device 100 illustrated in fig. 13 to 14 is manufactured in a process different from the above process in that the conductive posts 7 are not embedded in the photo chip 1, but embedded in the supporting layer 9, and are electrically connected to the photo chip 1 through the conductive layer 8. The other flows are substantially the same.

The identification module 100 illustrated in fig. 15 to 18 is different from the identification module 100 illustrated in fig. 13 to 14 in that the upper end of the support layer 9 supports the circuit board 12 provided with an opening, and the protective module 5 is provided in the opening or on the circuit board 12. The other flows are substantially the same.

As shown in fig. 19 to 24, the carrier is removed after the package of the photo sensor chip 1 is completed.

Similarly, the same or repeated structures, such as the protection component 5, the conductive pillar 7, the conductive layer 8, the supporting layer 9, the circuit board 12, the conductive bump 16, etc., that occur in the case that the carrier is removed after the package of the optical sensor chip 1 is completed and the carrier continues to be combined with the optical sensor chip 1 in a protection manner can be referred to the above description, and are not repeated herein.

Since in this case the carrier is removed after the final encapsulation of the photo die 1 is completed. Therefore, the carrier in this case may not be limited to be composed of the substrate 3 or the encapsulation layer 11 in the above case.

In fact, the carrier in this case may be any object capable of providing a supporting or setting surface for the optical sensor chip 1, or may be flexible or hard.

For example, in one possible embodiment, glass, plastic film or release film may be used as the carrier.

As described above, at least the metal layer 1a of the photo chip 1 needs to be protected in order to not affect the yield and normal operation of the photo chip 1.

However, the carrier needs to be supported during the packaging process of the optical sensor chip 1. Therefore, the carrier is generally disposed on the lower surface of the optical sensor chip 1. Thus, after the package carrier is completely removed, the lower surface of the photo sensor chip 1 is exposed.

Thus, in this case, it is necessary to dispose the metal layer 1a included in the photo chip 1 above the silicon layer 1 b. Thus, after the carrier is removed, the lower surface of the silicon layer 1b is exposed without affecting the protection of the metal layer 1 a.

Furthermore, in order to achieve conductive communication between the light-sensing chip 1 and the conductive substrate 300, the identification component 100 in this case also needs to be provided with a conductive path. Since the metal layer 1a is provided on the upper layer, in this case, a member for constituting a conductive path and making conductive connection with the metal layer 1a of the photo chip 1 cannot be generally located below.

That is, in this case, the member for constituting the conductive path and making the conductive connection with the metal layer 1a of the photo chip 1 cannot be selected similarly to the conductive bump 10 illustrated in fig. 11 to 12. Thus, it is necessary to form the conductive path by using the pad 101 to match the conductive post 7.

Since the metal layer 1a is thin, the bonding pad 101 and the wires or traces are generally formed on the upper surface of the photo sensor chip 1. Therefore, at least the upper surface of the metal layer 1a needs to be protected so as not to affect the yield and normal operation of the photo sensor chip 1. In a specific embodiment, only the upper surface of the metal layer 1a may be protected, or both the upper surface and the side surface of the metal layer 1a may be protected. For example, the side of the metal layer 1a may be coated with a protective coating.

In addition, since the carrier is removed, the bottom surface or the side surface of the photo chip 1 loses a structure capable of supporting it. Therefore, in this case, the photo sensor chip 1 can be fixed by being suspended.

Specifically, as shown in fig. 19 to fig. 22, the light sensor chip 1 is provided with a supporting layer 9 spaced from the light sensor chip 1, the upper end of the supporting layer 9 supports the circuit board 12, and the light sensor chip 1 can be fixed below the circuit board 12 by the conductive bumps 16.

Specifically, the upper end of the conductive bump 16 is fixedly connected to the lower surface of the circuit board 12, and the lower end thereof can be fixed to the light sensing chip 1 by soldering. Thus, the photo chip 1 is suspended on the lower surface of the wiring board 12.

The conductive bumps 16 are arranged uniformly and at intervals along the circumferential direction, so that the photosensitive chip 1 is uniformly fixed.

Further, the wiring board 12 is provided with an opening, and the shield member 5 may be provided in the opening or may be provided on the wiring board 12 and cover the opening. Therefore, a protection cavity 2 is defined among the light sensing chip 1, the circuit board 12, the protective component 5 and the conductive bumps 16.

Thus, the protection chamber 2 may be a non-sealed chamber.

Of course, the protection chamber 2 may be a closed chamber. Specifically, a sealing layer 17 may be provided between the upper surface of the photo chip 1 and the lower surface of the wiring board 12, the sealing layer 17 being stopped at the outer sides of the plurality of conductive bumps 16. The sealing layer 17 thus seals the protection chamber 2 to form a closed chamber.

The sealing layer 17 may also be any one or a combination of EMC, SMF or underfil glue, which may be enclosed on the outside of the plurality of conductive bumps 16 by a packaging process.

The sealing layer 17 may contact and be adhered to the upper surface of the light sensing chip 1 and the lower surface of the circuit board 12, thereby improving the fixing strength of the light sensing chip 1.

The upper surface of the light sensing chip 1, that is, the upper surface of the metal layer 1a, forms a pad 101, the circuit board 12 is provided with a conductive layer 8, and the pad 101 and the conductive layer 8 are electrically connected through a conductive bump 16. Specifically, the two ends of the conductive bump 16 are electrically connected to the pad 101 and the conductive layer 8 by physical contact. And, the supporting layer 9 is embedded with a conductive column 7, the conductive column 7 is electrically connected with the conductive layer 8, specifically, the upper end of the conductive column 7 touches the conductive layer 8 to realize electrical connection. The lower end of the conductive column 7 is positioned outside the protection cavity 2.

