CN109803519A - A kind of mobile terminal radiator - Google Patents
A kind of mobile terminal radiator Download PDFInfo
- Publication number
- CN109803519A CN109803519A CN201910156538.4A CN201910156538A CN109803519A CN 109803519 A CN109803519 A CN 109803519A CN 201910156538 A CN201910156538 A CN 201910156538A CN 109803519 A CN109803519 A CN 109803519A
- Authority
- CN
- China
- Prior art keywords
- mobile terminal
- fan
- shell
- cooling module
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of mobile terminal radiators, including shell and radiating subassembly；The radiating subassembly is placed in the accommodating cavity that the enclosure interior is formed, and the radiating subassembly includes heat dissipation element, cooling module and heat conducting element, and the heat dissipation element and the heat conducting element are respectively arranged at the two sides of the cooling module；The bottom of the shell offers first through hole, the heat conducting element extends to the outside of the shell via the first through hole, the heat conducting element is in contact with mobile terminal, hold assembly by eliminating traditional heat sinks makes radiator more small volume and less weight, simultaneously, cooled down by cooling module to mobile terminal, it is air-cooled with better refrigeration effect compared to tradition, mobile terminal is more effectively alleviated due to temperature excessively high the case where leading to reduced performance.
Description
Technical field
The present invention relates to a kind of radiators, more specifically, it relates to a kind of mobile terminal radiator.
Background technique
With the continuous development of scientific and technological level, mobile terminal has become indispensable science and technology in people's daily life and produces
Product, and mobile phone and tablet computer, as product most common in mobile terminal, function is also more and more.Mobile terminal is for a long time
In the case where using mobile terminal, it often will appear heating up situation, and the heating up performance that will affect mobile terminal
And therefore there is the radiator used for mobile terminal on the market in service life.
Currently, existing mobile terminal radiator generallys use air-cooled, i.e., fan is fixed on by movement by hold assembly
The back of terminal, and the wind speed circulation of mobile terminal back part is increased to take away heat by fan.But such heat dissipation
Mode efficiency is lower, and hold assembly increases the weight of mobile device entirety, unsuitable long-time makes usually than cumbersome
With.
Therefore, the prior art could be improved and develop.
Summary of the invention
The object of the present invention is to provide a kind of mobile terminal radiators, are dropped by cooling module to mobile terminal
Temperature, it is air-cooled with better refrigeration effect compared to tradition.
Above-mentioned technical purpose of the invention has the technical scheme that
A kind of mobile terminal radiator, wherein including shell and radiating subassembly；The radiating subassembly is placed in the shell
In the accommodating cavity that portion is formed, the radiating subassembly includes heat dissipation element, cooling module and heat conducting element, the heat dissipation element and
The heat conducting element is respectively arranged at the two sides of the cooling module；The bottom of the shell offers first through hole, described to lead
Thermal element extends to the outside of the shell via the first through hole, and the heat conducting element is in contact with mobile terminal.
The mobile terminal radiator, wherein the radiating subassembly further includes fan, and the fan is set to described
Enclosure interior, the fan are flexibly connected with the heat dissipation element.
The mobile terminal radiator, wherein the shell includes lid, body and pedestal, the body with
The lid is internal after connecting with the pedestal to form accommodating cavity, and the radiating subassembly is installed in the accommodating cavity；The wind
Fan, the heat dissipation element, the cooling module and the heat conducting element are sequentially connected, and the fan connects with the lid
Touching.
The mobile terminal radiator, wherein the body is removably connected to the pedestal, institute by fastener
It states lid to be connected together in the body, the lower end of the pedestal is arranged in the first through hole.
The mobile terminal radiator, wherein at least one ventilating hole channel is offered in the top surface.
The mobile terminal radiator, wherein the second through-hole is offered on the body, the lid includes at least
Two pieces of activities are erected at the floor on second through-hole, and the floor fastens with second through-hole, between the floor
There are gaps.
The mobile terminal radiator, wherein further include for the work to the fan and the cooling module
The control switch controlled as state；The control switch is set on the shell, the control switch respectively with it is described
Fan and the cooling module are electrically connected.
The mobile terminal radiator, wherein be also equipped with power supply line on the shell, the power supply line respectively with
The fan, the cooling module and the control switch are electrically connected.
