CN109741681A - It is bonded the applying method of carrying platform, abutted equipment and display module - Google Patents
It is bonded the applying method of carrying platform, abutted equipment and display module Download PDFInfo
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- CN109741681A CN109741681A CN201910015269.XA CN201910015269A CN109741681A CN 109741681 A CN109741681 A CN 109741681A CN 201910015269 A CN201910015269 A CN 201910015269A CN 109741681 A CN109741681 A CN 109741681A
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- carrying platform
- negative
- adsorption hole
- pressure adsorption
- base plate
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Abstract
The present invention provides a kind of applying method for being bonded carrying platform, abutted equipment and display module.Wherein, fitting carrying platform includes fitting carrying platform ontology, and the fitting carrying platform ontology has loading end and the side lateral positioned at the loading end, negative-pressure adsorption hole is offered on the side, the negative-pressure adsorption hole with negative pressure equipment for being connected.In this way, when use, when display base plate is set on loading end, the side for being bonded carrying platform ontology can will be adsorbed on the COF/FPC that screen is bound by negative-pressure adsorption hole, avoiding COF/FPC that from may being bonded process to CG, there may be interference, meanwhile also can reduce the external force that COF/FPC may be subject to, to reduce a possibility that binding structural failure.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of fitting carrying platforms, abutted equipment and display module
Applying method.
Background technique
Display base plate (panel) is fixed by OCA (Optically Clear Adhesive) optical cement with touch module
In the process, and with during CG (Cover Glass, cover-plate glass) fitting, the FPC of (bonding) is bound with display base plate
(Flexible Printed Circuit, flexible printed circuit)/COF (Chip On Film, flip chip) etc. may be to patch
Conjunction process interferes, and may influence Anawgy accuracy, it is also possible to lead to COF/FPC or binding structural failure.
Summary of the invention
The embodiment of the present invention provides a kind of applying method for being bonded carrying platform, abutted equipment and display module, to solve
COF/FPC may to CG be bonded process there may be interference, and may cause COF/FPC or binding structural failure the problem of.
In a first aspect, the embodiment of the invention provides a kind of fitting carrying platform, including fitting carrying platform ontology, it is described
Being bonded carrying platform ontology has loading end and the side lateral positioned at the loading end, offers negative-pressure adsorption on the side
Hole, the negative-pressure adsorption hole with negative pressure equipment for being connected.
Optionally, the quantity of the side is multiple, and the negative-pressure adsorption hole is offered at least one described side.
Optionally, the side includes at least first side, and the second side being oppositely arranged with the first side,
At least one described negative-pressure adsorption hole is respectively offered in the first side and the second side.
Optionally, on each side for offering the negative-pressure adsorption hole, the quantity in the negative-pressure adsorption hole is more
It is a.
Optionally, on each side equipped with the negative-pressure adsorption hole, the negative-pressure adsorption hole array arrangement.
Optionally, it is bonded the holding tank offered on the loading end of carrying platform ontology for accommodating display base plate.
Second aspect, the embodiment of the invention provides a kind of abutted equipments, which is characterized in that including negative pressure equipment with more than
Described in any item fitting carrying platforms, the negative pressure equipment and each negative-pressure adsorption for being bonded and being opened up on carrying platform
Hole is connected.
The third aspect, the embodiment of the invention provides a kind of applying methods of display module, pass through above-mentioned abutted equipment
It realizes, including display base plate is set on fitting carrying platform, and cover board and the display base plate are fitted；Wherein,
It is described that display base plate is set on fitting carrying platform, comprising:
The display base plate is set on the loading end of the carrying platform ontology, and will be bound with the display base plate
Flexible circuit board the side of the carrying platform ontology is adsorbed in by the negative-pressure adsorption hole.
Optionally, the display base plate includes display module and touch module, described to bind with the display base plate
Flexible circuit board is adsorbed in described this body side surface of carrying platform by the negative-pressure adsorption hole, further includes:
The flexible circuit board being connected with the display module is adsorbed in the carrying platform by the negative-pressure adsorption hole
The flexible circuit board being connected with the touch module is adsorbed in described hold by the negative-pressure adsorption hole by the first side of ontology
The second side of carrying platform ontology, wherein the first side and the second side are opposite for the carrying platform ontology
Two sides.