Thus, the pad 101, the conductive bump 16, the conductive layer 8, and the conductive pillar 7 form a conductive path.

The lower ends of the conductive posts 7 may penetrate the support layer 9. The lower ends of the conductive posts 7 can be flush with the lower surface of the supporting layer 9; alternatively, the lower ends of the conductive posts 7 may protrude from the lower surface of the support layer 9.

Similarly, the conductive layer 8 may be formed by an RDL process or implanted in the built-in wiring board 12, so that the conductive layer 8 constitutes a part of the structure of the wiring board 12 itself. Specifically, the circuit board 12 may be a PCB, and the conductive layer 8 may be formed on the lower surface of the circuit board 12 by an RDL process, so as to realize the conductive connection with the pad 101 through the conductive bump 16. Further, by forming the conductive layer 8 as a part of the structure of the wiring board 12 itself, integration of the circuit structure can be realized, which contributes to reduction in size.

The above is an embodiment in which the photo sensor chip 1 is fixed to the lower surface of the wiring board 12 by the conductive bumps 16. Of course, the fixing method of the photo die 1 without the carrier is not limited to this. In other possible embodiments, the light sensing chip 1 may also be fixed by directly bonding the upper surface of the light sensing chip 1 to the lower surface of the circuit board 12.

Specifically, as shown in fig. 23 to 24, in the embodiment, a supporting layer 9 is disposed at an interval outside the light sensing chip 1, a circuit board 12 is supported by an upper end of the supporting layer 9, and an upper surface of the light sensing chip 1 is attached and fixed to a lower surface of the circuit board 12.

Similarly, an opening is provided on the circuit board 12, and the protective component 5 may be disposed in the opening or disposed on the circuit board 12 and covers the opening.

However, it should be noted that the upper surface of the optical sensor chip 1 is attached to the lower surface of the circuit board 12. Therefore, in order to form the protection chamber 2, the lower surface of the protection member 5 is higher than the lower surface of the wiring board 12.

Specifically, when the shield member 5 is embedded in the opening, the thickness of the shield member 5 may be smaller than the thickness of the wiring board 12. And, the upper surface of the shield member 5 is disposed flush with the upper surface of the wiring board 12. Thus, the lower surface of the shield member 5 will be higher than the lower surface of the wiring board 12.

Or, the thickness of the protection component 5 may be equal to or even greater than the thickness of the circuit board 12, and the protection component 5 is embedded in the opening, so that the upper surface of the protection component 5 is higher than the upper surface of the circuit board 12, and the lower surface of the protection component 5 is also higher than the lower surface of the circuit board 12.

Or, the cross-sectional area of the protection component 5 is larger than the cross-sectional area of the opening, the protection component 5 is disposed on the upper surface of the circuit board 12, and the edge of the protection component 5 overlaps the edge of the opening. It is also possible to make the lower surface of the shield member 5 higher than the lower surface of the wiring board 12.

Therefore, a protection cavity 2 is defined among the light sensing chip 1, the circuit board 12 and the protection component 5.

Similarly, the protection chamber 2 may be a non-sealed chamber or a non-sealed chamber. The specific implementation manner can refer to the above description, and is not repeated herein.

The upper surface of the light sensing chip 1, that is, the upper surface of the metal layer 1a, is provided with a pad 101, the lower surface of the circuit board 12 is provided with a conductive layer 8, and the pad 101 is in contact with the conductive layer 8 in a fitting manner, so that conductive communication is realized. And the support layer 9 is embedded with a conductive column 7, the conductive column 7 is electrically connected with the conductive layer 8, and the lower end of the conductive column 7 is positioned outside the protection cavity 2.

Thus, the pad 101, the conductive layer 8, and the conductive post 7 form a conductive path.

Similarly, the lower end of the conductive post 7 forms the other end of the conductive path for connection to the conductive substrate 300.

This is the case when the carrier is removed after the package of the photo sensor chip 1 is completed. Similarly, in this case, the specific manufacturing process or flow of the identification component 100 generally includes first packaging the light-sensing chip 1 and the carrier by the CSP process, then attaching or assembling other corresponding components, and then removing the carrier.

The identification device 100 as illustrated in fig. 19 to 24 is manufactured in a process different from the process of manufacturing the identification device 100 as illustrated in fig. 15 to 18 in that the peripheral portion 11b of the encapsulation layer 11 covers the side surface of the light-sensing chip 1, i.e., the peripheral portion 11b of the encapsulation layer 11 is in contact with the side surface of the light-sensing chip 1. And the supporting layer 9 surrounds the outside of the photo chip 1, i.e., the supporting layer 9 does not contact with the side of the photo chip 1. After the attachment of the shield assembly 5 is completed, the carrier is removed. The other flows are substantially the same.

As shown in fig. 25 and 26, and fig. 25A to 25G, and 26A to 26G, the identification module 1000 may further include a conductive substrate 300. The identification component 100 is disposed on the conductive substrate 300, and the other end of the conductive path of the identification component 100 may be conductively connected to the conductive substrate 300 through a reflow process.

In the embodiment, the conductive substrate 300 may be a rigid substrate (e.g., a PCB) or a Flexible Printed Circuit (FPC).

When the conductive substrate 300 is a hard substrate, it can be connected to a peripheral circuit or an electronic component by soldering or wire bonding, so as to achieve the conductive connection between the light sensing chip 1 in the identification component 100 and an external circuit.

