CN109755232A - A kind of the four-in-one LED display module and its display screen of Optimization-type - Google Patents
A kind of the four-in-one LED display module and its display screen of Optimization-type Download PDFInfo
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- CN109755232A CN109755232A CN201910097864.2A CN201910097864A CN109755232A CN 109755232 A CN109755232 A CN 109755232A CN 201910097864 A CN201910097864 A CN 201910097864A CN 109755232 A CN109755232 A CN 109755232A
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Abstract
The present invention provides the four-in-one LED display modules and its display screen of a kind of Optimization-type, including substrate, the substrate front side is equipped with patterned line layer, the patterned line layer includes several functional areas, the substrate back is equipped with several lower pads, the corresponding lower pad in each functional areas, is connected by the conductive hole through substrate；Four luminescence units, four luminescence units are arranged in square array and are located at substrate front side, and each luminescence unit includes A chip, B chip and C chip；Four luminescence units are wrapped on substrate by light transmission glue-line, the light transmission glue-line.Substrate of the invention is in addition to Pin locations, no via hole, reduces technical difficulty, the structural strength for increasing substrate, reduces costs；Base plate bottom can not need solder mask；In the case of lead copper foil and via hole orifice ring, solder mask can be accomplished to be lower than pin pad height；Improve the reliability of welding yield and welding.
Description
Technical field
The present invention relates to SMD LED(Surface Mounted Devices, surface mount devices) encapsulation technology, it is special
It is not to be related to the four-in-one LED display module and its display screen of a kind of Optimization-type.
Background technique
LED display is used with its high brightness, weatherability in advertisement, stage, public information display, sport means of transportation etc.
It is widely applied in field.LED display is divided into monochromatic screen, double-colored screen and full-color screen by display color.Full-color LED display screen
Most critical component be LED component.It is the key that usage quantity at most device in full-color panel type display that reason, which has three: the first, LED,
Part, every square metre can all use thousands of to tens of thousands of LED；Second, LED are the main body for determining whole screen optics display performance, direct shadow
Ring evaluation of the spectators to display screen；Third, LED proportion in display screen overall cost is maximum, and from 30% to 70% etc..
With the progress of LED core chip technology and LED encapsulation technology, the brightness of SMD and degree of protection have been able to meet outdoor application
Demand, and SMD is used for outdoor full color SMD display screen, has extra small pixel spacing, high production efficiency, horizontal vertical angle
Greatly, the advantages that color blending effect is good, contrast is high, therefore obtain quick application.
Although LED display haves many advantages, such as, there is also many areas for improvement to restrict LED display
Development, one of them is the low problem of single packaging efficiency.In existing SMD LED manufacture, product generally uses PLCC4
Structure (such as 3528,2121,1010 equal-specifications), but above structure is all individually to exist, it in actual production, can only be one one
A patch, production efficiency is low, and maintenance difficulty is big, and especially when LED display produces, the quantity of the LED used is usually
The order of magnitude up to ten thousand or even up to a million, when producing small sized product, such as the specification and following specification of 1.0mm*1.0mm
When, the production difficulty of product is multiplied, and the mechanical strength of product also can be very low, is easy to damage under external force, produces
Efficiency also can be very low, and the requirement to mounting device also can be very high.
In order to solve this problem, the Chinese patent of notification number CN106847801A, CN106847800A uses Encapsulation Moulds
The form of group, as shown in Figure 1, encapsulating multiple groups RGB-LED chip in i.e. same mould group.But when using this kind of encapsulation module,
The number of pads at the mould group back side will be very more, such as tetrad RGB-LED encapsulation module, place in encapsulation module as shown in Fig. 2, working as
When 4 groups of RGB-LED chips, the quantity of backside pads just up to 16, under small spacer conditions, this considerably increases pcb boards to set
The difficulty and welding difficulty of meter.
In order to solve the problem of the more complex circuit designs of modularity packaging pin quantity, notification number CN108511431A
Chinese patent provide a kind of LED display unit group and display panel, by encapsulating n × m pixel unit together, formed
One display unit group increases the volume of single display unit group, and welding is facilitated to operate；In addition, in single display unit group,
Pin number increases, and the solder joint contacted with pcb board increases, and then improves the fastness of welding.
But the program equally there is also some problems.First is that as shown in figure 3, its substrate front side pad and pin on back surface it
Between need to be electrically connected by via hole and metal routing；Device substrate central bore increases technical difficulty, reduces base
The structural strength of plate increases cost；Second is that as shown in figure 4, its back side via hole orifice ring and metal routing and bottom legs spacing
It is limited, it is easy to be connected to form short circuit by scolding tin in welding, it is therefore desirable in bottom print solder mask or there is insulation performance
Material, and require via hole and lead are effectively covered；Increase process difficulty and cost；If solder mask covering is improper, can lead
Cause short circuit.On the other hand, back side via hole orifice ring and metal routing have certain altitude, and after printing solder mask, whole height can be high
In pad height of pin；Carrying out SMT(Surface Mount Technology, i.e. surface mount) welding when, due to bottom
Solder mask is higher by pin, is easy to cause scolding tin poor contact, forms rosin joint.In addition, even if having printed solder mask, in practical application
In, solder mask is also easy to fall off, and directly affects the reliability of product.
