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CN109768034B - Pressure sensor module and pressure sensor device having a pressure sensor module - Google Patents

Pressure sensor module and pressure sensor device having a pressure sensor module Download PDF

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Publication number
CN109768034B
CN109768034B CN201811329884.XA CN201811329884A CN109768034B CN 109768034 B CN109768034 B CN 109768034B CN 201811329884 A CN201811329884 A CN 201811329884A CN 109768034 B CN109768034 B CN 109768034B
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China
Prior art keywords
pressure sensor
substrate
pressure
sensor module
section
Prior art date
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Active
Application number
CN201811329884.XA
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Chinese (zh)
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CN109768034A (en
Inventor
J·鲁伊斯伊达尔戈
M·哈比比
P·帕茨纳
R·伊斯拉米
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Robert Bosch GmbH
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Robert Bosch GmbH
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Publication of CN109768034A publication Critical patent/CN109768034A/en
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Publication of CN109768034B publication Critical patent/CN109768034B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118—Masterslice integrated circuits
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
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    • H01L2224/732—Location after the connecting process
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    • H01L2224/73265—Layer and wire connectors
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/143—Digital devices
    • H01L2924/1433—Application-specific integrated circuit [ASIC]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
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    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
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    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

The invention relates to a flexibly mountable pressure sensor module having a module carrier with a substrate, wherein a pressure sensor chip and a control and evaluation circuit electrically connected to the pressure sensor chip are arranged on the substrate and are electrically connected to conductor tracks of the substrate, wherein the control and evaluation circuit has an ASIC circuit part and passive electrical components, wherein, furthermore, a molding material which completely covers the ASIC circuit part and the passive components on the substrate is arranged on the substrate, wherein the molding material has a recess on the substrate, wherein the pressure sensor chip is arranged in the recess and is covered there with a gel cover, wherein contact surfaces which are electrically connected to the control and evaluation circuit are present on a contact side of the substrate facing away from the assembly side. The pressure sensor module has in particular shaped electrical connection elements which protrude from the module carrier and which have a high dielectric and vibration resistance.

Description

Pressure sensor module and pressure sensor device having a pressure sensor module
Technical Field
The present invention relates to a pressure sensor module and a pressure sensor device having such a pressure sensor module. The pressure sensor module is used to detect the pressure of the fluid medium and can be installed in a pressure sensor device for this purpose. Such pressure sensor devices are used, for example, in motor vehicle technology, for example, in particulate filters or in engine control systems with particulate filters, and in low-pressure exhaust gas recirculation, or as tank pressure sensors or in other ways. Based on the diversity of application possibilities, there is a need for a flexibly loadable pressure sensor module that can be installed in a pressure sensor device that is adapted to the respective application situation. The pressure sensor device has a pressure connection geometry and a housing structure adapted to the application, while the pressure sensor module can be flexibly inserted as a miniaturized unit into the housing receptacle of the respective pressure sensor device in different installation situations.
Background
A pressure sensor module is known, for example, from DE 10 2010 039 599 A1. The known pressure sensor module can be installed in a pressure sensor device in different installation situations. Thus, the bottom is mountedIt is likewise possible to mount the pressure sensor module in a face-up position, in which it is mounted with a 180 ° turn, in a normal position in which it is fastened in the housing receptacle with the side facing away from the pressure sensor chip. In the known pressure sensor module, the passive electrical components and parts of the control and evaluation circuit are exposed to an external medium. Contact between the pressure sensor module and the conductor tracks of the pressure sensor device is achieved by means of bonding wires. To design these connections resistant to media, gold-bonded wire connections, which are produced at great expense, may be necessary, which necessitates a heating process and increases the production costs. Furthermore, the bond wire connection is not resistant to vibration loads, which in the worst case may damage the bond wire connection.