When the conductive substrate 300 is a flexible circuit board, it may be disposed on the hard steel plate 400, and supported by the steel plate 400 and the identification assembly 100. Moreover, the flexible circuit board is connected with other peripheral circuits or electronic components in a plug-in manner through a connector or a connecting plug, so that the light sensing chip 1 in the identification assembly 100 is electrically connected with an external circuit.

In the present embodiment, the identification module 1000 is generally formed by completing the preparation of the identification module 100 (mainly the packaging of the optical sensor chip 1 and the formation of the protection cavity 2) in a packaging factory, and then performing the reflow soldering of the identification module 100 in the module factory to achieve the conductive connection with the conductive substrate 300, thereby completing the assembly of the identification module 1000.

From this, the assembly work of whole discernment module 1000 only needs to carry out the not high reflow soldering technology of cleanliness factor requirement to operating environment or atmosphere at the module factory that efficiency is lower. Thereby greatly improving the production and assembly efficiency of the identification module 1000.

Further, the conductive substrate 300 can be connected to a peripheral circuit or an electronic component in the manner provided above, so as to realize the conductive connection between the light sensing chip 1 in the identification component 100 and an external circuit.

As shown in fig. 27A and 27B, since the display 200 emits light not only to the finger of the user but also directly to the light sensing chip 1, the light directly emitted to the light sensing chip 1 is non-reflected noise light ④ since it does not carry the fingerprint information of the user, which may reduce the imaging quality of the light sensing chip 1.

Therefore, it is necessary to attenuate as much as possible the non-reflected noise light ④ emitted directly from the display panel 200 toward the photo chip 1 without attenuating or attenuating to a small extent the target signal light ② reflected by the user's finger, in order to further improve the imaging quality.

In order to achieve the above object, a first film unit 800 is disposed between the display panel 200 and the photo sensor chip 1. The first film unit 800 may include a first 1/4 wave plate 800a and a first linear polarizer 800 b. Also, the first 1/4 wave plate 800a is located between the first linear polarizer 800b and the display panel 200, i.e., the first 1/4 wave plate 800a is located above the first linear polarizer 800 b.

The first 1/4 wave plate 800a and the first linear polarizer 800b may be made of organic materials or inorganic materials as long as they can perform the phase retardation function and the polarization function, respectively.

The first 1/4 wave plate 800a and the first linear polarizer 800b may be stacked on each other, that is, the lower surface of the first 1/4 wave plate 800a contacts and adheres to the upper surface of the first linear polarizer 800 b. Of course, the first 1/4 wave plate 800a and the first linear polarizer 800b may be disposed at intervals, that is, the lower surface of the first 1/4 wave plate 800a is isolated from the upper surface of the first linear polarizer 800 b.

The first film unit 800 may be supported by the display screen 200. For example, at least a first 1/4 wave plate 800a may be implanted in display screen 200. Specifically, only the first 1/4 wave plate 800a may be implanted in the display 200, and the first linear polarizer 800b may be located outside the display 200. Alternatively, both the first 1/4 wave plate 800a and the first linear polarizer 800b are implanted in the display 200.

By implanting at least the first 1/4 wave plate 800a within the display screen 200, the structure can be integrated.

Alternatively, the first film unit 800 may be disposed on the lower surface of the display panel 200 in a bonded manner. That is, the upper surface of the first 1/4 wave plate 800a included in the first membrane unit 800 is attached to the lower surface of the display panel 200. Thereby, the first film unit 800 is fixed to the lower surface of the display screen 200.

Of course, the first membrane unit 800 may also be supported on the support 500 (i.e., the middle frame described above) of the electronic device. Specifically, as shown in fig. 25 and 26, and fig. 25A to 25G, and 26A to 26G, the bracket 500 may define a receiving space 501 with a member (which may be the conductive substrate 300 shown in fig. 25 and 25A to 25G, or may be the identification assembly 100 shown in fig. 26 and 26A to 26G) supporting the bracket 500. The upper end of the bracket 500 is provided with an opening corresponding to the identification module 100. That is, at least the upper end of the accommodating space 501 is open, and the circumferential direction thereof may be closed, or may be non-closed or open.

For example, the bracket 500 may be a cylindrical body having an opening at an upper end, and the wall of the cylindrical body is not provided with any through structure, such as a through hole, an opening, etc., for communicating the internal space and the external space. Thus, the accommodating space 501 is circumferentially closed.

Alternatively, the holder 500 may be a cylindrical body having a wall provided with a through structure, such as a through hole or an opening, for communicating the internal space and the external space. Alternatively, the holder 500 has a housing structure that is not closed in the circumferential direction, and may have an arc-shaped or C-shaped cross section in a plan view, for example. Still alternatively, the bracket 500 may be a plurality of columns which are arranged at intervals in the circumferential direction, thereby forming a structure similar to a fence. Thus, the accommodating space 501 is not closed or opened.

As shown in fig. 25, and fig. 25A to 25G, in one possible case, the bracket 500 may be provided on the conductive substrate 300. Specifically, the lower end of the support 500 may be fixed on the upper surface of the conductive substrate 300 by an adhesive.

As described above, the bracket 500 and the conductive substrate 300 define the accommodating space 501. Since the identification component 100 is disposed on the conductive substrate 300, at this time, the identification component 100 is received in the receiving space 501.