Therefore, the existing technology needs to be improved and developed.
Summary of the invention
The purpose of the present invention is to provide the four-in-one LED display modules and its display screen of a kind of Optimization-type, can also claim
For 1 LED encapsulation module of the tetrad of Optimization-type, mini COB or 4 in, aim to solve the problem that existing LED encapsulation module
And the problems such as LED display punching is more, and substrate bottom surface is easy to cause short circuit, rosin joint, high solder mask there are metal routing, Yi Jisheng
Produce problem at high cost.
To solve the above problems, technical scheme is as follows:
A kind of four-in-one LED display module of Optimization-type, comprising:
Substrate, the substrate front side are equipped with patterned line layer, and the patterned line layer includes several functional areas, the base
Back is equipped with several lower pads, and the corresponding lower pad in each functional areas is connected by the conductive hole through substrate；
Four luminescence units, four luminescence units are arranged in square array and are located at substrate front side, each luminescence unit
It include A chip, B chip and C chip, the A chip, B chip and C chip are uniformly in row arrangement or column arrangement, position
In the middle position of the luminescence unit region, it is fixed on the functional areas by conducting resinl or insulating cement；
Four luminescence units are wrapped on substrate by light transmission glue-line, the light transmission glue-line；
Wherein, the functional areas include copolar area and chip bonding pad, and the chip bonding pad includes A chip bonding pad, B chip
Bonding pad and C chip bonding pad, each chip of the luminescence unit are equipped with first electrode and second electrode, and described second
Electrode and first electrode polarity are on the contrary, in four luminescence units, the first electrode of all chips of the first row luminescence unit
It being electrically connected with the first copolar area, the first electrode of all chips of the second row luminescence unit is electrically connected with the second copolar area, and first
The second electrode of the A chip of column luminescence unit is electrically connected with the first A chip bonding pad, and the of the A chip of secondary series luminescence unit
Two electrodes are electrically connected with the 2nd A chip bonding pad, and the second electrode of the B chip of first row luminescence unit is connect with the first B chip
Area's electrical connection, the second electrode of the B chip of secondary series luminescence unit connect with the 2nd B chip bonding pad, and the of first row C chip
Two electrodes are electrically connected with the first C chip bonding pad, and the second electrode of secondary series C chip is electrically connected with the 2nd C chip bonding pad；
The copolar area is distributed in two sides opposite on substrate column direction, and the route of the chip bonding pad is set along substrate column direction
It sets, the route of a chip bonding pad is at most arranged in the region between the chip and substrate edges of the luminescence unit.
The four-in-one LED display module of the Optimization-type, wherein the A chip of each luminescence unit, B chip with
And the quantity of C chip is at least one, the A chip is blue chip, and B chip is green light chip, and C chip is feux rouges core
Piece.
The four-in-one LED display module of the Optimization-type, wherein the A chip, B chip, C chip are bipolar electrode core
Piece or single electric grade chip pass through lead or conducting resinl and the function through insulating cement or conducting resinl die bond on the functional areas
It can area's realization electrical connection.
The four-in-one LED display module of the Optimization-type, wherein the A chip, B chip and C chip are arranged along substrate
The angle of direction arrangement, the long axis direction and substrate line direction of the A chip and/or C chip is greater than zero.
The four-in-one LED display module of the Optimization-type, wherein the first electrode is anode, and second electrode is yin
Pole, the A chip and B chip are bipolar electrode chip, and the C chip is single electric grade chip of the cathode in chip bottom, described two
A B chip bonding pad is distributed in two sides opposite on substrate line direction, and two C chip bonding pads are distributed in phase on substrate line direction
Extend to opposite sides of the B chip bonding pad on the inside of the substrate and along substrate column direction, two A chip bonding pads are distributed in substrate
Opposite two sides and extend to place vacant on the inside of substrate on line direction；The A chip and B of luminescence unit in the first row first row
Chip die bond is on the first A chip bonding pad, and C chip die bond is on the first C chip bonding pad；Hair in the first row secondary series
The A chip and B chip die bond of light unit are on the 2nd A chip bonding pad, and C chip die bond is on the 2nd C chip bonding pad；It is in
All chip die bonds of the luminescence unit of second row first row are on the first C chip bonding pad；Hair in the second row secondary series
All chip die bonds of light unit are on the 2nd C chip bonding pad.
The four-in-one LED display module of the Optimization-type, wherein the first electrode is cathode, and second electrode is sun
Pole, the A chip and B chip are bipolar electrode chip, and the C chip is single electric grade chip of the cathode in chip bottom, described two
A B chip bonding pad is distributed in two sides opposite on substrate line direction, and two C chip bonding pads are distributed in phase on substrate line direction
To opposite sides of the B chip bonding pad on the inside of substrate, two A chip bonding pads are distributed in two sides opposite on substrate line direction
And extend to vacant place on the inside of substrate；The A chip and B chip die bond of luminescence unit in the first row first row are in the first A core
On piece bonding pad, C chip die bond is in the first copolar area；The A chip and B chip of luminescence unit in the first row secondary series are solid
Crystalline substance is on A chip bonding pad, and C chip die bond is in the first copolar area；The A chip of luminescence unit in the second row first row
With B chip die bond on the first C chip bonding pad, C chip die bond is in the second copolar area；Shining in the second row secondary series
The A chip and B chip die bond of unit are on the 2nd C chip bonding pad, and C chip die bond is in the second copolar area.