Optionally, it is described cover board and the display base plate are fitted after, further includes:
Release is adsorbed in the flexible circuit board at the negative-pressure adsorption hole.
Fitting carrying platform of the invention includes fitting carrying platform ontology, and the fitting carrying platform ontology has carrying
Face and the side lateral positioned at the loading end, offer negative-pressure adsorption hole on the side, the negative-pressure adsorption hole be used for
Negative pressure equipment is connected.It, can will be with screen by negative-pressure adsorption hole in this way, in use, when display base plate is set on loading end
The COF/FPC of curtain binding is adsorbed on the side of fitting carrying platform ontology, and avoiding COF/FPC that from may being bonded process to CG may produce
Raw interference, meanwhile, it can reduce the external force that COF/FPC may be subject to, also to reduce a possibility that binding structural failure.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, needed in being described below to the embodiment of the present invention
Attached drawing to be used is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention,
For those of ordinary skill in the art, without any creative labor, it can also obtain according to these attached drawings
Take other attached drawings.
Fig. 1 is the structural schematic diagram of fitting carrying platform provided in an embodiment of the present invention；
Fig. 2 is the structural schematic diagram of abutted equipment provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, those of ordinary skill in the art's acquired every other implementation without creative efforts
Example, shall fall within the protection scope of the present invention.
First embodiment:
The present invention provides a kind of fitting carrying platforms 100.
As shown in Figure 1, in one embodiment, which includes fitting carrying platform ontology, fitting is held
Carrying platform ontology have loading end 110 and positioned at 110 side of loading end to side 120, offer negative-pressure adsorption hole on side 120
130, negative-pressure adsorption hole 130 with negative pressure equipment for being connected.
In the present embodiment, the loading end 110 of fitting carrying platform ontology refers to the side for carrying display base plate 210
Surface.When implementation, display base plate 210 is set on the loading end 110, specifically, display base plate 210 can pass through Electrostatic Absorption
On fixed fitting loading end 110, it can also be adsorbed in by way of vacuum suction on loading end 110.It is then possible to execute by
OCA optical cement 212 is coated on display base plate or is bonded CG (Cover Glass, cover-plate glass) 220 with display base plate 210
Deng operation.
As shown in Fig. 2, in a specific embodiment, used CG220 is 3D (three-dimensional) grooving formula CG, i.e., should
CG220 is towards offering a groove on the direction of display base plate 210, and when implementation, display base plate 210 is contained in the groove,
In this way, bound flexible circuit board 211 can occur centainly on display base plate 210 when display base plate 210 and CG220 are pressed
Change.In the present embodiment, what flexible circuit board 211 referred to can be COF or FPC.
In addition, when display base plate 210 is bonded with CG220, needing to carry out in vacuum environment in certain techniques, so needing
By in environment gas extraction, in gas extraction process, due to air flowing in it is also possible that flexible circuit board 211 with sky
Fate is dynamic.
It, can will be with by negative-pressure adsorption hole 130 when display base plate 210 is set on loading end 110 in the present embodiment
The flexible circuit board 211 of screen binding is adsorbed on the side 120 of fitting carrying platform ontology, avoids flexible circuit board 211 may
To CG220 fitting process, there may be interference, meanwhile, it can reduce the external force that flexible circuit board 211 may be subject to, also to reduce
A possibility that binding structural failure.
Further, the quantity of the side 120 of fitting carrying platform ontology is multiple, for example, a kind of patch as shown in Figure 1
Closing carrying platform ontology is substantially in cuboid, and side 120 there are four tools, offers negative-pressure adsorption at least one side 120
Hole 130.
The quantity that the side 120 in negative-pressure adsorption hole 130 is opened up in the present embodiment according to circumstances can selectively be set.Example
Such as, as soon as certain display panel is able to satisfy use demand in the case where including a flexible circuit board 211, then when implementing, fitting
Offering negative-pressure adsorption hole 130 on one side 120 of carrying platform ontology can be achieved with through 130 stationary phase of negative-pressure adsorption hole
The flexible circuit board 211 answered.