The mobile terminal radiator, wherein at least one sucker is provided on the bottom of the shell.
The mobile terminal radiator, wherein the cooling module is semiconductor chilling plate, and the heat dissipation element is
Metal fin, the heat conducting element are heat-conducting silica gel sheet.
In conclusion the hold assembly of traditional heat sinks is replaced by setting sucker, so that radiator is more small and exquisite
It is light, meanwhile, cooled down by semiconductor chilling plate to mobile terminal, is compared air-cooled with preferably refrigeration effect with tradition
Fruit more effectively alleviates mobile terminal due to temperature excessively high the case where leading to reduced performance.
Detailed description of the invention
Fig. 1 is the structural schematic diagram in first embodiment of the invention at the top of radiator.
Fig. 2 is the structural schematic diagram of radiator bottom in first embodiment of the invention.
Fig. 3 is the explosive view of radiator in first embodiment of the invention.
Fig. 4 is the structural schematic diagram in second embodiment of the invention at the top of radiator.
Fig. 5 is the structural schematic diagram of radiator bottom in second embodiment of the invention.
Fig. 6 is the explosive view of radiator in second embodiment of the invention.
In figure: 1, shell；11, pedestal；111, first through hole；112, baffle ring；12, body；121, the second through-hole；122, block
Slot；13, lid；131, floor；132, strip；14, control switch；15, power supply line；2, radiating subassembly；21, cooling module；22,
Heat dissipation element；221, bottom plate；222, fin；23, heat conducting element；24, fan；3, absorbent module；31, locating piece is adsorbed；32, fixed
Position hole；33, sucker.
Specific embodiment
Below in conjunction with attached drawing, invention is further described in detail.
This specific embodiment is only explanation of the invention, is not limitation of the present invention, those skilled in the art
Member can according to need the modification that not creative contribution is made to the present embodiment after reading this specification, but as long as at this
All by the protection of Patent Law in the scope of the claims of invention.
Embodiment one: a kind of mobile terminal radiator as shown in Figure 1 to Figure 3, including shell 1 and is set to shell 1
Interior radiating subassembly 2, the preferred metal shell of shell 1 or plastic casing.Radiating subassembly 2 is placed in the accommodating cavity formed inside shell 1
Interior, radiating subassembly 2 includes cooling module 21, heat dissipation element 22 and heat conducting element 23, and heat dissipation element 22 and heat conducting element 23 divide
The two sides of cooling module 21 are not set, specifically, the upper end of cooling module 21 is arranged in heat dissipation element 22, heat conducting element 23 is set
It sets in the lower end of cooling module 21.
The bottom of shell 1 is provided with first through hole 111, and heat conducting element 23 extends to the outer of shell 1 via first through hole 111
Portion, heat conducting element 23 are in contact with mobile terminal.Cooling module 21 can pass through the setting of first through hole 111 or all be set to shell
The inside of body, heat dissipation element 22 are fixed inside shell 1, i.e., the projected area of first through hole 111 is less than the heat dissipation element
22 projected area.
In embodiments of the present invention, 21 preferred semiconductor cooling piece of cooling module, the preferred metal fin of heat dissipation element 22.
Heat dissipation element 22 specifically includes bottom plate 221 and is integrally formed the fin 222 on bottom plate 221, and radiating subassembly 2 further includes fan
24, fan 24 is set to inside shell 1, and fan 24 is flexibly connected with heat dissipation element 22.In other embodiments of the present invention, freeze
Element 21 can also can realize the component of refrigerating function for other.
In embodiments of the present invention, the cold end of semiconductor chilling plate is towards mobile terminal, and the hot end of semiconductor chilling plate
Towards heat dissipation element 22, the upper end of heat dissipation element 22 is provided with fan 24, and the effect of fan 24 and heat dissipation element 22 is partly to lead
The temperature difference of the hot-side heat dissipation of body cooling piece, usual semiconductor chilling plate hot and cold side can achieve 40 degree to 65 degree, pass through actively
The mode of heat dissipation reduces hot-side temperature, so that cold junction temperature accordingly declines, reaches better heat dissipation effect.