The four-in-one LED display module of the Optimization-type, wherein the conductive hole is located on the inside of substrate or substrate side
Edge, if the conductive hole is located on the inside of substrate, the aperture of the conductive hole is less than 0.2mm；If the conductive hole is located at substrate side
Edge, the conductive hole are the semicircle orifice or 1/4 circular hole of large aperture.
The four-in-one LED display module of the Optimization-type, wherein be provided between the adjacent luminescence unit virtual
Isolated area, the virtual isolated area include the dark light-absorption layer being disposed on the substrate.
The four-in-one LED display module of the Optimization-type, wherein the substrate back is additionally provided with male and female face, described
Male and female face has two different colors, for identification the direction of the display module.
A kind of four-in-one LED display of Optimization-type, wherein the four-in-one LED including Optimization-type as described above is shown
Mould group.
The beneficial effect comprise that the four-in-one LED display module of a kind of Optimization-type provided by the invention and its aobvious
Display screen, device substrate is in addition to Pin locations, no via hole；It reduces technical difficulty, the structural strength for increasing substrate, reduce
Cost；Device substrate bottom is in addition to pin pad, without other lead copper foils and via hole orifice ring；Therefore bottom can not need to hinder
Layer；In the case of lead copper foil and via hole orifice ring, solder mask can be accomplished to be lower than pin pad height；Improve welding yield
With the reliability of welding, a chip bonding pad is at most arranged in the region between the chip and substrate edges of the luminescence unit
Route, can be adapted for the manufacture of the display module of smaller spacing.
Detailed description of the invention
Fig. 1 is a kind of existing Facad structure schematic diagram of the encapsulation module of the surface-adhered type of four-in-one.
Fig. 2 is a kind of existing backside structure schematic diagram of the encapsulation module of the surface-adhered type of four-in-one.
Fig. 3 is a kind of existing Facad structure schematic diagram of LED display unit.
Fig. 4 is a kind of existing backside structure schematic diagram of LED display unit.
Fig. 5 is a kind of positive structure schematic of the four-in-one LED display module of Optimization-type provided by the invention.
Fig. 6 is a kind of structure schematic diagram of the four-in-one LED display module of Optimization-type provided by the invention.
Fig. 7 is the circuit connection diagram of the four-in-one LED display module of Optimization-type provided by the invention.
Fig. 8 is the positive structure schematic of the four-in-one LED display module of another Optimization-type provided by the invention.
Fig. 9 is the structure schematic diagram of the four-in-one LED display module of another Optimization-type provided by the invention.
Figure 10 is the positive structure schematic of the four-in-one LED display module of another Optimization-type provided by the invention.
Figure 11 is the structure schematic diagram of the four-in-one LED display module of another Optimization-type provided by the invention.
Figure 12 is the structure schematic diagram of the four-in-one LED display module of another Optimization-type provided by the invention.
Figure 13 is the structure schematic diagram of the four-in-one LED display module of another Optimization-type provided by the invention.
Figure 14 is the Facad structure signal of the four-in-one LED display module of another common cathode Optimization-type provided by the invention
Figure.
Figure 15 is the backside structure signal of the four-in-one LED display module of another common cathode Optimization-type provided by the invention
Figure.
Figure 16 is the Facad structure signal of the four-in-one LED display module of another common cathode Optimization-type provided by the invention
Figure.
Figure 17 is the backside structure signal of the four-in-one LED display module of another common cathode Optimization-type provided by the invention
Figure.
Figure 18 is the circuit connection diagram of the four-in-one LED display module of common cathode Optimization-type provided by the invention.
Description of symbols: 100, substrate；200, patterned line layer；201, the first copolar area；202, the second copolar area；
203, the first A chip bonding pad；204, the 2nd A chip bonding pad；205, the first B chip bonding pad；206, the 2nd B chip connects
Area；207, the first C chip bonding pad；208, the 2nd C chip bonding pad；300, luminescence unit；301, A chip；302, B chip；
303, C chip；3011, first electrode；3012, second electrode；400, lower pad；500, conductive hole；600, dark light-absorption layer；
700, male and female face.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", etc. instruction
Orientation or positional relationship be based on the orientation or positional relationship shown in the drawings, be merely for convenience of description the present invention and simplification retouch
It states, rather than the device or element of indication or suggestion meaning must have a particular orientation, be constructed and operated in a specific orientation,
Therefore it is not considered as limiting the invention.In the description of the present invention, it should be noted that unless otherwise specific regulation
And restriction, term " installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, be also possible to removable
Connection is unloaded, or is integrally connected；It can be mechanical connection, be also possible to be electrically connected or can mutually communicate；It can be direct phase
Even, can also indirectly connected through an intermediary, the interaction that can be connection or two elements inside two elements is closed
System.For the ordinary skill in the art, above-mentioned term in the present invention specific can be understood as the case may be
Meaning.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower"
It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it
Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above "
Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of
First feature horizontal height is less than second feature.