A pressure sensor module is known from DE 10 2016 201 847 A1, which has a module carrier with a substrate. The pressure sensor chip and the control and evaluation circuit electrically connected to the pressure sensor chip are arranged on the assembly side of the substrate and are electrically connected to the conductor tracks of the substrate. The evaluation circuit has an ASIC circuit part and passive electrical components which are completely covered by the molding compound applied to the assembly side of the substrate. The molding material has a recess, wherein the pressure sensor chip is arranged in the recess and covered there with a gel cover. The pressure sensor module can be produced particularly advantageously, cheaply and simply. The ASIC circuit parts and passive components are particularly well protected against invasive media. In the known pressure sensor module, contact surfaces, which are electrically connected to the control and evaluation circuit and are each electrically connected to the conductor tracks of the pressure sensor device by means of an electrically conductive adhesive incorporated in the sealing material, are arranged on the contact side of the substrate facing away from the mounting side.
Disclosure of Invention
The invention relates to a pressure sensor module of the generic type, wherein the pressure sensor module has electrical connection elements extending from a module carrier, wherein the connection elements each have a longitudinal extension, wherein the connection elements each have a head section at one end, seen in the direction of their longitudinal extension, and a connection section at their end facing away from the head section, wherein the head section has a greater width in a plane parallel to the substrate and perpendicular to the direction of the longitudinal extension than the remaining sections of the respective connection element, wherein the head section of the respective connection element is configured with a flat contact surface facing the contact side of the substrate, which contact surface is welded directly to the electrical contact surface assigned to the respective connection element on the contact side of the substrate, wherein the connection elements each have an elastic section between the head section and the connection section, wherein the elastic section has alternating (WECHSELSEITIG) bends, seen in the direction of their longitudinal extension, in a first bending position facing the mounting side and bends back in a second bending position arranged in the direction of the longitudinal extension, facing the contact side of the respective connection section, such that the contact surface extends back towards the respective connection section.
By virtue of the special configuration and fastening of the connecting element to the pressure sensor module, the pressure sensor module according to the invention enables a high resistance of the pressure sensor module to iodine and diiodomethane in particular, with a simultaneously high load capacity of the connecting element with respect to vibration loads and vibration loads.
The combination of the known molding technology for protecting ASIC circuit parts and passive electrical components with a special configuration of the connecting elements soldered on the underside of the substrate enables a multiplicity of applications of the pressure sensor module in different pressure sensor devices with a high dielectric resistance. The connecting element can completely replace the bond wire connections used in the prior art, but is stable with respect to the shaking load due to its design and can be soldered directly to the conductor tracks of the pressure sensor device. The connection can be manufactured much cheaper than the adhesive connections used in the prior art. By means of the configuration of the head section of the connecting element provided for soldering, a stable mechanical and electrical connection to the respective contact surface of the substrate is achieved. The elastically configured connecting elements are each configured at their two ends in a particularly stable manner with respect to vibration loading by means of a welded connection to the contact surface on the one hand and to the conductor tracks of the pressure sensor device on the other hand. The pressure sensor module according to the invention can be manufactured by means of standard methods, which are inexpensive.
The concept "pressure" is described next, for example, as partial pressure and/or absolute pressure and/or differential pressure and/or pressure curve and/or pressure development, for example over time. For example, the pressure may also involve a difference in multiple pressures. That is, the pressure sensor module may in particular be a differential pressure measuring device, namely the following: the device is arranged for detecting a difference between a first pressure, e.g. in the first pressure chamber, and a second pressure, e.g. in the second pressure chamber. For example, one of these pressure chambers may relate to a reference pressure chamber, such as a chamber having atmospheric pressure. The other pressure chamber may be loaded, for example, with the pressure of the measuring medium to be measured. Other configurations are also possible.
Basically, a "fluid medium" is understood to mean any substance in a fluid, in particular gaseous, state. For example, the following substances may be mentioned: the material does not resist any slow shear. In general, the state of the fluid may be temperature-dependent and/or pressure-dependent. The fluid medium may be present as pure or as a mixture.
Basically, the concept "molding material" describes an arbitrary material that can withstand the molding process in a mold or in a tool in an initial state. In particular, it may relate to a hardenable material or material mixture which can be shaped in the initial state in order to harden and to maintain a stable shape. The molding material may in particular comprise at least one plastic or a plastic mixture or also at least one starting material for the plastic. For example, the molding material may include at least one flowable resin and/or a synthetic resin and/or a thermosetting resin. Other materials are also contemplated. The molding material may be arranged to at least partially enclose the substrate together with the member. The molding material may be provided for protecting the member from damage due to mechanical damage, contamination, and the like. The molding material may be configured such that the pressure sensor chip is at least partially uncovered by the molding material.