The thermal inertia of semiconductor chilling plate is small, and the cooling and warming time is fast, can reach maximum within being usually powered one minute
The temperature difference, and while working do not shake, noise, service life it is long and easy for installation, can continuous work.
In embodiments of the present invention, the preferred heat-conducting silica gel sheet of heat conducting element 23, heat conducting element 23 are attached to cooling module
21 lower end, heat conducting element 23 plays thermally conductive and soaking, so that the heat transfer between cooling module 21 and mobile terminal is more
Uniformly.Meanwhile heat-conducting silica gel sheet has viscosity, so that radiator is capable of fixing after mobile terminal dorsal shield, it is not easy to fall.
Specifically, heat-conducting silica gel sheet is porous form, with 2.4 nanometers of average pore size, therefore there is good viscosity,
Meanwhile heat-conducting silica gel sheet has the advantages that high temperature resistant, easy cleaning and service life are long.After radiator use, directly impacted with clear water
It can restore clean, provide convenience for user.
The shell 1 include for accommodating the pedestal 11 of radiating subassembly 2, setting is held on the pedestal 11 and for accommodating fan
24 body 12 and the lid 13 for being arranged on body 12 and covering at 24 outside of fan, body 12 and lid 13 and pedestal 11
Internal after connection to form accommodating cavity, radiating subassembly 2 is installed in accommodating cavity.Fan 24, heat dissipation element 22, cooling module 21 and
Heat conducting element 23 is sequentially connected, and fan 24 is in contact with lid 13, and body 12 is removably connected to pedestal 11 by fastener, lid
Body 13 is connected together in body 12.
Specifically, heat dissipation element 22 is arranged in pedestal 11, body 12 is fixed on the pedestal 11 by soket head cap screw, and
Soket head cap screw contacts on heat dissipation element 22 after penetrating pedestal 11, to complete the fixation to heat dissipation element 22, cooling module
21 attach the lower end that heat dissipation element 22 is arranged in, the lower end for being fitted in cooling module 21 on one side of heat conducting element 23, and thermally conductive member
The another side of part 23 is tightly attached to mobile terminal dorsal shield.
In other embodiments, semiconductor chilling plate is fixed by screws in the lower end of metal fin, semiconductor refrigerating
Heat dissipating silicone grease layer is provided between piece and metal fin, heat-conducting silica gel sheet is fixed by screws under semiconductor chilling plate
End, so that semiconductor chilling plate and heat-conducting silica gel sheet have better heat-conducting effect while completing radiating subassembly assembly.
Lid offers at least one ventilating hole channel on 13 surface, specifically, the second through-hole 121 is offered on body 12,
Second through-hole 121 includes that at least two pieces of activities are erected at the floor 131 on the second through-hole 121 for accommodating fan 24, lid 13,
Floor 131 fastens with the second through-hole 121, and there are gaps between floor 131, specifically, the both ends of floor 131 are provided with card
Item 132 is provided with the card slot 122 being connected together with strip 132 on body 12.
It is fitted close between fan 24 and the second through-hole 121, lid 13 covers the upper end for being located at fan 24, wherein lid 13
Including several floors 131 disposed in parallel, to provide protection while guaranteeing ventilation for fan 24, prevent user from making
With in the process due to accidentally touching fan 24 and damage.In the present embodiment, lid 13 preferably includes five floors 131.
The side of pedestal 11 is provided with baffle ring 112, and the side of pedestal 11 is provided with several baffle rings 112, increases pedestal 11
The frictional force and heat dissipation area of side, while facilitating user to pick and place radiator, so that the heat dissipation effect that shell 1 has had
Fruit.In the present embodiment, the side of pedestal 11 is preferably provided with four layers of baffle ring 112.
It is provided with the control switch 14 for controlling radiator working condition on shell 1 and is connected to the power supply line of power supply
15, wherein control switch 14 is arranged on body 12, and power supply line 15 connects on the pedestal 11, the preferred USB of the connector of power supply line 15
Connector.
Specifically, control switch 14 is for controlling the working condition of fan 24 and cooling module 21, control is opened
It closes 14 to be set on shell 1, control switch 14 is electrically connected with fan 24 and cooling module 21 respectively.
Be also equipped with power supply line 15 on shell 1, power supply line 15 respectively with fan 24, cooling module 21 and control switch 14
It is electrically connected.