Following disclosure provides many different embodiments or example is used to realize different structure of the invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
It referring to figs. 5 and 6, is a kind of embodiment of the four-in-one LED display module of Optimization-type provided by the invention.At this
In embodiment, the display module specific structure includes:
One substrate 100, for substrate 100 for carrying luminescence unit and being electrically connected, 100 front of substrate is equipped with patterned lines
Road floor 200, patterned line layer 200 include several functional areas, and 100 back side of substrate is equipped with several lower pads 400, Mei Gegong
The corresponding lower pad 400 in energy area, the conductive hole 500 passed through through substrate connect.In actual production, substrate 100 can select
With pcb board, copper-clad plate, FR-4 plate or other kinds of printed circuit board, it is preferable that it is exhausted that substrate 100, which can select middle layer,
Edge material, the substrate of double-sided copper-clad form patterned line layer in substrate front side by techniques such as etchings in actual production
200, lower pad 400 is formed in substrate back.In actual production, the position of conductive hole 500 can be located at substrate frontside edge,
The edge of substrate 100 can not also be located at, in the present embodiment, conductive hole 500 is not at the edge of substrate 100, under corresponding
Pad 400 is not also at the edge of substrate 100.The aperture of conductive hole 500 is less than 0.2mm in this embodiment.Conductive hole 500 is not
In substrate frontside edge, then the edge of Metal Cutting is not present in mould group edge, ensure that the air-tightness and reliability of mould group.About
The position present invention of lower pad 400 and without limitation, can be on the inside of 100 back side four edges edge of substrate, each edge is divided
Cloth two lower pads 400；It is also possible to there are two sides to be respectively distributed three lower pads 400 as shown in Figure 9, two other side is respectively distributed
One lower pad 400；It can also be that each edge as shown in figure 11 is respectively distributed a lower pad 400, each point of the intersection of each edge
Cloth one lower pad 400.
As shown in figure 5, in 100 front setting of substrate, there are four luminescence unit 300, four luminescence units 300 arrangements
Squarely array is located at 100 front of substrate, and each luminescence unit includes A chip 301, B chip 302 and C chip
303.In practical applications, the quantity of the A chip 301 of each luminescence unit 300, B chip 302 and C chip 303 is at least
One, in the present embodiment, the quantity of the A chip 301 of each luminescence unit, B chip 302 and C chip 303 is one.
In practical applications, A chip 301, B chip 302 and C chip 303 can be red light chips, green light chip and blue chip
Combination, in the present embodiment, A chip 301 be blue chip, B chip 302 be green light chip, C chip 303 be red light chips.
In practical applications, A chip 301, B chip 302 and C chip 303 can be single electric grade chip, bipolar electrode chip or upside-down mounting core
In piece any one and combinations thereof.In the present embodiment, A chip 301 and B chip 302 are bipolar electrode chip, i.e., positive assembling structure
Chip, the first electrode 3011 and second electrode 3012 of chip are respectively positioned on chip top surface, and C chip 303 is single electric grade chip, that is, hang down
Straight fabric chip, in this embodiment, the first electrode 3011 of C chip 303 is in chip top surface, and second electrode 3012 is at chip bottom
Portion.Then two electrodes of A chip 301 and B chip 302 can be realized with corresponding functional areas by lead and are electrically connected, C chip 303
First electrode 3011 can realize by lead with corresponding functional areas and be electrically connected that second electrode 3012 can be directly solid by conducting resinl
Crystalline substance realizes electrical connection on functional areas, and A chip 301 and B chip 302 are then by insulating cement die bond on functional areas.
It is also covered with one layer of light transmission glue-line (not shown) on four luminescence units 300, the light transmission glue-line is by four
A package of luminescence unit 300 is on the substrate 100.In actual production, the light transmission glue-line can be molded into base by mould pressing process
On plate, four luminescence units 300 are covered.The presence of one side light transmission glue-line can form luminescence unit 300 and protect, and reinforce
On the other hand the mechanical strength of display module can carry out light mixing to the light that three kinds of chips issue in luminescence unit 300, ensure that
The illumination effect of luminescence unit.