Furthermore, the module carrier may have at least one pressure opening. For example, the pressure opening may be or include a through-bore.
The pressure sensor chip relates to a semiconductor substrate which is designed to detect at least one pressure of a fluid medium. The pressure sensor chip has a diaphragm. The membrane may for example be exposed to the pressure of the fluid medium on one side and bend more or less strongly under the influence thereof. The pressure sensor chip may preferably be constructed from porous silicon.
Furthermore, the pressure sensor chip is covered completely or partially with a gel cover. The gel cover provides protection for the pressure sensor chip from external influences. A gel is understood to be a dispersion system which consists of at least two components. The fixed components form a spongy, three-dimensional network, the pores of which are filled with a liquid or gas. For example, silicone gel may be involved.
The term "control and evaluation unit" means an electrical and/or electronic circuit which is provided for detecting and/or regulating at least one signal, in particular an electrical signal. For example, the control and evaluation unit can have at least one ASIC circuit part (application specific integrated circuit) and at least one passive electrical component, for example a capacitor. Basically, other configurations are also conceivable.
The substrate of the module carrier may be a circuit board and comprise conductor tracks. And more particularly to LGA substrates (LAND GRID ARRAY, land grid arrays). The conductor tracks can be used for electrical connection of electronic components. The conductor tracks can be produced, for example, from copper or gold. Basically, other materials are also conceivable. The pressure sensor chip and the control and analysis processing unit are electrically connected with the printed conductor. The sensor element and/or the control and evaluation unit may have, in particular, pads, which are electrically connected to the bonding surfaces of the conductor tracks.
The bonding surfaces of the conductor tracks can be covered at least in part by a protective material. A protective material may be provided to provide protection to the bonding surface from external influences. The protective material may comprise, for example, a resin, in particular an epoxy resin or a silicone adhesive.
Advantageous configurations and embodiments of the invention can be achieved by the features contained in the dependent claims.
Advantageously, the first bending position of the connecting element may be at most 3mm from a lateral edge of the substrate in the direction of the longitudinal extension of the connecting element. This advantageously makes it possible to reduce the installation space required for the arrangement of the pressure sensor module in the pressure sensor device in terms of its lateral dimensions. Since the pressure sensor module can also be mounted in a bottom-up mounting or in a position turned 180 ° relative thereto in the "normal position", little installation space is required even if the pressure sensor module is rotated in order to accommodate the spring section of the connecting element.
It is particularly advantageous if the module carrier with the substrate and the molding material arranged thereon has a mounting height in a direction perpendicular to the mounting side of the substrate, and the distance between the side of the connection section facing away from the contact side and the contact surface of the connection element is between 60% and 100% of the mounting height of the module carrier. By this measure, on the one hand, a sufficient elasticity of the connecting element and, on the other hand, a simple installation of the pressure sensor module is possible both in the normal position and also in the bottom position. The connecting section is located at the level of the module carrier in two positions, so that no additional installation space is required. The connection section is thus easily soldered to the conductor track of the pressure sensor device in two positions.
The molding material can be applied to the mounting side of the substrate in part also at the left-out bottom, and the pressure sensor chip is placed on the molding material at the left-out bottom. In this case, a further reduction in installation space can be achieved in that the ASIC circuit part is arranged in the molding material section between the pressure sensor chip and the substrate in a direction perpendicular to the assembly side of the substrate. By this measure the space requirements on the substrate are reduced. This, in combination with the configuration of the connecting element, results in a particularly short installation length of the pressure sensor module. This embodiment is particularly advantageous when the pressure sensor module is designed for absolute pressure measurement.
The pressure sensor module can advantageously have a pressure opening, which is formed in the substrate. The pressure opening may have an inner wall which is only delimited by the material of the substrate. This can be produced simply by introducing the pressure openings as bores into the substrate, in particular into the circuit board substrate.