In another specific embodiment, the side 120 of fitting carrying platform ontology includes at least first side, and
At least one negative-pressure adsorption hole is respectively offered in the second side being oppositely arranged with first side, first side and second side
130。
In the specific embodiment, multiple flexible circuit boards 211 are connected on targeted display base plate 210.For example, its
In a flexible circuit board 211 for realizing display function, another flexible circuit board 211 is then for realizing touch function, then
Need to connect at least two flexible circuit boards 211 on the display base plate 210.
It it may also be desirable to increase the flexible circuit board for realizing other function clearly for the display base plate 210 being likely to occur
211, at this time, it may be necessary to which the quantity of fixed flexible circuit board 211 is also just more, at this point, then can be by fitting carrying platform
The corresponding side 120 of ontology opens up negative-pressure adsorption hole 130 to provide adsorption function, to realize the absorption to flexible circuit board 211
It is fixed.
It, can be according to actual needs in a side, two sides, three sides of fitting carrying platform ontology when implementation
Or negative-pressure adsorption hole 130 is opened up on multiple sides, to satisfy the use demand.
Further, on each side 120 for offering negative-pressure adsorption hole 130, the quantity in negative-pressure adsorption hole 130 is more
It is a.Specifically, can for example open up four to six row's negative-pressure adsorption holes 130, it is clear that negative-pressure adsorption hole 130 in the present embodiment
Quantity is not further qualified.By opening up more adsorption hole, it is capable of providing bigger adsorption capacity, so that flexible circuit board
211 can be adsorbed it is stronger.On each side 120 equipped with negative-pressure adsorption hole 130,130 array arrangement of negative-pressure adsorption hole.
Bigger adsorption area can be provided, additionally it is possible to so that flexible circuit board 211 is more uniformly stressed.
Further, it is bonded the receiving offered on the loading end 110 of carrying platform ontology for accommodating display base plate 210
Slot.The holding tank can be opened up according to the shape and size of display base plate 210, to help to improve to display base plate 210
The order of accuarcy of positioning.
For the display base plate 210 of certain specific model, the fixed bit of flexible circuit board 211 and display base plate 210
It is also relatively determining for setting, so, the setting position of display base plate 210 is determined by opening up holding tank, can also be aligned
Position of the true determination flexible circuit board 211 relative to fitting carrying platform ontology, can make the position in negative-pressure adsorption hole 130 with
The position of flexible circuit board 211 is corresponding more accurate.
In a preferable specific embodiment, the depth of the holding tank and the thickness of display base plate 210 are essentially identical,
In this way, when display base plate 210 is placed in holding tank, the position for the flexible circuit board 211 being connected with display base plate 210 substantially position
In the opening of holding tank, the bending that flexible circuit board 211 may be subject to can be reduced, reduces what flexible circuit board 211 damaged
Possibility.
Second embodiment:
A kind of abutted equipment is provided in the present embodiment, including negative pressure equipment and any of the above are bonded carrying platform 100,
Negative pressure equipment is connected with each negative-pressure adsorption hole 130 opened up on carrying platform 100 is bonded.
As shown in Fig. 2, the abutted equipment includes the first tooling 310 and the second tooling 320 being oppositely arranged, wherein fitting
Carrying platform 100 is fixed in the first tooling 310, and when in use, display base plate 210 is set to holding for fitting carrying platform 100
On section 110, CG220 then passes through the clamping of the second tooling 320, to realize being bonded for display base plate 210 and CG220.
Wherein, negative pressure equipment be can be that vacuum pump, negative pressure pump, air exhauster etc. can provide the equipment of condition of negative pressure, in this way,
It can be the air pressure in each negative-pressure adsorption hole 130 lower than the external world when the negative pressure equipment starting being connected with negative-pressure adsorption hole 130
Flexible circuit board 211 is adsorbed at negative-pressure adsorption hole 130 by air pressure, realization.Negative pressure equipment can provide each negative-pressure adsorption hole 130
Adsorption capacity needed for adsorption flexible circuit board 211.
Since the technical solution of the present embodiment includes whole technical solutions of above-described embodiment, at least it is able to achieve
Whole technical effects are stated, details are not described herein again.