As shown in figure 5, the functional areas include two A chip bonding pads, two B chip bonding pads, two C chip connections
Area and Liang Ge copolar area, i.e. the first copolar area 201, the second copolar area 202, the first A chip bonding pad 203, the 2nd A chip connect
Connect area 204, the first B chip bonding pad 205, the 2nd B chip bonding pad 206, the first C chip bonding pad 207 and the 2nd C chip
Bonding pad 208.Each chip of the luminescence unit 300 is equipped with first electrode 3011 and second electrode 3012, and described second
On the contrary, in the present embodiment, first electrode 3011 is anode, second electrode 3012 is for electrode 3012 and 3011 polarity of first electrode
Cathode.In four luminescence units 300, the first electrode 3011 of all chips of the first row luminescence unit 300 and first is total to
Polar region 201 is electrically connected, and the first electrode 3011 of all chips of the second row luminescence unit 300 is electrically connected with the second copolar area 201,
The second electrode 3012 of the A chip 301 of first row luminescence unit 300 is electrically connected with the first A chip bonding pad 203, secondary series hair
The second electrode 3012 of the A chip 301 of light unit 300 is electrically connected with the 2nd A chip bonding pad 204, first row luminescence unit 300
The second electrode 3012 of B chip 302 be electrically connected with the first B chip bonding pad 205, the B chip of secondary series luminescence unit 300
302 second electrode 3012 is connect with the 2nd B chip bonding pad 206, the second electricity of the C chip 303 of first row luminescence unit 300
Pole 3012 is electrically connected with the first C chip bonding pad 207, the second electrode 3012 of the C chip 303 of secondary series luminescence unit 300 with
The electrical connection of 2nd C chip bonding pad 208；
Described two copolar areas are distributed in two sides opposite on 100 column direction of substrate, in the present embodiment, the first copolar area 201
It is distributed in the positive top of substrate 100, the second copolar area 202 is then distributed in the positive lower part of substrate 100.Two B chip connections
Area is distributed in two sides opposite on 100 line direction of substrate, and in the present embodiment, the first B chip bonding pad is being distributed in substrate 100 just
The left part in face, the 2nd B chip bonding pad are distributed in the positive right part of substrate 100.Two C chip bonding pads are distributed in substrate 100
Opposite sides on line direction with respect to B chip bonding pad on the inside of the substrate simultaneously extends along substrate column direction, as shown in figure 4, at this
In embodiment, the first C chip bonding pad, close to the inside of substrate 100, and upwardly extends, the 2nd C with respect to the first B chip bonding pad
Chip bonding pad, close to the inside of substrate 100, and is upwardly extended with respect to the 2nd B chip bonding pad.Two A chip bonding pad distributions
Opposite two sides and extend to place vacant on the inside of substrate on substrate line direction.
The A chip 301 of luminescence unit 300 in the first row first row is connected with 302 die bond of B chip in the first A chip
In area 203,303 die bond of C chip is on the first C chip bonding pad 207；The A core of luminescence unit 300 in the first row secondary series
Piece 301 and 302 die bond of B chip are on the 2nd A chip bonding pad 204, and 303 die bond of C chip is on the 2nd C chip bonding pad 208；
All chip die bonds of luminescence unit 300 in the second row first row are on the first C chip bonding pad 207；In the second row
All chip die bonds of the luminescence unit 300 of secondary series are on the 2nd C chip bonding pad 208.First copolar area 201 and
The corresponding lower pad 400 in two copolar area 202 is located at 100 back side column direction opposite sides of substrate, the first A chip bonding pad
203 corresponding lower pads 400 are located at the upper left corner at 100 back side of substrate, the corresponding lower pad in the first A chip bonding pad 204
400 be located at 100 back side of substrate the upper right corner, the first B chip bonding pad 205 and the 2nd B chip bonding pad 206 it is corresponding under
Pad 400 is located at 100 back side line direction opposite sides of substrate, the corresponding lower pad 400 in the first C chip bonding pad 207
In the lower left corner at 100 back side of substrate, the corresponding lower pad 400 in the 2nd C chip bonding pad 208 is located at the bottom right at 100 back side of substrate
Angle.
It should be noted that the description as described in ranks orientation in above-described embodiment, can also be adjusted in practical applications
It changes, this is the simple transformation that those of ordinary skill in the art can carry out according to foregoing description, still falls within protection model of the invention
It encloses.
By the ingenious arrangement above to basic 100 positive patterned line layers 200 and luminescence unit 300, so that aobvious
Showing that the connection of each functional areas of mould group is respectively positioned on the front of substrate 100,100 back side of substrate does not have any metal routing, and one
Aspect the problems such as there is no the short circuits as caused by back metal cabling, on the other hand because the present invention is without at 100 back side of substrate
Metal routing is set, and also just not extra conductive hole on substrate, punching quantity is opposite to be reduced, and substrate back is hindered without coating
Layer further reduces the technological process of production, to reduce production cost.
In addition, four luminescence units 300 are arranged in square array, each luminescence unit 300 have two cutting edges and
Two common edges are all unified independent pixels, ensure that the consistency of its illumination effect.Since luminescence unit 300 is as only
Standing statue element, the position in mould group be all it is unified, chip should be respectively positioned on pixel center position, for patterned line layer
For 200, the chip of luminescence unit 300 to the space of substrate frontside edge it is opposite be it is fixed, available space is also opposite
Fixed.With the diminution of display module size, this segment space further compresses, and the space of energy cabling also will further subtract
It is small.In order to adapt to small spacing display module production, as shown in figure 5, the present invention luminescence unit 300 chip to substrate
One piece of bonding pad is only arranged in frontside edge position, for example, first row luminescence unit 300 chip to 100 left edge of substrate it
Between, it is provided only with the first B chip bonding pad 205, and by the first A chip bonding pad 201 then pass through 100 opposite chip of substrate
Inside is routed.The positive space of substrate 100 can be efficiently used by being designed in this way, so that the present invention be made to be suitable for smaller spacing
Product.