As shown in fig. 25A to 25G, the assembly of the different identification assemblies 100 and the conductive substrate 300 is schematically illustrated in the case that the bracket 500 is disposed on the conductive substrate 300. Wherein:

in the embodiment illustrated in fig. 25A, the identification component 100 corresponds to the embodiment illustrated in fig. 1 or fig. 2;

in the embodiment illustrated in fig. 25B, the identification component 100 corresponds to the embodiment illustrated in fig. 5 or fig. 6;

in the embodiment illustrated in fig. 25C, the identification component 100 corresponds to the embodiment illustrated in fig. 9 or 10;

in the embodiment illustrated in fig. 25D, the identification component 100 corresponds to the embodiment illustrated in fig. 13 or 14;

in the embodiment illustrated in fig. 25E, the identification component 100 corresponds to the embodiment illustrated in fig. 17 or fig. 18;

in the embodiment illustrated in fig. 25F, the identification component 100 corresponds to the embodiment illustrated in fig. 19 or 20;

in the embodiment illustrated in fig. 25G, the identification component 100 corresponds to the embodiment illustrated in fig. 23 or 24.

It should be noted that the identification module 100 included in the identification module 1000 shown in fig. 25A to 25G is only a partial embodiment. In other embodiments, for example, the identification assembly 100 in the embodiments illustrated in fig. 3 or fig. 4, fig. 7 or fig. 8, fig. 11 or fig. 12, fig. 15 or fig. 16, fig. 21 or fig. 22 may be assembled with the conductive substrate 300 in the manner illustrated in fig. 25A to fig. 25G, which is not described herein again.

As shown in fig. 26, and fig. 26A to 26G, in another possible case, a bracket 500 may also be provided on the identification assembly 100. Also, the lower end of the bracket 500 may be fixed to the upper surface of the identification assembly 100 by adhesive.

As described above, the bracket 500 and the identification module 100 define a receiving space 501.

As shown in fig. 25A to 25G, in the case where the bracket 500 is disposed on the identification component 100, the assembly of the different identification components 100 and the bracket 500 is schematically illustrated. Wherein:

in the embodiment illustrated in fig. 26A, the identification component 100 corresponds to the embodiment illustrated in fig. 1 or fig. 2;

in the embodiment illustrated in fig. 26B, the identification component 100 corresponds to the embodiment illustrated in fig. 5 or 6;

in the embodiment illustrated in fig. 26C, the identification component 100 corresponds to the embodiment illustrated in fig. 9 or 10;

in the embodiment illustrated in fig. 26D, the identification component 100 corresponds to the embodiment illustrated in fig. 13 or 14;

in the embodiment illustrated in fig. 26E, the identification component 100 corresponds to the embodiment illustrated in fig. 17 or fig. 18;

in the embodiment illustrated in fig. 26F, the identification component 100 corresponds to the embodiment illustrated in fig. 19-22;

in the embodiment illustrated in fig. 26G, the identification component 100 corresponds to the embodiment illustrated in fig. 23 or 24.

It should be noted that the identification module 100 included in the identification module 1000 shown in fig. 26A to 26G is only a partial embodiment. In other embodiments, for example, the identification assembly 100 of the embodiment illustrated in fig. 3 or fig. 4, fig. 7 or fig. 8, fig. 11 or fig. 12, fig. 15 or fig. 16 may be assembled with the bracket 500 in the manner illustrated in fig. 26A to fig. 26G, which is not repeated herein.

As can be seen from the above description of the identification component 100, the structure of the upper surface of the identification component 100 is different in different embodiments. Therefore, in different embodiments of the identification device 100, when the bracket 500 is disposed on the identification device 100, the structure of the identification device 100 on which the lower end of the bracket 500 is disposed may be different. The method comprises the following specific steps:

when the identification assembly 100 is any one of the embodiments as illustrated in fig. 1 to 8, the bracket 500 is provided on the shield assembly 5 of the identification assembly 100. In these embodiments, the photo chip 1 is disposed on the substrate 3, the substrate 3 is disposed with the supporting wall 4 outside the photo chip 1, and the upper end of the supporting wall 4 supports the protection component 5. The base plate 3, the support walls and the shield assembly 5 define a protective cavity 2 therebetween.

Correspondingly, when the bracket 500 is disposed on the identification module 100 according to any one of the embodiments illustrated in fig. 1 to 8, the assembled identification module 1000 is the embodiment illustrated in fig. 26A and 26B.

When the identification device 100 is any one of the embodiments illustrated in fig. 9 to 16, the bracket 500 may also be disposed on the shielding device 5 of the identification device 100. In these embodiments, the identification component 100 further includes an encapsulation layer 11, and the encapsulation layer 11 includes at least a peripheral portion 11b surrounding the side of the light-sensing chip 1. The peripheral portion 11b is provided with a support wall 4, and the upper end of the support wall 4 supports the shield assembly 5. The light sensing chip 1, the supporting wall 4 and the protection component 5 define a protection cavity 2 therebetween.

Correspondingly, when the bracket 500 is disposed on the identification module 100 according to any one of the embodiments illustrated in fig. 9 to 16, the assembled identification module 1000 is the embodiment illustrated in fig. 26C and 26D.

When the identification module 100 is any one of the embodiments illustrated in fig. 17 to 18, the bracket 500 is provided on the wiring board 12 of the identification module 100. In these embodiments, the identification component 100 further includes an encapsulation layer 11, and the encapsulation layer 11 includes at least a peripheral portion 11b surrounding the side of the light-sensing chip 1. The upper end of the peripheral portion 11b supports a circuit board 12, and the circuit board 12 is provided with an opening. The shield assembly 5 is disposed in the opening; alternatively, the shield member 5 is provided on the wiring board 12 and covers the opening. A protection cavity 2 is defined among the light sensing chip 1, the circuit board 12 and the protection component 5

Correspondingly, when the bracket 500 is disposed on the identification module 100 according to any one of the embodiments illustrated in fig. 17 to 18, the assembled identification module 1000 is the embodiment illustrated in fig. 26E.