3rd embodiment:
The applying method for present embodiments providing a kind of display module is realized by above-mentioned abutted equipment.
This method includes being set to display base plate 210 on fitting carrying platform 100, and by cover board and the display base
Plate 210 fits；It is wherein, described that display base plate 210 is set on fitting carrying platform 100, comprising:
The display base plate 210 is set on the loading end 110 of the carrying platform ontology, and will be with the display base
The flexible circuit board 211 that plate 210 is bound is adsorbed in the side 120 of the carrying platform ontology by the negative-pressure adsorption hole 130.
Wherein flexible circuit board 211 refers to COF or FPC, when flexible circuit board 211 is adsorbed in carrying platform ontology
After side 120, then OCA optical cement can be further coated on display base plate 210 or by CG220 and display base plate 210
Pressing.
The main distinction of the present embodiment and the applying method of existing display module is, by what is be connected with display base plate 210
Flexible circuit board 211 is adsorbed in the side 120 of fitting carrying platform 100 by way of negative-pressure adsorption, to avoid flexible electrical
Road plate 211 may be bonded process to CG220, and there may be interference, meanwhile, it also can reduce what flexible circuit board 211 may be subject to
External force, to reduce a possibility that binding structural failure.
Further, the display base plate 210 include display module and touch module, it is described will be with the display base plate
The flexible circuit board 211 of 210 bindings is adsorbed in described this body side surface of carrying platform 120 by the negative-pressure adsorption hole 130, also wraps
It includes:
The flexible circuit board 211 being connected with the display module is adsorbed in described hold by the negative-pressure adsorption hole 130
The flexible circuit board 211 being connected with the touch module is passed through the negative-pressure adsorption hole by the first side 120 of carrying platform ontology
130 are adsorbed in the second side 120 of the carrying platform ontology, wherein the first side 120 and the second side 120
For two opposite sides 120 of the carrying platform ontology.
In this specific embodiment, display base plate 210 includes two flexible circuit boards 211, two flexible circuit boards 211
It may be respectively used for the display function and touch function of corresponding display base plate 210, it is clear that 210 institute of display base plate may also be corresponded to
The other function that need to be realized, is not further qualified herein.Two flexible circuit boards 211 adsorb respectively is fixed on carrying platform sheet
Two sides 120 of body, equally can be avoided flexible circuit board 211 may to CG220 be bonded process there may be interference, together
When, it can reduce the external force that flexible circuit board 211 may be subject to, also to reduce a possibility that binding structural failure.
Further, it is described cover board and the display base plate 210 are fitted after, further includes:
Release is adsorbed in the flexible circuit board 211 at the negative-pressure adsorption hole 130.
In the present embodiment, complete and then discharge to be adsorbed in negative-pressure adsorption hole 130 when cover board is bonded with display base plate 210
The flexible circuit board 211 at place.Specifically, can be realized by closing negative pressure equipment, can also be inhaled by disconnecting negative pressure
The modes such as the connecting line between attached hole 130 and negative pressure equipment are realized.In such manner, it is possible to effectively avoid 211 institute of flexible circuit board
The external force being subject to.
More than, only a specific embodiment of the invention, but scope of protection of the present invention is not limited thereto, and it is any to be familiar with
Those skilled in the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all cover
Within protection scope of the present invention.Therefore, protection scope of the present invention should be subject to the protection scope in claims.
Claims (10)
1. a kind of fitting carrying platform, which is characterized in that including being bonded carrying platform ontology, the fitting carrying platform ontology tool
There are loading end and the side lateral positioned at the loading end, negative-pressure adsorption hole, the negative-pressure adsorption hole are offered on the side
For being connected with negative pressure equipment.
2. as described in claim 1 fitting carrying platform, which is characterized in that the quantity of the side be it is multiple, at least one
The negative-pressure adsorption hole is offered on the side.
3. fitting carrying platform as claimed in claim 2, which is characterized in that the side includes at least first side, and
At least one is respectively offered in the second side being oppositely arranged with the first side, the first side and the second side
The negative-pressure adsorption hole.
4. fitting carrying platform as claimed any one in claims 1 to 3, which is characterized in that each to offer the negative pressure
On the side of adsorption hole, the quantity in the negative-pressure adsorption hole is multiple.