It is the circuit structure diagram of Fig. 5-embodiment shown in fig. 6 referring to Fig. 6 ,+1 and+2 be the anode of the power supplys of connection,
B1, G1, R1, B2, G2, R2 connect the cathode of power supply, 8 lower pads 400 of corresponding above-described embodiment.
It is another embodiment of the four-in-one LED display module of Optimization-type provided by the invention referring to Fig. 8 and Fig. 9.?
In the embodiment, basic structure is identical as Fig. 5-embodiment shown in fig. 6.The difference is that the conductive hole of the embodiment
500 are located at the edge of substrate 100, semicircular in shape.In actual production, adjacent display module can share conductive hole 500, in life
Cutting substrate 100, formation mould group can effectively reduce the quantity of conductive hole 500, simplify technique again when production.Preferably, in practical life
In production can in conductive hole fill insulant, such as ink, resin, can avoid subsequent when being molded light transmission glue-line, light transmission
The glue of glue-line enters in conductive hole 500, avoids light transmission glue from the lower pad 400 that conductive hole 500 spills into 100 back side of substrate,
The processes such as test, welding are influenced, or mould group is caused to fail.
It is another embodiment of the four-in-one LED display module of Optimization-type provided by the invention referring to Figure 10 and Figure 11.
In this embodiment, basic structure is identical as Fig. 5-embodiment shown in Fig. 9.The difference is that the conduction of the embodiment
Hole 500 is semicircle orifice or a quarter circular hole, further reduces total punching quantity.In this embodiment, A chip 301
The angle of long axis direction and 100 line direction of substrate is greater than zero.In practical applications, the long axis of A chip 301 and/or B chip 302
The angle of direction and 100 line direction of substrate is greater than zero.On the one hand the purpose being designed in this way can reduce chip die bond position
Width is conducive to the area for further reducing substrate 100, to be adapted to the production of the display module of smaller spacing, on the other hand
The chip of each luminescence unit 300 can be made to be consistent, can disposably complete die bond when carrying out die bond process.It is asked about this
Topic, in embodiment as shown in Figure 10, B chip 302 is bipolar electrode chip, first electrode 3011 and second electrode 3012
Position opposite is fixed, and bonding wire for convenience, and the B chip 302 of the B chip 302 of first row and secondary series is in the plane
Direction be it is opposite, need the B chip 302 of first die bond first row in actual production, then by 302 Plane Rotation 180 degree of B chip
Again in die bond to secondary series.If not such die bond, secondary series B chip 302 will make lead be covered on chip in bonding wire
On, light efficiency is influenced, also inconvenient bonding wire.And in this embodiment, A chip 301 is in such a way that inclination is put, so that all A
The problem of 301 direction of chip is consistent, and can disposably complete die bond, and B chip 302 is not present.C chip 303 is then using single
The problem of electric grade chip, also just there is no electrode directions.It in practical applications, can also be equal using A chip 301 and B chip 302
To tilt the mode put.
Above embodiments are the embodiment of no virtual isolated area.As shown in Figure 10, in this embodiment, adjacent to shine
Virtual isolated area is provided between unit 300, the virtual isolated area includes the dark light-absorption layer 600 of setting on the substrate 100.
The color of the dark color light-absorption layer 600 is black, Dark grey, darkviolet, blackish green, navy blue, the one of which in dark brown,
The dark color light-absorption layer may include that carbon black, graphite, carbon nanotube, melanin, iron oxide black, graphene or other same type dark colors are inhaled
One of luminescent material or a variety of combinations.The setting of virtual isolated area can effectively absorb the interference between adjacent light-emitting units
Light, on the other hand, virtual isolated area are disposed on the substrate, the main light for absorbing adjacent area bottom, in practical application,
Deep Canvas can be formed, its display effect is further strengthened.
As shown in figure 11,100 back side of substrate is provided with male and female face 700, the male and female face 700 has two different face
Color, for identifying the direction of the display module in production.In the present embodiment, male and female face 700 is the group of white and black
It closes, in actual production, male and female face can be obtained by coating printing ink, can coat the ink for the color that two kinds are easily distinguished, such as black
Color ink and white ink, wherein black ink may be the ink of the colors such as dark, blackish green, or directly half coating
White ink layer, the other half is not coated by, and is distinguish by means of the color of substrate itself.
Referring to Figure 12 and Figure 13, the arrangement mode of the lower pad 400 at 100 back side of substrate of the present invention is in addition to above-described embodiment
Outside arrangement mode, two lower pads 400 can also be set in the every side of substrate 100 as shown in Figure 12 or 13, it is corresponding only to need
It adjusts the punch position of conductive hole 500 and positive patterned line layer is adaptively adjusted.Wherein shown in Figure 12
Embodiment using half pass conductive hole 500, embodiment shown in Figure 13 using pinhole type conductive hole 500.