When the identification module 100 is any one of the embodiments illustrated in fig. 19 to 22, the bracket 500 may also be disposed on the circuit board 12 of the identification module 100. In these embodiments, the light sensor chip 1 is provided with a support layer 9 spaced from the light sensor chip 1, the circuit board 12 is supported by the upper end of the support layer 9, and the light sensor chip 12 is fixed below the circuit board 12 by the conductive bumps 16. The circuit board 12 is provided with an opening in which the protective assembly 5 is disposed; alternatively, the shield member 5 is provided on the wiring board 12 and covers the opening. A protection cavity 2 is defined among the light sensing chip 1, the circuit board 12, the protection component 5 and the conductive bumps 16.

Correspondingly, when the bracket 500 is disposed on the identification module 100 according to any one of the embodiments illustrated in fig. 19 to 22, the assembled identification module 1000 is the embodiment illustrated in fig. 26F.

When the identification module 100 is any one of the embodiments illustrated in fig. 23 to 24, the bracket 500 may also be disposed on the circuit board 12 of the identification module 100. In these embodiments, the supporting layer 9 is disposed at an interval outside the photo chip 1, the circuit board 12 is supported by the upper end of the supporting layer 9, and the upper surface of the photo chip 1 is attached to the lower surface of the circuit board 12. The circuit board 12 is provided with an opening in which the protective assembly 5 is disposed; alternatively, the shield member 5 is provided on the wiring board 12 and covers the opening. And the lower surface of the protection component 5 is higher than the lower surface of the circuit board 12. A protection cavity 2 is defined among the light sensing chip 1, the circuit board 12 and the protection component 5.

Correspondingly, when the bracket 500 is disposed on the identification module 100 according to any one of the embodiments illustrated in fig. 23 to 24, the assembled identification module 1000 is the embodiment illustrated in fig. 26G.

In addition, in order to make the projection of the first film unit 800 at least partially cover the light sensing chip 1, so as to attenuate the brightness of the non-reflected noise light ④ (light emitted from the display 200 of the electronic device directly towards the light sensing chip 1, which does not carry fingerprint information because it is not reflected by a finger, and makes the light sensing chip 1 reach light saturation in advance, and reduces the amount of signal light reflected by the finger received by the light sensing chip 1, thereby reducing the signal-to-noise ratio of the light received by the light sensing chip 1 and deteriorating the imaging quality) directed to the light sensing chip 1 as much as possible, a light gathering structure may be adopted to gather and image wide-angle light before the light reaches the light sensing chip 1.

Specifically, as shown in fig. 25 and 26, and fig. 25A to 25G, 26A to 26G, 27A and 27B, the light-gathering structure is composed of one or more optical lenses 700, the one or more optical lenses 700 are located between the light-sensing chip 1 and the display screen 200, and the one or more optical lenses 700 are located upstream of the recognition component 100 along the propagation path of the target signal light ②, so that the target signal light ② can reach the light-sensing chip 1 of the recognition component 100 through the plurality of optical lenses 700. thus, the target signal light ② reaching the light-sensing chip 1 is the light processed by the one or more optical lenses 700.

The optical lens 700 may include convex, micro and concave lenses, and the convex, micro and concave lenses may be aspheric convex, micro and concave lenses. I.e. the optical lens 700 is an unconventional lens.

Thereby, optical lens piece 700 not only can assemble light to can realize assembling comparatively dispersed signal light in the wide angle within range to light sense chip 1 on, can also correct optical distortion, carry out optical imaging, thereby can make things convenient for light sense chip 1 to the collection of fingerprint figure, promote the imaging quality.

One or more optical lenses 700 may also be disposed on the lower surface of the display screen 200, and the display screen 200 provides a location and support for the one or more optical lenses 700. Of course, one or more optical lenses 700 may also be fixed on the bracket 500, and the bracket 500 provides a setting position and support for the one or more optical lenses 700.

Similarly, in order not to affect the imaging quality of the optical sensor chip 1, when the one or more optical lenses 700 are spaced apart from the optical sensor chip 1, the distance between the optical lens 700 located at the bottom of the one or more optical lenses 700 and the optical sensor chip 1 is equal to or close to the focal length of the optical lens 700. For a detailed principle, please refer to the description of the microlens 13 above, and the embodiments of the present invention are not described herein again.

To facilitate focusing, one or more optical lenses 700 are configured to be movable relative to the optical sensor chip 1.

To achieve the above purpose, one or more optical lenses 700 are fixedly disposed in the lens barrel 600, and the lens barrel 600 is connected to the bracket 500 by means of a threaded connection. Specifically, the outer wall of the lens barrel 600 may be provided with an external thread, and the inner wall of the opening of the holder 500 may be provided with an internal thread. The lens barrel 600 is threadedly disposed in an opening of the holder 500. Thus, the lens barrel 600 can rotate to configure different screwing lengths with the bracket 500, so as to drive the one or more optical lenses 700 to move towards or away from the identification component 100, thereby realizing adjustment of the distance between the one or more optical lenses 700, especially the lowermost optical lens 700, and the light sensing chip 1.

Similarly, as long as one or more optical lenses 700 are located between the light-sensing chip 1 and the display panel 200, the relative position relationship and contact relationship between the one or more optical lenses 700 and the first film unit 800 and the light-sensing chip 1 are not limited.