Furthermore, it is advantageous if the pressure sensor device has a housing with at least one pressure supply channel, and the pressure sensor module is accommodated in the housing such that the pressure sensor module is fastened in the housing receptacle and covers the pressure supply channel there, wherein the connecting elements are welded with the connecting sections to the conductor tracks of the pressure sensor device. The soldered connection produces a particularly stable connection between the connecting element and the conductor track.
The term "housing" relates to an optionally shaped element which is provided to completely or partially enclose components of the device and to further protect these components from external influences such as mechanical loads or moisture. The housing may comprise at least one first housing part, in particular a housing baseAnd at least one second housing part, in particular a housing cover. The first housing part and the second housing part can be connected to one another in a material-locking manner. The designations "first" and "second" housing parts may be regarded as simple designations without giving priority to and without excluding, for example, the possibility that multiple types of first housing parts and multiple types of second housing parts may be provided or that each is just one type. Furthermore, additional housing parts, for example a third housing part, may be present.
The housing may comprise at least one housing receptacle for receiving the pressure sensor module. The housing receptacle may in particular relate to a recess in the housing part. The pressure sensor module can be fixed in the housing receptacle by means of a sealing adhesive. The housing may enclose at least one pressure chamber. The pressure chamber may be sealed from other housing chambers or pressure chambers. The pressure sensor module may also be arranged partly in the pressure chamber and partly in the other housing chamber or pressure chambers and sealed against the housing part or housing parts. The pressure chamber may in particular be the following chamber: at least one pressure of the fluid medium is prevailing in the chamber, which at least one pressure is detected by the device.
The housing may have one or two or more pressure feed channels. Each pressure feed channel may be pressure-loaded, for example, with a pressure of the measuring medium, an external pressure or a reference pressure, for example, a pressure of external air. The pressure sensor chip of the pressure sensor module can preferably be connected via a pressure supply channel to a fluid medium having a pressure to be detected in such a way that the pressure can be detected by the pressure sensor element.
The pressure sensor chip can be acted upon by at least one further pressure via the second pressure supply channel. The further pressure may preferably be different from the first pressure, but may also coincide with the first pressure, for example also for performing calibration and/or balancing.
Advantageously, the pressure sensor module can be mounted above the pressure supply channel with the side of the module carrier provided with the gel cover. This embodiment is suitable, for example, for absolute pressure measurement or relative pressure measurement, for example, for tank pressure sensors.
The pressure sensor module may advantageously also be provided for differential pressure measurement, and the substrate of the pressure sensor module may have a pressure opening, the inner wall of which is limited only by the material of the substrate. The contact side of the substrate may be arranged above the first pressure feed channel of the pressure sensor device such that the pressure opening is fluidly connected with the first pressure feed channel. The contact side can be bonded to the housing by means of a sealing bond around the edge of the pressure feed channel in the housing receptacle. The side of the pressure sensor module provided with the gel cover can preferably be acted upon by a second pressure via a second pressure supply channel.
Drawings
Figure 1 shows a cross section of a first embodiment of a pressure sensor module according to the invention,
Figure 2a shows a top view of a second embodiment of a pressure sensor module according to the invention,
Figure 2b shows a top view of the underside of the pressure sensor module in figure 2a,
Figure 3 shows a top view of the underside of a third embodiment of a pressure sensor module with two pressure sensor chips,
Figure 4a shows a schematic cross section of a fourth embodiment of a pressure sensor module according to the invention without a connecting element,
Figure 4b shows a perspective view of a fourth embodiment of a pressure sensor module according to the invention,
Figure 4c shows a top view of the underside of a fourth embodiment of a pressure sensor module according to the invention,
Figure 4d shows a side view of a fourth embodiment of a pressure sensor module according to the invention,
Figure 5 shows a cross section of an embodiment of a pressure sensor device with a pressure sensor module,
Figure 6 shows an enlarged segment a of figure 5,
Fig. 7 shows a cross section of a further embodiment of a pressure sensor device with a pressure sensor module.