It is a kind of four-in-one LED display module of common cathode Optimization-type provided by the invention referring to Figure 14-Figure 15.In the reality
It applies in example, first electrode 3011 is cathode, and second electrode 3012 is anode, and A chip 301 uses the blue chip of bipolar electrode, B
Chip 302 uses the green light chip of bipolar electrode, and C chip uses single electric grade chip of the cathode under.This kind of chip portfolio side
Formula is combination current currently on the market, and opposite cost is relatively low.Certainly, the present invention can also use other chipsets
Conjunction mode, such as C chip also use the red light chips of bipolar electrode chip, and only patterned line layer need to be adaptively adjusted i.e.
Can, these combinations should also fall into protection scope of the present invention.
In this embodiment, the first copolar area 201 is divided into three parts, participates in Figure 14, and a portion is located at substrate
100 the first row central regions, in addition two parts carry two C chips of two luminescence units of the first row respectively, the two first
201 region of copolar area passes through lead respectively and connect with the first copolar area 201 for being located at central region.Preferably, in order to reinforce connecting
Intensity is connect, avoids failing, two leads can be welded simultaneously.First B chip bonding pad 205 and the 2nd B chip bonding pad 206 difference
It is distributed in the opposite sides of 100 line direction of substrate.First C chip bonding pad 207 and the 2nd C chip bonding pad 208 are distributed in base
Opposite sides on 100 line direction of plate with respect to B chip bonding pad on the inside of substrate, the first A chip bonding pad 203 and the 2nd A core
Piece bonding pad 204 is distributed in two sides opposite on 100 line direction of substrate and extends to the 100 vacant place in inside of substrate；In first
The A chip 301 and 302 die bond of B chip of the luminescence unit of row first row are on the first A chip bonding pad 203,303 die bond of C chip
In the first copolar area 201；The A chip 301 and 302 die bond of B chip of luminescence unit in the first row secondary series are in the 2nd A core
On piece bonding pad 204,303 die bond of C chip is in the first copolar area 201；The A chip of luminescence unit in the second row first row
301 and B chip, 302 die bond is on the first C chip bonding pad 207, and 303 die bond of C chip is in the second copolar area 202；In
For the A chip 301 and 302 die bond of B chip of the luminescence unit of two row secondary series on the 2nd C chip bonding pad 208, C chip 303 is solid
Crystalline substance is in the second copolar area 202.
Embodiment basic structure shown in Figure 16-Figure 17 is identical as Figure 14-embodiment shown in figure 15, and difference is figure
Embodiment shown in 16- Figure 17 using half bore conductive hole 500 mode.
It is Figure 14-embodiment illustrated in fig. 17 circuit connection diagram, using altogether in the two embodiments referring to Figure 18
The mode of yin is attached, and used in the examples shown in Fig. 5-Figure 11 is that the mode of common anode is attached, and should be infused
Meaning, no matter protection scope of the present invention should all be fallen into using common cathode or the connection type of common anode.
It should be understood that the application of the present invention is not limited to the above for those of ordinary skills can
With improvement or transformation based on the above description, all these modifications and variations all should belong to the guarantor of appended claims of the present invention
Protect range.
Claims (10)
1. a kind of four-in-one LED display module of Optimization-type characterized by comprising
Substrate, the substrate front side are equipped with patterned line layer, and the patterned line layer includes several functional areas, the base
Back is equipped with several lower pads, and the corresponding lower pad in each functional areas is connected by the conductive hole through substrate；
Four luminescence units, four luminescence units are arranged in square array and are located at substrate front side, each luminescence unit
It include A chip, B chip and C chip, the A chip, B chip and C chip are uniformly in row arrangement or column arrangement, position
In the middle position of the luminescence unit region, it is fixed on the functional areas by conducting resinl or insulating cement；
Four luminescence units are wrapped on substrate by light transmission glue-line, the light transmission glue-line；
Wherein, the functional areas include copolar area and chip bonding pad, and the chip bonding pad includes A chip bonding pad, B chip
Bonding pad and C chip bonding pad, each chip of the luminescence unit are equipped with first electrode and second electrode, and described second
Electrode and first electrode polarity are on the contrary, in four luminescence units, the first electrode of all chips of the first row luminescence unit
It being electrically connected with the first copolar area, the first electrode of all chips of the second row luminescence unit is electrically connected with the second copolar area, and first
The second electrode of the A chip of column luminescence unit is electrically connected with the first A chip bonding pad, and the of the A chip of secondary series luminescence unit
Two electrodes are electrically connected with the 2nd A chip bonding pad, and the second electrode of the B chip of first row luminescence unit is connect with the first B chip
Area's electrical connection, the second electrode of the B chip of secondary series luminescence unit connect with the 2nd B chip bonding pad, and the of first row C chip
Two electrodes are electrically connected with the first C chip bonding pad, and the second electrode of secondary series C chip is electrically connected with the 2nd C chip bonding pad；
The copolar area is distributed in two sides opposite on substrate column direction, and the route of the chip bonding pad is set along substrate column direction
It sets, the route of a chip bonding pad is at most arranged in the region between the chip and substrate edges of the luminescence unit.