For example, the first membrane unit 800 may be located above all the optical lenses 700. Alternatively, the first membrane unit 800 may be located under all the optical lenses 700. Alternatively, the first film unit 800 is located between any two adjacent optical lenses 700. Alternatively, one or more optical lenses 700 may be spaced between the first linear polarizer 800b and the first 1/4 wave plate 800 a.

Thereby, by providing a plurality of optical lenses 700 having a light condensing function and an image forming function, even if the first film unit 800 of a smaller size is arranged, it is possible to achieve at least partial coverage of the light-sensing chip 1 by the projection of the first film unit 800. That is, by configuring one or more optical lenses 700 having a condensing function for wide-angle light, the size of the first film unit 800 can be reduced, thereby facilitating the integration of the structure.

Bearing the above description, the first membrane unit 800 may be disposed on the bracket 500 in such a manner that the first membrane unit 800 is directly disposed on the bracket 500; alternatively, the first diaphragm unit 800 is at least partially disposed in the lens barrel 600, and is indirectly disposed on the stand 500 through the lens barrel 600.

The first diaphragm unit 800 may be at least partially disposed in the lens barrel 600 such that the first diaphragm unit 800 is entirely disposed in the lens barrel 600.

Alternatively, only the first linear polarizer 800b included in the first film unit 800 is disposed in the lens barrel 600, and the first 1/4 wave plate 800a is located outside the lens barrel 600. The first 1/4 wave plate 800a is located outside the barrel 600. the first 1/4 wave plate 800a is supported on the upper end of the support 500.

Alternatively, only the first 1/4 wave plate 800a included in the first film unit 800 is disposed in the lens barrel 600, and the first linear polarizer 800b is disposed outside the lens barrel 600. The first linear polarizer 800b may be located outside the lens barrel 600, and the first linear polarizer 800b is disposed in the opening of the bracket 500.

The first membrane unit 800 is directly disposed on the bracket 500. the first membrane unit 800 is at least partially embedded in the bracket 500. Specifically, the entire first membrane unit 800 may be accommodated in an opening of the holder 500.

Alternatively, only the first linear polarizer 800b included in the first film unit 800 is received in the opening, and the first 1/4 wave plate 800a is located outside the opening (not shown). The first 1/4 wave plate 800a is located outside the opening, and the first 1/4 wave plate 800a is supported on the upper end of the bracket 500.

Alternatively, the first membrane unit 800 may be entirely located outside the opening. At this time, the first diaphragm unit 800 is supported on the upper end of the support 500.

As shown in fig. 27A and 27B, the electronic device according to the embodiment of the present invention may further include a second film unit 900 located on a side of the display screen 200 facing away from the first film unit 800, that is, the second film unit 900 is disposed above the display screen 200. The second film unit 900 may include a second 1/4 wave plate 900a and a second linear polarizer 900 b. Also, the second 1/4 wave plate 900a is located between the second linear polarizer 900b and the display panel 200, i.e., the second linear polarizer 900b is located above the second 1/4 wave plate 900 a.

Similarly, with respect to the second 1/4 wave plate 900a and the second linear polarizer 900b included in the second film unit 900, and the positional relationship between the second film unit 900 and the display panel 200, reference may be made to the above description of the first film unit 800, and the embodiments of the present invention are not repeated herein.

The second film unit 900 may be disposed on the upper surface of the display screen 200 in a fitting manner. That is, the lower surface of the second 1/4 wave plate 900a included in the second diaphragm unit 900 is attached to the upper surface of the display panel 200.

Further, a surface (i.e., an upper surface) of the second film unit 900 facing away from the display screen 200 is provided with a cover 1100, and the cover 1100 has a light-transmitting area on which an operation area for pressing a finger is formed.

In this embodiment, the light-transmitting region may occupy the entire upper surface of the cover plate 1100. In this case, the entire cover 1100 may be made of a light-transmitting material, and there is no light-opaque region on the upper surface thereof.

Alternatively, the light-transmitting region may occupy only a part of the upper surface of the cover 1100. For example, the cover plate 1100 may include a central display region made of a light transmissive material and a bezel region made of an opaque material. Wherein, the central display area can constitute the transparent area.

And, a part or the whole of the light transmission region constitutes the operation region.

The cover 1100 having the light transmission region may be specifically a glass cover or a sapphire cover. And the upper surface of the cap plate 1100 may be provided with a protective layer. It should be understood that the pressing of the finger may be actually the pressing of the finger on the cover 1100, or may be the pressing of a protective layer provided on the upper surface of the cover 1100.

As shown in fig. 27A and 27B, the first diaphragm unit 800 and the second diaphragm unit 900 are both located on the propagation path of the target signal light ②, specifically, the first diaphragm unit 800 is located downstream of the second diaphragm unit 900 along the propagation path of the target signal light ②, so that the target signal light ② reflected by the finger can both transmit through the first diaphragm unit 800 and the second diaphragm unit 900, ensuring the effectiveness of the processing of the target signal light ②.

To achieve the above object, the first and second diaphragm units 800 and 900 are at least partially overlapped. Alternatively, the projection of the second membrane unit 900 towards the first membrane unit 800 at least partially covers the first membrane unit 800. As illustrated in fig. 27A and 27B, the second film sheet unit 900 at least partially covers the first film sheet unit 800 in a vertically downward projection.

Specifically, the second film unit 900 covers a partial area of the first film unit 800 along a vertical downward projection; alternatively, the second membrane unit 900 completely covers the first membrane unit 800 in a vertically downward projection.