Detailed Description
Fig. 1 shows a cross section of an exemplary first embodiment of a pressure sensor module according to the invention. The pressure sensor module 100 comprises a module carrier 101 having at least one substrate 102 and at least one molding material 110. The molding material 110 is preferably present in a hardened state during use of the sensor module 100. The substrate 102 may be configured, for example, as a circuit board. Further, the substrate 102 may have a basic shape of a rectangular parallelepiped shape or a plate shape. The substrate 114 may be, for example, fabricated entirely or partially from a fiberglass reinforced epoxy material.
The molding material 110 may for example comprise a flowable resin material or a synthetic resin material and may be provided for at least partially covering the substrate 102 on the mounting side 103 thereof.
Furthermore, the pressure sensor module has a pressure opening 118, which is introduced into the substrate 102, for example as a drilled hole, so that the inner wall of the pressure opening 118 is delimited by the material of the substrate. The channels 119, which are guided, for example, through the molding material sections 117 of the molding material 110 and through the adhesive layer 116, for example, adhesive or solder, connect the pressure openings 118 of the substrate 102 and end with recesses of the pressure sensor chip 105 that are blind holes, at the diaphragm 106.
The pressure sensor chip 105 is arranged in a recess 111 of the molding material 110. The molding material 110 can be applied to the mounting side 103 of the substrate 102, in part, also on the bottom of the recess 111, and the pressure sensor chip 105 can be placed on the molding material section 117 of the molding material 110 on the bottom of the recess 111 as shown by means of the adhesive layer 116. The pressure sensor chip 105 covers the pressure opening 118 and is completely or partially covered in the recess 111 with a gel cover 113. The gel cover 113 is provided for providing protection of the pressure sensor chip 105 against external influences and allowing pressure to be transmitted to the membrane 106.
In addition, the pressure sensor module 100 has a control and evaluation circuit 107. The control and analysis processing circuit 107 may be arranged to detect and/or adjust at least one signal. The control and analysis processing circuit 107 is arranged on the mounting side 103 of the substrate 102. The control and evaluation circuit 107 has at least one ASIC circuit part 108 (application specific integrated circuit) and passive electrical components 109, for example capacitors. The molding compound 110 completely covers the ASIC circuit part 108 and the passive components 109 on the substrate 102. In terms of the possibility of configuring the control and evaluation circuit, reference is made by way of example to the structure described in DE 10 2016 201 847 A1, without the control and evaluation circuit being limited to this structure.
Substrate 102 includes a printed wiring 130. The pressure sensor chip 105 and the control and evaluation circuit 107 can be electrically connected to the conductor tracks 130, for example, by means of bond wire connections 114, 115. For this purpose, the molding material section 117 has at least one recess 150, which exposes the conductor track 130, through which the bonding wire connection 114 is applied to the conductor track 130.
The bonding surface of the conductor tracks 130 can be covered at least partially in the recess 150 by the protective material 112. The protective material 112 may be provided to provide protection to the bonding surface from external influences. The protective material 112 may include, among other things, a resin, especially an epoxy resin. The protective material 112 may be covered with a gel cover 113.
In the embodiment of fig. 1, the pressure sensor module is preferably provided for differential pressure measurement and can be acted upon by a first pressure through the pressure opening 118 and by a second pressure through the gel cover 113, both of which act on the diaphragm 106.
As is also shown in fig. 1, the pressure sensor module 100 has electrical connection elements 120 that protrude laterally from the module carrier 101. The connection elements 120 each have a longitudinal extension L. Seen in the direction of this longitudinal extension (L), the connecting elements each have a head section 121 at the end facing the module carrier 101 and a connecting section 123 at their end facing away from the head section 121. The head section 121 has a greater width B in a plane parallel to the substrate 102 and perpendicular to the longitudinal extension L than the remaining sections of the respective connecting element 120, as can be seen best in fig. 4 c.
The head section 121 of the connecting element 120 is configured with a flat contact surface 132, which faces the contact side 104 of the substrate 102 facing away from the mounting side 103 of the substrate. Each connecting element 120 is soldered directly to the contact side 104 of the substrate 102 with the electrical contact surface 131 associated with the respective connecting element 120.