Fan 24 and cooling module 21 are electrically connected with control switch 14, after radiator external power supply, fan 24 with
And cooling module 21 is started to work, the vent passages that fan 24 is formed the heat in shell 1 by the second through-hole 121 and lid 13
It is discharged into outside shell.
In other embodiments, it is additionally provided in shell 1 and provides the battery of power supply for fan 24 and cooling module 21, thus
The power supply line 15 of external power supply is eliminated, is provided convenience for the mobile use of user.
Embodiment two, as shown in Fig. 4 to Fig. 5, embodiments herein two and embodiment one the difference is that, in shell
The absorbent module 3 for being absorbed and fixed on mobile terminal is additionally provided on body 1, absorbent module 3 includes at least one sucker 33.
In the present embodiment, absorbent module 3 further includes the absorption locating piece 31 for being set to 1 lower end of shell, and sucker 33 is arranged
In adsorption fastener.
The application is passed by setting sucker 33 and the absorption locating piece 31 being connected between sucker 33 and shell 1, substitution
The clamping device of system radiator, simplifies the structure of traditional clamping device, so that radiator is more compact light.Meanwhile passing through
The fixed mode of sucker 33, it is only necessary to fixation is can be completed into radiator compression at the desired position, is provided users with the convenient.
Absorption locating piece 31 is fixed on the lower end of pedestal 11 by bonding or screw mode, and adsorbs and be arranged on locating piece 31
There is location hole 32, sucker 33 is connected together with location hole 32.In the present embodiment, the cross sectional shape and pedestal of locating piece 31 are adsorbed
11 cross sectional shape is identical, adsorbs and is provided with location hole 32 on four angles of locating piece 31, adsorbs and is arranged altogether on locating piece 31
There are four with the one-to-one sucker 33 of location hole 32 so that the suction of absorbent module 3 is more evenly, so that fixed effect is more preferable,
It is not easy to fall in user's use process.
In other embodiments, the fixed form of absorbent module 3 can also be that sucker 33 is bonded towards one end of pedestal 11
It fixes on the pedestal 11, adsorption fastener is connected together in sucker 33 and is suspended in 11 lower section of pedestal, for on four angles
Sucker 33 is positioned and increases the intensity of sucker 33.
To sum up, the absorption locating piece that the application is arranged sucker and is connected between sucker and shell substitutes traditional heat-dissipating
The clamping device of device simplifies the structure of traditional clamping device, so that radiator is more light, meanwhile, pass through semiconductor
Cooling piece cools down to mobile terminal, air-cooled with better refrigeration effect compared to tradition, more effectively alleviates movement
Terminal is due to temperature excessively high the case where leading to reduced performance.
It should be understood that the application of the present invention is not limited to the above for those of ordinary skills can
With improvement or transformation based on the above description, all these modifications and variations all should belong to the guarantor of appended claims of the present invention
Protect range.
Claims (10)
1. a kind of mobile terminal radiator, it is characterised in that: including shell and radiating subassembly；The radiating subassembly is placed in institute
In the accommodating cavity for stating enclosure interior formation, the radiating subassembly includes heat dissipation element, cooling module and heat conducting element, described to dissipate
Thermal element and the heat conducting element are respectively arranged at the two sides of the cooling module；It is logical that the bottom of the shell offers first
Hole, the heat conducting element extend to the outside of the shell, the heat conducting element and mobile terminal phase via the first through hole
Contact.
2. mobile terminal radiator according to claim 1, it is characterised in that: the radiating subassembly further includes fan,
The fan is set to the enclosure interior, and the fan is flexibly connected with the heat dissipation element.
3. mobile terminal radiator according to claim 2, it is characterised in that: the shell include lid, body with
And pedestal, the body is internal after connecting with the lid and the pedestal to form accommodating cavity, and the radiating subassembly is installed on institute
It states in accommodating cavity；The fan, the heat dissipation element, the cooling module and the heat conducting element are sequentially connected, the wind
Fan is in contact with the lid.
4. mobile terminal radiator according to claim 3, it is characterised in that: the body is detachable by fastener
It is connected to the pedestal, the lid is connected together in the body, and the lower end of the pedestal is arranged in the first through hole.