5. fitting carrying platform as claimed in claim 4, which is characterized in that each institute for being equipped with the negative-pressure adsorption hole
It states on side, the negative-pressure adsorption hole array arrangement.
6. fitting carrying platform as claimed any one in claims 1 to 3, which is characterized in that fitting carrying platform ontology
The holding tank for accommodating display base plate is offered on loading end.
7. a kind of abutted equipment, which is characterized in that held including negative pressure equipment and fitting described in any one of claims 1 to 6
Carrying platform, the negative pressure equipment are connected with each negative-pressure adsorption hole opened up on carrying platform that is bonded.
8. a kind of applying method of display module, is realized by abutted equipment as claimed in claim 7, which is characterized in that including
Display base plate is set on fitting carrying platform, and cover board and the display base plate are fitted；Wherein, described to show
Substrate is set on fitting carrying platform, comprising:
The display base plate is set on the loading end of the carrying platform ontology, and soft by being bound with the display base plate
Property circuit board is adsorbed in the side of the carrying platform ontology by the negative-pressure adsorption hole.
9. the applying method of display module as claimed in claim 8, which is characterized in that the display base plate includes display module
And touch module, it is described that the flexible circuit board bound with the display base plate is adsorbed in described hold by the negative-pressure adsorption hole
This body side surface of carrying platform, further includes:
The flexible circuit board being connected with the display module is adsorbed in the carrying platform ontology by the negative-pressure adsorption hole
First side, it is flat that the flexible circuit board being connected with the touch module by the negative-pressure adsorption hole is adsorbed in the carrying
The second side of playscript with stage directions body, wherein the first side and the second side are opposite two of the carrying platform ontology
Side.
10. the applying method of display module as claimed in claim 8 or 9, which is characterized in that described by cover board and the display
After substrate fits, further includes:
Release is adsorbed in the flexible circuit board at the negative-pressure adsorption hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910015269.XA CN109741681A (en) | 2019-01-08 | 2019-01-08 | It is bonded the applying method of carrying platform, abutted equipment and display module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910015269.XA CN109741681A (en) | 2019-01-08 | 2019-01-08 | It is bonded the applying method of carrying platform, abutted equipment and display module |
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| Publication Number | Publication Date |
|---|---|
| CN109741681A true CN109741681A (en) | 2019-05-10 |
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| CN201910015269.XA Pending CN109741681A (en) | 2019-01-08 | 2019-01-08 | It is bonded the applying method of carrying platform, abutted equipment and display module |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012004143A (en) * | 2010-06-14 | 2012-01-05 | Panasonic Corp | Mounting device and mounting method for electronic component |
| CN207458015U (en) * | 2017-09-30 | 2018-06-05 | 南昌欧菲显示科技有限公司 | Flexible PCB, touch module and touch-screen |
| CN108198515A (en) * | 2018-02-07 | 2018-06-22 | 京东方科技集团股份有限公司 | A kind of laminating apparatus and its application method |
| CN108582944A (en) * | 2018-03-28 | 2018-09-28 | 京东方科技集团股份有限公司 | A kind of production method of abutted equipment and display module |
| CN109121317A (en) * | 2018-07-23 | 2019-01-01 | 武汉华星光电半导体显示技术有限公司 | Support device and hot-press equipment |
-
2019
- 2019-01-08 CN CN201910015269.XA patent/CN109741681A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012004143A (en) * | 2010-06-14 | 2012-01-05 | Panasonic Corp | Mounting device and mounting method for electronic component |
| CN207458015U (en) * | 2017-09-30 | 2018-06-05 | 南昌欧菲显示科技有限公司 | Flexible PCB, touch module and touch-screen |
| CN108198515A (en) * | 2018-02-07 | 2018-06-22 | 京东方科技集团股份有限公司 | A kind of laminating apparatus and its application method |
| CN108582944A (en) * | 2018-03-28 | 2018-09-28 | 京东方科技集团股份有限公司 | A kind of production method of abutted equipment and display module |
| CN109121317A (en) * | 2018-07-23 | 2019-01-01 | 武汉华星光电半导体显示技术有限公司 | Support device and hot-press equipment |
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