The connecting element 120 has a spring section 122 between the head section 121 and the connecting section 123, respectively, wherein the spring section 122 is provided with alternating bends. Each connecting element 120 has a first bending position 124, seen in the direction of its longitudinal extension L, from the head section 121. The first bending position 124 is preferably arranged up to 3mm behind the lateral edge 140 of the substrate 102, seen in the direction of the longitudinal extension L. The connecting element 120 is bent in a first bending position 124 towards the mounting side 103. For example, the connecting element 120 may be bent at an angle between 30 ° and 90 ° with respect to the flat contact surface 132. A second bending position 125 is arranged behind the first bending position 124, seen in the direction of the longitudinal extension L. The connecting element 120 can be bent back in the second bending position 125 toward the contact side 104 in such a way that the corresponding connecting section 123 of the connecting element 120 extends parallel to the contact surface 132 and the substrate 102. For example, the connecting element 120 can be bent back at the second bending position 125 by an angle of between 30 ° and 90 ° with respect to a linear section 127 arranged between the first bending position 124 and the second bending position 125.
As can be seen well in fig. 1, the module carrier 101 with the substrate 102 and the molding material 110 arranged thereon has a mounting height H in a direction perpendicular to the mounting side 103 of the substrate 102. The mounting height H may for example have a value between 2mm and 10 mm. The distance a between the side 133 of the connecting section 123 facing away from the contact side 104 and the contact surface 132 of the connecting element 121 is preferably between 60% and 100% of the mounting height H of the module carrier 101. Preferably, the connecting section 123 extends laterally away from the module carrier 101 in an area between a first plane extending through the contact side 104 and a second plane parallel to the first plane, which extends through the outer surface 134 of the molding material 110 facing away from the contact side 104.
Fig. 2a shows a top view of a second embodiment of a pressure sensor module according to the invention, in which the pressure sensor chip 105 is arranged directly on the substrate 102 by means of an adhesive layer 116. That is, in this embodiment, the molding material section 117 has been omitted, and the groove 150 in the molding material occupies the entire bottom of the void 111. Fig. 2b shows the same pressure sensor module in a perspective view from below, in which the pressure opening 118 can be seen. As can be seen well in fig. 2a and 2b, the module carrier 101 preferably has a compact cuboid geometry.
Fig. 3 shows a top view of the underside of a third embodiment of a pressure sensor module. In this embodiment, two pressure sensor chips 105 are arranged on the module carrier 101. In fig. 3, two pressure openings 118 can be seen, above which in each case one pressure sensor chip is arranged. The two pressure sensor chips 3 can be connected to the same control and evaluation circuit 107. It is also possible, however, to provide two separate control and evaluation circuits 107 on the substrate 102. Furthermore, it is naturally also possible to provide more than two pressure sensor chips.
Fig. 4a shows a schematic cross section of a fourth embodiment of a pressure sensor module 100 according to the invention, wherein the connection elements are not shown. In this embodiment, the pressure sensor module is provided for absolute pressure measurement or relative pressure measurement. Thus, no pressure openings 118 are provided in the substrate 102.
As can be seen in fig. 4a, the molding material 110 is applied here as in fig. 1 also partially on the bottom of the recess 111 to the mounting side 103 of the substrate 102, and the pressure sensor chip 105 is placed on the molding material on the bottom of the recess 111. As a result of the omission of the pressure opening 118, it is possible to arrange the ASIC circuit part 108 space-saving between the pressure sensor chip 105 and the substrate 102 inside the molding material section 117 of the molding material 110, seen in a direction perpendicular to the assembly side 103 of the substrate 102.
Fig. 4b shows a perspective view for this fourth embodiment. Fig. 4c shows a top view of the underside of this embodiment, which shows the shape and position of the head section 121 particularly well. Fig. 4d shows a side view of this embodiment.