2. the four-in-one LED display module of Optimization-type according to claim 1, which is characterized in that each luminous list
The A chip of member, the quantity of B chip and C chip are at least one, and the A chip is blue chip, and B chip is green light core
Piece, C chip are red light chips.
3. the four-in-one LED display module of Optimization-type according to claim 2, which is characterized in that the A chip, B core
Piece, C chip are bipolar electrode chip or single electric grade chip, through insulating cement or conducting resinl die bond on the functional areas, by drawing
Line or conducting resinl are realized with the functional areas to be electrically connected.
4. the four-in-one LED display module of Optimization-type according to claim 3, which is characterized in that the A chip, B chip
And C chip is arranged along substrate column direction, the angle of the long axis direction and substrate line direction of the A chip and/or C chip is greater than
Zero.
5. the four-in-one LED display module of Optimization-type according to claim 1, which is characterized in that the first electrode is
Anode, second electrode are cathode, and the A chip and B chip are bipolar electrode chip, and the C chip is cathode in chip bottom
Single electricity grade chip, described two B chips bonding pad are distributed in two sides opposite on substrate line direction, and two C chip connections are distinguished
Cloth leans on the opposite sides on the inside of substrate with respect to B chip bonding pad on substrate line direction and along the extension of substrate column direction, two A core
Piece bonding pad is distributed in two sides opposite on substrate line direction and extends to vacant place on the inside of substrate；In the first row first row
The A chip and B chip die bond of luminescence unit are on the first A chip bonding pad, and C chip die bond is on the first C chip bonding pad；Place
In the luminescence unit of the first row secondary series A chip and B chip die bond on the 2nd A chip bonding pad, C chip die bond is second
On C chip bonding pad；All chip die bonds of luminescence unit in the second row first row are on the first C chip bonding pad；Place
In the second row secondary series luminescence unit all chip die bonds on the 2nd C chip bonding pad.
6. the four-in-one LED display module of Optimization-type according to claim 1, which is characterized in that the first electrode is
Cathode, second electrode are anode, and the A chip and B chip are bipolar electrode chip, and the C chip is cathode in chip bottom
Single electricity grade chip, described two B chips bonding pad are distributed in two sides opposite on substrate line direction, and two C chip connections are distinguished
Opposite sides of the cloth on substrate line direction with respect to B chip bonding pad on the inside of substrate, two A chip bonding pads are distributed in substrate
Opposite two sides and extend to place vacant on the inside of substrate on line direction；The A chip and B of luminescence unit in the first row first row
Chip die bond is on the first A chip bonding pad, and C chip die bond is in the first copolar area；Luminous list in the first row secondary series
The A chip and B chip die bond of member are on the 2nd A chip bonding pad, and C chip die bond is in the first copolar area；In the second row
The A chip and B chip die bond of the luminescence unit of one column are on the first C chip bonding pad, and C chip die bond is in the second copolar area；
The A chip and B chip die bond of luminescence unit in the second row secondary series are on the 2nd C chip bonding pad, and C chip die bond is
In two copolar areas.
7. the four-in-one LED display module of Optimization-type according to claim 1, which is characterized in that the conductive hole is located at
Substrate inside or substrate edges, if the conductive hole is located on the inside of substrate, the aperture of the conductive hole is less than 0.2mm；If described
Conductive hole is located at substrate edges, and the conductive hole is the semicircle orifice or 1/4 circular hole of large aperture.
8. the four-in-one LED display module of Optimization-type according to claim 1, which is characterized in that adjacent is described luminous
Virtual isolated area is provided between unit, the virtual isolated area includes the dark light-absorption layer being disposed on the substrate.
9. the four-in-one LED display module of Optimization-type according to claim 1, which is characterized in that the substrate back is also
It is provided with male and female face, the male and female face has two different colors, for identification the direction of the display module.
10. a kind of four-in-one LED display of Optimization-type, which is characterized in that including as described in any one of claims 1-9
The four-in-one LED display module of Optimization-type.
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| CN110350073A (en) * | 2019-07-18 | 2019-10-18 | 浙江英特来光电科技有限公司 | One kind 4 closes 1 full-color SMD LED |
| CN110391325A (en) * | 2019-07-18 | 2019-10-29 | 苏州晶台光电有限公司 | It is a kind of to reduce the structure design interfered between four-in-one LED pixel point |
| CN111092070A (en) * | 2019-11-29 | 2020-05-01 | 长治市华光半导体科技有限公司 | TOP-LED packaging all-in-one bracket |
| CN111463196A (en) * | 2020-03-26 | 2020-07-28 | 深圳利亚德光电有限公司 | Display support, display assembly and manufacturing method of display support |
| CN112164327A (en) * | 2020-09-23 | 2021-01-01 | 广东晶科电子股份有限公司 | Mini LED device and module easy to identify |
| CN112635448A (en) * | 2020-12-30 | 2021-04-09 | 广东晶科电子股份有限公司 | Flip-chip LED device |
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| CN109755232B (en) | 2024-04-19 |
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