5. mobile terminal radiator according to claim 4, it is characterised in that: offered at least in the top surface
One ventilating hole channel.
6. mobile terminal radiator according to claim 4, it is characterised in that: it is logical to offer second on the body
Hole, the lid include that at least two pieces of activities are erected at the floor on second through-hole, the floor and second through-hole
It fastens, there are gaps between the floor.
7. mobile terminal radiator described according to claim 1 ~ any one of 6, it is characterised in that: further include for institute
State the control switch that the working condition of fan and the cooling module is controlled；The control switch is set to the shell
On, the control switch is electrically connected with the fan and the cooling module respectively.
8. mobile terminal radiator according to claim 7, it is characterised in that: be also equipped with power supply on the shell
Line, the power supply line are electrically connected with the fan, the cooling module and the control switch respectively.
9. mobile terminal radiator described according to claim 1 ~ any one of 6, it is characterised in that: the bottom of the shell
On be provided at least one sucker.
10. mobile terminal radiator described according to claim 1 ~ any one of 6, it is characterised in that: the cooling module
For semiconductor chilling plate, the heat dissipation element is metal fin, and the heat conducting element is heat-conducting silica gel sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910156538.4A CN109803519A (en) | 2019-03-01 | 2019-03-01 | A kind of mobile terminal radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910156538.4A CN109803519A (en) | 2019-03-01 | 2019-03-01 | A kind of mobile terminal radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109803519A true CN109803519A (en) | 2019-05-24 |
Family
ID=66562625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910156538.4A Pending CN109803519A (en) | 2019-03-01 | 2019-03-01 | A kind of mobile terminal radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109803519A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110365194A (en) * | 2019-08-12 | 2019-10-22 | 合肥通用电源设备有限公司 | A kind of Switching Power Supply with cooling, dust preventing |
| CN112020279A (en) * | 2020-08-31 | 2020-12-01 | 维沃移动通信有限公司 | Heat sink device |
-
2019
- 2019-03-01 CN CN201910156538.4A patent/CN109803519A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110365194A (en) * | 2019-08-12 | 2019-10-22 | 合肥通用电源设备有限公司 | A kind of Switching Power Supply with cooling, dust preventing |
| CN112020279A (en) * | 2020-08-31 | 2020-12-01 | 维沃移动通信有限公司 | Heat sink device |
| CN112020279B (en) * | 2020-08-31 | 2022-11-18 | 维沃移动通信有限公司 | Heat sink device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109168302B (en) | Wearable equipment | |
| CN209420220U (en) | A kind of mobile phone dorsal clamp type radiator | |
| CN109662360A (en) | A kind of isothermic garment for heating and freezing using power supply | |
| CN109803519A (en) | A kind of mobile terminal radiator | |
| CN209314206U (en) | A kind of mobile terminal radiator | |
| CN210578708U (en) | Mobile phone heat dissipation device | |
| CN207993484U (en) | Double dish mobile hard disc boxes | |
| CN110837284A (en) | Thermoelectric module, hard disk device and electronic equipment | |
| CN206147496U (en) | Be used for solid state hard drives heat dissipation to use annular heat abstractor | |
| TWI565444B (en) | Heating and cooling device | |
| CN212323769U (en) | Wireless charging seat | |
| CN220713014U (en) | Head-mounted temperature adjusting device | |
| CN210053451U (en) | Temperature adjusting device for mobile phone | |
| CN210868559U (en) | Mobile phone radiator | |
| CN207321355U (en) | Automatically the mobile phone shell to cool down | |
| CN208655742U (en) | Power battery module | |
| CN215733564U (en) | Wireless charging device | |
| CN219627381U (en) | High-power wireless charger and vehicle-mounted charging structure | |
| CN207216547U (en) | A kind of computer radiator | |
| JP2023052801A (en) | Semiconductor cooling module and photocosmetic instrument | |
| CN210351947U (en) | Attached formula mobile terminal heat abstractor | |
| CN113555941B (en) | Wireless charging device | |
| CN219978680U (en) | Photographing apparatus | |
| CN207166545U (en) | A kind of smart mobile phone radiator structure | |
| CN113138645A (en) | Dedicated heat dissipation collet of notebook |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190524 |
|
| WD01 | Invention patent application deemed withdrawn after publication |