Fig. 5 shows a cross section of an embodiment of a pressure sensor device 200 with a pressure sensor module 100 according to the invention. This embodiment may for example relate to a pressure sensor device for absolute pressure measurement or for relative pressure measurement. The pressure sensor device 200 has a housing 200 made of, for example, plastic. The housing can be constructed, for example, in two parts, with a housing base part 208 shown here and a housing cover, not shown here. The housing 200 has, for example, at least one pressure feed channel 201, which is arranged in a pressure sleeve extending from a housing base part 208. The pressure sensor module 100, for example the pressure sensor module shown in fig. 4a to 4d, is accommodated in a housing 200. As can be seen, the housing 200 has a slot-like housing receptacle 202. The pressure sensor module 100 is fastened in the groove-shaped housing receptacle 202 in such a way that it covers the pressure supply channel 201, wherein the side of the module carrier 101 provided with the gel cover 113 is preferably mounted directly above the pressure supply channel 201 and faces the pressure supply channel 201. The pressure sensor module 100 can be fastened in the housing receptacle 202 by means of a circumferential sealing adhesive that seals the pressure supply channel 201. Thus, the pressure in the pressure supply channel 201 can be transmitted to the pressure sensor chip 105 via the gel cover 113. The connecting elements 120 of the pressure sensor module 100 are each soldered with their connecting sections 123 to the conductor tracks 203 of the pressure sensor device 200. The conductor tracks 203 may be, for example, punched grid lines (Stanzgitterbahn) which are sprayed into the housing base part 208 and which are electrically connected to the plug pins 207 of the pressure sensor device 200. Fig. 6 shows that a stable solder connection 204 between the connection section 123 and the conductor track 203 can be produced easily.
Fig. 7 shows a cross section of a further embodiment of a pressure sensor device with a pressure sensor module 100 according to the invention. This embodiment may for example relate to a pressure sensor device for differential pressure measurement. The pressure sensor device 200 has a housing 200 made of, for example, plastic. The housing can be constructed in two parts, with a housing base part 208 and a housing cover 205. The housing 200 has, for example, a first pressure feed channel 201, which is connected to the fluid line element. Furthermore, the housing 200 has, for example, a second pressure feed channel 201a, which is fluidically connected to the external connection 201 b. A pressure sensor module 100, such as the pressure sensor module 100 shown in fig. 1, is housed in a housing 200. The sealing plate (DICHTSCHWERT) 206 arranged on the housing cover 205 can bear sealingly against the outer surface 134 of the module carrier 101, whereby a contact chamber 209 can be formed, which is sealed against the first pressure supply channel 201 and the second pressure supply channel 201 a.
As can be seen, the housing 200 has a slot-like housing receptacle 202. The pressure sensor module 100 is inserted into the groove-shaped housing receptacle 202 in such a way that the contact side 104 of the substrate 102 is arranged above the first pressure supply channel 201 of the pressure sensor device. The substrate 102 of the pressure sensor module 100 has a pressure opening 118, whose inner wall can preferably be delimited only by the material of the substrate 102 and which is fluidically connected to the first pressure supply channel 201. The contact side 104 can be bonded to the housing 200 by means of a sealing bond 212 in the housing receptacle 202 around the edge of the first pressure feed channel 201. The second pressure supply channel 201a is connected to a pressure chamber 211 in which the side of the pressure sensor module 100 provided with the gel cover 113 is also arranged. The seal bonding portion 211 isolates the first supply passage 201 from the pressure chamber 211. In this exemplary embodiment, the connecting elements 120 of the pressure sensor module 100 are each soldered with their connecting sections 123 to the conductor tracks 203 of the pressure sensor device 200.
According to the completely different design of the pressure sensor device in fig. 5 and 7, it can be seen how the pressure sensor module according to the invention can be flexibly installed. In all cases, a stable structure against the jitter load is achieved and a high dielectric resistance is ensured.