The first film unit 800 including the first 1/4 wave plate 800a and the first linear polarizer 800b naturally attenuates the brightness of the non-reflected noise light ④ directly emitted downward from the display panel 200.

However, in order to attenuate the brightness of the non-reflected noise light ④ directly emitted downward from the display panel 200 without attenuating the brightness of the target signal light ② reflected back by the finger, the angles between the optical axes of the wave plates and the polarization directions of the polarizers included in the first film unit 800 and the second film unit 900, respectively, should have special requirements.

Specifically, the optical axis of the first 1/4 wave plate 800a and the polarization direction of the first linear polarizer 800b form a first angle α, the optical axis of the second 1/4 wave plate 900a and the polarization direction of the second linear polarizer 900b form a second angle β, the values (i.e., absolute values) of the first angle α and the second angle β are both about 45 °, and specifically, the difference between the values of the first angle α and the second angle β may also be within a tolerance range.

Specifically, the value of the first angle α is 45 ° ± 5 °, the value of the second angle β is also 45 ° ± 5 °, the difference between the values of the first angle α and the second angle β is within the tolerance range of 0 ° to 10 °, for example, the value of the first angle α is 45 °, the value of the second angle β is 43 °, or the value of the first angle α is 42 °, and the value of the second angle β is 50 °, which still meets the practical requirements.

In addition, the first angle α is opposite to the second angle β in the viewing direction (from top to bottom) of the second film unit 900 toward the first film unit 800. specifically, one of the first angle α and the second angle β is +45 ° ± 5 ° and the other is-45 ° ± 5 ° in the viewing direction from top to bottom.

For example, as shown in fig. 28A and 28B, the first angle α is +45 ° ± 5 °, and the second angle β is-45 ° ± 5 °, or, as shown in fig. 29A and 29B, the first angle α is-45 ° ± 5 °, and the second angle β is +45 ° ± 5 °.

Of course, the viewing direction is not limited to the top-to-bottom direction along the second film unit 900 toward the first film unit 800, but may be the opposite direction. I.e., in a bottom-to-top direction along the first membrane unit 800 toward the second membrane unit 900.

The direction of the first angle α and the direction of the second angle β in a bottom-to-top direction pointing along the first membrane unit 800 toward the second membrane unit 900 are opposite to the above.

Since the first film unit 800 including the first 1/4 wave plate 800a and the first linear polarizer 800b has the principle of attenuating the brightness of the non-reflected noise light ④ directly emitted downward by the light emitting unit, which is already explained above and not described herein, the following describes the principle of not attenuating or slightly attenuating the brightness of the target signal light ② reflected back by the finger while attenuating the brightness of the non-reflected noise light ④ by the scheme design that the first angle α is opposite to the second angle β and the values are equal or similar.

As shown in fig. 27A and 27B, light ① emitted from the light emitting unit of the display panel 200 and directed to the second film unit 900 is reflected by the finger pressing on the cover 1100 and returns through the second film unit 900 again, and becomes target signal light ② of circular polarization or elliptical polarization.

The object signal light ② propagates through the display panel 200, and after reaching the first 1/4 wave plate 800a of the first film unit 800, it becomes a linearly polarized light ③ with the same polarization direction as the first linear polarizer 800b, and can be incident to the photo sensor chip 1 through the first linear polarizer 800b without loss or with low loss for imaging.

By disposing the first film unit 800 including the first 1/4 wave plate 800a and the first linear polarizer 800b between the display panel 200 and the photo chip 1, the non-reflected noise light ④ directly emitted from the display panel 200 to the photo chip 1 is attenuated after passing through the first 1/4 wave plate 800a and the first linear polarizer 800b, so that the brightness of the non-reflected noise light ④ can be reduced and the image quality can be improved.

In addition, the second diaphragm unit 900 including the second 1/4 wave plate 900a and the second linear polarizer 900b is configured, and the direction and the difference between the first angle α formed between the first 1/4 wave plate 800a and the first linear polarizer 800b and the second angle β formed between the second 1/4 wave plate 900a and the second linear polarizer 900b are designed to be suitable, so that the target signal light ② is not attenuated or less attenuated while the non-reflected noise light ④ is attenuated, thereby the signal-to-noise ratio of the light received by the photo sensor chip 1 is improved, and the imaging quality is greatly improved.

It should be noted that, in the description of the present invention, the terms "first", "second", and the like are used for descriptive purposes only and for distinguishing similar objects, and no precedence between the two is considered as indicating or implying relative importance. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.

It is to be understood that the above description is intended to be illustrative, and not restrictive. Many embodiments and many applications other than the examples provided would be apparent to those of skill in the art upon reading the above description. The scope of the present teachings should, therefore, be determined not with reference to the above description, but should instead be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The disclosures of all articles and references, including patent applications and publications, are hereby incorporated by reference for all purposes. The omission in the foregoing claims of any aspect of subject matter that is disclosed herein is not intended to forego such subject matter, nor should the applicant consider that such subject matter is not considered part of the disclosed subject matter.

Claims

1. The identification module is used for being arranged below a display screen; characterized in that, the identification module includes:

a conductive substrate;

2. The module of claim 1, wherein the conductive substrate is a flexible printed circuit board disposed on the steel plate.

3. The identification module for an off-screen optical fingerprint as recited in claim 1 further comprising a bracket disposed on the conductive substrate; alternatively, the bracket is arranged on the identification component;

the bracket supports one or more optical lenses; one or more optical lenses are positioned at the upstream of the identification component along the propagation path of the target signal light, and the target signal light can reach the light sensing chip of the identification component through one or more optical lenses.