Claims (10)

1. A pressure sensor module (100) having a module carrier (101) with a substrate (102), wherein the substrate (102) has a mounting side (103), a pressure sensor chip (105) and a control and evaluation circuit (107) electrically connected to the pressure sensor chip (105) are arranged on the mounting side and electrically connected to a conductor track (130) of the substrate (102), wherein the control and evaluation circuit (107) has an ASIC circuit part (108) and a passive electrical component (109), wherein, in addition, A molding compound (110) which completely covers the ASIC circuit part (108) and the passive electrical component (109) on the substrate (102) is arranged on the assembly side (103) of the substrate (102), wherein the molding compound (110) has a recess (111) on the substrate (102), wherein the pressure sensor chip (105) is arranged in the recess (111) and is covered there with a gel cover (113), wherein an electrical contact surface (131) which is electrically connected to the control and evaluation circuit (107) is provided on a contact side (104) of the substrate (102) facing away from the assembly side (103), characterized in that the pressure sensor module (100) has electrical connection elements (120) which protrude from the module carrier (101), wherein the connection elements (120) each have a longitudinal extension (L), wherein the connection elements (120) each have a head section (121) at one end as seen in the direction of their longitudinal extension (L) and a connection section (123) at their end facing away from the head section (121), wherein the head section (121) has a greater width (B) in a plane parallel to the substrate (102) and perpendicular to the longitudinal extension (L) than the remaining sections of the respective connection element (120), Wherein the head section (121) of the respective connecting element (120) is configured with a flat contact surface (132) facing the contact side (104) of the substrate (102), which contact surface is welded directly to an electrical contact surface (131) associated with the respective connecting element (120) on the contact side (104) of the substrate (102), wherein the connecting element (120) has an elastic section (122) between the head section (121) and the connecting section (123), respectively, wherein the elastic section (122) has alternating bends, Wherein the respective connecting element (120) is bent, seen in the direction of its longitudinal extension (L), from the head section (121) in a first bending position (124) towards the mounting side (103) and is bent back in a second bending position (125) arranged behind the first bending position (124) in the direction of the longitudinal extension (L) towards the contact side (104) in such a way that the respective connecting section (123) of the connecting element (120) extends parallel to the contact surface (132).
2. The pressure sensor module according to claim 1, characterized in that the first bending position (124) is at most 3mm from a lateral edge (140) of the substrate (102) in the direction of the longitudinal extension (L).
3. Pressure sensor module according to claim 1 or 2, characterized in that the module carrier (101) with the substrate (102) and the molding material (110) arranged thereon has a mounting height (H) in a direction perpendicular to the mounting side (103) of the substrate (102), and that the distance (a) of the side (133) of the connection section (123) facing away from the contact side (104) from the contact face (132) of the connection element (120) is between 60% and 100% of the mounting height (H) of the module carrier (101).
4. A pressure sensor module according to claim 3, characterized in that the connection section (123) extends laterally away from the module carrier (101) in a region extending between a first plane through the contact side (104) and a second plane parallel to the first plane, which extends through an outer surface (134) of the molding material (110) facing away from the contact side (104).
5. Pressure sensor module according to claim 1 or 2, characterized in that the molding material (110) is applied in part also on the bottom of the recess (111) onto the assembly side (103) of the substrate (102), that the pressure sensor chip (105) is placed on the molding material on the bottom of the recess (111), and that the ASIC circuit part (108) is arranged in a molding material section (117) of the molding material (110) between the pressure sensor chip (105) and the substrate (102) as seen in a direction perpendicular to the assembly side (103) of the substrate (102).
6. The pressure sensor module according to claim 1 or 2, characterized in that the substrate (102) has a pressure opening (118), the inner wall of which is limited only by the material of the substrate (102).
7. The pressure sensor module of claim 1 or 2, wherein a plurality of pressure sensor chips are arranged on the substrate.
8. Pressure sensor device with a pressure sensor module according to one of claims 1 to 7, characterized in that the pressure sensor device (200) has a housing with at least one pressure supply channel (201), the pressure sensor module (100) being accommodated in the housing in such a way that the pressure sensor module (100) is fastened in a housing receptacle (202) and covers the pressure supply channel (201) there, wherein the connecting elements (120) are each welded with the connecting sections (123) to the conductor tracks (203) of the pressure sensor device (200).
9. Pressure sensor device according to claim 8, characterized in that the pressure sensor module (100) is mounted above the pressure supply channel (201) with the side of the module carrier (101) provided with the gel cover (113).
10. The pressure sensor device according to claim 8, characterized in that the substrate (102) of the pressure sensor module (100) has a pressure opening (118), the inner wall of which is delimited only by the material of the substrate (102), and that the contact side (104) of the substrate (102) is arranged above the pressure feed channel (201) of the pressure sensor device, so that the pressure opening (118) is fluidically connected to the pressure feed channel (201), and that the contact side (104) is bonded to the housing by means of a sealing bond in the housing receptacle (202) around the edge of the pressure feed channel (201).
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