4. The module of claim 3, wherein the photo sensor chip is disposed on a substrate, the substrate is disposed with a supporting wall disposed outside the photo sensor chip, and an upper end of the supporting wall supports the protection component;

the protection cavity is defined among the base plate, the supporting wall and the protection component;

the bracket is arranged on the protection component.

5. The identification module for the optical fingerprint under the screen of claim 3, wherein the identification component further comprises an encapsulation layer, the encapsulation layer at least comprises a peripheral portion surrounding the side of the light-sensing chip; the peripheral edge part is provided with a supporting wall, and the upper end of the supporting wall props against the protection component;

the light sensing chip, the supporting wall and the protection component define a protection cavity;

the bracket is arranged on the protection component.

6. The identification module for an off-screen optical fingerprint of claim 5,

the peripheral part covers the side face of the light sensing chip; or,

the peripheral portion and the light sensing chip are spaced, and a supporting layer is filled between the side face of the light sensing chip and the inner wall of the peripheral portion.

7. The identification module for the optical fingerprint under the screen of claim 3, wherein the identification component further comprises an encapsulation layer, the encapsulation layer at least comprises a peripheral portion surrounding the side of the light-sensing chip; the upper end of the peripheral part supports against a circuit board, and the circuit board is provided with an opening; the shield assembly is disposed in the opening; or the protection component is arranged on the circuit board and covers the opening;

the light sensing chip, the circuit board and the protection assembly define a protection cavity therebetween;

the bracket is arranged on the circuit board.

8. The module as claimed in claim 3, wherein the light sensor chip is provided with a support layer spaced from the light sensor chip, a circuit board is supported by the upper end of the support layer, and the light sensor chip is fixed below the circuit board by a conductive bump; the circuit board is provided with an opening; the shield assembly is disposed in the opening; or the protection component is arranged on the circuit board and covers the opening;

the light sensing chip, the circuit board, the protection assembly and the conductive protrusion define a protection cavity therebetween;

the bracket is arranged on the circuit board.

9. The module as claimed in claim 3, wherein the light sensor chip is provided at an outer side thereof with a supporting layer spaced from the light sensor chip, a circuit board is supported at an upper end of the supporting layer, and an upper surface of the light sensor chip is fixedly attached to a lower surface of the circuit board; the circuit board is provided with an opening; the shield assembly is disposed in the opening; or the protection component is arranged on the circuit board and covers the opening; the lower surface of the protection component is higher than the lower surface of the circuit board;

the bracket is arranged on the circuit board.

10. The identification module for the optical fingerprint under the screen of claim 3, wherein one or more of the optical lenses are disposed in a lens barrel, and the lens barrel is connected with the bracket by a threaded connection; the lens barrel can drive one or more optical lenses to move towards or away from the identification component through rotation.

11. The module of claim 10, wherein a first film unit is disposed between the display panel and the photo sensor chip, the first film unit includes a first 1/4 wave plate and a first linear polarizer, and the first 1/4 wave plate is disposed between the display panel and the first linear polarizer.

12. The identification module for an off-screen optical fingerprint of claim 11,

the first diaphragm unit is supported by the display screen; or,

the first diaphragm unit is disposed on the bracket.

13. The identification module for an off-screen optical fingerprint of claim 11 or 12,

the first diaphragm unit is arranged at the upper end of the bracket; or,

the first diaphragm unit is disposed in the lens barrel; or,

the first linear polarizer is accommodated in an accommodating space defined by the bracket, and the first 1/4 wave plate is arranged at the upper end of the bracket.

14. The identification module for an optical fingerprint under a screen of claim 13, wherein when the first diaphragm unit is disposed in the lens barrel,

the first membrane unit is positioned above all the optical lenses; or,

the first diaphragm unit is positioned below all the optical lenses; or,

the first membrane unit is positioned between any two adjacent optical lenses; or;

one or more optical lenses are arranged between the first 1/4 wave plate and the first linear polarizer in a spaced mode.

15. An electronic device, comprising:

a display screen;

the identification module for the optical fingerprint under the screen of any one of claims 11 to 14, wherein the identification module is disposed below the display screen.

16. The electronic device of claim 15, wherein a second diaphragm element is disposed on a side of the display screen facing away from the first diaphragm element, the second diaphragm element comprising a second 1/4 wave plate and a second linear polarizer; the second 1/4 wave plate is located between the second linear polarizer and the display screen;

wherein a first angle is formed between the optical axis of the first 1/4 wave plate and the polarization direction of the first linear polarizer, and a second angle is formed between the optical axis of the second 1/4 wave plate and the polarization direction of the second linear polarizer;

and, in the viewing angle direction of the second diaphragm unit pointing to the first diaphragm unit, one of the first angle and the second angle is +45 ° ± 5 °, and the other is-45 ° ± 5 °.

17. The electronic device of claim 16,

the first angle is +45 ° ± 5 °, and the second angle is-45 ° ± 5 °; or,

the first angle is-45 ° ± 5 °, and the second angle is +45 ° ± 5 °.

18. The electronic device according to claim 16, wherein the first diaphragm unit and the second diaphragm unit are both located on a propagation path of the target signal light.

19. The electronic device of claim 16 or 18, wherein the first diaphragm unit and the second diaphragm unit at least partially overlap.

20. The electronic device of claim 16 or 18, wherein a projection of the second membrane unit towards the first membrane unit at least partially covers the first membrane unit.